JPH01270290A - Thick film printed board - Google Patents

Abstract

PURPOSE:To decrease the impedance of earth pattern, prevent noise, and stabilize the circuit performance, by making the earth pattern of a thick printed board in a multilayer structure. CONSTITUTION:When an earth pattern 2b as a second layer is formed on an earth pattern 2a as a first layer printed on a ceramic base 1, a cloth glass layer 4a is formed between a general signal wiring pattern 3a and a general resistance pattern 5. When an earth pattern 2c as a third layer is formed on the earth pattern 2b as the second layer, a cloth glass layer 4b is formed between the earth pattern 2C and a general signal wiring pattern 3b. Thereby, an earth pattern of three layer structure is formed, and therefore a thick film printed board has multilayer structure earth patterns 2a-2c. Thereby the impedance of earth pattern is decreased, and the permeation of noise can be sufficiently prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thick film printed substrate used for hybrid integrated circuits and the like.

[Prior Art] Generally, a conventional thick film printed circuit board including a ground pattern is
As shown in FIG. 2, a ground pattern 2 and a signal wiring pattern 3 are formed on a ceramic substrate base 1.

As described above, in the conventional thick film printed circuit board, the ground/gutter 2 is formed in a single layer pattern.

[Problems to be solved] In the conventional thick film printed circuit board described above, the ground pattern 2 was formed at the same time as the other signal wiring pattern 3, resulting in a single layer pattern, which made it impossible to increase the film thickness and caused noise. The problem was that it was not possible to sufficiently prevent this.

For this reason, with conventional thick film printed circuit boards, it was necessary to attach a hub bar, a noise prevention capacitor, etc. to the external circuit to prevent noise.

The present invention has been made in view of the above-mentioned problems.
To provide a thick film printed circuit board capable of sufficiently preventing noise without installing a noise prevention capacitor or the like to an external circuit.

[Means for Solving Problems] In order to achieve the above objects, the present invention includes printing and forming thick film circuit conductors, thick film resistors, etc. on a ceramic substrate.
In the thick film printed circuit board including a ground pattern, the ground pattern has a multilayer structure.

[Example] Hereinafter, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a partial sectional view showing one embodiment of the present invention.

In the figure, 1 is a ceramic substrate base, 2a is a first layer ground pattern, 2b is a second layer ground pattern, 2C is a third layer ground pattern, 3a and 3b are general signal wiring patterns, respectively. 4a and 4b are cross glass layers, and 5 is a general resistance pattern.

In such a thick film printed circuit board, when forming the second layer earth pattern 2b on the first layer earth pattern 2a printed on the ceramic space l, the general signal wiring pattern 3a and the film resistance A cross glass layer 4a is formed between the pattern 5 and the second layer earth pattern 2.
When forming the third layer ground pattern 2C on b,
- Cross glass layer 4b between the general signal wiring pattern 3b
By forming this, a three-layer earth pattern can be formed.

Since such a thick film printed circuit board has the multilayered earth patterns 2a, 2b, and 2c, the impedance of the earth patterns is low, and noise can be sufficiently prevented from entering.

Therefore, noise can be sufficiently prevented without attaching a conventionally required noise prevention capacitor to the external circuit, and the operation of the circuit can be stabilized.

[Effects of the Invention] As explained above, the present invention reduces the impedance of the ground pattern by making the ground pattern of the thick film printed circuit board have a multilayer structure, and the impedance of the ground pattern can be lowered and the noise prevention capacitor or the like can be installed without the need for an external circuit. This has the effect of preventing noise and stabilizing the operation of one circuit.

[Brief explanation of the drawing]

FIG. 1 is a partial vertical cross-sectional view of an embodiment of the thick film printed circuit board of the present invention, and FIG. 2 is a partial vertical cross-sectional view of a conventional thick film printed circuit board. 1: Ceramic substrate base 2: Earth pattern 2a: 1st layer earth pattern 2b = 2nd layer earth pattern 2C: 3rd layer earth pattern 3a, 3b 2. General signal wiring pattern 4a, 4b: Cross glass Layer 5 Ni General Resistance Pattern Agent Patent Attorney Yoshihira Watanabe Figure 1 3b Toga Ikai 52 (Kuhn Figure 2

Claims (1)

[Claims] 1. A thick film printed board including a ground pattern formed by printing a thick film circuit conductor, a thick film resistor, etc. on a ceramic substrate, characterized in that the ground pattern has a multilayer structure.