JPH11347855A - Attaching/detaching method of parts for printed board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the attaching/detaching method of parts for a printed board by which the parts can accurately be attached to and can easily be detached from a device. SOLUTION: A heat sink 3 adhered to a device 2 mounted on a printed board 1 is constituted by providing a notch part 6 for forming an insertion part 7 between the installed surface 2a of the device 2 and the heat sink 3 and adhered to the device 2 through a printed part suggesting own outline provided on the upper surface of the printed board 1 including the device 2, at the attaching time to the device 2 and detached while peel off from the device 2 by inserting a flat tip screw driver into the insertion part 7, at the detaching time from the device 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of attaching and detaching a printed circuit board component to be mounted on a device mounted on a printed circuit board. The present invention relates to a method of attaching and detaching a printed circuit board component that can be detached from the main body.

[0002]

2. Description of the Related Art In recent years, as devices such as processors and various controllers have become smaller and have higher performance, the amount of heat generated by the devices has increased and some kind of device cooling method has been required. Therefore, as a method of simply cooling such a device, a method of mounting a heat sink on the device or cooling the device by blowing air is used. For example, when the above heat sink is mounted, the device and the heat sink are fixed with a stopper, or the device and the heat sink are fixed with an adhesive such as a bond. 63-29999, and JP-A-7-106767).

[0003]

However, in the former method of fixing the device and the heat sink with a stopper, there is an advantage that the device can be easily attached and detached because the device and the heat sink are fixed by the stopper. There is a problem that the score increases and the cost increases. In addition, as the number of components increases, more occupied space is required, and there is also a problem that it is difficult to arrange the components on a printed circuit board, which has many restrictions on the arrangement space. On the other hand, the latter method of fixing the device and the heat sink with an adhesive does not cause the same problem as the former method since the mounting is performed with the adhesive, but conversely has a problem that it is difficult to attach and detach.

In addition, there is a problem that the mounting position is unclear because the heat sink becomes larger than the mounted device due to the miniaturization of the device, and it becomes difficult to remove the device from the device. If you try to remove it forcibly, a large load will be applied to the joint between the printed circuit board and the device, and there is a risk that the joint between the two may be damaged, so using a tool such as a flathead screwdriver, However, since the tool does not easily enter between the device and the heat sink, the printed circuit board and the device may be damaged by the tool.

Accordingly, the present invention provides a printed circuit board component, such as a heat sink, larger than a device, which can be easily adjusted to an accurate position, and which is larger than the device. It is intended to provide a method of attaching and detaching a printed circuit board component that can be easily peeled off even when a component is mounted.

[0006]

Means for Solving the Problems A structure in which a printed board component to be bonded to a device mounted on a printed board is provided with a notch for forming an insertion portion of a peeling tool between the component and a mounting surface of the device. When attached to a device, it is attached and attached to the device via positioning means that suggests its own contour line provided on the upper surface of the printed circuit board including the device, and when detached from the device, it is attached to the insertion section. Insert a peeling tool, peel off the device and remove. With this configuration, even if the printed circuit board component is larger than the device and the device cannot be confirmed, the mounting can be performed while confirming the mounting position by the positioning means. Further, when detaching, a peeling tool may be inserted into the insertion portion and peeled from the device.

The positioning means may be a printing unit,
Further, it may be a peripheral component arranged on a printed circuit board. In the case of such a configuration, when the positioning section is a printing section, the printing section is drawn by this printing section.
For example, when the positioning part is a peripheral component disposed on a printed circuit board while being adhered to the contour line, the bonding to the device is performed using the position of the peripheral component as a mark. Here, as the component for a printed board, for example, a heat sink for cooling a device mounted on the printed board may be mentioned.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. FIGS. 1 to 5 show a first embodiment of the present invention. In FIG.
The printed circuit board 1 includes, for example, a BGA having a relatively low height.
A device 2 such as (BallGA) is mounted. A printed portion 4 (positioning means) showing an outline of a heat sink 3 (a component for a printed board) is drawn on the printed board 1 by silk printing so as to surround the device 2.

Then, a heat sink 3 larger than the device 2 is arranged in accordance with the printing section 4, and as shown in FIG.
a. In addition, as long as the printing unit 4 can indicate the contour of the heat sink 3, various modes such as a dotted line, a broken line, and a hatching line can be adopted.

