JP3157875B2 - Multi-layer flexible printed wiring board - Google Patents
Multi-layer flexible printed wiring boardInfo
- Publication number
- JP3157875B2 JP3157875B2 JP30781291A JP30781291A JP3157875B2 JP 3157875 B2 JP3157875 B2 JP 3157875B2 JP 30781291 A JP30781291 A JP 30781291A JP 30781291 A JP30781291 A JP 30781291A JP 3157875 B2 JP3157875 B2 JP 3157875B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flexible printed
- multilayer
- cutting line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Description
【０００１】[0001]
【産業上の利用分野】本発明は、屈曲状態で電子機器等
に取り付けできる可撓性を有する多層フレキシブルプリ
ント配線板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible multi-layer flexible printed wiring board which can be attached to an electronic device or the like in a bent state.
【０００２】[0002]
【従来の技術】近年、電子機器の小型化等に伴って、可
撓性を有するプリント配線板を屈曲させて立体的に取り
付けることが行われている。この種の可撓性プリント配
線板としては、電子部品を実装するための複数個の多層
部相互間を恰もケーブルとして機能するフレキシブル部
により電気的接続した多層フレキシブルプリント配線
板、多層部を硬質プリント配線板材料で構成した複合多
層配線板、極めて薄い硬質板からなる薄型プリント配線
板等が存在する。2. Description of the Related Art In recent years, with the downsizing of electronic devices and the like, flexible printed wiring boards have been bent and attached three-dimensionally. As a flexible printed wiring board of this type, a multilayer flexible printed wiring board in which a plurality of multilayer parts for mounting electronic components are electrically connected to each other by a flexible part that functions as a cable, and the multilayer part is hard printed. There are a composite multilayer wiring board made of a wiring board material, a thin printed wiring board made of an extremely thin hard board, and the like.
【０００３】[0003]
【発明が解決しようとする課題】ところで、この種の可
撓性プリント配線板は、一般に所謂腰が無くハンドリン
グ性の悪いものであり、このような可撓性プリント配線
板にプリント配線板用部品実装機で電子部品のマウント
またはリフローを行う場合、図３に示すように、当該可
撓性プリント配線板（１）は腰が無いためにプリント配
線板用部品実装機の搬送用レール（２）上で撓んでしま
い、チップ部品の打ち込みによる表面実装やソルダーペ
ーストの印刷等の作業が非常に困難となる。By the way, this kind of flexible printed wiring board is generally so-called rigid and has poor handling properties. When mounting or reflowing an electronic component with a mounting machine, as shown in FIG. 3, the flexible printed wiring board (1) has no stiffness, so that the transport rail (2) of the printed wiring board component mounting machine is used. This makes it extremely difficult to perform operations such as surface mounting by driving in chip components and printing of solder paste.
【０００４】そこで、図４に示すように、可撓性プリン
ト配線板（１）をパレット板（３）上に載置してガイド
ピン（４）により固定し、このパレット板（３）を搬送
レール（２）上に載せて搬送し、可撓性プリント配線板
（１）の表側の一面に部品を実装する手段が一般に採用
されている。Therefore, as shown in FIG. 4, a flexible printed wiring board (1) is placed on a pallet board (3) and fixed with guide pins (4), and the pallet board (3) is transported. In general, means for transporting a product on a rail (2) and mounting components on one surface of the front side of the flexible printed wiring board (1) is generally employed.
【０００５】然し乍ら、一面に部品を実装した可撓性プ
リント配線板（１）を裏向けてパレット板（３）上に載
置することはできないので、片面実装しかできない重大
な問題が残存している。また、高密度実装等の点からど
うしても両面実装しなければならない場合には、図４の
ようにパレット板（３）を用いて実装機で一面に所要部
品の表面実装を施した後に、他面には手付け部品を手作
業により取り付けており、この部品取付作業は、可撓性
プリント配線板に腰が無いために極めて煩雑であり、非
常に非能率である。However, since a flexible printed wiring board (1) having components mounted on one side cannot be placed face down on a pallet board (3), there remains a serious problem that only one-side mounting is possible. I have. If it is absolutely necessary to mount both sides in terms of high-density mounting, etc., as shown in FIG. Are manually attached, and the work of attaching the parts is extremely complicated and inefficient because the flexible printed wiring board has no rigidity.
