JPS6050986A - Method of producing elexible printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a flexible printed circuit board for a circuit structure built into various electronic devices.

[Background technology and its problems]

Conventionally, flexible printed circuit boards have been manufactured as follows.

First, a flexible printed circuit board on which a wiring pattern has been formed is pasted onto a mounting plate made of a hard plate called a motherboard using adhesive means such as double-sided tape. Next, circuit components are attached to the portions of the wiring pattern. Finally, by peeling off the flexible printed circuit board from the mounting plate, a flexible printed circuit board in which predetermined circuit components are arranged on the flexible printed circuit board is manufactured.

By the way, the above-mentioned flexible printed circuit board needs to be flattened so that circuit components can be mounted accurately. Therefore, a method is used in which substantially the entire surface of the flexible printed circuit board is adhered onto the mounting plate.

However, since flexible printed circuit boards are thin and flexible, if almost the entire surface of the flexi-no pre-printed circuit board is adhered to the mounting plate, it will be difficult to peel off during the board peeling process after circuit components are mounted. In some cases, parts of the wiring pattern may be cut off.
This was not desirable in terms of manufacturing.

[Purpose of the invention]

Therefore, the present invention has been proposed in view of the above-mentioned conventional circumstances, and aims to (a) facilitate manufacturing and improve reliability.

[Summary of the invention]

In order to achieve the above object, the present invention provides a flexible printed circuit board having a main printed circuit board region and a disposable board region used as a supporting portion of the main printed circuit board region, by bonding the above-mentioned disposable board region onto a mounting plate. A step of pasting the flexible printed circuit board onto a mounting plate, a step of attaching circuit components to the wiring pattern portion formed in the main printed circuit board region, and a step of separating the main printed circuit board region from the above-mentioned waste board region. It consists of a process! It is designated as one temple.

[Example] Hereinafter, an example of the present invention will be specifically described with reference to the drawings.

FIG. 1 is a plan view showing an example of a flexible printed circuit board on which circuit components are mounted. This printed circuit board 1
are two main printed circuit board areas 2, 2 arranged in parallel.
And, it has a sacrificial board area 3 arranged around the periphery of each of these printed board areas 2.2 and used as a support member for each of the main printed board areas 2, 2. Note that the present invention may include three or more main printed circuit board areas, or may include only one main printed board area.

L-shaped notches 4 are provided at the boundaries with the sacrificial board area 3 at the four corners of each of the main printed circuit board areas 2.2.
is formed.

Wiring patterns 5.5 having the same shape are formed in each of the main printed circuit board areas 2, 2, respectively.

Note that in the present invention, wiring patterns having different shapes may be formed in each of the main printed circuit board areas 2, 2.

Each of the wiring patterns 5, 5 is formed by pasting copper foil on the base 6 of the flexible printed circuit board 1, as shown in FIG.
Almost the entire area is covered with resist 1 and 7. It should be noted that parts 5A that are attached to each of the wiring patterns 5.5 are placed in a state where the resist film 5A is not applied and is exposed to the outside.

Further, at the position of the disposable board 3 in the flexible printed circuit board 1, there are positioning holes 8, 8 into which two board positioning bins 15, 15 provided in an automatic component mounting machine to be described later are inserted, respectively. The positioning holes 8 may be formed at any position in the disposable substrate area 3, and the number thereof is not limited.

Next, a method for manufacturing a flexible printed circuit board using the flexible printed circuit board 1 having the above configuration will be described.

First, as shown in FIG. 3, the flexible printed circuit board 1f is bonded onto the mounting plate 10 via adhesive means such as the adhesive 9. The mounting plate 10 is relatively rigid and thick enough to be easily cut, and is formed to have approximately the same size as the substrate 1, as shown in FIG. 4. The portion of the substrate 10 attached to the mounting plate 10 is discarded in the substrate area 3.
, so that the main printed circuit board areas 2, 2 are not bonded onto the mounting plate 10.

