JPS61107788A - Universal material for printed wiring board and manufacture of printed circuit board using the same - Google Patents
Universal material for printed wiring board and manufacture of printed circuit board using the sameInfo
- Publication number
- JPS61107788A JPS61107788A JP22771584A JP22771584A JPS61107788A JP S61107788 A JPS61107788 A JP S61107788A JP 22771584 A JP22771584 A JP 22771584A JP 22771584 A JP22771584 A JP 22771584A JP S61107788 A JPS61107788 A JP S61107788A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- holes
- laminate
- universal material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、スルーホールを有する印刷配線板用材料及び
この材料を用いて印刷配線板に加工する製造方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a printed wiring board material having through-holes and a manufacturing method for processing the material into a printed wiring board.
従来の印刷配線板用材料は、積層板の表面に銅箔を貼り
合せたいわゆる銅張積層板が主力であった。このため、
規定された厚さの高価な銅箔が必要なため、印刷配線板
用材料としても高価なものであった。又、この材料を用
いて印刷配線板として加工するセットメーカにとっては
、スルーホールを治する印刷配線板を加工する場合には
、スルーホールめっき設備及び技術が必要であり、且つ
工程数が多いため、長時間の加工時間が必要である等の
多くの欠点を有していたつ
〔発明の目的〕
本発明は、上記した欠点をなりシ、印刷配線板材料を安
価に提供し、又印刷配線板を安く早く、容易に製造する
方法を提供するにある。The mainstay of conventional materials for printed wiring boards has been so-called copper-clad laminates, in which copper foil is bonded to the surface of a laminate. For this reason,
Since expensive copper foil of a specified thickness is required, it is also an expensive material for printed wiring boards. In addition, for set manufacturers who use this material to process printed wiring boards, processing printed wiring boards that cure through holes requires through-hole plating equipment and technology, and the number of steps is large. [Object of the Invention] The present invention overcomes the above-mentioned drawbacks, provides printed wiring board materials at low cost, and provides printed wiring board materials. The goal is to provide a cheap, fast, and easy way to manufacture.
本発明は、積層板上に於て、予め印刷配線板の基準格子
交点に相当する箇所全箇所に対し、スルーホール用穴を
設け、この穴の内壁を含む積層板の全表面に対し、無電
解又は電解鋼めっきにより銅めっき層を形成したものを
印刷配線板用のユニバーサル材料とし、この材料に対し
必要なスル−ホール及び表裏の銅めつき層を必要な領域
だけ残すようエツチングすることにより印刷配線板を製
造するようにしたことを特徴とする。In the present invention, holes for through-holes are formed in advance on the laminate at all locations corresponding to the intersection points of the reference grid of the printed wiring board, and the entire surface of the laminate including the inner wall of the hole is made blank. By forming a copper plating layer by electrolytic or electrolytic steel plating and using it as a universal material for printed wiring boards, by etching the material so that the necessary through holes and the copper plating layer on the front and back sides are left in only the necessary areas. The present invention is characterized in that it is adapted to manufacture printed wiring boards.
〔発明の実施ζ１１〕 以下、本発明の一実施例を図により説明する。[Practice of the invention ζ11] Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１１ヌ１は、本発明による印刷配線板用ユニバーサル
材↑１１の平面１菌を示しており、予め、印刷配線板の
基進格子２の交点に相当する箇所、全箇所に対し、スル
ーホール用に３を設け、このへの内壁を含む積層板の全
表面に対し、無電解又はｔＷｆ鋼めっきにより、鋼めっ
き層を形成したものである。The 11th number 1 shows a plane 1 of the universal material ↑11 for printed wiring boards according to the present invention, and through holes have been prepared in advance at locations corresponding to the intersections of the basic lattice 2 of the printed wiring board, and at all locations. 3, and a steel plating layer was formed on the entire surface of the laminate including the inner wall thereof by electroless or tWf steel plating.
又、第２図は、第１図の材料を使って加工した印刷配線
板４の完成後の状態を示しており、表裏のパターンを接
続、あるいは部品取付用穴として必要な部分のスルーホ
ール５、及び表裏のパターン６だけを残して、他の不必
要な銅めっき層はエツチングにより除去することにより
、印刷配線板を製造するものである。Moreover, FIG. 2 shows the state after completion of the printed wiring board 4 processed using the materials shown in FIG. , and patterns 6 on the front and back sides, and other unnecessary copper plating layers are removed by etching to produce a printed wiring board.
