JPS61214497A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPS61214497A JPS61214497A JP5480385A JP5480385A JPS61214497A JP S61214497 A JPS61214497 A JP S61214497A JP 5480385 A JP5480385 A JP 5480385A JP 5480385 A JP5480385 A JP 5480385A JP S61214497 A JPS61214497 A JP S61214497A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- double
- wiring board
- copper
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
(イ)発明の目的
〔産業上の利用分野〕
この発、明は、プリント配線板の製造方法に係り、とく
にスルーホールを有するフレキシブル両面配線板や多層
プリント配線板の製造方法に関する。Detailed Description of the Invention (a) Purpose of the Invention [Field of Industrial Application] The present invention relates to a method for manufacturing printed wiring boards, and in particular to a method for manufacturing a flexible double-sided wiring board having through holes and a multilayer printed wiring board. Regarding the manufacturing method.
従来のスルーホールを有する両面プリント配線板や多層
プリント配線板の製造において、その主工程をなすスル
ーホールの製造はNCドリルによるスルーホール用穴の
穴明は工程とその銅めっき工程とによって行われている
。In the production of conventional double-sided printed wiring boards and multilayer printed wiring boards with through-holes, the main process of manufacturing through-holes is the drilling of through-hole holes using an NC drill and the copper plating process. ing.
従来のプリント配線板の製造方法において、NCドリル
による穴明は工程や銅めっき工程は、比較的多くの工数
を要するし、場合によっては公害問題がともなうばかり
でなく、昨今のようにプリント配線板の多層化が進み高
密度配線が要求されてくると、スルーホールのドリル加
工による寸法精度やメッキによる接続の信頼性などが大
きな課題となり加工技術的な面からもその要求に対応す
ることが難しくなってきているなどの問題点がある。In the conventional manufacturing method of printed wiring boards, the drilling process using an NC drill and the copper plating process require a relatively large number of man-hours, and in some cases, not only do they cause pollution problems, but also the process of manufacturing printed wiring boards as in recent years. As the number of layers increases and high-density wiring is required, the dimensional accuracy of through-hole drilling and the reliability of connections through plating become major issues, making it difficult to meet these demands from a processing technology perspective. There are some problems, such as:
この発明は、このような事情に鑑みてなされたもので、
レーザビームを用いてスルーホールを形成しドリル加工
や銅めっき工程を省略し、高密度配線が可能で信頼性の
高いプリント配線板を製造する方法を提供するものであ
る。This invention was made in view of these circumstances,
The present invention provides a method for manufacturing a highly reliable printed wiring board that enables high-density wiring by forming through holes using a laser beam and omitting drilling and copper plating steps.
(ロ)発明の構成
この発明のプリント配線板の製造方法は、両面銅張基板
の銅はくの片面もしくは両面の所定箇所にエツチング処
理で銅はく除去部を形成し、この銅はく除去部にレーザ
ビームを照射して基板絶縁層を除去して対応する裏面の
銅はく地肌を露出させた開口部を形成し、この開口部を
介してハンダ付け処理を施こして両面鋼はくを接続し、
スル−ホールを形成することを特徴とする。(B) Structure of the Invention The method for manufacturing a printed wiring board of the present invention includes forming a copper foil removal portion by etching at a predetermined location on one or both sides of the copper foil of a double-sided copper-clad board, and removing the copper foil. The insulating layer of the board is removed by irradiating the area with a laser beam to form an opening that exposes the corresponding copper foil surface on the back side, and soldering is performed through this opening to remove the double-sided steel foil. connect and
It is characterized by forming through holes.
(実施例〕
以下図面に示す実施例に基づいて、この発明を詳述する
。なおこれによってこの発明が限定されるものではない
。(Examples) The present invention will be described in detail below based on the examples shown in the drawings.It should be noted that the present invention is not limited thereto.
製造工程を示す第1図(a)〜(d)において、(1,
1は両面銅張基板、(2a) (2b)は銅は< 、(
3)は基板絶縁層、(6)ははんだである。In Figures 1 (a) to (d) showing the manufacturing process, (1,
1 is a double-sided copper-clad board, (2a) (2b) is copper < , (
3) is a substrate insulating layer, and (6) is a solder.
