JPS6373589A - Printed board - Google Patents

Printed board

Info

Publication number
JPS6373589A
JPS6373589A JP21869986A JP21869986A JPS6373589A JP S6373589 A JPS6373589 A JP S6373589A JP 21869986 A JP21869986 A JP 21869986A JP 21869986 A JP21869986 A JP 21869986A JP S6373589 A JPS6373589 A JP S6373589A
Authority
JP
Japan
Prior art keywords
land
conductor
printed circuit
circuit board
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21869986A
Other languages
Japanese (ja)
Inventor
伸一 清田
徹 小泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP21869986A priority Critical patent/JPS6373589A/en
Publication of JPS6373589A publication Critical patent/JPS6373589A/en
Pending legal-status Critical Current

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  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、ランドを含むパターン導体の高密度配線を可
能にしたプリント基板に関するものである。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a printed circuit board that enables high-density wiring of patterned conductors including lands.

〈従来の技術〉 従来のプリント基板の場合は、第5図に示すようにパタ
ーン導体1のランド2部分は、その機能上、導体1の線
幅より大きく、一般に円形として且つその中心をパター
ン導体1が通るように形成しであるため、ランド2の2
箇所(例えば図中、上下)が左右に延びた導体1部分か
ら少々はみ出してしまう。
<Prior Art> In the case of a conventional printed circuit board, as shown in FIG. 5, the land 2 portion of the pattern conductor 1 is functionally larger than the line width of the conductor 1, and is generally circular, with its center pointing toward the pattern conductor. Since it is formed so that 1 passes through, 2 of land 2
A portion (for example, the top and bottom in the figure) protrudes a little from the 1 portion of the conductor extending left and right.

〈発明が解決しようとする問題点〉 このうような従来のプリント基板の場合、例えば、回路
形成上の技術的制約から、形成可能な最小導体幅が0.
5mm、最小導体間隔が0.5mmの場合、ランド2部
分の直径を1.5mmとすると、導体間のワンピッチP
が1.5mmとなってζ隣接する導体1.1間の外縁同
志の間隔は1゜9mmとなる。
<Problems to be Solved by the Invention> In the case of such conventional printed circuit boards, for example, due to technical constraints in circuit formation, the minimum conductor width that can be formed is 0.
5mm, and the minimum conductor spacing is 0.5mm, and if the diameter of the land 2 part is 1.5mm, the one pitch P between the conductors is
is 1.5 mm, and the distance between the outer edges of adjacent conductors 1.1 is 1.9 mm.

従って、−aにランド2が存在する場合、導体形成上の
技術的限度一杯まで導体間隔を狭めた導体配線を行うこ
とは不可能であった。つまり、導体配線の高密度化が困
難であった。
Therefore, when land 2 is present at -a, it is impossible to perform conductor wiring with the conductor spacing narrowed to the maximum technical limit in conductor formation. In other words, it has been difficult to increase the density of conductor wiring.

本発明は、このような従来の実情に鑑みてなされたもの
である。
The present invention has been made in view of such conventional circumstances.

〈問題点を解決するための手段及びその作用〉か\る本
発明の特徴とする点は、従来のようにランドの2箇所(
例えば上下や左右等)がパターン導体の線幅からはみ出
す構成ではなく、ランドを中心にして、左右又は上下等
に延びるパターン導体をランドの適宜部分の一方の側(
最外縁)に合わせて(寄せて)形成したことにある。
<Means for solving the problem and its operation> The feature of the present invention is that unlike the conventional method, two places on the land (
For example, instead of having the pattern conductor extending horizontally, vertically, etc.) from the line width of the pattern conductor, centering on the land, the pattern conductor is placed on one side of the appropriate portion of the land (
This is due to the fact that it is formed in line with (aligned with) the outermost edge.

より具体的には、本発明の場合、ランドを有するパター
ン導体の複数本を同方向に平行して配線した領域のある
プリント基板において、前記ランドを中心にして、左右
又は上下等に延びる両パターン導体の一方(片側)の外
縁を当該ランドの最外縁に合わせて形成したプリント基
板にある。
More specifically, in the case of the present invention, in a printed circuit board that has an area in which a plurality of patterned conductors having lands are wired in parallel in the same direction, both patterns extend horizontally or vertically with the land as the center. This is a printed circuit board in which the outer edge of one (one side) of the conductor is formed to match the outermost edge of the land.

これにより、後述するようにパターン導体間の間隔を最
小導体間隔とすることができ、導体配線の高密度化を図
ることができる。
Thereby, as will be described later, the spacing between the pattern conductors can be set to the minimum conductor spacing, and the density of the conductor wiring can be increased.

〈実施例〉 第1図は本発明に係るプリント基板の一実施例を示した
ものである。
<Embodiment> FIG. 1 shows an embodiment of a printed circuit board according to the present invention.