本発明によれば、印刷配線板用材料の銅箔材として、通
常３５μｍ、７０μｍといった規定された厚さの、高価
な銅箔材が不要となるばかりか、銅めっき層の厚さは顧
客ニーズに合せて自由で選択できる。According to the present invention, not only is it unnecessary to use an expensive copper foil material that normally has a specified thickness of 35 μm or 70 μm as a copper foil material for printed wiring boards, but the thickness of the copper plating layer can also be adjusted according to customer needs. You can choose freely according to your needs.
又、本発明の最も大きな特徴は、この材料を使って加工
する工程には、複雑且つ高価なめっき設備及び技術が不
要となるため、通常この加 １．。Moreover, the most significant feature of the present invention is that the process of processing using this material does not require complicated and expensive plating equipment and techniques. .
工工程を業務とするセットメーカにとっては、極めて有
効な材料と言える。It can be said to be an extremely effective material for set manufacturers whose business is the manufacturing process.
更に本発明による印刷配線板の製造方法によれば、工程
数も少ないため、加工時間が短かくてよい等、多くの効
果が期待できる。Further, according to the method for manufacturing a printed wiring board according to the present invention, many effects can be expected, such as a short processing time because the number of steps is small.
第１図は、本発明による印刷配線板用ユニバーサル材料
を示す平面図、第２図は、第１図の材料を使って加工し
た印刷配線板完成後の平面図である。
１・・・印刷配線板用ユニバーサル材料２・・・基準格
子
３・・・スルーホール用人
４・・・印刷配線板
５・・・スルーホール
６・・・ノ櫂ターンFIG. 1 is a plan view showing the universal material for printed wiring boards according to the present invention, and FIG. 2 is a plan view after the printed wiring board processed using the material shown in FIG. 1 is completed. 1...Universal material for printed wiring boards 2...Reference grid 3...Through hole user 4...Printed wiring board 5...Through hole 6...Nokai turn
Claims (1)
相当する全箇所に対し、スルーホール用穴を設け、この
穴内の表面を含む積層板全表面に対し、無電解又は電解
銅めっきにより銅めっき層を形成してなる印刷配線板用
ユニバーサル材料。 ２、積層板上に於て、予め印刷配線板の基準格子交点に
相当する全箇所に対し、スルーホール用穴を設け、この
穴内の表面を含む積層板全表面に対し、無電解又は電解
銅めっきにより銅めっき層を形成したユニバーサル材料
を用い、この積層板表面にパターンを形成し、且つ必要
なスルーホールのみを使用して表裏パターンを接続して
なる印刷配線板の製造方法。[Claims] 1. On the laminate, holes for through-holes are provided in advance at all locations corresponding to the intersection points of the reference grid of the printed wiring board, and the entire surface of the laminate including the surface inside these holes is , a universal material for printed wiring boards, with a copper plating layer formed by electroless or electrolytic copper plating. 2. On the laminate, holes for through holes are prepared in advance at all locations corresponding to the intersection points of the standard grid of the printed wiring board, and the entire surface of the laminate, including the surface inside these holes, is coated with electroless or electrolytic copper. A method for manufacturing a printed wiring board, which uses a universal material with a copper plating layer formed by plating, forms a pattern on the surface of this laminate, and connects the front and back patterns using only necessary through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22771584A JPS61107788A (en) | 1984-10-31 | 1984-10-31 | Universal material for printed wiring board and manufacture of printed circuit board using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22771584A JPS61107788A (en) | 1984-10-31 | 1984-10-31 | Universal material for printed wiring board and manufacture of printed circuit board using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61107788A true JPS61107788A (en) | 1986-05-26 |
Family
ID=16865214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22771584A Pending JPS61107788A (en) | 1984-10-31 | 1984-10-31 | Universal material for printed wiring board and manufacture of printed circuit board using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61107788A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0846322A (en) * | 1994-07-29 | 1996-02-16 | Nec Corp | Manufacture of printed wiring board |
| JPH0897524A (en) * | 1994-09-29 | 1996-04-12 | Nec Data Terminal Ltd | General purpose circuit board and formation method for electronic circuit wiring pattern on the board |
-
1984
- 1984-10-31 JP JP22771584A patent/JPS61107788A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0846322A (en) * | 1994-07-29 | 1996-02-16 | Nec Corp | Manufacture of printed wiring board |
| JPH0897524A (en) * | 1994-09-29 | 1996-04-12 | Nec Data Terminal Ltd | General purpose circuit board and formation method for electronic circuit wiring pattern on the board |
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