JPS60146374U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS60146374U JPS60146374U JP3394884U JP3394884U JPS60146374U JP S60146374 U JPS60146374 U JP S60146374U JP 3394884 U JP3394884 U JP 3394884U JP 3394884 U JP3394884 U JP 3394884U JP S60146374 U JPS60146374 U JP S60146374U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- hole
- conductive pattern
- land portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はスルーホールの周囲に形成された従来から知ら
れるランドとこのランドに接続される導−電パターンを
示す平面図、第２図は上記ランドを有するスルーホール
間に形成された導電パターンを示す平面図、第３図はラ
ンドレス・スルーホールとこれに接続される導電パター
ンを示す平面図、第４図は本考案の一実施例を示しスル
ーホールの周囲の内導電パターンの接続部方向にのみ形
成されたランド部とこのランド部に接続される導電パタ
ーンを示す平面図、第５図は第４図のランド部を設けた
スルーホール間に形成された導電パターンを示す平面図
、第６図は導通テストの方法を示す断面図、第７図は本
考案の他の実施例を示す平面図である。
１１．２２・・・・・・スルーホール、１２・・・・・
・ランド部、１３，１４．２１・・・・・・導電パター
ン、２０・・・・・・基板。Fig. 1 is a plan view showing a conventionally known land formed around a through hole and a conductive pattern connected to this land, and Fig. 2 is a plan view showing a conductive pattern formed between through holes having the land. 3 is a plan view showing a landless through hole and a conductive pattern connected to it, and FIG. 4 is a plan view showing an embodiment of the present invention. FIG. 5 is a plan view showing a conductive pattern formed between the through holes provided with the land portion shown in FIG. 4; FIG. 6 is a sectional view showing a continuity test method, and FIG. 7 is a plan view showing another embodiment of the present invention. 11.22...Through hole, 12...
- Land portion, 13, 14.21... Conductive pattern, 20... Substrate.
Claims (1)
ルの周囲に形成されるランド部を導電パターンとの接続
部方向のみに形成するとともに、上記ランド部のパター
ン幅をスルーホールの直径とほぼ等しく形成し、上記導
電パターンの幅をスルーホールの直径より狭く形成する
ことを特徴とする印刷配線基板。In a printed wiring board having a through hole, a land portion formed around the through hole is formed only in the direction of the connection with the conductive pattern, and the pattern width of the land portion is formed to be approximately equal to the diameter of the through hole, A printed wiring board characterized in that the width of the conductive pattern is narrower than the diameter of the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3394884U JPS60146374U (en) | 1984-03-09 | 1984-03-09 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3394884U JPS60146374U (en) | 1984-03-09 | 1984-03-09 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60146374U true JPS60146374U (en) | 1985-09-28 |
Family
ID=30536870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3394884U Pending JPS60146374U (en) | 1984-03-09 | 1984-03-09 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60146374U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02268483A (en) * | 1989-04-11 | 1990-11-02 | Hitachi Ltd | Printed wiring board |
-
1984
- 1984-03-09 JP JP3394884U patent/JPS60146374U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02268483A (en) * | 1989-04-11 | 1990-11-02 | Hitachi Ltd | Printed wiring board |
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