JPS6267893A - Data for printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to printed circuit board data suitable for increasing the density of circuit patterns and increasing the mounting density of electronic components.

[Prior art]

In recent years, as printed circuit boards have become more dense and mounted, the circuit patterns created on printed circuit boards have become narrower in line spacing and line width (through-hole land patterns are smaller, and circuits are becoming more complex). However, as shown in FIG. 9, the conventional printed circuit board data simply connects the line 2 to the circular land pattern 1. Therefore, based on the above printed circuit board data, When a printed circuit board is manufactured, as shown in FIG. 10, if there is a misalignment between the through hole 3 formed by drilling or the like and the land pattern 1, the circuit may be disconnected. In conventional printed circuit board data for circuit patterns such as those shown in FIGS. 11 to 16, land pattern 1 and line 2 are close to each other.

Therefore, when a printed circuit board is manufactured based on this printed circuit board data, land pattern 1 and line 2 tend to be short-circuited due to etching or printing misalignment of the solder resist, resulting in poor product yield and productivity. It had the disadvantage that it decreased.

[Purpose of the invention]

The present invention has been made in consideration of the above-mentioned conventional problems, and provides data for printed circuit boards that can prevent disconnections and short circuits in circuit patterns on printed circuit boards and improve productivity and product yield of printed circuit boards. The purpose is to provide the following.

[Structure of the invention]

The printed circuit board data of the present invention includes printed circuit board data created using a CAD system, in which a taper is formed at a connecting portion between a land pattern and a line for forming a through hole, and the land pattern is adjacent to the line. The line has data for printed circuit boards that are characterized by the formation of tears.

〔Example〕

Embodiments of the present invention will first be described below with reference to FIGS. 1 and 2. FIG. 1 shows data for a printed circuit board in which a taper 13 is formed based on original data created with a CAD system, and a line 9 is connected to a circular land pattern 8 for forming a through hole. this line 9
Auxiliary lines 10, 10 are provided in a tapered fan shape from the top to the outer periphery of the land pattern 8, thereby forming a taper 13. When a printed circuit board is manufactured based on this printed circuit board data, as shown in FIG. 2, the connecting portion between the land pattern 8 and the line 9 is Expanded into a fan shape. As a result, when the through hole 11 is formed in the land pattern 8 as shown in FIG.
Even if the land pattern 8 is formed with a slight deviation in the direction, the land pattern 8
Therefore, the situation where the circuit of the line 9 is disconnected does not occur.

Note that the above-mentioned taper 13 is applied not only to a land pattern for providing a through hole for forming a through hole, but also for a land pattern for providing a through hole for inserting and attaching components, for example.

Next, each embodiment shown in FIGS. 3 to 7 will be described. Each of these figures is board data in which tiers 12 are formed based on original data created using a CAD system. FIG. 3 shows the line 9 in a region where the land pattern 8 for through holes and the line 9 are close to each other.
By providing the tier 12 in a concave shape, the interval between the land pattern 8 and the line 9 is widened by a certain width,
This prevents short circuits. Similarly to FIG. 3, FIG. 4 is data for a printed circuit board in which line 9 is modified.
The tear 12 widens the distance between the through-hole land pattern 8 and the line 9 by a certain width, thereby preventing short circuits. 5 and 6 show that a tear 12 is formed in a region where the land pattern 8 for through holes and a line 9 are close to each other, and three or more lines are formed away from the land pattern 8. 9... are formed, thereby preventing a short circuit. FIG. 7 shows that in areas where the land patterns 8 and 8 for component insertion holes and component attachment holes and line 9 are narrow, tiers 12 and 12 are formed, respectively, and line 9 is formed in a concave and convex shape. By doing so, a short circuit between the land pattern 8 for the component insertion hole and the component attachment hole and the line 9 is prevented.

Further, FIG. 8 shows data for a printed circuit board in which tapers 13 and tiers 12 are formed together based on original data created by a CAD system. Land patterns 8a and 8b for through holes form line 9 near the outer periphery away from another land pattern 8G for through holes.
A tier 12 is formed by being connected by.

Further, tapers 13, 13 are formed at the connecting portions between the line 9 and the land patterns 8a, 8b.

This prevents a short circuit between the land pattern 8c and the line 9, and also prevents disconnection due to drilling in the land patterns 8a and 8b.

It goes without saying that the taper 13 and the tear 12 can be formed not only on vertical lines and horizontal lines but also on diagonal lines.

〔Effect of the invention〕

In the printed circuit board data of the present invention, a taper is formed at a connecting portion between a land pattern and a line for forming a through hole, and a tear is formed at a line adjacent to the land pattern. As a result, when printed circuit boards are manufactured based on the above printed circuit board data, it is possible to reliably prevent circuit pattern disconnections and short circuits due to etching, disconnections due to misalignment of drilling, and short circuits due to misalignment of solder resist printing. This brings about effects such as improving product yield and productivity.

[Brief explanation of drawings]

1, 3 to 8 are plan views showing embodiments of the present invention, FIG. 2 is a plan view of a printed circuit board manufactured using the printed circuit board data shown in FIG. 1, and FIG. 9 to 1st
FIG. 6 is a plan view of conventional printed circuit board data, which includes FIGS. 1 to 8 of the present invention and FIGS. 9 to 16 of the conventional example.
The figure shows the state in which the figures correspond to each other. 8 is a land pattern, 9 is a line, 10 is an auxiliary line,
11 is a through hole, 12 is a tear, and 13 is a taber. Figure 1 Figure 4 Figure 5 So Figure 6 (-, Warno Figure 7 Figure 12 Figure 13 Figure 141 Figure 15 Figure 16

Claims (1)

[Claims] 1. In the printed circuit board data created with a CAD system, a taper is formed at the connection site between the land pattern and the line for forming the through hole, and a tear is formed at the line that is close to the land pattern. Data for printed circuit boards characterized by: