JP2912160B2 - Thin multilayer printed wiring board - Google Patents

Thin multilayer printed wiring board

Info

Publication number
JP2912160B2
JP2912160B2 JP6134024A JP13402494A JP2912160B2 JP 2912160 B2 JP2912160 B2 JP 2912160B2 JP 6134024 A JP6134024 A JP 6134024A JP 13402494 A JP13402494 A JP 13402494A JP 2912160 B2 JP2912160 B2 JP 2912160B2
Authority
JP
Japan
Prior art keywords
slit
printed wiring
component mounting
board
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP6134024A
Other languages
Japanese (ja)
Other versions
JPH088535A (en
Inventor
和之 大山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP6134024A priority Critical patent/JP2912160B2/en
Publication of JPH088535A publication Critical patent/JPH088535A/en
Application granted granted Critical
Publication of JP2912160B2 publication Critical patent/JP2912160B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【産業上の利用分野】本発明は、部品実装後に装置形状
に合わせて不要な部分を切り落とすためのスリットを有
する薄板多層プリント配線板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin multilayer printed wiring board having slits for cutting off unnecessary portions in accordance with the shape of a device after mounting components.

【０００２】[0002]

【従来の技術】従来のプリント配線板を図２に示す。図
２（ａ）は平面図であり、図２（ｂ）はＢ−Ｂ断面図で
ある。必要とするプリント配線板の形状が四角形であれ
ば問題はないが、近年の電子機器の小型軽量化、高密度
化の要求から、プリント配線板は、複雑な形状となるこ
とが多くなっている。この場合、生産ラインにプリント
配線板を流すためには、周囲に適当な捨て基板１を設け
て形状を四角形にする必要がある。捨て基板１との間に
はスリット２が設けられ、適当な間隔をもってミシン目
３によりつなげられている。通常、回路形成に必要なパ
ターン以外は、エッチングされるため、ミシン目３の周
囲の銅箔はエッチングされて残っていない。従って、ミ
シン目３の周囲は、絶縁層のみから構成され、エポキシ
−ガラス布、エポキシ−ガラス不織布等の材料からなる
ため、従来のプリント配線板は、熱を加えると軟化する
性質を有している。2. Description of the Related Art FIG. 2 shows a conventional printed wiring board. FIG. 2A is a plan view, and FIG. 2B is a BB cross-sectional view. There is no problem if the required shape of the printed wiring board is square, but in recent years, printed wiring boards have become complicated in shape due to recent demands for smaller and lighter electronic devices and higher density. . In this case, in order to allow the printed wiring board to flow through the production line, it is necessary to provide a suitable discarded substrate 1 around the printed wiring board and make the shape square. Slits 2 are provided between the discarded substrate 1 and are connected by perforations 3 at appropriate intervals. Usually, portions other than the pattern necessary for circuit formation are etched, so that the copper foil around the perforations 3 is not etched and left. Therefore, the periphery of the perforation 3 is composed of only an insulating layer and is made of a material such as an epoxy-glass cloth and an epoxy-glass non-woven fabric, so that the conventional printed wiring board has a property of softening when heat is applied. I have.

【０００３】[0003]

【発明が解決しようとする課題】上述のように、この従
来のプリント配線板では、スリットのミシン目の周囲が
絶縁層のみから構成され、エポキシ−ガラス布、エポキ
シ−ガラス不織布等の材料からなるため、熱を加えると
軟化する性質がある。従って、プリント配線板に部品を
実装するためにリフロー炉に通すと、プリント配線板に
反りが発生し、ハンダ付け品質が悪化するという問題点
があった。As described above, in this conventional printed wiring board, the periphery of the slit perforation is composed of only an insulating layer, and is made of a material such as an epoxy-glass cloth or an epoxy-glass nonwoven fabric. Therefore, it has the property of softening when heat is applied. Therefore, there is a problem that when the components are passed through a reflow furnace to mount the components on the printed wiring board, the printed wiring board is warped and the soldering quality is deteriorated.

【０００４】また、これは、プリント配線板が薄型化す
ればより顕著に表れる。[0004] In addition, this becomes more conspicuous when the thickness of the printed wiring board is reduced.

【０００５】本発明の目的は、プリント配線板に部品を
実装するためリフロー炉に通した時に、プリント配線板
に反りが発生せず、ハンダ付け品質が悪化しない薄板多
層プリント配線板を提供することにある。An object of the present invention is to provide a thin multilayer printed wiring board which does not warp and does not deteriorate soldering quality when the printed wiring board is passed through a reflow furnace for mounting components on the printed wiring board. It is in.

