JPS63104498A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS63104498A JPS63104498A JP24960186A JP24960186A JPS63104498A JP S63104498 A JPS63104498 A JP S63104498A JP 24960186 A JP24960186 A JP 24960186A JP 24960186 A JP24960186 A JP 24960186A JP S63104498 A JPS63104498 A JP S63104498A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- hole
- hole land
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009434 installation Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- DOETVZCFKJCYJV-UHFFFAOYSA-N 6-(4,5-dihydro-1h-imidazol-2-yl)-2-[4-(4,5-dihydro-1h-imidazol-2-yl)phenyl]-1h-indole Chemical compound N1CCN=C1C1=CC=C(C=2NC3=CC(=CC=C3C=2)C=2NCCN=2)C=C1 DOETVZCFKJCYJV-UHFFFAOYSA-N 0.000 description 1
- 101100286286 Dictyostelium discoideum ipi gene Proteins 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント回路基板に係り、特に方向性のある部
品の組込み方向を示すマーク形成iこ関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to printed circuit boards, and particularly to the formation of marks indicating the installation direction of directional components.
第2図は従来のプリント基板を示す。即ち、プリント基
板1には、スルホール2の周りに円形状のスルホールラ
ンド3が形成されている。また方向のある部品、例えば
デュアルインラインパツγ−ジ(f)IP )ICの組
込み方向を示すマークとして、シルク印刷表示4を設け
るか、またはスルホールランド3の近くにパターンを残
すなどのことが行われている。なお、上記手段を施した
ものとして、例えば雑誌「電子材料J 1985年10
月号第13頁に記載されている。FIG. 2 shows a conventional printed circuit board. That is, on the printed circuit board 1, a circular through hole land 3 is formed around the through hole 2. In addition, as a mark to indicate the installation direction of components with a direction, such as dual inline parts (f) ICs, a silk-print display 4 may be provided or a pattern may be left near the through-hole land 3. It is being said. In addition, for example, the magazine "Electronic Materials J October 1985"
It is listed on page 13 of the monthly issue.
部品の組込み方向を示すマークとして、前者のシルク印
刷表示による手段は、このシルク印刷のための工程が増
加し、コスト高になる。また後者のスルホールランドの
近くにパターンを残す手段は、回路パターンの配線の邪
魔になり、パターン設計上の煩わしさがあった。The former method of using silk-screen printing as a mark to indicate the direction in which parts are to be assembled requires an additional process for silk-screen printing, resulting in high costs. In addition, the latter method of leaving a pattern near the through-hole land interferes with the wiring of the circuit pattern, causing trouble in pattern design.
本発明の目的は、シルク印刷が不要で安価にできると共
に、パターン設計も容易にできるプリント回路基板を提
供することにある。An object of the present invention is to provide a printed circuit board that does not require silk printing, can be made inexpensive, and can be easily patterned.
上記目的は、一つあるいは一方のスルホールランド形状
を他のスルホールランド形状と異なる形状に形成するこ
とにより達成される。The above object is achieved by forming one or one of the through-hole lands in a different shape from the other through-hole lands.
例えば14ピンDIP、ICの場合、1ビンのスルホー
ルランド形状を他の13ピンのスルホールランド形状と
異なったものにすることにより、前記1ピンのスルホー
ルランドの位置で方向性が判別でき、DIPIICの組
込み方向のマークとしての機能をもつ。For example, in the case of a 14-pin DIP or IC, by making the through-hole land shape of 1 pin different from the through-hole land shape of the other 13 pins, the directionality can be determined by the position of the through-hole land of the 1 pin, and the DIPI IC It functions as a mark for the installation direction.
以下、本発明の一実施例を第1図により説明する。プリ
ント基板1には例えば1個のI Cに対応する多数のス
ルホール2が設けられている。また一つのスルホールラ
ンド5は角形状に形成され、他のスルホールランド6は
円形状に形成されている。An embodiment of the present invention will be described below with reference to FIG. A printed circuit board 1 is provided with a large number of through holes 2 corresponding to, for example, one IC. Further, one through hole land 5 is formed in a square shape, and the other through hole land 6 is formed in a circular shape.
