JPH08267399A - Printed circuit board dividing jig and method - Google Patents

Abstract

PURPOSE: To provide a printed circuit board dividing jig and method not causing cracking and solder peering of parts on the circuit board and disconnection of printed pattern due to the warp of the printed circuit board and capable of handling even after applying cream solder when dividing the printed circuit board by bending. CONSTITUTION: This printed circuit dividing jig is equipped with a pedestal 2 in which pins 3 are buried for fixing a printed circuit board 8 by being inserted in the fixing holes of the printed circuit board 8 and a connecting means which connects this pedestal 2 and is capable of bending in cross direction at a bending section and separating the pedestal 2. Therefore, since the printed circuit board is fixed to the pedestal 2 by the pins 3, when the jig is bent, any stress is not applied to the printed circuit board other than the groove where the printed circuit board is divided, being free from warp, not causing troubles. In addition, the printed circuit board is not directly touched, it can be handled even after applying cream solder.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board dividing jig used for dividing a plurality of circuit boards from a single printed board.

[0002]

2. Description of the Related Art A circuit board used for electronic equipment has come to be used in high density packaging, which is small and thin. When manufacturing such a circuit board, it is efficient to form a plurality of identical circuits on one printed board and divide the printed board to obtain each circuit board. However, when dividing a thin printed circuit board, warping of the board and cracks of parts due to the warping, peeling of solder, cutting of the print pattern, etc. occur, so it is necessary to divide the printed board with a means to hold the printed board. A method of dividing the printed circuit board by using a jig has been devised without applying an unreasonable force to the printed circuit board.

For example, the method disclosed in Japanese Patent Laid-Open No. 63-191599 will be described with reference to the drawings. FIG.
FIG. 4 is a perspective view of a printed circuit board dividing jig according to this publication, which includes a base 10 and a slide plate 11 as shown in FIG. 4, and the base 10 is integrated with a horizontal base and extends in the vertical direction. The vertical wall portion 12 is provided. The slide plate 11 is formed with a long hole 13 for screwing, and is fixed to the base 10 by a screw 14 through the long hole 13. The printed circuit board 15 to be divided has a plurality of identical circuits formed therein, a V-groove 17 of a planned dividing line is formed in the boundary area, and a holding portion 18 is formed in the peripheral end portion. To explain the dividing work, first, the side surface of the printed circuit board is installed on a horizontal base of the base, and the sandwiching portion 18 other than the circuit board 16 on the printed circuit board 15 which is previously formed is brought into contact with the vertical wall portion 12. . In this state, the slide plate 11 is slid to sandwich the sandwiching portion 18 of the printed circuit board 15, and the screw 14 is fixed in this state. Next, the printed board 15 is manually bent to the side of the slide plate 11 or the vertical wall portion 12 to form the printed board 1
5 is divided by the V-groove 17 except for the portion sandwiched by the vertical wall portion 12 and the slide plate 11. In this way, one of the printed circuit boards 15 is bent in a fixed state to reduce the stress at the time of division so as to reduce cracks in parts, breaks in patterns, and peeling of solder.

[0004]

However, such a conventional method of fixing only one side of the printed board and bending the free piece which is not held is not held when the printed board is thin. The stress on the other printed circuit board could not be made uniform, resulting in partial warpage, and cracks, pattern breaks, and solder peeling still occurred. Also,
The area for sandwiching the printed circuit board has also been a cause of a decrease in the utilization rate of the printed circuit board. In addition, there are some parts that cannot be mounted by surface mounting technology (hereinafter referred to as "SMT"). In this case, after mounting the parts in the SMT process, cream solder is applied to predetermined positions on the printed circuit board to mount the parts. Must be inserted and soldered.

However, after the cream solder is applied, if the chassis housing is fitted directly to each circuit so that it fits into each circuit, the cream solder will adhere to unnecessary parts and damage the circuit, or touching the solder will cause corrosion. Therefore, it is necessary to divide the board into small pieces from the beginning, set the printed boards individually in the cream solder applying jig and the component inserting jig, and perform each work. That is,
Conventionally, there has been a problem that cream solder coating on a large printed circuit board cannot be used to dispense parts, and inefficient work must be performed.

