JPH069287B2 - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH069287B2 JPH069287B2 JP1116617A JP11661789A JPH069287B2 JP H069287 B2 JPH069287 B2 JP H069287B2 JP 1116617 A JP1116617 A JP 1116617A JP 11661789 A JP11661789 A JP 11661789A JP H069287 B2 JPH069287 B2 JP H069287B2
- Authority
- JP
- Japan
- Prior art keywords
- signal lines
- printed wiring
- wiring board
- substrate
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、基板の上に信号線を形成したプリント配線板
に関し、詳しくは小型化を図りながら信号線間の信号の
干渉を抑制し、それでいてプリント配線板の機械的強度
の低下を抑制しようとする技術に係るものである。Description: TECHNICAL FIELD The present invention relates to a printed wiring board in which signal lines are formed on a substrate, and more specifically, to suppress signal interference between signal lines while achieving miniaturization, Still, it relates to a technique for suppressing a decrease in mechanical strength of a printed wiring board.
［従来の技術］ 従来、プリント配線板においては、信号線間の信号の干
渉を抑制するために、基板上に信号線を充分な間隔を隔
てて分布容量を小になるようになすのである。[Prior Art] Conventionally, in a printed wiring board, in order to suppress signal interference between signal lines, the signal lines are arranged on the substrate at sufficient intervals so that the distributed capacitance becomes small.
［発明が解決しようとする課題］ ところが、近年、種々の部品も含めてプリント配線板も
小型化され、略平行になされる信号線間の距離も小にな
され、しかして信号線間の分布容量も大きくなり、信号
線間の干渉、混信（クロストーク）が生じ、信号線を平
行に長くし難いという問題があった。[Problems to be Solved by the Invention] However, in recent years, printed wiring boards including various components have been downsized, and the distance between signal lines made substantially parallel has also been made small. However, there is a problem that it is difficult to lengthen the signal lines in parallel because interference between signal lines and interference (crosstalk) occur.
本発明はこのような問題に鑑みてなされたものであり、
その目的とするところは、信号線間の距離を小にしなが
ら信号の干渉を抑制することができ信号線を平行に長く
形成でき、しかもプリント配線板の機械的強度の低下を
抑制できるプリント配線板を提供することにある。The present invention has been made in view of such problems,
The purpose thereof is to reduce the distance between the signal lines, suppress the signal interference, form the signal lines in parallel and long, and prevent the mechanical strength of the printed wiring board from decreasing. To provide.
［課題を解決するための手段］ 本発明のプリント配線板は、基板１上に形成された信号
線２，２間の基板１部分に信号線２，２の長さ方向に間
隔を隔てて穿孔３を設けて成ることを特徴とするもので
ある。[Means for Solving the Problems] A printed wiring board according to the present invention has a structure in which a portion of a substrate 1 between signal lines 2 and 2 formed on a substrate 1 is perforated at intervals in the length direction of the signal lines 2 and 2. 3 is provided.
［作用］ このように、基板１上に形成された信号線２，２間の基
板１部分に穿孔３を設けることによって、樹脂製の基板
１が有する分布容量に比べて穿孔３を形成することで、
その穿孔３部分において分布容量を小にでき、信号線
２，２を近付けてプリント配線板を小型化しながら信号
の干渉を抑制し、信号線を平行に長くでき、かつプリン
ト配線板の機械的強度の低下を抑制できるようにしたも
のである。[Operation] By providing the perforations 3 in the portion of the substrate 1 between the signal lines 2 and 2 formed on the substrate 1 as described above, the perforations 3 are formed in comparison with the distributed capacitance of the resin substrate 1. so,
The distributed capacitance can be reduced in the perforated portion 3 and the signal lines 2 and 2 can be brought close to each other to suppress the signal interference while reducing the size of the printed wiring board, and the signal lines can be elongated in parallel, and the mechanical strength of the printed wiring board can be increased. It is possible to suppress the decrease of the.
［実施例］ 以下本発明の実施例を図面に基づいて詳述する。Embodiments Embodiments of the present invention will be described in detail below with reference to the drawings.
基板１は例えば基材にフェノール樹脂を含浸させ、この
ようなプリプレグを多数枚積層して加熱加圧したもので
あり、このような基板１に銅箔を積層し、そしてスクリ
ーン印刷にて回路パターンの印刷を行い、エッチング加
工にて回路パターンの通りに銅箔を残し、これら回路パ
ターンの信号線２，２に導通させて各種の部品を実装す
るものである。The substrate 1 is, for example, a substrate in which a phenol resin is impregnated, a large number of such prepregs are laminated and heated and pressed, a copper foil is laminated on such a substrate 1, and a circuit pattern is formed by screen printing. Is printed, the copper foil is left as the circuit pattern by etching, and the signal lines 2 and 2 of these circuit patterns are electrically connected to mount various components.
そして基板１上に形成された信号線２，２間の基板１部
分に穿孔３を設けてある。かかる穿孔３はきり孔のよう
なや円孔４やスリットのような長孔５でもよく、その形
状形態及び大きさは種々設計変更可能である。A perforation 3 is provided in the substrate 1 portion between the signal lines 2 and 2 formed on the substrate 1. The perforations 3 may be holes such as cut holes, circular holes 4 or elongated holes 5 such as slits, and the shape and form thereof can be variously changed in design.
しかして、樹脂製の基板１が有する分布容量に比べて穿
孔３を形成することで、その穿孔３部分において分布容
量を小になし、信号線２，２を近付けてプリント配線板
円を小型化しながら信号の干渉を抑制するものであり、
しかも、信号線２，２間の基板部分に信号線２の長さ方
向に間隔を隔てて穿孔３・・を設けてあり、間隔を隔て
た穿孔３・・において信号線２，２間の干渉、混信（ク
ロストーク）を抑制できながら、信号線２，２間におけ
るプリント配線板の機械的強度を充分に維持することが
できるのである。By forming the perforations 3 in comparison with the distributed capacitance of the resin-made substrate 1, the distributed capacitance can be made small in the perforation 3 portion, and the signal lines 2 and 2 can be brought close to each other to reduce the size of the printed wiring board circle. While suppressing signal interference,
Moreover, perforations 3 ... Are provided in the substrate portion between the signal lines 2 and 2 at intervals in the lengthwise direction of the signal lines 2, and at the perforations 3 ... While suppressing crosstalk, the mechanical strength of the printed wiring board between the signal lines 2 and 2 can be sufficiently maintained.
［発明の効果］ 以上要する本発明は、基板上に形成された信号線間の基
板部分に穿孔を設けるから、樹脂製の基板が有する分布
容量に比べて穿孔を形成することで、その穿孔部分にお
いて分布容量を小にでき、信号線を近付けてプリント配
線板を小型化しながら信号の干渉を抑制し、信号線を平
行に長く形成することができるという利点があり、しか
も、信号線間の基板部分に信号線の長さ方向に間隔を隔
てて穿孔を設けてあるから、間隔を隔てた穿孔において
信号線間の干渉、混信（クロストーク）を抑制できなが
ら、信号線間におけるプリント配線板の機械的強度を充
分に維持することができるという利点がある。EFFECTS OF THE INVENTION In the present invention required above, since the perforation is provided in the substrate portion between the signal lines formed on the substrate, the perforation portion is formed by forming the perforation as compared with the distributed capacitance of the resin substrate. There is an advantage that the distributed capacitance can be made small, the signal line can be brought close to the printed wiring board to reduce the size of the printed wiring board, the signal interference can be suppressed, and the signal line can be formed to be long in parallel. Since perforations are provided in the portions at intervals in the length direction of the signal lines, interference between signal lines and crosstalk (crosstalk) can be suppressed in the perforated holes at intervals, and the printed wiring board between the signal lines is There is an advantage that the mechanical strength can be sufficiently maintained.
第１図は本発明の一実施例の部分平面図、第２図は第１
図のＡ−Ａ線断面図であり、１は基板、２は信号線、３
は穿孔である。FIG. 1 is a partial plan view of an embodiment of the present invention, and FIG.
It is the sectional view on the AA line of a figure, 1 is a board | substrate, 2 is a signal line, 3
Is a perforation.
Claims (1)
信号線の長さ方向に間隔を隔てて穿孔を設けて成ること
を特徴とするプリント配線板。1. A printed wiring board, characterized in that perforations are provided at intervals between the signal lines formed on the substrate in the length direction of the signal lines.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1116617A JPH069287B2 (en) | 1989-05-10 | 1989-05-10 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1116617A JPH069287B2 (en) | 1989-05-10 | 1989-05-10 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02295183A JPH02295183A (en) | 1990-12-06 |
| JPH069287B2 true JPH069287B2 (en) | 1994-02-02 |
Family
ID=14691617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1116617A Expired - Lifetime JPH069287B2 (en) | 1989-05-10 | 1989-05-10 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH069287B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2639161B2 (en) * | 1990-03-15 | 1997-08-06 | 松下電器産業株式会社 | Electronic equipment |
| KR100285957B1 (en) * | 1997-11-06 | 2001-07-12 | 윤종용 | Printed circuit board for adhereing rf band pass filter and design method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5546794Y2 (en) * | 1978-07-11 | 1980-11-01 | ||
| JPS5849460U (en) * | 1981-09-28 | 1983-04-04 | 東芝ライテック株式会社 | printed wiring board equipment |
| JPS60169856U (en) * | 1984-04-17 | 1985-11-11 | 三菱電機株式会社 | printed wiring board |
-
1989
- 1989-05-10 JP JP1116617A patent/JPH069287B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02295183A (en) | 1990-12-06 |
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