本プリント基板では、ランド12を有するパターン導体
11の複数本を同方向に平行して配線する場合、ランド
12を中心にして、図中、左右に延びる両パターン導体
の一方11a (図中、左側)はその片側外縁13aを
ランド12の一つの最外縁12a(図中、上方の頂部)
に合わせて(接線として)形成し、パターン導体の他方
11b(図中、右側)はその片側外1113bをランド
12の前記最外縁12aとは反対の対向する最外縁12
b(下方の底部)に合わせて(接線として)形成しであ
る。
In this printed circuit board, when a plurality of pattern conductors 11 having lands 12 are wired in parallel in the same direction, one of the pattern conductors 11a (on the left side in the figure) extends left and right in the figure with the land 12 as the center. ) is the outermost edge 12a of one of the lands 12 (upper top in the figure).
(as a tangent line), and the other side 11b (right side in the figure) of the pattern conductor has its one side outer 1113b aligned with the opposing outermost edge 12 of the land 12 opposite to the outermost edge 12a.
b (lower bottom) and formed (as a tangent).

従って、ランドエ2はパターン導体11の線幅からはみ
出すことはなく、これらのパターン導体11・・におい
て、例えば、形成可能な最小導体幅が0.5mm、最小
導体間隔がQ、5mmの場合であって、ランド12部分
の直径をl、5mmとしても、導体間のワンピッチPを
l、Qn’+mとすることができ、これに伴って、隣接
する導体11.11間の外縁同志の間隔をQ、5mmと
することが可能となる。つまり、導体配線を高密度で行
うことができる。
Therefore, the land area 2 does not protrude from the line width of the pattern conductor 11, and in these pattern conductors 11, for example, when the minimum conductor width that can be formed is 0.5 mm and the minimum conductor interval is Q, 5 mm. Therefore, even if the diameter of the land 12 portion is l, 5 mm, the one pitch P between the conductors can be l, Qn'+m, and accordingly, the distance between the outer edges of adjacent conductors 11 and 11 is Q. , 5mm. In other words, conductor wiring can be performed with high density.

尚、ランドの形状は、上記円形ののちに限定されず、例
えば第2図(A)〜(C)に示したように変形楕円のラ
ンド12′、方形のランド12“、菱形のランド12′
等とすること可能である。
Note that the shape of the land is not limited to the above-mentioned circular shape; for example, as shown in FIG.
etc. is possible.

第3図〜第4図は本発明に係る他のプリント基板の各実
施例を示したものである。
3 and 4 show other embodiments of printed circuit boards according to the present invention.

これらのプリント基板も本質的には、上記第1図の場合
と同様であるが、ランド12を中心にして、図中、左右
に延びる両パターン導体11a。
These printed circuit boards are also essentially the same as those shown in FIG.

11bの方向、ランド12への取付き方、その部位が異
なり、又必要により湾曲型パターン導体11Cを中継用
として入れたケースである。
This is a case in which the direction of the conductor 11b, the way it is attached to the land 12, and its location are different, and a curved pattern conductor 11C is inserted as a relay if necessary.

これらの実施例によっても、導体本数が少ないときには
、上記第1図の場合と同様、やはり、導体間のワンピッ
チPを1.Qmmとすることができる。勿論、これによ
って、隣接する導体11゜11間の外縁同志の間隔を0
.5mmとすることが可能となる。つまり、導体配線を
高密度で行うことができる。
Even in these embodiments, when the number of conductors is small, the one pitch P between the conductors is set to 1. Qmm. Of course, this reduces the distance between the outer edges of adjacent conductors 11 and 11 to 0.
.. It becomes possible to set it to 5 mm. In other words, conductor wiring can be performed with high density.

要するに、本発明では、従来のようにランドの2箇所(
例えば上下や左右等)がパターン導体の線幅からはみ出
す構成ではなく、ランドを中心にして、左右又は上下等
に延びるパターン導体をランドの適宜部分の一方の側(
最外縁)に合わせて(寄せて)形成しておけば、その形
成されたパターン導体の適宜組み合わせることにより、
パターン導体間の間隔を最小導体間隔とすることができ
る。
In short, in the present invention, two places on the land (
For example, instead of having the pattern conductor extending horizontally, vertically, etc.) from the line width of the pattern conductor, centering on the land, the pattern conductor is placed on one side of the appropriate portion of the land (
If the pattern conductors are formed along the outermost edge (outermost edge), then by appropriately combining the formed pattern conductors,
The spacing between pattern conductors can be the minimum conductor spacing.