【０００６】[0006]

【課題を解決するための手段】本発明は、部品実装基板
と、部品実装後に装置形状に合わせて切り落とされる捨
て基板とからなり、部品実装基板と捨て基板との間にス
リットが設けられ、捨て基板が適当な間隔をもってミシ
ン目により部品実装基板につなげられている薄板多層プ
リント配線板において、 前記ミシン目の周囲部の前記部
品実装基板および捨て基板の内層および外層の全層また
は一部の層に形成され、 中心部にスリット方向に逃げ部
を有し、 大きさが、前記スリットの垂直方向には、前記
部品実装基板側および前記捨て基板側にそれぞれスリッ
トの一辺から前記ミシン目の穴径と同程度であり、スリ
ットの平行方向には、スリットが直線になる部分程度ま
でである銅箔を備えることを特徴としている。The present invention relates to a component mounting board.
And the discarded parts that are cut off to fit the device shape after component mounting
Board between the component mounting board and the discarded board.
Lit is provided, and discarded substrates are
Board connected to the component mounting board
In the lint wiring board, the portion around the perforation
All or all of the inner and outer layers of the
Is formed on some layers and has a relief in the slit direction at the center.
Having a size in the vertical direction of the slit,
Slip each on the component mounting board side and the discard board side.
From one side of the slot
In the direction parallel to the
It is characterized by having a copper foil that is:

【０００７】[0007]

【実施例】次に、本発明の実施例について図面を参照し
て説明する。Next, embodiments of the present invention will be described with reference to the drawings.

【０００８】図１は、本発明の薄板多層プリント配線板
の一実施例を示す図であり、図１（ａ）は平面図、図１
（ｂ）はＡ−Ａ断面図である。この薄板多層プリント配
線板の製造に当たっては、ガラス布基材エポキシ樹脂、
ガラス不織布基材エポキシ樹脂等の銅張積層板を使用す
る。プリント配線板の設計段階で、ミシン目３の周囲に
銅箔４を設ける。FIG. 1 is a view showing one embodiment of a thin multilayer printed wiring board according to the present invention. FIG. 1 (a) is a plan view and FIG.
(B) is AA sectional drawing. In producing this thin multilayer printed wiring board, a glass cloth base epoxy resin,
Use a copper-clad laminate such as a glass nonwoven base epoxy resin. At the stage of designing a printed wiring board, a copper foil 4 is provided around the perforations 3.

【０００９】ミシン目３の１つの穴径は、１．０ｍｍ〜
１．５ｍｍ程度で、穴と穴の間隔は、穴径＋０．５ｍｍ
〜１．０ｍｍ程度とする。ミシン目３の穴径および穴の
間隔は、プリント配線板の板厚により適した大きさにす
る必要があるが、穴径は、おおよそプリント配線板の板
厚と同程度とすることが望ましい。[0009] One hole diameter of the perforation 3 is from 1.0 mm to
Approximately 1.5mm, the distance between holes is the hole diameter + 0.5mm
To about 1.0 mm. The hole diameter and the interval between the holes in the perforations 3 need to be made more suitable for the thickness of the printed wiring board, but the hole diameter is desirably approximately equal to the thickness of the printed wiring board.

【００１０】銅箔４については、ミシン目３の穴と穴お
よび穴とスリット２の間の部分を含んで、ミシン目３の
全体を覆うように設ける。銅箔４の大きさは、スリット
２の垂直方向には、捨て基板１側および部品実装基板５
側にそれぞれスリット２の一辺からミシン目３の穴径と
同程度とし、スリット２の平行方向には、スリット２が
直線になる部分程度までとする。銅箔４の大きさが、上
述のものより大きくても効果を減らすことにはならな
い。しかしながら、銅箔４の大きさを大きくすれば、部
品実装基板５側では、配線パターンを引くための領域を
減らすことになり、非効率的であるため、必要最小限に
とどめるのがよい。[0010] The copper foil 4 is provided so as to cover the entire perforation 3 including the hole between the perforation 3 and the portion between the hole and the slit 2. The size of the copper foil 4 is determined in the vertical direction of the slit 2 by the side of the discard substrate 1 and the component mounting substrate 5.
In each of the sides, the length of one side of the slit 2 is set to be approximately the same as the hole diameter of the perforation 3, and in the parallel direction of the slit 2, up to a portion where the slit 2 becomes a straight line. Even if the size of the copper foil 4 is larger than that described above, the effect is not reduced. However, if the size of the copper foil 4 is increased, the area for drawing the wiring pattern is reduced on the component mounting board 5 side, which is inefficient. Therefore, it is preferable to keep it to the minimum necessary.