In this way, by bonding the substrate 1 to the mounting plate 10, the flatness of the main printed circuit board areas 2, 2 can be maintained even if they are not directly attached to the mounting plate 10. It has become.

Note that when bonding the substrate 1 to the mounting plate 10, in order to prevent the substrate 10 from warping, or the main printed circuit board area 2.2
In order to prevent the adhesive 9 etc. from spilling out onto the mounting plate 10,
, the portion (fourth
It is preferable to apply an adhesive 9 or the like to the area 11 (demarcated by broken lines in the figure), and then laminate the substrate 1 thereon. Furthermore, a positioning hole 12.12 is formed through the mounting plate 10 so as to communicate with the positioning hole 8.8 of the substrate 1 when the substrate 1 is bonded thereto.

Next, apply the fifth layer of solder 13 using screen printing, etc.
As shown in the figure, wiring patterns 5, 5 on the board 1
0 parts are installed on part 5A.

Next, as shown in FIG.
4 Place it on top. Then, as shown in FIG. 7, circuit components 16 such as capacitors are mounted on the substrate 1 by an automatic component mounting machine.

When the mounting of the circuit components 16 on the board 1 is completed, the board 1 is inserted into the firing furnace together with the mounting plate 10,
The solder 13 is reflowed at about 240°C. and,
If necessary, after reflow, circuit components such as large capacitors are manually placed on the substrate 1. Finally, using a cutting machine such as a press, the main printed circuit board areas 2 and 2 of the board 1 are cut as shown in FIG.
The boundary portion 17 (indicated by the broken line in FIG. 8) between the main printed circuit board area 3 and the sacrificial board area 3 is cut together with the mounting plate 10, and each of the main printed circuit board areas 2, 2 is separated from the sacrificial board area 3. The substrate area is removed and the manufacturing process of the flexible printed circuit arrangement is completed.

In this way, according to the above embodiment, when the circuit components 16 are mounted on the main printed circuit board areas 2.2, an automatic component mounting machine is used because the flatness of each printed circuit board area 2.2 is maintained. Thus, the component 16 can be easily and accurately mounted on each of the printed circuit board areas 2.2.

Also, in the step of removing each main printed circuit board area 2.2 to which the above-mentioned components 16 are attached from the mounting plate 10,
Considering that each of the printed circuit board areas 2, 2 is not glued onto the mounting plate 10, the work of cutting the boundary portion 17 between the main printed circuit board area 2.2 and the sacrificial board area 3 together with the mounting plate 10 Each of the printed circuit board areas 2, 2 can be automatically taken out from the mounting plate 10 by using only a single button, which facilitates manufacturing.

Since the main printed circuit board area 2.2 is not bonded to the mounting plate 10, each of these printed circuit board areas 2.
2 from the mounting plate 10, and accidents such as cutting of the wiring pattern 5.5 can be reliably prevented.

Furthermore, the adhesive 9 does not stick to each of the printed circuit board areas 2, 2, resulting in a clean finish.

In addition, as shown in FIG. 9, the main printed circuit board/definition 2
．． A large number of incisions 18 are provided on the boundary line between the printed circuit board areas 2 and 3, and each of the areas 2.3 is separated using a knife or the like while using these incisions 18. 2 may be taken out. At this time, only the substrate 1 may be cut, or the substrate 1 may be cut together with the mounting plate 70.

Further, the present invention arranges a printer for printing cream solder 13 on the flexible printed circuit board 1, a component mounting machine, a reflow machine, and a board press machine in a series, and places the printed circuit board 1 together with the mounting plate 10 on the conveyor table. If the substrate is conveyed sequentially through each of the above-mentioned machines, the solder printing process to the board cutting process can be automatically carried out at the same size.

