JP2869616B2 - Manufacturing method of circuit wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a circuit wiring board, and more specifically, the present invention relates to a method for manufacturing a drill or laser.
Without fine processing such as via holes by processing, etc.
The present invention relates to a method of manufacturing a multilayer circuit wiring board capable of forming fine wiring patterns and via-hole connections by ordinary exposure / development processing and etching processing.

[0002]

2. Description of the Related Art Conventional techniques for performing fine processing such as via holes on an insulating material used for a circuit wiring board include drill processing, laser processing means and resin etching means. Etc.

[0003] However, it is difficult to obtain a fine hole and an accurate depth by drilling. On the other hand, in the case of a laser processing means, the equipment cost is high and the fine processing of the resinous insulating layer is difficult. Frequent maintenance is required to keep the laser conditions optimal at all times to suit
In addition to the high running cost of the laser device, there are many problems in the mass production method, such as a problem in the insulating characteristics because conductive carbides are easily generated in the laser processed portion.

In the case of resin etching means, since the resin etching liquid contains many substances which are extremely harmful to the human body,
Considerable equipment costs are required to stably and safely organize processes including work, maintenance, management, and waste liquid treatment.

[0005]

SUMMARY OF THE INVENTION Accordingly, the present invention relates to a drill and a laser.
Manufacture of multi-layer circuit wiring board that can form fine wiring pattern and via-hole connection by ordinary exposure / development processing and etching processing without fine processing of via-holes etc. It provides the law.

Therefore, in the method of manufacturing a circuit wiring board according to the present invention, after a required wiring pattern is formed on at least one surface of an insulating base material, a photosensitive insulating adhesive layer is formed on the wiring pattern. Then, the photosensitive insulating adhesive layer is subjected to an exposure treatment to form an unexposed area at a position where a via hole is formed and an exposed area at other positions, and a conductor portion is formed on the unexposed area. After forming another required wiring pattern on the photosensitive insulating adhesive layer so as not to be located, an unexposed area of the photosensitive insulating adhesive layer is removed by a developing process, and then a curing process is applied to the photosensitive insulating adhesive layer. Forming an exposed region of the photosensitive insulating adhesive layer on the insulating layer, and then forming a conductive layer for via hole connection between the exposed wiring pattern and the other wiring pattern. is there.

[0007]

1 (1) to 1 (9) show a manufacturing process diagram of a circuit wiring board according to an embodiment of the present invention. As shown in FIG. 1A, first, required wiring patterns 2 and 3 are formed on one surface of an appropriate insulating base material 1 by an ordinary method. Here, the wiring pattern
The terminals 2 and 3 can also be formed on both surfaces of the insulating base material 1.

Therefore, as shown in FIG. 1B, a photosensitive insulating adhesive layer 4 made of a photosensitive insulating adhesive film is formed on the wiring patterns 2 and 3 by laminating the wiring patterns. By subjecting the adhesive layer 4 to an exposure treatment,
As shown in FIG.
An unexposed area 4A is formed on the portion of the wiring pattern 2 so that a pattern can be formed, and an exposed area 4B is formed in other areas.

At the stage where such an exposure treatment is applied, a conductive foil is adhered, sputtered or sputtered on the photosensitive insulating adhesive layer composed of the unexposed area 4A and the exposed area 4B as shown in FIG. The conductive layer 5 is formed uniformly by plating means or the like.

In order to form another wiring pattern using the conductive layer 5, an etching resist 6 made of, for example, a dry film is laminated on the conductive layer 5 as shown in FIG. By exposing and developing the etching resist 6, the unexposed area 4A for forming a via hole is formed as shown in FIG.
A hole 6A is formed at a position coincident with the above, and a part of the conductive layer 5 is exposed.

Next, as shown in FIG. 7 (7), a portion of the conductive layer 5 exposed to the hole 6A is removed by etching to form a hole 7 by etching, and other necessary wiring patterns are formed. 5A. The etching resist 6 which becomes unnecessary after such an etching process
Is peeled off.

Here, in the case where the other required wiring pattern 5A is formed of conductive ink, the wiring pattern 5A is formed on the photosensitive insulating adhesive layer which has been exposed without forming the conductive layer 5. The wiring pattern 5A can be formed.

Next, as shown in FIG. 8 (8), the unexposed area 4A of the photosensitive insulating adhesive layer is removed by performing a developing process to form a hole 7A for a via hole to form a first layer wiring pattern. The exposed region 4B of the photosensitive insulating adhesive layer is formed in the insulating layer 4C by exposing a part of the negative electrode 2 and performing curing.

Therefore, a conductive layer 8 for via hole connection is formed in the via hole hole 7A by means such as electroless plating, electrolytic plating, sputtering, or adhesion of conductive ink. It is possible to manufacture a multilayer circuit wiring board in which the first wiring pattern 2 and the second wiring pattern 5A are electrically interconnected by a fine via hole.

With respect to the circuit wiring board having the via hole connection obtained in such a step, the wiring pattern having another via hole connection is multilayered by adopting the above-mentioned step. It is easy to perform such a series of steps at a low cost using existing equipment.

In the multilayer circuit wiring board having such a via-hole connection, it is of course possible to form a through-hole connection between the wiring patterns by an ordinary method.

[0017]

In the method for manufacturing a circuit wiring board according to the present invention, since a photosensitive insulating adhesive layer is used as a member for forming an intermediate insulating layer, it is necessary to perform general exposure / development processing and etching processing for a conductive layer. A hole for the via hole can be easily formed, and thus a conductive layer for forming the via hole connection can be easily formed. Such a via hole
Holes after forming the second layer wiring pattern
The wiring pattern of the second layer is made of conductive foil
Etching, sputtering, plating or conductive
This second layer wiring
There is great freedom in pattern formation.

By repeating the method of the present invention, it is easy to make a fine wiring pattern having a via hole connection into a thin multi-layer while reducing the adhesive layer between the constituent members.
Continuation of the process can also be achieved at low cost.

Therefore, the I-type module such as a multi-chip module
This is advantageous as a method for manufacturing a high-performance circuit board on which a C bare chip or the like can be mounted.

[Brief description of the drawings]

FIGS. 1 (1) to 1 (9) are manufacturing process diagrams of a circuit wiring board according to an embodiment of the present invention.

[Description of Signs] 1 Insulating base material 2 Wiring pattern 3 Wiring pattern 4 Photosensitive insulating adhesive layer 4C Insulating layer 5 Conductive layer 5A Other wiring pattern 6 Etching resist 7 Hole 8 For via hole connection Conductive layer

Claims (2)

(57) [Claims] After a required wiring pattern is formed on at least one surface of an insulating base material, a photosensitive insulating adhesive layer is formed on the wiring pattern, and the photosensitive insulating adhesive layer is exposed to light to form a via hole. An unexposed area is formed at the position where the pattern is to be formed, and an exposed area is formed at other positions. Other necessary wiring patterns are formed on the photosensitive insulating adhesive layer so that the conductor is not located on the unexposed area. After forming, the unexposed area of the photosensitive insulating adhesive layer is removed by a development treatment, and then a cured treatment is applied to form the exposed area of the photosensitive insulating adhesive layer on the insulating layer. A method for manufacturing a circuit wiring board, comprising a step of forming a conductive layer for connecting a via hole to the another wiring pattern. 2. The method according to claim 1, wherein the photosensitive insulating adhesive layer is a photosensitive insulating adhesive film.