JPH02295183A - Printed wiring board - Google Patents

Abstract

PURPOSE:To supply a printed wiring board capable of inhibiting the interruption of a signal and forming long and parallel signal lines by boring a hole on a portion of a substrate where signal lines are formed. CONSTITUTION:Punched holes 3 are provided on a portion of substrate 1 where signal lines 2 are formed. A round hole 4, such as a drilled hole or a long hole 5, such as a slit, is acceptable for the punched holes 3. The configuration and size of the hole can be subjected to various design changes. Compared with the distribution capacity of a resin-made substrate 1, a punched hole can be bored so that the distribution capacity in the punched section may be reduced. Moreover, this construction makes it possible to reduce the size of the printed wiring board, bringing the signal lines 2 nearer, prevent the interruption of signals, and form, the signal lines 2 in parallel over a longer distance.

Description

[Detailed Description of the Invention] [Industrial Application Field 1] The present invention relates to a printed wiring board in which signal lines are formed on a substrate, and more specifically, to suppress signal interference between signal lines while achieving miniaturization. It is related to the technology to

[Jubei's technology 1 Jubei: In printed wiring boards, in order to suppress signal interference between signal lines, the signal lines are spaced sufficiently apart on the board to reduce the distributed capacitance. [Problem to be Solved by the Invention 1] However, in recent years, printed wiring boards, including various components, have become smaller, and the distance between signal lines that are substantially parallel has also become smaller, resulting in an increase in the distribution between signal lines. The capacitance also increases, causing interference and crosstalk between signal lines, and there are problems in that it is difficult to make the signal lines long and parallel.

The present invention was made in view of such problems,
The object is to provide a printed wiring board that can suppress signal interference while reducing the distance of signal #II111, and can form long signal lines in parallel.

[1,000 Pj to solve problems. 1 The printed wiring board of the present invention is characterized in that the signal lines 2 and 2 formed on the substrate 1 and the perforations 3 are provided in the dark portion of the substrate 1.

[Action 1 In this way, the signals IiA2,
By forming the perforation 3 in one minute of the two-way board, the distributed capacitance at the perforation 3 portion can be made smaller than the distributed capacitance of the resin board 1, and the signal line 2, 2 closer to each other to reduce the size of the printed wiring board while suppressing signal interference and allowing the signal lines to be parallel and long.

[Embodiment 1] An embodiment of the present invention will be described below in detail based on the drawings. Board 1
For example, 7-phenol resin is impregnated into the group H, and a large number of such Bripregs are laminated and heated and pressurized.
Copper foil is laminated on such a board 1, a circuit pattern is printed by screen printing, the copper foil is left along the circuit pattern by etching, and the signal lines 2 of these circuit patterns are made conductive. It is used to mount various parts. And the substrate lf between the signal lines 2 and 2 formed on the base@1
A perforation 3 is provided at flS. The perforation 3 may be a round hole 4 like a drill hole or a hole 5 like a slit,
Its shape and size can be changed in various designs.

By forming the perforations 3 compared to the distributed capacitance of the resin substrate 1, the capacitance at the perforations 3 is made smaller, and the signal @2. 2 closer together to reduce the size of the printed wiring board and suppress signal interference.

[Effects of the Invention J] In short, the present invention provides perforations in the substrate portion between the signal lines formed on the substrate. There are advantages in that the distributed capacitance can be made small, signal interference can be suppressed while reducing the size of the printed wiring board by bringing the signal #l closer to each other, and the signal lines can be formed in parallel.

[Brief explanation of drawings]

Figure @X is a partial plan view of an embodiment of the present invention, and Figure tjS2 is a sectional view taken along line 81A in Figure 1, where 1 is a substrate, 2 is a signal line, and 3 is a perforation. Agent Patent Attorney Ai Shichi Ishida

Claims (1)

[Claims] (1) A printed wiring board characterized in that a hole is provided in a portion of the board between signal lines formed on the board.