As shown in FIGS. 2 to 4, the heat sink 3 is, for example, a component made of aluminum or the like. The heat sink 3 generates heat when adhered to the mounting surface 2a of the device 2.
Is to cool. The upper surface of the heat sink 3 has an uneven heat radiating portion 3a having a large surface area to enhance the heat radiating effect.
The back surface of the heat sink 3 is
Has an adhesive surface 3b which comes into contact with the mounting surface 2a. A cutout 6 extending from the center of one side toward the center of the heat sink 3 is formed on the back side of the heat sink 3. As shown in FIG. 4, the notch 6 forms an insertion portion 7 of a flathead screwdriver D (peeling tool) between the notch 6 and the mounting surface 2a of the device 2 in a state where the notch 6 is mounted on the device 2. is there. In addition, as shown in FIG.
The mark M (positioning means) is attached to the printed portion 4 drawn on the printed circuit board 1 in order to indicate the position.

Therefore, the heat sink 3 is attached to the device 2.
When attaching the device 2, as shown in FIG.
When the adhesive 5 is applied to the mounting surface 2a of the device and the heat sink 3 is bonded with the printed portion 4 of the printed circuit board 1 as a mark and the mark M is oriented so that the mark M matches the notch 6, the heat sink 3 is larger than the device 2. Therefore, the device 2 itself is bonded in a state where the device 2 itself cannot be confirmed, but the heat sink 3 is bonded to the device 2 at an appropriate position by the printing unit 4 indicating a proper position. Therefore, the correctly positioned heat sink 3 can exhibit the cooling effect as set without contacting the peripheral components. In addition, there is an advantage that the printed portion 4 drawn on the printed circuit board 1 makes it possible to easily determine that the heat sink 3 is mounted at the time of manufacturing.

Next, a case where the heat sink 3 is removed from the device 2 will be described. Specifically, between the heat sink 3 and the device 2 mounted as described above,
Adhesive surface 3b of heat sink 3 and mounting surface 2a of device 2
Is formed between them. Therefore, as shown in FIG. 4, if a flathead screwdriver D is inserted here and the heatsink 3 is pushed up by the flathead screwdriver D, the heat sink 3 can be easily peeled off from the device 3 without damaging the joint portion between them. it can. In this way, the heat sink 3 can be mounted in a state where it is accurately positioned with respect to the device 2, and can be easily removed. In particular, in this embodiment, since the occupied area of the heat sink 3 is clearly indicated by the printing unit 4, the arrangable range of the peripheral mounting components is clear, and the position setting of the peripheral mounting components is easy. There is a merit.

Next, a second embodiment of the present invention will be described with reference to FIG. The heat sink 8 in this embodiment is smaller in size than the device 2. When such a heat sink 8 is mounted on the device 2, the printed portion 4 indicating the outline of the heat sink 3 in the first embodiment is drawn on the mounting surface 2 a which is the upper surface of the device 2. In addition, even in this heat sink 8, the first
As in the embodiment, a notch 6 is provided, and an insertion portion 7 is formed between the device 2 and the notch 6.

Therefore, also in this embodiment, the heat sink 8 can be adhered to an accurate position by using the printed portion 4 on the upper surface of the device 2 as a mark, and the removal operation can be easily performed by the insertion portion 7. . In particular, in this embodiment, the printed portion 4 is drawn on the device 2 to indicate that the heat sink 3 is mounted, so that attention can be drawn in the manufacturing process.

The present invention is not limited to the above-described embodiment. Instead of employing the printing unit 4 as the positioning means, the present invention is not limited to the mounting parts such as resistors and ceramic capacitors arranged around the device 2. Peripheral mounting components may be arranged so as to serve as landmarks to indicate the outline of the heat sink 3. Further, the printed circuit board component is not limited to the heat sink, but may be any other component, as long as it is a component mounted on a component mounted on the printed circuit board.
The device is not limited to the BGA as in the case of the heat sink. Further, the case has been described where the device and the heat sink are attached with an adhesive, but they may be attached with a double-sided tape.

[0016]

As described above, according to the present invention, a printed circuit board part to be bonded to a device mounted on a printed circuit board is inserted between a device mounting surface and a peeling tool insertion portion. With a notch that forms
When attached to a device, it is adhered to the device via a positioning means provided on the upper surface of a printed circuit board including the device and suggests its own contour line. Since the tool is inserted and removed from the device to remove it, even if the printed circuit board parts are larger than the device and the device can not be confirmed, the mounting work can be easily performed while confirming the mounting position by the positioning means. In the case of removal, there is an effect that the device can be easily peeled off from the device without damaging the attachment portions of both.

In the case where the positioning means is a printing section, in addition to the above effects, especially when the printed circuit board component is larger than the device, the printed section clearly shows the occupied area of the printed circuit board component. There is a secondary effect that the range in which the arrangement of the peripheral mounting components is restricted is clarified, and therefore, the position setting of the peripheral mounting components is easily performed. In the case where the positioning means is a peripheral component arranged on a printed circuit board, there is an effect that bonding to a device can be performed using the position of the peripheral component as a mark without drawing a printed portion.