第1図(alに示す両面銅張基板(11の銅は< (2
a)に第1図(blのようにエツチング処理を施こして
銅はく除去部(4)を形成し、次に、第1図(C)のよ
うにこの銅はく除去部(4)にレーザビームを矢印(^
)方向から照射して基板絶縁層(3)を除去して裏面の
銅は< (2b)の地肌を露出させた開口部(5)を形
成し、さらに、第1図(d)のようにこの開口部(5)
を介してハンダ(6)にて処理を施こして両面の銅は<
(2a) (2b)を接続し、スルーホール(5a)
を形成する。Figure 1 (double-sided copper-clad board shown in al) (11 copper is < (2
A) is subjected to an etching process as shown in FIG. 1 (bl) to form a copper-bladed portion (4), and then this copper-bladed portion (4) is etched as shown in FIG. 1(C). Arrow the laser beam to (^
) to remove the substrate insulating layer (3) and form an opening (5) exposing the copper on the back side (2b), as shown in Figure 1(d). This opening (5)
The copper on both sides is treated with solder (6) through
(2a) Connect (2b) and through hole (5a)
form.
なお、この実施例においては、両面銅張基板として、厚
さ00025flのポリイミドフィルムに35μmの銅
はくを接着した商品名銅張ポリイミドフィルム(東しく
株)製)のフレキシブル基板を使用した。In this example, the double-sided copper-clad substrate used was a flexible substrate manufactured by Copper-clad Polyimide Film (trade name, manufactured by Toshishiku Co., Ltd.), which is a polyimide film with a thickness of 00025 fl and a copper foil of 35 μm adhered thereto.
また、レーザとしては、出力150ワツト、ビーム径1
.6 mmのCO2レーザを使用したが、ビームの出力
と照射時間を設定することにより銅はく(2b)は損傷
せず、絶縁層のみ除去することが可能である。In addition, the laser has an output of 150 watts and a beam diameter of 1
.. Although a 6 mm CO2 laser was used, by setting the beam output and irradiation time, it was possible to remove only the insulating layer without damaging the copper foil (2b).
この実施例によるとフレキシブルな基板にもかかわらず
直径0.8 mmのスルーホール用穴が0.3秒/個の
速度であけることができ、従来のNCドリルによるより
もはるかに高速で一様に加工され、はんだ処理によって
両面の銅はくが確実に接続できることが確認された。According to this example, despite the flexible substrate, through-holes with a diameter of 0.8 mm can be drilled at a speed of 0.3 seconds/piece, which is much faster and more uniform than with a conventional NC drill. It was confirmed that the copper foil on both sides could be reliably connected by soldering.
第2図(al〜(d)は、この発明の他の実施例の製造
工程を示す。FIGS. 2(al) to (d) show the manufacturing process of another embodiment of the present invention.
すなわち、第2図(a)に示す両面銅張基板(11の両
面鋼は< (2a) (2b)に第2図(b)のように
エツチング処理を施こし基板絶縁層(3)を介して相交
互して位置する銅はく除去部(4a) (4b)を形成
し、第2図(C)のようにこの銅はく除去部(4a)
(4b)に基板両面からレーザビームを照射して絶縁層
(3)を除去し、連通ずる開口部(5a) (5b)を
形成すると共に互に裏面の銅はく地肌を露出させて形成
した3枚の基板を、第2図+d)のように各々の開口部
(5a) (5b)が連通ずるように積層しエポキシ樹
脂(7)を介在させ、熱プレスによって接着する。その
後、はんだディップ法によって、連通ずる各開口部(5
a) (5b)にはんだ付処理を施こして工程を終了す
る。That is, the double-sided copper-clad board shown in FIG. 2(a) (the double-sided steel of No. 11 is etched) is etched as shown in FIG. 2(b). As shown in FIG.
(4b) was irradiated with a laser beam from both sides of the substrate to remove the insulating layer (3), forming communicating openings (5a) and (5b) and exposing the copper foil skin on the back side. Three substrates are stacked so that their respective openings (5a) and (5b) communicate with each other as shown in FIG. After that, each communicating opening (5
a) Perform a soldering process on (5b) to complete the process.