〔Effect of the invention〕

As described above, according to the present invention, circuit components can be easily and accurately mounted on the main printed circuit board area using an automatic component mounting machine, and the main printed circuit board area on which the above-mentioned components are mounted can be easily and accurately mounted. Since it can be easily taken out from the mounting plate, manufacturing becomes easy.

In addition, since the main printed circuit board area is not glued onto the mounting plate, when the main printed circuit board area to which the circuit components are attached is taken out from the mounting plate, the wiring pattern is All flexible printed circuit boards can be manufactured with high reliability without accidents such as cutting.

[Brief explanation of the drawing]

Fig. 1 is a plan view of a flexible printed circuit board, Fig. 2 is an enlarged sectional view of its main parts, and Figs. FIG. 3 is a cross-sectional view showing a state in which the flexible printed circuit board is attached to the mounting plate, FIG. 4 is a plan view of the above-mentioned mounting plate, and FIG. An enlarged cross-sectional view of the main parts showing the solder printed state,
Figure 6 is a cross-sectional view showing the printed circuit board placed on the board positioning table of an automatic component mounting machine, and Figure 7 is an enlarged cross-sectional view of the main parts showing the printed circuit board with circuit components placed on it. 8 is a plan view of the flexible printed circuit board showing a state in which the above components are attached, and FIG. 9 is a partially omitted plan view showing another example of the flexible printed circuit board. 1... Flexible print 14 board 2... Main printed circuit board area 3... Disposable board area 5... Wiring pattern 9... Adhesive 10... Placing board 16... Circuit component patent application Person Sony Corporation Representative Patent Attorney Koike Mimi 1) Sakae Mura - Figure 43 Figure 6 '71'' 16 No. 81-1 No. 91-1 Procedural Amendment (Mutsu) November 1980 10 Commissioner of the Japan Patent Office Kazuo Wakasugi 1, Indication of the case 1982 Patent application No. 157196 Relationship with car f'1 Special RR applicant's address No. 6-7-35, Kitashina, Tokyo Parts Ward, (
218) Sony Corporation (Name) Representative Norio Ohga4, Agent Voluntary6, “Claims” and “Detailed Description of the Invention” of the specification subject to amendment
Each column 7, contents of amendment (7-1) The statements in the claims column of the specification are corrected as shown in the attached sheet. (7-2) [[
The description from ``Flexible printed circuit board'' to ``Process and,'' on the 16th line of the same page is changed to ``Flexible printed circuit board is placed on the entire mounting plate, and the above-mentioned disposable board area and the mounting plate opposite to the disposable board area. The process of gluing the (7-3) Next to "Good" on page 4, line 13 of the specification, there is a statement that says, "Furthermore, a disposable board area may be provided in 1i111 (inside) of the main printed board area." join. (7-4) From the 14th line of page 5 of the specification to the 15th line of the same page, the description is corrected to ``the position of the above-mentioned disposable board area 3'' as ``Sr main printed board area 2''. (7-5) From page 5, line 20 of the specification to page 6, line 1 of ``the flexible printed circuit board 1'' force) and page 6, line 2 of ``Launching.'' 1 The entire flexible printed circuit board 1 is placed on the mounting plate 1θ, and the disposable board area 3 and the mounting plate 10 facing the disposable board area 3 are bonded together using a bundling means such as an adhesive 9. ”, he corrected. (7-6) On page 6, line 6 of the specification; and on line 7 of the same page, the statement ``partially'' was corrected to ``partially only.'' do. (And more) Attachment Claims

Claims (1)

[Claims] The above-mentioned disposable board area of a flexible printed circuit board having a main printed circuit board area and a disposable board area used as a support member for this main printed board area is adhered onto a mounting plate, and the flexible printed circuit board is pasted onto the mounting plate. A method for manufacturing a flexible printed circuit board, comprising: a step of attaching circuit components to a wiring pattern portion formed in the main printed circuit board region; and a step of separating the main printed circuit board region from the sacrificial board region. .