Further, in the conventional dividing jig, the printed board is sandwiched by the base and the slide plate and divided by the V groove of the planned dividing line, so that the dividing jig can be divided only in one direction and in the other direction. Had to be reset on the jig, which was also inefficient. The object of the present invention is to solve the above problems.

[0007]

In order to solve the above-mentioned problems, the present invention is a board dividing jig for dividing a printed board on which a circuit is formed by a predetermined dividing line, and a plurality of boards including a printed board fixing means. There is provided a board dividing jig having a pedestal and flexible connecting means for connecting the pedestal to each other adjacent to each other on the planned dividing line. That is, in a jig that divides a printed circuit board on which a plurality of circuits are formed,
Provided is a printed circuit board dividing jig which includes a fixing means for fixing a printed circuit board to a pedestal, and a connecting means which can be bent in a cross direction, and a detaching means for each pedestal.

Further, there is provided a printed circuit board dividing jig in which the printed circuit board fixing means comprises pins erected on a pedestal.

Further, a step of fixing the printed circuit board to a predetermined position of a flat plate-shaped pedestal with a planting pin, a step of bending the pedestal of the dividing jig at a bending portion, and a printed circuit board being bent along with this, Provided is a method of assembling a chassis housing by separating a printed board from each other together with a pedestal and a step of dividing the board at a predetermined dividing line.

Further, there is provided a method of dividing a printed circuit board into four parts by using a jig in which the pedestal is arranged in a T-shape.

[0011]

According to the above construction, since the pins are inserted into the fixing holes of the printed circuit board and the entire printed circuit board is fixed to the flat base of the dividing jig, no stress is applied to the printed circuit board except for the planned dividing line of the printed circuit board. Further, according to the above configuration, since the pins implanted from the pedestal are used to fix the printed circuit board, it is not necessary to form the holding area other than the circuit board. Further, since the printed circuit board is fixed to the dividing jig and is not directly handled, the printed circuit board can be divided even after the cream solder is applied, so that the cream solder can be applied and the parts can be dispensed by using a large board. Further, since the position of the pin can be set according to the printed circuit board, it can be applied to various printed circuit boards.

Further, after the printed circuit boards are divided, the printed circuit boards can be separated from each other, and a gap for assembling the chassis case can be provided. In addition, the pedestal is arranged in a T-shaped,
Since the jig can be bent in the intersecting direction, the printed circuit board can be divided in the cross direction without resetting.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a printed board dividing jig 1 according to an embodiment of the present invention. As shown in FIG. 1, this jig is
As shown in FIG. 2, four pedestals 2 and a plurality of printed circuit board fixing pins (hereinafter referred to as “pins”) 3 planted on the pedestals 2 and the four pedestals 2 are connected on the back surface as shown in FIG. It is made of a thin stainless steel plate 4. Four pedestals 2
Is a flat plate made of aluminum with a thickness of 10 mm, and tapped at each pin position so that the pin 3 can be screwed and planted, corresponding to fixing holes of various printed circuit boards. Further, the pedestal 2 has a flat plate shape so as not to give stress to the printed circuit board 5 when the printed circuit board 5 is fixed, and has a rigidity such that it is not bent by a small force. Further, the pins 3 planted on the pedestal 2 are 3 mmφ × 25 mm made of SK material, and the respective fixing holes are formed in the printed circuit board 5 so as to match the pins.