この実施例においては、両面銅張基板として、厚さQ、
l +nのエポキシガラス樹脂板に35μmの銅はく
を接着した基板を使用した。レーザとしては出力160
ワツト、ビーム径1.61−のCO2レーザを使用した
が、これによって直径0.8 m−のスルーホール用穴
が0.3秒/個の高速度で一様に精度よく加工され、基
板を積層してもスルーホール穴の位置関係のずれがなく
、はんだ処理によって十分な導通を示すスルーホールが
得られた。In this example, the double-sided copper-clad board has a thickness of Q,
A substrate consisting of a 35 μm copper foil bonded to an 1 + n epoxy glass resin plate was used. Output 160 as a laser
A CO2 laser with a beam diameter of 1.61 mm was used, which uniformly and accurately processed holes for through-holes with a diameter of 0.8 m at a high speed of 0.3 seconds per hole, and the substrate was processed with high precision. There was no deviation in the positional relationship of the through-holes even when stacked, and through-holes with sufficient electrical conductivity were obtained by soldering.
第3〜5図は、第2図に示す実施例に使用されるスルー
ホール形成部のランドの平面図であり、第3〜5図の(
alはすべて基板表面から見たランドであり、各図(b
)は基板表面から基板を透視した対応する裏面のランド
の平面図である。第3図Ta) (b)は交互に銅はく
除去部(4a) (4b)を有し、両面プリント配線板
のスルーホール用ランドとして使用する。3 to 5 are plan views of lands of the through-hole forming portion used in the embodiment shown in FIG.
al are all lands seen from the substrate surface, and each figure (b
) is a plan view of the corresponding land on the back surface when looking through the board from the front surface of the board. Figures 3(a) and 3(b) have alternately copper-bladed portions (4a) and (4b), and are used as lands for through-holes in a double-sided printed wiring board.
第4図(a) (blは交互に片面2箇所の銅はく除去
部(4a) (4a’ )と(4b) (4b’ ”)
を有し多層プリント配線板のスルーホール用ランドとし
て好ましい例である。また、第5図はスルーホールを利
用して部品を取付ける場合のランドを示し、中央に部品
取付用の銅はく除去部(8a) (8b)を備えている
。Fig. 4(a) (bl is the two copper strip removal parts on one side alternately (4a) (4a') and (4b) (4b''')
This is a preferable example as a land for through holes in a multilayer printed wiring board. Moreover, FIG. 5 shows a land in which parts are mounted using through holes, and the land is provided with copper stripping parts (8a) and (8b) for mounting parts in the center.
(ハ)発明の効果
この発明によれば、NCドリル加工および銅メツキ加工
を使用せず、基板にレーザによって穴加工した後、直接
ハンダ処理にてスルーホールを形成するので、加工時間
が短縮されて大幅な工数低減が可能になると共に、加工
精度が大きく向上するため高密度配線や多層のプリント
配線板の製造が可能となる。(C) Effects of the Invention According to the present invention, the through holes are formed by direct soldering after drilling holes in the board with a laser without using NC drilling or copper plating, so the processing time is shortened. This makes it possible to significantly reduce the number of man-hours and greatly improve processing accuracy, making it possible to manufacture high-density wiring and multilayer printed wiring boards.
第1図(al〜(d)はこの発明の一実施例の工程を示
示す部分平面図である。
(ll−−一画面銅張基板、 (2a) (2b)−
・・−銅はく、(3)・・・基板絶縁層、 (4ト
ー銅はく除去部、(5ドースルーホールの開口部、 (
6)・・はんだ。
第1図
b
第2m
b 5bFigures 1 (al to d) are partial plan views showing the steps of an embodiment of the present invention.