When the printed circuit board component is a heat sink for cooling a device mounted on the printed circuit board, in addition to the above-mentioned effects, the heat sink does not come into contact with the peripheral mounted components and a predetermined interval is provided. Since it can be mounted separately, there is an effect that the cooling effect of the device by the heat sink can be maximized.

[Brief description of the drawings]

FIG. 1 is a partial plan view of a printed circuit board before mounting a heat sink according to a first embodiment of the present invention.

FIG. 2 is a rear view of the heat sink according to the first embodiment of the present invention.

FIG. 3 is a sectional view taken along line AA of FIG. 2;

FIG. 4 is a sectional view taken along line BB of FIG. 2;

FIG. 5 is a front view showing a state where the heat sink according to the first embodiment of the present invention is mounted.

FIG. 6 is a front view showing a state where a heat sink according to a second embodiment of the present invention is mounted.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Device 2a Mounting surface 3, 8 Heat sink (parts for printed circuit board) 4 Printing part (positioning means) 5 Adhesive 6 Notch part 7 Insertion part D Flathead screwdriver (peeling tool) M mark (positioning means)

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[Procedure amendment]

[Submission date] April 9, 1999

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0006

[Correction method] Change

[Correction contents]

[0006]

Means for Solving the Problems A structure in which a printed board component to be bonded to a device mounted on a printed board is provided with a notch for forming an insertion portion of a peeling tool between the component and a mounting surface of the device. When mounting on a device, indicate the positioning means provided on the upper surface of the printed circuit board containing this device to indicate its own contour line and the position of the notch.
When the device is attached to the device via the positioning means and removed from the device, a peeling tool is inserted into the insertion portion, and the device is peeled and removed from the device. When configured in this way, also part printed circuit board is not confirmed larger device than the device, its contour
Positioning means indicating the line and positioning indicating the position of the notch
The mounting can be performed while confirming the mounting position by the means . Further, when detaching, a peeling tool may be inserted into the insertion portion and peeled from the device.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0007

[Correction method] Change

[Correction contents]

[0007] The positioning means indicating the contour of the user may be a printing unit or a peripheral component arranged on a printed circuit board. In the case of such a configuration, in the case where the positioning unit is a printing unit, the positioning unit is adhered to the device while being aligned with, for example, an outline drawn by the printing unit, and the positioning unit is attached to the printed board. In the case where the peripheral components are arranged, adhesion to the device is performed using the arrangement position of the peripheral components as a mark. Here, as the component for a printed board, for example, a heat sink for cooling a device mounted on the printed board may be mentioned.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0016

[Correction method] Change

[Correction contents]

[0016]

As described above, according to the present invention, a printed circuit board part to be bonded to a device mounted on a printed circuit board is inserted between a device mounting surface and a peeling tool insertion portion. With a notch that forms
When mounting on a device, it is attached to the device via positioning means for indicating its own contour line provided on the upper surface of the printed circuit board including the device and positioning means for indicating the position of the cutout portion, and is attached to and removed from the device. In this case, since the peeling tool was inserted into the insertion portion and peeled off from the device to be removed, even if the device for the printed circuit board was larger than the device and the device could not be confirmed,
There is an effect that the mounting operation can be easily performed while confirming the mounting position by the positioning means, and that when the device is removed, it can be easily peeled off from the device without damaging the mounting portions of both.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0017

[Correction method] Change

[Correction contents]

In the case where the positioning means for indicating the contour of the user is a printing unit, in addition to the above effects, especially when the printed circuit board component is larger than the device, the printed unit occupies the printed circuit board component. To clearly show the area,
There is a secondary effect that the range in which the arrangement of the peripheral mounting components is restricted is clarified, and therefore, the position setting of the peripheral mounting components is easily performed. In the case where the positioning means suggesting the contour of the user is a peripheral component arranged on a printed circuit board, it is possible to adhere to the device using the position of the peripheral component as a mark without drawing a printed portion. There is an effect that can be done.

Claims (4)

[Claims] 1. A device for a printed circuit board to be bonded to a device mounted on a printed circuit board, wherein a notch for forming an insertion portion of a peeling tool is provided between the component and a mounting surface of the device. In the case of attachment, it is adhered to the device via positioning means for indicating its own contour line provided on the upper surface of the printed circuit board including this device, and in the case of removal from the device, a peeling tool is attached to the insertion portion. A method for attaching and detaching components for printed circuit boards, comprising inserting, removing from a device, and removing. 2. The method according to claim 1, wherein the positioning means is a printing unit. 3. The method according to claim 1, wherein said positioning means is a peripheral component arranged on a printed circuit board. 4. The printed circuit board component according to claim 1, wherein the printed circuit board component is a heat sink for cooling a device mounted on the printed circuit board. Method.