JPH053160B2 - - Google Patents
Info
- Publication number
- JPH053160B2 JPH053160B2 JP58016057A JP1605783A JPH053160B2 JP H053160 B2 JPH053160 B2 JP H053160B2 JP 58016057 A JP58016057 A JP 58016057A JP 1605783 A JP1605783 A JP 1605783A JP H053160 B2 JPH053160 B2 JP H053160B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- floating signal
- signal line
- component mounting
- floating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002344 surface layer Substances 0.000 claims description 17
- 239000010410 layer Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、電子計算機等の電子装置に用いられ
る多層配線基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a multilayer wiring board used in electronic devices such as computers.
多層配線基板としては、ガラスエポキシ、ポリ
イミドを基材とした銅貼り基板を積層したもの
や、グリーンシート（末焼結セラミツク）にパタ
ーン印刷し、それを積層して焼結したセラミツク
多層配線基板がある。いずれの多層配線基板であ
つても、部品実装密度が高くなつてくると、デイ
スクリート布線による配線変更は極めて困難にな
る。
Multilayer wiring boards include those made by laminating copper-clad boards based on glass epoxy or polyimide, and ceramic multilayer wiring boards made by printing patterns on green sheets (pre-sintered ceramic), laminating them, and sintering them. be. In any multilayer wiring board, as the component mounting density increases, it becomes extremely difficult to change the wiring using discrete wiring.
この問題に対処するために、部品取付けパツド
と接続しない浮き信号ラインを内層に設け、それ
をスルーホールによつて部品実装側（表側）の表
面層に引き出したセラミツク多層配線基板が実公
昭57−58798号で提案されている。この多層配線
基板は、在来の多層配線基板に比較すれば配線変
更はかなり容易である。しかし、浮き信号ライン
は基板の片面、つまり表側の表面層にしか引き出
されていないため、配線変更個所が局所に集中し
た場合に浮き信号ラインを有効に利用できず、配
線変更が困難になることがあつた。また、部品を
表裏両面に実装した場合、裏側に取り付けた部品
に関する配線変更に浮き信号ラインを利用でき
ず、配線変更は極めて困難であつた。 To deal with this problem, a ceramic multilayer wiring board was developed in which floating signal lines that are not connected to the component mounting pads were provided in the inner layer, and these lines were brought out to the surface layer on the component mounting side (front side) using through holes. Proposed in No. 58798. This multilayer wiring board is considerably easier to change wiring than conventional multilayer wiring boards. However, since the floating signal lines are only drawn out to one side of the board, that is, the front surface layer, if the wiring changes are concentrated in a localized area, the floating signal lines cannot be used effectively, making it difficult to change the wiring. It was hot. Furthermore, when components are mounted on both the front and back sides, floating signal lines cannot be used to change the wiring for components mounted on the back side, making it extremely difficult to change the wiring.
本発明の目的は、上記従来の多層配線基板より
も配線変更を容易かつ自由に行い得るようにした
多層配線基板を提供することにある。
An object of the present invention is to provide a multilayer wiring board that allows wiring to be changed more easily and freely than the conventional multilayer wiring board described above.
本発明は、浮き信号ラインを表側と裏側の両方
の表面層にスルーホールで引き出すことにより、
表裏いずれの側からでも浮き信号ラインを配線変
更に利用できるようにし、上記の目的を達成しよ
うとするものである。
The present invention allows floating signal lines to be drawn out through holes on both the front and back surface layers.
The above object is achieved by making it possible to use the floating signal line for wiring changes from either the front or the back side.
本発明の一実施例について、第１図および第２
図により説明する。本実施例の多層配線基板は片
面実装用のものであり、第１図は部分断面図、第
２図は部品実装面（表側表面層）を示す部分平面
図である。
Regarding one embodiment of the present invention, FIG. 1 and FIG.
This will be explained using figures. The multilayer wiring board of this embodiment is for single-sided mounting, and FIG. 1 is a partial sectional view, and FIG. 2 is a partial plan view showing the component mounting surface (front surface layer).