...-Copper foil, (3)...Substrate insulating layer, (4 Toe copper foil removed portion, (5 Dose through hole opening, (
6)...Solder. Fig. 1b Fig. 2m b 5b
Claims (1)
所にエッチング処理で銅はく除去部を形成し、この銅は
く除去部にレーザビームを照射して基板絶縁層を除去し
て対応する裏面の銅はく地肌を露出させた開口部を形成
し、この開口部を介してハンダ付け処理を施こして両面
銅はくを接続し、スルーホールを形成することを特徴と
するプリント配線板の製造方法。 2、所定箇所の開口部が、両面銅張基板の片面に形成さ
れる特許請求の範囲第1項記載のプリント配線板の製造
方法。 3、所定箇所の開口部が、両面銅張基板の両面に形成さ
れる特許請求の範囲第1項記載のプリント配線板の製造
方法。 4、所定箇所の開口部が、両面銅張基板の両面から互に
隣接し且つ連通して形成される特許請求の範囲第1項記
載のプリント配線板の製造方法。 5、両面銅張基板が積層され多層プリント配線板として
形成される特許請求の範囲第4項記載のプリント配線板
の製造方法。[Claims] 1. A copper foil removed portion is formed by etching at a predetermined location on one or both sides of the copper foil of a double-sided copper-clad board, and the copper foil removed portion is irradiated with a laser beam to prepare the substrate. The insulating layer is removed to form an opening that exposes the corresponding copper foil surface on the back side, and a soldering process is performed through this opening to connect the double-sided copper foil to form a through hole. A method for manufacturing a printed wiring board, characterized by: 2. The method for manufacturing a printed wiring board according to claim 1, wherein the openings at predetermined locations are formed on one side of the double-sided copper-clad board. 3. The method for manufacturing a printed wiring board according to claim 1, wherein the openings at predetermined locations are formed on both sides of the double-sided copper-clad board. 4. The method of manufacturing a printed wiring board according to claim 1, wherein the openings at predetermined locations are formed adjacent to and communicating with each other from both sides of the double-sided copper-clad board. 5. The method of manufacturing a printed wiring board according to claim 4, wherein double-sided copper-clad substrates are laminated to form a multilayer printed wiring board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5480385A JPS61214497A (en) | 1985-03-18 | 1985-03-18 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5480385A JPS61214497A (en) | 1985-03-18 | 1985-03-18 | Manufacture of printed wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61214497A true JPS61214497A (en) | 1986-09-24 |
JPH0312792B2 JPH0312792B2 (en) | 1991-02-21 |
Family
ID=12980896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5480385A Granted JPS61214497A (en) | 1985-03-18 | 1985-03-18 | Manufacture of printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61214497A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS639194A (en) * | 1986-06-30 | 1988-01-14 | 株式会社日立製作所 | Manufacture of multilayer printed circuit board |
JPH01204497A (en) * | 1988-02-09 | 1989-08-17 | Sony Corp | Manufacture of printed board |
JP2003163465A (en) * | 2002-11-19 | 2003-06-06 | Ibiden Co Ltd | Method for manufacturing printed wiring board |
KR100774894B1 (en) * | 1999-11-11 | 2007-11-08 | 신꼬오덴기 고교 가부시키가이샤 | Semiconductor device |
WO2012108381A1 (en) * | 2011-02-08 | 2012-08-16 | 株式会社村田製作所 | Resin multilayer substrate and method for manufacturing same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5480559A (en) * | 1977-12-09 | 1979-06-27 | Matsushita Electric Ind Co Ltd | Method of producing printed wiring board |
JPS5922393A (en) * | 1982-07-29 | 1984-02-04 | 日本電気株式会社 | Printed circuit board and method of producing same |
-
1985
- 1985-03-18 JP JP5480385A patent/JPS61214497A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5480559A (en) * | 1977-12-09 | 1979-06-27 | Matsushita Electric Ind Co Ltd | Method of producing printed wiring board |
JPS5922393A (en) * | 1982-07-29 | 1984-02-04 | 日本電気株式会社 | Printed circuit board and method of producing same |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS639194A (en) * | 1986-06-30 | 1988-01-14 | 株式会社日立製作所 | Manufacture of multilayer printed circuit board |
JPH0518478B2 (en) * | 1986-06-30 | 1993-03-12 | Hitachi Ltd | |
JPH01204497A (en) * | 1988-02-09 | 1989-08-17 | Sony Corp | Manufacture of printed board |
KR100774894B1 (en) * | 1999-11-11 | 2007-11-08 | 신꼬오덴기 고교 가부시키가이샤 | Semiconductor device |
JP2003163465A (en) * | 2002-11-19 | 2003-06-06 | Ibiden Co Ltd | Method for manufacturing printed wiring board |
WO2012108381A1 (en) * | 2011-02-08 | 2012-08-16 | 株式会社村田製作所 | Resin multilayer substrate and method for manufacturing same |
JPWO2012108381A1 (en) * | 2011-02-08 | 2014-07-03 | 株式会社村田製作所 | Resin multilayer substrate and manufacturing method thereof |
JP5652481B2 (en) * | 2011-02-08 | 2015-01-14 | 株式会社村田製作所 | Resin multilayer substrate and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
JPH0312792B2 (en) | 1991-02-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |