JPS60106365U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS60106365U JPS60106365U JP20018783U JP20018783U JPS60106365U JP S60106365 U JPS60106365 U JP S60106365U JP 20018783 U JP20018783 U JP 20018783U JP 20018783 U JP20018783 U JP 20018783U JP S60106365 U JPS60106365 U JP S60106365U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- wiring board
- printed wiring
- intermittent
- land portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の実施例を示す概略平面図、第２図はそ
の概略断面図である。
図面で４０は絶縁基板、４１はその配線パターン、４２
は改造層の絶縁層、４３はその配線パターン、ｈは孔、
３１，３２．・・・はランド部、１２．１４．・・・、
２２，２４．・・・は断続パターン、１１．１３．・・
・、 ２１． ２３．・・・は連続パターンである。FIG. 1 is a schematic plan view showing an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view thereof. In the drawing, 40 is an insulating substrate, 41 is its wiring pattern, 42
is the insulating layer of the modified layer, 43 is its wiring pattern, h is the hole,
31, 32. ... is the land part, 12.14. ...,
22, 24. ... is an intermittent pattern, 11.13.・・・
・, 21. 23. ... is a continuous pattern.
Claims (1)
いて、 該印刷配線板上に、絶縁層と結線変更用の配線パターン
からなる改造層を設け、該改造層にはその下部の印刷配
線板の配線パターンとの接続用の孔をあけておき、かつ
該結線変更用配線パターンは該孔が貫通するランド部と
、該ランド部を結ぶように縦、横に延びるが該ランド部
とは間隙を有する断続パターンと、これらの断続パター
ン間を連続して延び断続パターンとの交差部では該断続
パターンと一体になった連続パターンからなることを特
徴とする改造層を持？印刷配線板。[Scope of Claim for Utility Model Registration] In a printed wiring board formed by forming a wiring pattern on an insulating substrate, a modified layer consisting of an insulating layer and a wiring pattern for changing connection is provided on the printed wiring board, and the modified layer is has a hole for connection with the wiring pattern of the printed wiring board at the bottom thereof, and the wiring pattern for connection change extends vertically and horizontally so as to connect the land portion through which the hole penetrates and the land portion. The modified layer is characterized in that the land portion is composed of an intermittent pattern having gaps, and a continuous pattern that extends continuously between these intermittent patterns and is integrated with the intermittent pattern at the intersection with the intermittent pattern. Do you have it? Printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20018783U JPS60106365U (en) | 1983-12-26 | 1983-12-26 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20018783U JPS60106365U (en) | 1983-12-26 | 1983-12-26 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60106365U true JPS60106365U (en) | 1985-07-19 |
Family
ID=30760799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20018783U Pending JPS60106365U (en) | 1983-12-26 | 1983-12-26 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60106365U (en) |
-
1983
- 1983-12-26 JP JP20018783U patent/JPS60106365U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS60106365U (en) | printed wiring board | |
| JPS6020163U (en) | printed wiring board | |
| JPS60146374U (en) | printed wiring board | |
| JPS6146766U (en) | printed wiring board | |
| JPS58164267U (en) | Land structure on printed circuit board | |
| JPS5887380U (en) | printed wiring board | |
| JPS60103863U (en) | printed board | |
| JPS59112972U (en) | multilayer printed board | |
| JPS59131171U (en) | printed wiring board | |
| JPS59191754U (en) | Component mounting structure of printed wiring board | |
| JPS60141164U (en) | printed wiring board | |
| JPS6078166U (en) | Double-sided printed wiring structure | |
| JPS60163768U (en) | Printed board | |
| JPS58191661U (en) | printed board | |
| JPS59146985U (en) | Layer misalignment test coupon for multilayer printed wiring board | |
| JPS59127263U (en) | Land pattern of flexible printed board | |
| JPS59119058U (en) | wiring board | |
| JPS5944075U (en) | multilayer printed wiring board | |
| JPS59103468U (en) | printed wiring board | |
| JPS5952523U (en) | Printed circuit board switch pattern | |
| JPS60194368U (en) | Printed board | |
| JPS58106973U (en) | printed wiring board | |
| JPS58180657U (en) | Printed circuit board for bridging prevention | |
| JPS5977256U (en) | Printed board | |
| JPS5812969U (en) | flexible printed circuit board |