JPS5834774Y2 - Printed circuit board for mounting electronic components - Google Patents

Description

[Detailed description of the invention] The present invention relates to a printed circuit board for mounting electronic components, and when mounting any one of a plurality of electronic components having lead wires of different pitch widths to a printed circuit board, The printed circuit board has an extremely simple structure, and the centers of the different pitch widths are set as a common center, and each lead wire can be mounted to the printed circuit board extremely simply and easily. The purpose is to provide

Conventionally, when attaching any one of a plurality of electronic components having lead wires with different pitch widths to a printed circuit board, the printed circuit board for each lead wire with a different pitch width of each mold component is attached. Each of the lead wire insertion holes is provided with a plurality of lead wire insertion holes that are drilled according to different pitch widths based on one lead wire insertion hole. The center positions of the electronic components are shifted from each other, and when there is a certain space restriction in the printed circuit board, there is a drawback that it is difficult to arrange the electronic components in close proximity to each other.

The present invention is intended to eliminate the above-mentioned drawbacks, and will be described in detail with reference to the drawings.

The mounting of electronic components, which is an embodiment of the present invention shown in FIGS. 1 and 2, will be explained using a printed circuit board. Reference numeral 1 is a printed circuit board, and a point P on the printed circuit board 1 is a common center, Two electronic components A (shown by solid lines in Figure 1-2)
, B (indicated by dotted lines in FIGS. 1 and 2), each lead wire A',
Different pitch widths of B' l A, l B's 1/2 pitch width I A/2. l B/2, each lead wire insertion hole a, a', l) in a right-angled cross shape and symmetrically.

b' is formed in the printed board 1 for mounting electronic components.

In the figure, reference numeral 2 denotes a conductive thin layer (land) made of copper or the like provided on the back surface of the printed circuit board 1 to which the ends of the lead wires A' and B' are soldered.

Since the present invention has the above-described configuration, the lead wires A' and B' of the two electronic components A and H have different pitch widths of 7A.
, IB, each of the lead wires A', B
', with one point P on the printed circuit board 1 as a common center, and a pitch width l A that is 1/2 of the different pitch width I A, l s.
/2. Each lead wire insertion hole a, a', l) is perforated symmetrically in a right-angled cross shape with B/2.

By inserting the lead wires A' and B' into the conductive thin layer 2 of the printed circuit board 1, the two electronic components A and B can be assembled very easily. Moreover, it can be easily attached to the printed circuit board 1.

When applying the present invention, it is particularly important to attach any one of several types of electronic components whose lead wires have different pitch widths to a printed circuit board, such as in a cylindrical container with terminals in the same direction. suitable for implementation.

As mentioned above, the electronic component mounting printed circuit board according to the present invention is suitable for mounting electronic components to which one of a plurality of electronic components, each having a pair of lead wires with different pitch widths, can be attached to the mold side component. In a printed circuit board for use with a printed circuit board, one point on the printed circuit board is used as a common center, and each lead wire is symmetrically arranged in a radial direction from the common center with a pitch width of 1/2 of the pitch width of each lead wire of the plurality of electronic components. The electronic components are mounted on the printed circuit board in which the insertion holes are formed in the printed circuit board, and the center points of the lead wires of the electronic components with different pitch widths are all set as a common center. Not only can each electronic component be easily mounted on a printed circuit board without changing the basic positional relationship with other electronic components, but the pitch of each lead wire can be adjusted while maintaining the same capacitance value or resistance value. A wide variety of electronic components with different widths can be easily replaced and used as substitutes for each other, and each electronic component can be mounted as close as possible to the printed circuit board. Since it can be arranged, it has extremely excellent effects such as making it possible to effectively utilize the space of the printed circuit board.

[Brief explanation of drawings]

Fig. 1 is a plan view of a printed circuit board showing the positional relationship between lead insertion holes of different pitch widths of two electronic components, which is an embodiment of the present invention, and Fig. 2 is a plan view of a printed circuit board showing the positional relationship between lead insertion holes of two electronic components with different pitch widths. FIG. 3 is a vertical sectional view showing the state in which the 1... Printed board, 2... Conductive thin layer, A, B... Electronic component, A', B'...
・Lead wire, lA, lB...Pitch width, a, a
', l), l)'...Lead wire insertion hole.

Claims (1)

[Scope of utility model registration request] Mounting of an electronic component to which any one of a plurality of electronic components having a pair of lead wires with different pitch widths can be mounted is carried out on a printed circuit board, with one point on the printed circuit board as a common center, and the plurality of electronic components are Mounting of an electronic component is configured such that each lead wire insertion hole is drilled in the printed circuit board symmetrically from the common center in the radial direction with a pitch width of 1/2 of the pitch width of each lead wire of the electronic component. printed base.