従って、前記角形状のスルポールランド5によってIC
などの部品の組込み方向が判別でき、部品の組込みが容
易にできる。Therefore, the IC
It is possible to determine the installation direction of parts, such as, and facilitate the installation of parts.
このように、スルポールランド5.6の形状を変えるの
みで部品組込み方向の識別機能が得られ、従来のような
シルク印刷による表示が不要となり、安価にできる。ま
たスルホールランドの近くにパターンを残す必要もない
ので、パターン設計が容易である。In this way, the function of identifying the component installation direction can be obtained by simply changing the shape of the Surpol land 5.6, and the conventional display using silk printing is not required, making it possible to reduce the cost. Further, since there is no need to leave a pattern near the through-hole land, pattern design is easy.
なお、上記実施例においては、一つのスルホールランド
5の形状を角形に形成した場合について説明したが、2
列1組のスルホールランド群の内、左側を角形にし、右
側を円形に形成してもよい。In the above embodiment, the case where one through hole land 5 is formed into a rectangular shape has been described, but two
Of the through-hole land groups in one row, the left side may be square and the right side may be circular.
またスルポールランド5.6の形状は角形、円形に限ら
なく、両者が区別できる形状であれば他の形状の組合せ
でもよい。Further, the shape of the Surpol land 5.6 is not limited to square or circular, but may be a combination of other shapes as long as the two can be distinguished.
本発明によれば、スルホールランド形状で部品組込みの
方向性が判別できるので、シルク印刷lこよる表示が不
要で安価にできると共ζこ、パターン設計が容易である
。According to the present invention, since the direction of component assembly can be determined based on the through-hole land shape, it is not necessary to use silk printing for display, which makes pattern design easier.
第1図は本発明の一実施例を示す平面図、第2図は従来
例の平面図である。FIG. 1 is a plan view showing an embodiment of the present invention, and FIG. 2 is a plan view of a conventional example.
Claims (1)
設けたプリント回路基板において、一つあるいは一方の
スルホールランド形状を他のスルホールランド形状と異
なつた形状に形成したことを特徴とするプリント回路基
板。1. A printed circuit board provided with a group of through-hole lands for mounting directional components, characterized in that one or one of the through-hole lands is formed in a shape different from that of the other through-hole lands. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24960186A JPS63104498A (en) | 1986-10-22 | 1986-10-22 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24960186A JPS63104498A (en) | 1986-10-22 | 1986-10-22 | Printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63104498A true JPS63104498A (en) | 1988-05-09 |
Family
ID=17195444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24960186A Pending JPS63104498A (en) | 1986-10-22 | 1986-10-22 | Printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63104498A (en) |
-
1986
- 1986-10-22 JP JP24960186A patent/JPS63104498A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH04303988A (en) | Printed wiring board | |
JPS63104498A (en) | Printed circuit board | |
JPS58187174U (en) | Printed board | |
JPH0621270Y2 (en) | Printed wiring board | |
JPH04317386A (en) | Assembling method for mounting board | |
JPS6018566U (en) | Connection positioning structure between circuit boards | |
JPS6068671U (en) | printed wiring board | |
JPS5887383U (en) | printed wiring board | |
JPH0639477Y2 (en) | Pin number identification mark for integrated circuit parts | |
JPS5939964U (en) | wiring board | |
JPS60106371U (en) | printed wiring board | |
JPH10135626A (en) | Printed board | |
JPS6180891A (en) | Identification of printed circuit board | |
JPS60192469U (en) | printed wiring board | |
JPS5852895A (en) | Printed circuit board | |
JPS60111060U (en) | Printed circuit board marking | |
JPS5914370U (en) | printed wiring board | |
JPS5944062U (en) | printed wiring board structure | |
JPH04120272U (en) | printed wiring board | |
JPS58166063U (en) | printed wiring board | |
JPH0260186A (en) | Printed board | |
JPS62293795A (en) | Method of forming through-hole land of printed wiring board | |
JPS59159968U (en) | Destination display printed circuit board | |
JPH0742965U (en) | IC flat package mounting structure | |
JPH04111782U (en) | printed wiring board |