両図において、５は内層（信号層）に設けられ
た信号ラインであり、スルーホール４によつて基
板の表側と裏側の表面層に引き出され、補修用パ
ツド３と接続される。表側の表面層（部品実装
面）には部品１を取り付けるための部品取付けパ
ツド２が図示のように設けられ、これは対応する
補修用パツド３と接続される。 In both figures, 5 is a signal line provided in the inner layer (signal layer), which is led out to the front and back surface layers of the board through through holes 4 and connected to the repair pad 3. A component mounting pad 2 for mounting a component 1 is provided on the front surface layer (component mounting surface) as shown in the figure, and is connected to a corresponding repair pad 3.
８は内層（信号層）に設けられた浮き信号ライ
ンであり、いずれの部品取付けパツド２とも接続
されない。各浮き信号ライン８はスルーホール７
によつて表側と裏側の表面層に引き出され、補修
用パツド６と接続される。本実施例では、少なく
とも１部の浮き信号ライン８は特定の部品実装領
域の両側にスルーホール７で引き出されている。
第１図、第２図で浮き信号ライン８は内層に設け
られているが、スペースが許せば、表又は裏の表
面層に設けてもよい。勿論この場合もスルーホー
ルによつて表側と裏側の表面層に引き出される。 8 is a floating signal line provided on the inner layer (signal layer) and is not connected to any component mounting pad 2. Each floating signal line 8 has a through hole 7
is pulled out to the front and back surface layers and connected to the repair pad 6. In this embodiment, at least some of the floating signal lines 8 are drawn out through holes 7 on both sides of a specific component mounting area.
Although the floating signal line 8 is provided on the inner layer in FIGS. 1 and 2, it may be provided on the front or back surface layer if space permits. Of course, in this case as well, it is drawn out to the front and back surface layers by the through holes.
ある部品１のあるリードの配線を変更する必要
が生じた場合、そのリードが接続されている部品
取付けパツド２とスルーホール４との接続ライン
を、そのスルーホール４と補修用パツドとの間に
おいてナイフで剥離したり、レーザで溶断するこ
とにより切断する。そして、当該補修用パツド３
と、適当な浮き信号ライン８と接続されている補
修用パツド６とを布線して接続する。このような
作業を行うことにより、浮き信号ライン８を利用
して配線変更を容易に行うことができる。しか
も、浮き信号ライン８は表裏両面に引き出されて
いるので、上記の布線作業を表側と裏側のいずれ
においても行うことができ、布線の集中により浮
き信号ライン８の一部を有効に利用できなくなる
という事態は殆んど回避できる。即ち、配線変更
の自由度が従来よりも大幅に向上し、またその作
業も容易になる。 When it becomes necessary to change the wiring of a certain lead of a certain component 1, the connection line between the component mounting pad 2 to which that lead is connected and the through hole 4 should be changed between the through hole 4 and the repair pad. Cut by peeling with a knife or cutting with a laser. Then, the repair pad 3
and the repair pad 6 connected to the appropriate floating signal line 8 are wired and connected. By performing such work, it is possible to easily change the wiring using the floating signal line 8. Moreover, since the floating signal line 8 is drawn out on both the front and back sides, the wiring work described above can be performed on either the front side or the back side, and by concentrating the wiring, a part of the floating signal line 8 can be used effectively. Most situations where this is not possible can be avoided. In other words, the degree of freedom in changing the wiring is greatly improved compared to the conventional method, and the work is also easier.
