JPS61161797A - Multilayer printed circuit board - Google Patents
Multilayer printed circuit boardInfo
- Publication number
- JPS61161797A JPS61161797A JP274885A JP274885A JPS61161797A JP S61161797 A JPS61161797 A JP S61161797A JP 274885 A JP274885 A JP 274885A JP 274885 A JP274885 A JP 274885A JP S61161797 A JPS61161797 A JP S61161797A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- multilayer printed
- layer
- printed board
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は多層プリント板に関し、特に雑音特性の改善さ
れた電子回路の多層プリント板の構造に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a multilayer printed board, and more particularly to a structure of a multilayer printed board for electronic circuits with improved noise characteristics.
従来、電子回路用の多層プリント板はプリント板の内部
のパターン層を電源パターン、グランドパターンとし、
表面側のパターン層を信号パターンとして使用している
。Conventionally, multilayer printed boards for electronic circuits use the internal pattern layer of the printed board as a power supply pattern and a ground pattern.
The pattern layer on the front side is used as a signal pattern.
上述した従来の多層プリント板は信号ラインがプリント
板の表面に存在するため、信号ラインから外部へ雑音成
分がａｎたり、外部からの雑音成分を伶つて電子回路の
雑音を増大させるという欠点があった。The above-mentioned conventional multilayer printed circuit board has signal lines on the surface of the printed circuit board, so it has the disadvantage that noise components are transmitted from the signal lines to the outside, and noise components from the outside are mixed up, increasing the noise of the electronic circuit. Ta.
本発明の多層プリント板は上記問題点に対処してなされ
たもので、信号ラインから外部への雑音成分が漏れるの
を防ぎ、又外部から雑音成分が混入するのを防止するこ
とが可能な多層プリント板を得ることを目的とする。The multilayer printed board of the present invention has been made to address the above problems, and is a multilayer printed board that can prevent noise components from leaking from the signal line to the outside, and can also prevent noise components from entering from the outside. The purpose is to obtain printed boards.
本発明の多層プリント板は、三層以上の多層プリント板
において、表面の各層を全面グランドパターンと全面電
源パターンとすることにより構成さｎる。The multilayer printed board of the present invention is a multilayer printed board with three or more layers, and is constructed by forming each surface layer into a ground pattern and a power pattern on the entire surface.
次に、本発明の実施例について、図面を参照して説明す
る。第１図は本発明の一実施例である４層プリント板の
斜視図であり、第２図は第１図の断面図である。Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a four-layer printed board according to an embodiment of the present invention, and FIG. 2 is a sectional view of FIG. 1.
第１図及び第２図において、パターン１層１の全面を電
源のパターンとし、下側の表面層であるパターン４１−
４の全面をグランドパターンとし、内層であるパターン
２層２、及びパターン３層３を信号ラインに使用する。In FIGS. 1 and 2, the entire surface of pattern 1 layer 1 is used as a power supply pattern, and the lower surface layer is pattern 41-
The entire surface of 4 is used as a ground pattern, and the inner layers, pattern 2 layer 2 and pattern 3 layer 3, are used for signal lines.
このように電源パターンのパターン１層１とグランドパ
ターンのパターン４１−４で信号ラインをはさみ込むこ
とにより信号ラインから外部へ雑音成分が漏ｎるのを防
ぎ、又外部より信号ラインに雑音成分が混入するのを防
ぐことができる。By sandwiching the signal line between the power supply pattern layer 1 and the ground pattern 41-4, it is possible to prevent noise components from leaking from the signal line to the outside, and to prevent noise components from entering the signal line from the outside. Contamination can be prevented.
なお上記実施例では４層プリント板につき説明したが、
こｎ以外の多層プリント板に於ても、表面の各パターン
層全面を電源パターンとグランドパターンとすることに
より同様の効果が得られる。Note that in the above embodiment, a four-layer printed board was explained.
Similar effects can be obtained in multilayer printed boards other than this one by using the entire surface of each pattern layer as a power supply pattern and a ground pattern.
以上説明したように、本発明によ几ば、多層プリント板
の表面の各パターン層を電源とグランドにすることによ
り、雑音成分が外部へ漏れるのを防ぎ、又外部より雑音
成分が混入するのを防止することができ、雑音につよい
電子回路を構成することが出来る。As explained above, according to the present invention, each pattern layer on the surface of a multilayer printed board is used as a power supply and a ground, thereby preventing noise components from leaking to the outside and preventing noise components from entering from the outside. Therefore, it is possible to configure an electronic circuit that is resistant to noise.
第１図は本発明の一実施例の４層プリント板の斜視図、
８Ｊ２図は第１図に示した実施例の断面図である。
１・・・・・・パターン１層、２・・・・・・ノ（ター
ン層、３・・−・・・パターン３層、４・・・・・・パ
ターン４１１１ｍ、５・・・・・・絶縁層、６・・・・
・・４層プリント板。FIG. 1 is a perspective view of a four-layer printed board according to an embodiment of the present invention;
FIG. 8J2 is a sectional view of the embodiment shown in FIG. 1. 1...Pattern 1 layer, 2......No (turn layer, 3...Pattern 3 layer, 4...Pattern 4111m, 5......・Insulating layer, 6...
...4-layer printed board.
Claims (1)
グランドパターンと全面電源パターンとしたことを特徴
とする多層プリント板。A multilayer printed board having three or more layers, characterized in that each layer on the surface has a ground pattern and a power pattern on the entire surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP274885A JPS61161797A (en) | 1985-01-11 | 1985-01-11 | Multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP274885A JPS61161797A (en) | 1985-01-11 | 1985-01-11 | Multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61161797A true JPS61161797A (en) | 1986-07-22 |
Family
ID=11537966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP274885A Pending JPS61161797A (en) | 1985-01-11 | 1985-01-11 | Multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61161797A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63119292A (en) * | 1986-11-07 | 1988-05-23 | 日本電気株式会社 | Multilayer interconnection board |
| JPS63155791A (en) * | 1986-12-19 | 1988-06-28 | 日本電気株式会社 | High density multilayer interconnection board |
-
1985
- 1985-01-11 JP JP274885A patent/JPS61161797A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63119292A (en) * | 1986-11-07 | 1988-05-23 | 日本電気株式会社 | Multilayer interconnection board |
| JPS63155791A (en) * | 1986-12-19 | 1988-06-28 | 日本電気株式会社 | High density multilayer interconnection board |
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