JPS58122473U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS58122473U JPS58122473U JP1850282U JP1850282U JPS58122473U JP S58122473 U JPS58122473 U JP S58122473U JP 1850282 U JP1850282 U JP 1850282U JP 1850282 U JP1850282 U JP 1850282U JP S58122473 U JPS58122473 U JP S58122473U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- copper foil
- conductor layer
- foil pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は、従来の印刷配線基板の銅箔パターン配置図、
第2図は本考案による印刷配線基板の銅箔パターン配置
の一実施例を示す図、第3図は交叉部分の詳細図、第4
図は結合部の詳細図である。Figure 1 is a copper foil pattern layout diagram of a conventional printed wiring board.
FIG. 2 is a diagram showing an example of the copper foil pattern arrangement of a printed wiring board according to the present invention, FIG. 3 is a detailed diagram of the intersection part, and FIG.
The figure is a detailed view of the joint.
Claims (1)
て、相関連する少なく共一対の銅箔パターンに関し、一
方の銅箔パターンと他方の銅箔パターンとを、所定の間
隔毎に絶縁体を介して交叉する如く、一方の導体層と他
方の導体層とに交互に配置することを特徴とする印刷配
線基板。In a multilayer wiring board having at least two or more conductor layers, one copper foil pattern and the other copper foil pattern are connected at predetermined intervals with an insulator interposed between at least a pair of mutually related copper foil patterns. 1. A printed wiring board characterized in that one conductor layer and the other conductor layer are alternately arranged so as to intersect with each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1850282U JPS58122473U (en) | 1982-02-15 | 1982-02-15 | printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1850282U JPS58122473U (en) | 1982-02-15 | 1982-02-15 | printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58122473U true JPS58122473U (en) | 1983-08-20 |
Family
ID=30030754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1850282U Pending JPS58122473U (en) | 1982-02-15 | 1982-02-15 | printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58122473U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008270559A (en) * | 2007-04-20 | 2008-11-06 | Sumitomo Electric Ind Ltd | Optical communication module |
-
1982
- 1982-02-15 JP JP1850282U patent/JPS58122473U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008270559A (en) * | 2007-04-20 | 2008-11-06 | Sumitomo Electric Ind Ltd | Optical communication module |
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