【０００６】そこで本発明は、特別な部材を用いること
なくプリント配線板用部品実装機により両面に部品の表
面実装を行えるとともに、実装後の後工程においてプリ
ント配線板自体に損傷等を与えることのない構成を備え
た多層フレキシブルプリント配線板を提供することを技
術的課題とするものである。In view of the above, the present invention provides a component mounting machine for printed wiring boards that can perform surface mounting of components on both sides without using any special member, and also performs pre-mounting in a post-process after mounting.
An object of the present invention is to provide a multilayer flexible printed wiring board having a configuration that does not damage the printed wiring board itself .
【０００７】[0007]
【課題を解決するための手段】本発明は、上記課題を達
成するための技術手段として、部品実装用の複数個の多
層部相互間をケーブルとして機能するフレキシブル部に
より電気的接続しかつ該フレキシブル部のみにより機械
的に連結した多層フレキシブルプリント配線板本体に、
部品実装配線用の所定箇所を囲む切断線を形成し、前記
多層フレキシブルプリント配線板本体の一面における前
記切断線の外側の余白部分に、該配線板本体を張った状
態で硬質素材からなる補強枠を貼着したことを特徴とす
る多層フレキシブルプリント配線板。According to the present invention, as a technical means for achieving the above object, a flexible portion which functions as a cable between a plurality of multilayer portions for component mounting is more electrically connected. Connected and machine only by the flexible part
To the multi-layer flexible printed wiring board body
Forming a cutting line surrounding a predetermined portion for component mounting wiring, a reinforcing frame made of a hard material in a state where the wiring board main body is stretched in a blank portion outside the cutting line on one surface of the multilayer flexible printed wiring board main body. A multilayer flexible printed wiring board characterized by having affixed thereto.
【０００８】また、本発明は、上記課題を達成するため
の他の技術的手段として、切断線を 多層フレキシブルプ
リント配線板自体のサイズに合致して形成したことを特
徴として構成されている。 [0008] Further , the present invention is to achieve the above object.
Another technical measure is to cut the cutting line with a multilayer flexible
Specially, it is formed to match the size of the lint wiring board itself.
It is configured as a sign.
【０００９】[0009]
【作用】この多層フレキシブルプリント配線板をそのま
ま搬送レール上に載せてプリント配線板用部品実装機に
供給することにより、多層フレキシブルプリント配線板
本体自体は腰の無いハンドリング性の悪いものである
が、補強枠により常に張った状態に保持されているの
で、特別な部材を用いることなくそのままで支障無く搬
送でき、且つ部品実装機によるチップ部品の打ち込みに
よる表面実装等も支障なく行える。また、部品の実装部
分は補強枠内に有るので、両面への表面実装も容易に行
われる。部品実装後に切断線に沿って配線板本体の余白
部分を切断除去する時に、補強枠も共に簡単に除去でき
るので、機器等に取り付け時に支障を来すことは一切な
い。また、切断線を多層フレキシブルプリント配線板自
体のサイズに合致して形成しているので、この切断線に
沿って切断するだけで、所望のサイズとすることができ
る。更に、切断線に沿って切断するだけで、外側の余白
部分とそれに貼着された補強枠を簡単に除去できるの
で、多層フレキシブルプリント配線板、特にケーブルと
して機能するフレキシブル部を損傷することなく、かつ
実装された部品が外れたり、部品と配線板との接続部分
に接続不良が発生するといった不具合の発生を防止する
ことができる。 The multilayer flexible printed wiring board itself is placed on a transport rail and supplied to a printed wiring board component mounter, so that the multilayer flexible printed wiring board body itself is rigid and has poor handling properties. Since it is always held in a stretched state by the reinforcing frame, it can be transported without any trouble without using any special member, and the surface mounting or the like by driving the chip component by the component mounting machine can be performed without any problem. In addition, since the component mounting portion is in the reinforcing frame, surface mounting on both surfaces is easily performed. When cutting and removing the margin of the wiring board main body along the cutting line after mounting the components, the reinforcing frame can be easily removed together, so that there is no hindrance at the time of mounting to a device or the like. Further, since the cutting line is formed so as to match the size of the multilayer flexible printed wiring board itself, it is possible to obtain a desired size simply by cutting along the cutting line. In addition, just cut along the cutting line to get the outer margin
The part and the reinforcement frame attached to it can be easily removed
With multilayer flexible printed wiring boards, especially cables
Without damaging the flexible part that functions as
Mounted parts may come off or the parts may be connected to the wiring board
To prevent problems such as connection failures
be able to.
