JPS60154591A - Method of plating contact lead - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a method of plating contact leads in a plug portion of a printed wiring board.

(Prior Art) A conventional method of plating contact leads in a plug portion of a printed wiring board will be described with reference to FIG.

In FIG. 1, 1 is a printed wiring board, and 2 is a plug.

Reference numeral 3 indicates a contact lead, 4 indicated by diagonal lines indicates noble metal plating, and printed wiring board material 6 and plating pattern 5 indicated by broken lines are portions to be removed after plating.

Conventionally, the method of applying precious metal plating 4 on contact leads 3 is to apply plating patterns 5 connected to each of contact leads 3 to printed wiring when printed wiring board 1 is integrated with printed wiring board material 6. After forming the precious metal plating 4 on the plate material 6 and passing a plating current through the plating turn 5, the printed wiring board material 6 on which the plating arm turn 5 is formed is removed. It was done.

However, according to this method, a plating pattern 5 corresponding to each contact lead 3 is required, and unnecessary parts that are removed after plating are also plated with precious metal, which increases the cost of printed wiring boards. This was a contributing factor to the high

In addition, since each of the plating holes and turns 5 and the contact leads 3 are always connected, the contact leads 3 are always in contact with the edges of the connection parts, and the shape of the contact leads 3 to be formed is very limited. There were some drawbacks that made it difficult to understand.

(Object of the Invention) In view of the above-mentioned problems, the object of the present invention is to provide a contact lead plating method that allows the contact lead to take a free shape at the plug and that reduces precious metal plating on unnecessary parts. The goal is to provide the following.

(Structure of the Invention) The present invention provides a method of plating a contact lead formed on a plug portion of a printed wiring board by applying a plating current to the contact lead.
A conductor pattern in which a plurality of contact leads including a contact lead connected to a plating pattern on the printed wiring board material is formed on the plug portion of the printed wiring board, and the contact leads are provided on the printed wiring board. The contact leads are electrically coupled to each other, a plating current is passed through the conductor pattern to plate the contact leads, and then the conductor pattern is cut to electrically separate each of the contact leads. This is a plating method, and will be explained in detail below using examples.

(Example) An example of the present invention will be described using FIG. 2. In the same figure, 1
1 is a printed wiring board, 12 is a plug part, 13 is a contact lead, 14 shown by diagonal lines is precious metal plating, and the plating connector 15 shown by broken lines and the printed wiring board material 16 are removed after the plating process. It is a part.

Further, 17 is a conductor cutter for electrically coupling each of the contact leads 13, and 18 is a conductor pattern cutting hole made with a drill or the like.

In this embodiment, in order to apply precious metal plating 14 to the contact leads 13 having different lead lengths, first, seven contact leads 13 including the contact lead connected to the plating pattern 15 on the outside of the printed wiring board are plated. After electrically coupling each with a conductor pattern 17 and plating by passing a plating current between the plating pattern 15 and the conductor pattern 17, a conductor pattern cutting hole J8 is made with a drill or the like and the conductor is connected. - A method is used in which the contact leads 13 are electrically isolated by cutting the turf 12.

Therefore, the number of plating grooves 15 can be reduced compared to the conventional case, and precious metal plating on unnecessary parts can be reduced.

In addition, since at least one contact lead 13 is required to be connected to the plating connector 15, the IJ-de 13 can be shaped freely so that it does not come in contact with the edge of the plug. There is. For example, in this embodiment, since the lead length of the contact lead 130D can be changed, it is possible to easily form a plug part that allows a power supply sequence to be established when inserting and removing the connector into the connector.

(Effects of the Invention) As explained above using the embodiments, according to the present invention,
A conductor/gutter for electrically coupling the contact lead is provided in the printed wiring board, a plating current is passed between the plating turn on the outside of the printed wiring board and the conductor A turn, and the contact lead is plated, and then the contact lead is plated. Since the conductor pattern is cut to electrically isolate the contact leads, fewer plating and mother turns are required on the outside of the printed wiring board, and precious metal plating on unnecessary parts can be reduced.
It is possible to reduce the cost of printed wiring boards.

In addition, the shape of the contact lead can be freely shaped, for example,
It can be applied to the formation of a plug part that can take a power sequence when inserting and removing from a connector.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram for explaining a contact lead plating method according to the prior art, and FIG. 2 is an explanatory diagram for explaining the present invention in detail. 11...Printed wiring board, 12...Connection part, 13...
Contact lead, 14...Precious metal plating, 15...
・Plating pattern, 16・・Printed wiring board material, 17・
・Conductor "l-n", 18...Conductor, turn cutting hole.

Claims (1)

[Claims] In a method of plating by applying a plating current to a contact lead formed on a plug part of a printed wiring board, a contact lead connected to a plating pattern on a printed wiring board material is connected to a plug part of the printed wiring board. forming a plurality of contact leads including the contact leads, electrically coupling the contact leads with a conductor pattern provided on a printed wiring board, plating the contact leads by passing a plating current through the conductor pattern, and then plating the contact leads with the conductor pattern. A method of plating contact leads, the method comprising cutting the turns and electrically isolating each of the contact leads.