The thin plate 4 made of stainless steel has a thickness of 0.5 mm and is substantially cross-shaped, and each has a long hole 6 at the tip thereof, which is loosely connected to the pedestal 2 at that portion. It is slidable in the cross direction (arrow in Figure 2). In addition, it is possible to bend at the bent portions 5 and 5 in the direction along the edge of the pedestal around the angle of 45 degrees (FIG. 2, two-dot chain line AA, BB) respectively with the cross direction of the cross. ing.
As shown in FIG. 3 (a), the working method is to bring the planned dividing line 9 of the printed circuit board 8 to be divided so as to be aligned with the bent portions 5 and 5 of the dividing jig of the present invention. 3 is inserted into the fixing hole of the printed circuit board 8 to fix the printed circuit board 8 to the pedestal 2, and the grip 7 is used to center the bent portion of the dividing jig 1 at about 20 to 30 degrees as shown in FIG. When bent, the printed circuit board 8 tries to bend following the dividing jig 1, and the depth formed in the printed circuit board 8 is 0.1 mm to 0.1 mm.
The printed circuit board 8 is broken at the groove 9 of the planned dividing line having a V-shaped cross section of 2 mm. However, in this state, the printed circuit board is only divided, and when the handle is returned, there is no gap for fitting the chassis case. Therefore, by expanding the pedestal of the dividing jig in all directions, the divided individual printed circuit boards fixed to the pedestal are separated, and the chassis housing can be fitted with a sufficient space to assemble the chassis housing. Then, the projecting portion of the chassis housing is caulked on the printed board to complete the process.

[0015]

According to the above construction, since the entire printed circuit board is fixed to the pedestal of the dividing jig by the pins, no stress is applied to the circuit board except the groove of the printed circuit board dividing line, and no warpage occurs. No cracks occur in the upper parts, and inconveniences such as peeling of solder and breaks in patterns do not occur. Further, according to the above configuration, since the pins are used to fix the printed circuit board, it is not necessary to form the holding area on the printed circuit board, and the utilization efficiency of the printed circuit board is increased and the mounting density is increased.

Further, even after applying the cream solder, the cream solder can be set in the dividing jig and divided, so that a multi-head cream solder applicator can be used with a large substrate and the parts can be dispensed efficiently. The advantage is that the lead time can be shortened.
Further, there is no possibility of causing inconvenience by attaching cream solder to an unnecessary portion by direct handling, nor causing rust by touching the solder. There is also an advantage that the degree of freedom in process design is increased.

Further, since the pin positions can be set according to the printed circuit board, various printed circuit board divisions can be dealt with. Further, since the dividing jig can be bent in the cross direction, the printed board can be divided in the intersecting direction without resetting the jig, which is efficient.

[Brief description of drawings]

FIG. 1 is a perspective view of a printed board dividing jig according to the present invention.

FIG. 2 is a rear view of the printed board dividing jig according to the present invention.

FIG. 3 is a printed circuit board dividing method according to the present invention.

FIG. 4 is a printed circuit board dividing jig according to a conventional technique.

[Explanation of symbols]

 1 printed circuit board dividing jig 2 pedestal 3 printed circuit board fixing pin 4 stainless steel thin plate 5 bent part 6 long hole 7 grip 8 printed circuit board 9 planned dividing line groove

Claims (5)

[Claims] 1. A jig for dividing a printed circuit board on which a plurality of circuits are formed at a predetermined dividing line, comprising printed board fixing means for fixing the printed circuit board to a pedestal that constitutes the board dividing jig. A printed circuit board dividing jig comprising a connecting means having a bendable bendable portion and a means for separating and attaching the pedestals. 2. The printed circuit board dividing jig according to claim 1, wherein the printed circuit board fixing means comprises a plurality of pins implanted in the pedestal. 3. The printed circuit board dividing jig according to claim 2, further comprising a mechanism capable of replacing the pin installation position corresponding to the fixing hole of the printed circuit board. 4. The printed circuit board division is performed by aligning the planned dividing line formed on the printed circuit board and the bent portion of the printed circuit board division jig, and fixing the divided line to the flat plate-shaped pedestal by the planting pin. A method in which a jig is bent, the printed circuit board is made to follow this, and the jig is bent to divide the printed circuit board. 5. A method of dividing a printed circuit board in a cross direction without resetting the printed circuit board by using the printed circuit board dividing jig in which the pedestals are arranged in a cross shape.