JPS58122473U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS58122473U
JPS58122473U JP1850282U JP1850282U JPS58122473U JP S58122473 U JPS58122473 U JP S58122473U JP 1850282 U JP1850282 U JP 1850282U JP 1850282 U JP1850282 U JP 1850282U JP S58122473 U JPS58122473 U JP S58122473U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
copper foil
conductor layer
foil pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1850282U
Other languages
Japanese (ja)
Inventor
角　武
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP1850282U priority Critical patent/JPS58122473U/en
Publication of JPS58122473U publication Critical patent/JPS58122473U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、従来の印刷配線基板の銅箔パターン配置図、
第２図は本考案による印刷配線基板の銅箔パターン配置
の一実施例を示す図、第３図は交叉部分の詳細図、第４
図は結合部の詳細図である。Figure 1 is a copper foil pattern layout diagram of a conventional printed wiring board.
FIG. 2 is a diagram showing an example of the copper foil pattern arrangement of a printed wiring board according to the present invention, FIG. 3 is a detailed diagram of the intersection part, and FIG.
The figure is a detailed view of the joint.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 少なく共２層以上の導体層を有する多層配線基板におい
て、相関連する少なく共一対の銅箔パターンに関し、一
方の銅箔パターンと他方の銅箔パターンとを、所定の間
隔毎に絶縁体を介して交叉する如く、一方の導体層と他
方の導体層とに交互に配置することを特徴とする印刷配
線基板。In a multilayer wiring board having at least two or more conductor layers, one copper foil pattern and the other copper foil pattern are connected at predetermined intervals with an insulator interposed between at least a pair of mutually related copper foil patterns. 1. A printed wiring board characterized in that one conductor layer and the other conductor layer are alternately arranged so as to intersect with each other.
JP1850282U 1982-02-15 1982-02-15 printed wiring board Pending JPS58122473U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1850282U JPS58122473U (en) 1982-02-15 1982-02-15 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1850282U JPS58122473U (en) 1982-02-15 1982-02-15 printed wiring board

Publications (1)

Publication Number Publication Date
JPS58122473U true JPS58122473U (en) 1983-08-20

Family

ID=30030754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1850282U Pending JPS58122473U (en) 1982-02-15 1982-02-15 printed wiring board

Country Status (1)

Country Link
JP (1) JPS58122473U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008270559A (en) * 2007-04-20 2008-11-06 Sumitomo Electric Ind Ltd Optical communication module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008270559A (en) * 2007-04-20 2008-11-06 Sumitomo Electric Ind Ltd Optical communication module

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