【００１０】[0010]
【実施例】以下、本発明の好適な一実施例について図面
を参照しながら詳細に説明する。図１（ａ），（ｂ）は
本発明の一実施例の正面図および底面図、図２は分解斜
視図をそれぞれ示す。本発明の多層フレキシブルプリン
ト配線板は、多層フレキシブルプリント配線板本体（１
０）と補強枠（１３）とから構成されている。そして、
この実施例では、可撓性プリント配線板本体（１０）と
して、内層導体パターンと外層導体パターンとが積層さ
れた３個の多層部（１１）とこの多層部（１１）相互間
を電気的接続して恰もケーブルとして機能する２個のフ
レキシブル部（１２）とを備えた既存の多層フレキシブ
ルプリント配線板と略同様のものを例示してある。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below in detail with reference to the drawings. 1A and 1B are a front view and a bottom view of an embodiment of the present invention, and FIG. 2 is an exploded perspective view. Multilayer flexible printed <br/> preparative wiring board of the present invention, a multilayer flexible printed circuit board body (1
0) and a reinforcing frame (13). And
In this embodiment, as a flexible printed wiring board main body (10), three multilayer portions (11) in which an inner layer conductor pattern and an outer layer conductor pattern are laminated are electrically connected to each other. In this case, the same as an existing multilayer flexible printed wiring board having two flexible portions (12) functioning as a cable is illustrated.
【００１１】また、補強枠（１３）は、硬質で且つ耐熱
性を有する素材、例えばガラスエポキシにより矩形枠状
に形成されており、フレキシブル部（１２）を十分に張
った状態の多層フレキシブルプリント配線板本体（１
０）の外形と略同一の外形を有している。そして、フレ
キシブル部（１２）を十分に張った状態の多層フレキシ
ブルプリント配線板本体（１０）の一面の外周部に補強
板（１３）が粘着テープ等の接着部材（図示せず）によ
り貼着されている。また、各多層部（１１）には、補強
枠（１３）内側に沿ってミシン目（１４）が加工されて
いる。即ち、この多層フレキシブルプリント配線板本体
（１０）は、既存の多層フレキシブルプリン配線板の周
囲に余白部を設け、この余白部と部品実装配線用の所要
箇所との間にミシン目（１４）が形成され、前述の余白
部分が補強枠（１３）の貼り代になっている。The reinforcing frame (13) is formed in a rectangular frame shape from a hard and heat-resistant material, for example, glass epoxy, and has a multilayer flexible printed wiring with a flexible portion (12) fully stretched. Board body (1
The outer shape is substantially the same as the outer shape of 0). Then, the multilayer flexi in a state where the flexible portion (12) is sufficiently stretched.
A reinforcing plate (13) is adhered to an outer peripheral portion of one surface of the bull- printed wiring board body (10) by an adhesive member (not shown) such as an adhesive tape. Further, perforations (14) are formed in each of the multilayer portions (11) along the inside of the reinforcing frame (13). That is, the multi-layer flexible printed wiring board main body (10) is provided with a margin around the existing multi-layer flexible printed wiring board, and a perforation (14) is formed between the margin and a necessary part for component mounting wiring. The above-mentioned blank portion is formed as a margin for attaching the reinforcing frame (13).
【００１２】従って、この補強枠（１３）を一体に備え
た多層フレキシブルプリント配線板を図１（ａ）に示す
ように搬送レール（２）上に載せてプリント配線板用部
品実装機に供給することにより、多層フレキシブルプリ
ント配線板本体（１０）自体は腰の無いハンドリング性
の悪いものであるが、補強枠（１３）により張った状態
に保持されているので、支障無く搬送され、且つ実装機
によるチップ部品の打ち込みによる表面実装等も支障な
く行われる。また、部品の実装部分は補強枠（１３）内
に有るので、両面への表面実装も容易に行われる。部品
実装後は、ミシン目（１４）に沿って切断することによ
り配線板本体（１０）の余白部分と共に補強枠（１３）
を簡単に除去できるので、多層フレキシブルプリント配
線板、特にケーブルとして機能するフレキシブル部を損
傷することなく、かつ実装された部品が外れたり、部品
と配線板との接続部分に接続不良が発生するといった不
具合の発生を防止することができる。従って、製品に取
り付け時に支障を来すことは一切ない。Therefore, as shown in FIG. 1A, the multilayer flexible printed wiring board integrally provided with the reinforcing frame (13) is placed on the transport rail (2) and supplied to the printed wiring board component mounter. Accordingly, the multilayer flexible printed wiring board body (10) itself is rigid and has poor handling properties, but is held in a stretched state by the reinforcing frame (13), so that it is transported without any trouble and the mounting machine is mounted. Surface mounting, etc., by driving chip components into the device. In addition, since the component mounting portion is in the reinforcing frame (13), surface mounting on both surfaces can be easily performed. After the components are mounted, the reinforcing frame (13) is cut along the margins of the wiring board body (10) by cutting along the perforations (14).