また、部品１を跨いで配線するような配線変更
が必要となる場合もあるが、これを布線のみで行
おうとすると、布線距離が長くなるため単線の使
用が許されず、布線作業の工数が増加し、また
NC機器による作業自動化が困難になる。しかし
本実施例では、部品実装領域の両側に浮き信号ラ
イン８を引き出しているため、部品１を跨ぐよう
な配線も補修パツド３，６間の布線と浮き信号ラ
イン８により行うことができ、布線距離を十分に
短縮できるから、単線を用いて布線を能率良く行
うことができるようになり、また布線作業の自動
化も容易になる。また迂回させることなく最短距
離で配線することができ、信号遅延等の面でも有
利である。 In addition, there may be cases where it is necessary to change the wiring such as wiring across component 1, but if you try to do this with only wiring, the wiring distance will be long, so using a single wire is not allowed, and the wiring work will be difficult. Increased man-hours and
It becomes difficult to automate work using NC equipment. However, in this embodiment, since the floating signal lines 8 are drawn out on both sides of the component mounting area, wiring that straddles the component 1 can be performed using the wiring between the repair pads 3 and 6 and the floating signal line 8. Since the wiring distance can be sufficiently shortened, wiring can be efficiently performed using a single wire, and automation of the wiring work can also be facilitated. Furthermore, wiring can be done over the shortest distance without detouring, which is advantageous in terms of signal delay and the like.
本発明の他の実施例を第３図ないし第５図によ
り説明する。第３図は多層配線基板の概略部分断
面図、第４図はその表側表面層を示す部分平面
図、第５図は裏側表面層を示す部分平面図であ
り、各図において第１図および第２図と同等部分
は同符号を付してある。 Another embodiment of the present invention will be described with reference to FIGS. 3 to 5. 3 is a schematic partial sectional view of the multilayer wiring board, FIG. 4 is a partial plan view showing the front surface layer, and FIG. 5 is a partial plan view showing the back surface layer. Parts that are equivalent to those in Figure 2 are given the same symbols.
本実施例は両面実装用であり、部品１を取り付
けるための部品取付けパツド２とその補修用パツ
ド３は表側と裏側の両方の表面層に設けられてい
る。これ以外は前実施例と同様である。 This embodiment is for double-sided mounting, and component mounting pads 2 for mounting components 1 and pads 3 for repair thereof are provided on both the front and back surface layers. Other than this, this embodiment is the same as the previous embodiment.
本実施例においても、表側または裏側に実装さ
れた部品１相互の配線変更を浮き信号ライン８を
利用して容易に行うことができることは明らかで
ある。また、表側に実装された部品１と裏側に実
装された部品１との間の配線変更も、浮き信号ラ
イン８を利用して容易に行うことができることも
明らかである。 It is clear that in this embodiment as well, the floating signal lines 8 can be used to easily change the wiring between the components 1 mounted on the front side or the back side. It is also clear that the floating signal line 8 can be used to easily change the wiring between the component 1 mounted on the front side and the component 1 mounted on the back side.
尚、前記各実施例では一方向の浮き信号ライン
のみに設けているが、２以上の方向の浮き信号ラ
インを設けるようにしてもよい。また本発明は、
ガラスエポキシ、ポリイミドを基材とした多層配
線基板、セラミツクを基材とした多層配線基板の
いずれにも適用できる。 In each of the embodiments described above, floating signal lines are provided in only one direction, but floating signal lines in two or more directions may be provided. Further, the present invention
It can be applied to both multilayer wiring boards based on glass epoxy and polyimide, and multilayer wiring boards based on ceramic.
以上の説明から明らかなように、本発明によれ
ば、基板の両面で配線変更のための布線を行うこ
とができるので、浮き信号ラインを最大限に利用
して配線変更を従来よりも容易かつ自由に行うこ
とができ、また従来極めて困難であつた両面実装
における配線変更も浮き信号ラインを利用して容
易に行うことができる等、多大の効果を得られ
る。
As is clear from the above description, according to the present invention, it is possible to perform wiring for wiring changes on both sides of the board, making the wiring changes easier than before by making full use of floating signal lines. Furthermore, wiring changes in double-sided mounting, which were extremely difficult in the past, can be easily performed by using floating signal lines, and many other effects can be obtained.
