JPS6037267U - Thick film hybrid IC - Google Patents
Thick film hybrid ICInfo
- Publication number
- JPS6037267U JPS6037267U JP12855183U JP12855183U JPS6037267U JP S6037267 U JPS6037267 U JP S6037267U JP 12855183 U JP12855183 U JP 12855183U JP 12855183 U JP12855183 U JP 12855183U JP S6037267 U JPS6037267 U JP S6037267U
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- thick film
- film hybrid
- land portion
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は一般的な厚膜ハイブリッドＩＣの構成を示す平
面図、第２図イ９口は絶縁塗料の進入防止のための従来
構造を示す平面図と断面図、第３図及び第４図は本考案
ＩＣの異なる二つの実施例をそれぞれ示し、両図ともイ
は要部の断面図で口はそのＡ−Ａ’線断面図である。
１・・・絶縁基板、３・・・導体パターン、４・・・ハ
ンダ付はランド部、５・・・絶縁塗料、８・・・第１の
抵抗体、９・・・第２の抵抗体。Figure 1 is a plan view showing the configuration of a typical thick film hybrid IC, Figure 2 A9 is a plan view and cross-sectional view showing a conventional structure for preventing the ingress of insulating paint, and Figures 3 and 4. 1A and 1B respectively show two different embodiments of the IC of the present invention, and in both figures, A is a cross-sectional view of the main part, and the opening is a cross-sectional view taken along the line A-A'. DESCRIPTION OF SYMBOLS 1... Insulating board, 3... Conductor pattern, 4... Land portion with solder, 5... Insulating paint, 8... First resistor, 9... Second resistor .
Claims (1)
成するハイブリッドＩＣに於いて、少なくとも前記導体
パターンと該パターンに設けられるハンダ付はランド部
の境界部分に第１の抵抗体を形成し、この第１の抵抗体
の上記ランド部に近い側の端縁部上に第２の抵抗体を積
層して形成すると共に、前記第１の抵抗体上の少な（と
も一部に絶縁塗料が重なるように、該絶縁塗料を前記ラ
ンド部以外の導体パターン上に塗布してなる厚膜ハイブ
リッドＩＣ０In a hybrid IC in which a resistor pattern and a conductor pattern are printed and formed on an insulating substrate, at least the conductor pattern and the solder attached to the pattern form a first resistor at the boundary of the land portion, and A second resistor is laminated on the edge of the first resistor on the side closer to the land portion, and a layer of insulating paint is layered on the first resistor so that it overlaps a portion of the first resistor. , a thick film hybrid IC0 formed by applying the insulating paint on the conductor pattern other than the land portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12855183U JPS6037267U (en) | 1983-08-19 | 1983-08-19 | Thick film hybrid IC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12855183U JPS6037267U (en) | 1983-08-19 | 1983-08-19 | Thick film hybrid IC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6037267U true JPS6037267U (en) | 1985-03-14 |
Family
ID=30291577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12855183U Pending JPS6037267U (en) | 1983-08-19 | 1983-08-19 | Thick film hybrid IC |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6037267U (en) |
-
1983
- 1983-08-19 JP JP12855183U patent/JPS6037267U/en active Pending
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