It is possible to easily remove, multilayer flexible printed wiring
Damage to the wire plate, especially the flexible part that functions as a cable
Without damage, the mounted parts may come off or
Connection failure between the cable and the wiring board
The occurrence of the condition can be prevented. Therefore, there is no trouble at the time of attachment to the product.
【００１３】尚、補強枠（１３）の厚みや幅は、多層フ
レキシブルプリント配線板本体（１０）の大きさや材質
により異なるが、例えば、４層の多層フレキシブルプリ
ント配線板の場合、これの１０パーセント程度の幅で且
つ０．８ｍｍ以上の厚みに形成するのが好ましい。ま
た、補強枠（１３）のサイズを、多層フレキシブルプリ
ント配線板本体（１０）の大きさに拘わらず標準化すれ
ば、プリント配線板用部品実装機の自動化の標準が容易
となる。この場合、多層フレキシブルプリント配線板本
体（１０）は、多層フレキシブルプリント配線板自体の
サイズに合致させてミシン目（１４）が形成されている
ので、サイズの小さなものにおいては補強枠（１３）の
貼り代と共に破棄される余白部分が僅かに大きくなるだ
けで何ら支障は生じない。The thickness and width of the reinforcing frame (13) are determined by the multilayer
Although it depends on the size and material of the flexible printed wiring board main body (10), for example, in the case of a four-layer multi-layer flexible printed wiring board, it is preferable to form the flexible printed wiring board with a width of about 10% and a thickness of 0.8 mm or more. . If the size of the reinforcing frame (13) is standardized irrespective of the size of the multilayer flexible printed wiring board main body (10), it becomes easy to standardize the automation of the component mounting machine for printed wiring boards. . In this case, since the perforations (14) are formed in the multilayer flexible printed wiring board main body (10) in conformity with the size of the multilayer flexible printed wiring board itself, the reinforcing frame (13) is not used for small-sized ones. There is no problem if the margin portion discarded together with the pasting margin becomes slightly larger.
【００１４】[0014]
【発明の効果】以上のように本発明の多層フレキシブル
プリント配線板によれば、多層フレキシブルプリント配
線板を張った状態でこれの一面に硬質の補強枠を一体に
貼着した構成としたので、配線板本体は補強枠により常
に張った状態に保持されるので、特別な部材を用いるこ
となくそのままで部品実装機によるチップ部品の表面実
装等を支障無く行うことができ、しかも、部品の実装箇
所が補強枠内に存在するので、両面への表面実装も容易
に行うことができる。つまり、従来のプリント配線板と
同様の両面部品実装等の製造工程が適用可能となる。ま
た、補助枠のサイズを標準化すれば、多層フレキシブル
プリント配線板自体のサイズが異なっても、同様の部品
実装工程が適用できる。更に、配線板本体における補強
枠内の部分に切断線が形成されているので、部品実装後
に切断線に沿って切断することにより、余白部分と共に
補強枠を除去できるので、機器への取付時等に支障にな
ることもない。また、切断線は、多層フレキシブルプリ
ント配線板自体のサイズに合致して形成されているの
で、この切断線に沿って切断するだけで、所望のサイズ
とすることができる。更に、切断線に沿って切断するだ
けで、外側の余白部分とそれに貼着された補強枠を簡単
に除去できるので、多層フレキシブルプリント配線板、
特にケーブルとして機能するフレキシブル部を損傷する
ことなく、かつ実装された部品が外れたり、部品と配線
板との接続部分に接続不良が発生するといった不具合の
発生を防止することができる。 As described above, according to the multilayer flexible printed wiring board of the present invention, a rigid reinforcing frame is integrally attached to one surface of the multilayer flexible printed wiring board in a state where the multilayer flexible printed wiring board is stretched. Since the wiring board body is always held in a stretched state by the reinforcing frame, the surface mounting of the chip component by the component mounting machine can be performed without any trouble without using a special member. Exists in the reinforcing frame, so that surface mounting on both sides can be easily performed. That is, a manufacturing process such as double-sided component mounting similar to that of a conventional printed wiring board can be applied. If the size of the auxiliary frame is standardized, the same component mounting process can be applied even if the size of the multilayer flexible printed wiring board itself is different. Furthermore, since the cutting line is formed in the portion of the wiring board body inside the reinforcing frame, the reinforcing frame can be removed together with the blank portion by cutting along the cutting line after mounting the components, so that the mounting frame can be removed when the device is mounted. There is no hindrance. Further, since the cutting line is formed to match the size of the multilayer flexible printed wiring board itself, it is possible to obtain a desired size simply by cutting along the cutting line. Then cut along the cutting line
The outer margin and the reinforcing frame attached to it
Can be removed in a multilayer flexible printed wiring board,
Especially damage the flexible part that functions as a cable
The mounted components can be removed without any
Malfunctions such as poor connection at the connection with the board
Generation can be prevented.