第１図は本発明の第１実施例を示す部分断面
図、第２図は同第１実施例の表側表面層を示す部
分平面図、第３図は本発明の第２実施例を示す部
分断面図、第４図は同第２実施例の表側表面層を
示す部分断面図、第５図は同第２実施例の裏側表
面層を示す部分断面図である。
１……部品、２……部品取付けパツド、３，６
……補修用パツド、４，７……スルーホール、５
……信号ライン、８……浮き信号ライン。
FIG. 1 is a partial cross-sectional view showing a first embodiment of the present invention, FIG. 2 is a partial plan view showing a front surface layer of the first embodiment, and FIG. 3 is a partial cross-sectional view showing a second embodiment of the present invention. 4 is a partial sectional view showing the front surface layer of the second embodiment, and FIG. 5 is a partial sectional view showing the back surface layer of the second embodiment. 1... Parts, 2... Parts mounting pad, 3, 6
...Repair pad, 4,7...Through hole, 5
...Signal line, 8...Floating signal line.
Claims (1)
ツドとも接続しない直線状の浮き信号ラインを内
層に部品実装領域の下部を通つて両側に延長して
設けると共に該浮き信号ラインの両端部に浮き信
号ライン用のスルーホールを設け、該スルーホー
ルを介して前記浮き信号ラインを表側および裏側
表面層に引き出したことを特徴とする多層配線基
板。1. A straight floating signal line that is not connected to the component mounting pads on either the front or back surface layer is provided on the inner layer and extends to both sides through the bottom of the component mounting area, and a floating signal line is provided at both ends of the floating signal line. 1. A multilayer wiring board, characterized in that a through hole is provided for the line, and the floating signal line is drawn out to the front and back surface layers through the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58016057A JPS59143394A (en) | 1983-02-04 | 1983-02-04 | Multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58016057A JPS59143394A (en) | 1983-02-04 | 1983-02-04 | Multilayer circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59143394A JPS59143394A (en) | 1984-08-16 |
| JPH053160B2 true JPH053160B2 (en) | 1993-01-14 |
Family
ID=11905945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58016057A Granted JPS59143394A (en) | 1983-02-04 | 1983-02-04 | Multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59143394A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0735374U (en) * | 1993-11-04 | 1995-06-27 | キタノ製作株式会社 | Container with cooking completion indication |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225437A (en) * | 1985-07-25 | 1987-02-03 | Nec Corp | Multilayer interconnection substrate |
| JPS63102399A (en) * | 1986-10-20 | 1988-05-07 | 富士通株式会社 | Multilayer printed interconnection board |
| JPH02143493A (en) * | 1988-11-24 | 1990-06-01 | Nec Corp | Multilayered printed-wiring board for both surface mounting use |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53145062A (en) * | 1977-05-23 | 1978-12-16 | Fujitsu Ltd | Wiring substrate easily capable of modifying wiring |
| JPS55103793A (en) * | 1979-01-31 | 1980-08-08 | Nippon Electric Co | Through hole printed circuit board |
| JPS56114395A (en) * | 1980-02-13 | 1981-09-08 | Nippon Electric Co | Multilayer printed board |
| JPS5752949U (en) * | 1980-09-12 | 1982-03-27 | ||
| JPS5758798U (en) * | 1980-09-24 | 1982-04-07 |
-
1983
- 1983-02-04 JP JP58016057A patent/JPS59143394A/en active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53145062A (en) * | 1977-05-23 | 1978-12-16 | Fujitsu Ltd | Wiring substrate easily capable of modifying wiring |
| JPS55103793A (en) * | 1979-01-31 | 1980-08-08 | Nippon Electric Co | Through hole printed circuit board |
| JPS56114395A (en) * | 1980-02-13 | 1981-09-08 | Nippon Electric Co | Multilayer printed board |
| JPS5752949U (en) * | 1980-09-12 | 1982-03-27 | ||
| JPS5758798U (en) * | 1980-09-24 | 1982-04-07 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0735374U (en) * | 1993-11-04 | 1995-06-27 | キタノ製作株式会社 | Container with cooking completion indication |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59143394A (en) | 1984-08-16 |
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