JPS61114596A - Multilayer printed wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial usage total] The present invention relates to a multilayer printed wiring board.

[Conventional technology]

A conventional multilayer printed wiring board structure will be explained using a four-layer printed wiring board as an example. Conventional 4-layer printed circuit board has 1 layer, 4th layer is individual layer for signal layer, 2nd layer is ground layer, and 3rd layer is common layer for Tri source layer. The connection Fff to the 31st layer is
On each printed board, the general parts bin or 1iV1 at the connection location
This was done with a through-hole position fixed at the a-hole. FIG. 3 shows a conventional inner layer structure, in which 10 is a connection hole and 12 is a clearance hole.

[Problems to be solved]

In conventional multilayer printed wiring boards, when considering mounting a wide variety of chip shapes, it is not possible to fix the connection position to the common pattern layer (ground, gLmm>), and the meaning of the common layer begins to diminish. .Also, if the common layer were to be treated individually, the original drawings would have to be created, which would affect the price of the printed board, making it impossible to supply cheap printed boards.My father, even if the inner layer connection position was fixed, the power supply of the inner layer, Even if we try to standardize the brand layer, if the power supply and ground supply of mounted components does not have a direct inner layer connection, it will be necessary to wire in a wide pattern on the signal wiring layer, which will reduce the wiring capacity. However, it also had the drawback of being inhibited and placed flat.

[Means for solving problems]

The present invention solves the above-mentioned conventional problems and enables connection to the common layer at any position using one type of common layer, one type of ground layer and one type of power layer.
A multilayer printed wiring board consisting of a signal layer, a power source, and a ground layer, characterized in that the connection positions of the power source and ground layers are alternately and repeatedly commonly arranged outside the wiring grid. [Embodiment] Next, an example in which the present invention is implemented in a four-layer printed board will be described with reference to the drawings.

Conventionally, in many cases, 41i'l printed boards used the 1st and 4th layers as individual signal layers, and the 2nd R4 and 3rd PI as ground layers.
It was composed of a common layer of four source layers.

FIG. 1 shows a common ground layer (or 71
This figure shows eight copper foil patterns of 1 fi, N5). For example, if you want to connect the through hole 3 formed in the clearance part 2 to the ground (or power supply), the connection land 1 is installed in the gap between the clearance part 2 of the inner layer with respect to the general component hole or the 'Via hole. As shown in the figure, the connection is completed by forming a through hole 4 in the connection land l and wiring in the signal layer. In this way, the power supply,
By alternately and commonly arranging the ground connection positions, it is possible to connect the power supply and the ground at desired positions, and it is also possible to share the inner layer pattern. Furthermore, by setting the inner layer connection position outside the wiring grid, the influence on the wiring accommodation surface of the signal layer can be reduced.

〔Effect of the invention〕

As explained above, the present invention has the advantage that it is possible to provide an inexpensive multilayer printed wiring board in which stable grounding and power supply can be easily connected in the shortest possible time by simply forming one type of common ground layer and power supply II layer.

[Brief explanation of drawings]

FIG. 1 is a partial explanatory diagram showing the inner layer structure of a multilayer printed wiring board partially representing an embodiment of the present invention, @2 is an explanatory diagram showing an example of a signal layer pattern of the present invention, and The figure is an explanatory diagram showing the inner layer structure of a conventional multilayer printed wiring board.

Claims (1)

[Claims] A multilayer printed wiring board comprising a signal layer, a power supply layer, and a ground layer, wherein the connection positions of the power supply layer and the ground layer are alternately and repeatedly commonly arranged outside the wiring grid.