【図１】（ａ），（ｂ）は本発明の一実施例の正面図お
よび底面図である。1A and 1B are a front view and a bottom view of an embodiment of the present invention.
【図２】同上、分解斜視図である。FIG. 2 is an exploded perspective view of the same.
【図３】多層フレキシブルプリント配線板をそのまま搬
送レールに載せた場合の状態を示す斜視図および正面図
である。FIGS. 3A and 3B are a perspective view and a front view showing a state where the multilayer flexible printed wiring board is directly mounted on a transport rail.
【図４】従来の可撓性プリント配線板への部品実装手段
を示す斜視図である。FIG. 4 is a perspective view showing a conventional means for mounting components on a flexible printed wiring board.
１０ 多層フレキシブルプリント配線板本体 １１ 多層部 １２ フレキシブル部 １３ 補強枠 １４ ミシン目（切断線） DESCRIPTION OF SYMBOLS 10 Multilayer flexible printed wiring board main body 11 Multilayer part 12 Flexible part 13 Reinforcement frame 14 Perforation (cutting line)
Claims (2)
ーブルとして機能するフレキシブル部により電気的接続
しかつ該フレキシブル部のみにより機械的に連結した多
層フレキシブルプリント配線板本体に、部品実装配線用
の所定箇所を囲む切断線を形成し、前記多層フレキシブ
ルプリント配線板本体の一面における前記切断線の外側
の余白部分に、該配線板本体を張った状態で硬質素材か
らなる補強枠を貼着したことを特徴とする多層フレキシ
ブルプリント配線板。1. A multi <br/> layer flexible printed wiring board which is mechanically linked only by a more electrically connected to the flexible portion and the flexible portion that serves a plurality of the inter-multi-layer section cross as a cable for component mounting In the main body, a cutting line surrounding a predetermined portion for component mounting wiring is formed, and in a blank portion outside the cutting line on one surface of the multilayer flexible printed wiring board main body, a hard material is stretched with the wiring board main body stretched. A multilayer flexible printed wiring board characterized by having a reinforcing frame attached thereto.
配線板自体のサイズに合致して形成されている請求項１
に記載の多層フレキシブルプリント配線板。2. The multi-layer flexible printed wiring board according to claim 1, wherein the cutting line is formed in accordance with the size of the multi-layer flexible printed wiring board itself.
4. The multilayer flexible printed wiring board according to the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30781291A JP3157875B2 (en) | 1991-11-22 | 1991-11-22 | Multi-layer flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30781291A JP3157875B2 (en) | 1991-11-22 | 1991-11-22 | Multi-layer flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05145203A JPH05145203A (en) | 1993-06-11 |
| JP3157875B2 true JP3157875B2 (en) | 2001-04-16 |
Family
ID=17973516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30781291A Expired - Fee Related JP3157875B2 (en) | 1991-11-22 | 1991-11-22 | Multi-layer flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3157875B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8378237B2 (en) * | 2008-11-10 | 2013-02-19 | Ibiden Co., Ltd. | Multi-piece board and fabrication method therefor |
-
1991
- 1991-11-22 JP JP30781291A patent/JP3157875B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05145203A (en) | 1993-06-11 |
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