〈発明の効果〉 以上の説明から明らかなように、本発明によれば、ラン
ドを有するパターン導体の複数本を同方向に平行して配
線した領域のあるプリント基板において、■パターン導
体間の間隔を最小導体間隔にまで狭めた高密度配線のプ
リント基板を得ることができ、■又、このプリント基板
を得にあたって、特別の設備や装置の変更等が必要とさ
れず、従来のままで実施することができ、■更に、例え
ば、回路形成時の歩留まりの向上のため、ランドとパタ
ーン導体とをなだらかな曲線で結ぼうとする場合、本発
明では、第6図(A)に示すようにランド間の横方向の
並びピンチ長さJ、を、第6図(B)に示した従来例の
もののピッチ長さ12に比較して、小さくすることがで
き、この点からも、高密度配線化を達成することができ
る。
<Effects of the Invention> As is clear from the above description, according to the present invention, in a printed circuit board having an area in which a plurality of pattern conductors having lands are wired in parallel in the same direction, ■ the interval between the pattern conductors; It is possible to obtain a printed circuit board with high-density wiring in which the conductor spacing is narrowed to the minimum conductor spacing. Also, in order to obtain this printed circuit board, there is no need to change special equipment or equipment, and it can be carried out as usual. Furthermore, for example, when connecting a land and a pattern conductor with a gentle curve in order to improve the yield during circuit formation, in the present invention, the land and pattern conductor can be connected with a gentle curve as shown in FIG. 6(A). The pinch length J in the horizontal direction between the lines can be made smaller than the pitch length 12 of the conventional example shown in FIG. can be achieved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係るプリント基板の一実施例を示した
概略平面図、第2図(A)〜(C)はランドの他の形状
を示した各概略平面図、第3図〜第4図は本発明に係る
他のプリント基板の各実施例を示した概略平面図、第5
図は従来のプリント基板の一例を示した概略平面図、第
6図(A) 、 (B)は本発明と従来例の効果を比較
した各概略平面図である。 図中、 11・・・パターン導体、 11a・・・パターン導体の一方、 11b・・・パターン導体の他方、 12・・・ランド、 12a、12b・・・ランドの最外縁、1’3a、13
b・・・パターン導体の外縁、特許出願人    藤倉
電線株式会社 第1図 第 2図(A)   第 2図(B) 第2図(C) 第3図 第4図 1b
FIG. 1 is a schematic plan view showing an embodiment of a printed circuit board according to the present invention, FIGS. 2A to 2C are schematic plan views showing other shapes of lands, and FIGS. 4 is a schematic plan view showing each embodiment of another printed circuit board according to the present invention, and FIG.
The figure is a schematic plan view showing an example of a conventional printed circuit board, and FIGS. 6(A) and 6(B) are respective schematic plan views comparing the effects of the present invention and the conventional example. In the figure, 11... Pattern conductor, 11a... One of the pattern conductors, 11b... Other pattern conductor, 12... Land, 12a, 12b... Outermost edge of land, 1'3a, 13
b... Outer edge of pattern conductor, patent applicant Fujikura Electric Wire Co., Ltd. Figure 1 Figure 2 (A) Figure 2 (B) Figure 2 (C) Figure 3 Figure 4 Figure 1b

Claims (2)

【特許請求の範囲】[Claims] (1)ランドを有するパターン導体の複数本を同方向に
平行して配線した領域のあるプリント基板において、前
記ランドを中心にして、左右又は上下等に延びる両パタ
ーン導体の一方(片側)の外縁を当該ランドの最外縁に
合わせて形成したことを特徴とするプリント基板。
(1) In a printed circuit board with an area in which a plurality of patterned conductors each having a land are wired in parallel in the same direction, the outer edge of one (one side) of both patterned conductors extends horizontally, vertically, etc. with the land as the center. A printed circuit board characterized in that a printed circuit board is formed to match the outermost edge of the land.
(2)前記左右又は上下等に延びる両パターン導体の一
方はその片側外縁を当該ランドの一つの最外縁に合わせ
、前記パターン導体の他方はその片側外縁を当該ランド
の前記最外縁とは反対の対向する最外縁に合わせて形成
したことを特徴とする特許請求の範囲第1項記載のプリ
ント基板。
(2) One of the two pattern conductors extending left and right or up and down has one outer edge aligned with the outermost edge of one of the lands, and the other pattern conductor has one outer edge aligned with the outermost edge of the land opposite to the outermost edge of the land. The printed circuit board according to claim 1, wherein the printed circuit board is formed to match the opposing outermost edges.
JP21869986A 1986-09-16 1986-09-16 Printed board Pending JPS6373589A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21869986A JPS6373589A (en) 1986-09-16 1986-09-16 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21869986A JPS6373589A (en) 1986-09-16 1986-09-16 Printed board

Publications (1)

Publication Number Publication Date
JPS6373589A true JPS6373589A (en) 1988-04-04

Family

ID=16724030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21869986A Pending JPS6373589A (en) 1986-09-16 1986-09-16 Printed board

Country Status (1)

Country Link
JP (1) JPS6373589A (en)

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