【００１１】また、銅箔４のスリット２の中心部には、
０．１ｍｍ〜０．２ｍｍ程度の幅で銅箔逃げ６が設けら
れている。銅箔逃げ６を設けないと、部品実装後に捨て
基板１を切り捨てるときに、銅箔４が切れないために不
都合が生じる。銅箔逃げ６の幅を太くすると、効果が小
さくなるために必要最小限にとどめる必要がある。通常
の工法では、最小クリアランスは０．１ｍｍ程度が限界
であるが、技術の進歩により最小クリアランスを小さく
することができれば、銅箔逃げ６の幅を狭くすることも
可能となる。銅箔逃げ６の幅は、銅箔４の幅に比べ十分
に狭いために、プリント配線板の反りを防ぐ効果を減じ
るものではない。In the center of the slit 2 of the copper foil 4,
The copper foil escape 6 is provided with a width of about 0.1 mm to 0.2 mm. If the copper foil escape 6 is not provided, when the discarded board 1 is cut off after the components are mounted, the copper foil 4 cannot be cut off, which causes a problem. If the width of the copper foil escape 6 is increased, the effect is reduced, so that it is necessary to keep it to a necessary minimum. In the ordinary method, the minimum clearance is limited to about 0.1 mm. However, if the minimum clearance can be reduced by the progress of technology, the width of the copper foil escape 6 can be reduced. Since the width of the copper foil escape 6 is sufficiently smaller than the width of the copper foil 4, the effect of preventing the warpage of the printed wiring board is not reduced.

【００１２】銅箔４は、プリント配線板の内層および外
層の全ての層、または一部の層に設けられる。全ての層
に銅箔４を設ける方が効果が大きいが、配線パターンへ
の影響などから、銅箔４を設けることができない層があ
っても、効果を得ることは可能である。また、銅箔４の
形状については、各層ごとに異なっていても構わない。The copper foil 4 is provided on all or some of the inner and outer layers of the printed wiring board. It is more effective to provide the copper foil 4 on all the layers, but the effect can be obtained even if there is a layer on which the copper foil 4 cannot be provided due to the influence on the wiring pattern. Further, the shape of the copper foil 4 may be different for each layer.

【００１３】以上のように設計を行い、通常のプリント
配線板の製造方法によってプリント配線板を製造する。The design is performed as described above, and the printed wiring board is manufactured by a normal method for manufacturing a printed wiring board.

【００１４】このように本実施例は、プリント配線板に
部品を実装するためリフロー炉に通した時には、ミシン
目の周囲に銅箔が設けられているため、絶縁層が軟化し
ても、反りが発生することを防ぐことができる。部品実
装後は、不要な捨て基板をミシン目を割って切り落と
し、実際に必要な外形をした部品実装基板を得ることが
できる。As described above, according to this embodiment, when the components are mounted on the printed wiring board, the copper foil is provided around the perforations when the components are passed through a reflow furnace. Can be prevented from occurring. After the components are mounted, the unnecessary discarded substrate is cut off at the perforation to obtain a component mounted substrate having an actually required outer shape.

【００１５】[0015]

【発明の効果】以上説明したように本発明は、部品実装
後に装置の形状に合わせて不要な部分を切り落とすため
のスリットに設けられたミシン目の周囲の全層または一
部の層に銅箔が設けられているので、プリント配線板に
部品を実装するためにリフロー炉に通した時でも、プリ
ント配線板の反りを防ぐことができ、ハンダ付け品質を
向上させることができるという効果を有している。As described above, according to the present invention, a copper foil is provided on all or a part of the layer around the perforation provided in the slit for cutting off an unnecessary portion according to the shape of the device after mounting the component. Is provided, so that even when the printed circuit board is passed through a reflow furnace to mount components on the printed circuit board, the printed circuit board can be prevented from warping, and the soldering quality can be improved. ing.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の薄板多層プリント配線板の一実施例を
示す平面図およびＡ−Ａ断面図である。FIG. 1 is a plan view and an AA sectional view showing an embodiment of a thin multilayer printed wiring board according to the present invention.

【図２】従来のプリント配線板の平面図およびＢ−Ｂ断
面図である。FIG. 2 is a plan view and a BB cross-sectional view of a conventional printed wiring board.

【符号の説明】[Explanation of symbols]

１ 捨て基板 ２ スリット ３ ミシン目 ４ 銅箔 ５ 部品実装基板 ６ 銅箔逃げ DESCRIPTION OF SYMBOLS 1 Discard board 2 Slit 3 Perforation 4 Copper foil 5 Component mounting board 6 Copper foil escape

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】部品実装基板と、部品実装後に装置形状に
合わせて切り落とされる捨て基板とからなり、部品実装
基板と捨て基板との間にスリットが設けられ、捨て基板
が適当な間隔をもってミシン目により部品実装基板につ
なげられている薄板多層プリント配線板において、前記ミシン目の周囲部の前記部品実装基板および捨て基
板の内層および外層の全層に形成され、 中心部にスリット方向に逃げ部を有し、 大きさが、前記スリットの垂直方向には、前記部品実装
基板側および前記捨て基板側にそれぞれスリットの一辺
から前記ミシン目の穴径と同程度であり、スリットの平
行方向には、スリットが直線になる部分程度までである
銅箔を備える ことを特徴とする薄板多層プリント配線
板。1. A component mounting board and a device shape after component mounting.
It consists of a discarded board that is cut off together, and component mounting
A slit is provided between the substrate and the waste substrate,
Is attached to the component mounting board with perforations at appropriate intervals.
In the thin multi-layer printed wiring board, the component mounting board around the perforation and the disposal board
It is formed on all the inner and outer layers of the plate, has a clearance in the center in the slit direction, and has a size in the vertical direction of the slit, the component mounting.
One side of the slit on each of the substrate side and the discarded substrate side
From the perforated hole diameter and the flatness of the slit.
In the row direction, it is up to the part where the slit becomes a straight line
A thin multilayer printed wiring board comprising a copper foil . 【請求項２】部品実装基板と、部品実装後に装置形状に
合わせて切り落とされる捨て基板とからなり、部品実装
基板と捨て基板との間にスリットが設けられ、捨て基板
が適当な間隔をもってミシン目により部品実装基板につ
なげられている薄板多層プリント配線板において、前記ミシン目の周囲部の前記部品実装基板および捨て基
板の一部の層に形成され、 中心部にスリット方向に逃げ部を有し、 大きさが、前記スリットの垂直方向には、前記部品実装
基板側および前記捨て基板側にそれぞれスリットの一辺
から前記ミシン目の穴径と同程度であり、スリットの平
行方向には、スリットが直線になる部分程度までである
銅箔を備える ことを特徴とする薄板多層プリント配線
板。2. A component mounting board and a device shape after component mounting.
It consists of a discarded board that is cut off together, and component mounting
A slit is provided between the substrate and the waste substrate,
Is attached to the component mounting board with perforations at appropriate intervals.
In the thin multi-layer printed wiring board, the component mounting board around the perforation and the disposal board
It is formed in a part of the plate, has a clearance in the center in the slit direction, and has a size in the vertical direction of the slit, the component mounting.
One side of the slit on each of the substrate side and the discarded substrate side
From the perforated hole diameter and the flatness of the slit.
In the row direction, it is up to the part where the slit becomes a straight line
A thin multilayer printed wiring board comprising a copper foil . 【請求項３】前記銅箔の形状が各層ごとに異なることを
特徴とする請求項１または２記載の薄板多層プリント配
線板。3. The thin multilayer printed wiring board according to claim 1, wherein the shape of the copper foil is different for each layer. 【請求項４】前記ミシン目の穴径が、プリント配線板の
板厚と同程度とし、穴と穴の間隔が、穴径＋０．５ｍｍ
〜１．０ｍｍであることを特徴とする請求項１または２
記載の薄板多層プリント配線板。4. The perforated hole diameter is substantially equal to the thickness of the printed wiring board, and the distance between the holes is the hole diameter + 0.5 mm.
3 to 1.0 mm.
The thin multi-layer printed wiring board as described.
JP6134024A 1994-06-16 1994-06-16 Thin multilayer printed wiring board Expired - Fee Related JP2912160B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6134024A JP2912160B2 (en) 1994-06-16 1994-06-16 Thin multilayer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6134024A JP2912160B2 (en) 1994-06-16 1994-06-16 Thin multilayer printed wiring board

Publications (2)

Publication Number Publication Date
JPH088535A JPH088535A (en) 1996-01-12
JP2912160B2 true JP2912160B2 (en) 1999-06-28

Family

ID=15118603

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6134024A Expired - Fee Related JP2912160B2 (en) 1994-06-16 1994-06-16 Thin multilayer printed wiring board

Country Status (1)

Country Link
JP (1) JP2912160B2 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0423158U (en) * 1990-06-15 1992-02-26
JPH05145235A (en) * 1991-11-20 1993-06-11 Nippon Avionics Co Ltd Manufacture of multilayered printed board and laminated board

Also Published As

Publication number Publication date
JPH088535A (en) 1996-01-12

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