JPH0222996Y2 - - Google Patents

Description

[Detailed description of the invention] (a) Technical field of the invention The invention relates to an IC mounting jig, particularly for integrated circuits (ICs) that have multiple lead terminals on both sides of a package, such as a dual-in-line package type. The present invention relates to an IC mounting jig that easily adjusts the width of the gap between the lead terminals on both sides when mounting the IC socket.

(b) Technical background In general, in dual inline package integrated circuits (hereinafter referred to as ICs), each lead terminal arranged on both sides of the IC body spreads outward. When installing into an IC socket, etc., the shape of each lead terminal is modified to match each terminal insertion hole of the IC socket, and then the lead terminal is installed.

(c) Conventional technology and problems That is, when a conventional dual inline package (DIP) type IC is installed in an IC socket, as described above, both lead terminal groups arranged on both sides of the IC body face outward. Since the lead terminal has a wide shape, it is not only difficult to directly attach it to an IC socket in this state, but also the lead terminal has to be bent. Therefore, in the past, the shape of each lead terminal of the IC was individually corrected by hand to match the position of each terminal insertion hole of the corresponding IC socket, and then
The conventional method used was to attach the lead terminal to an IC socket, but it took time to correct the lead terminal, and the efficiency of the installation process was low. There is a need for a method or jig that can mount the IC in an IC socket.

(d) Purpose of the invention In order to solve the above-mentioned drawbacks of the conventional technology, the present invention is a new IC mounting method that modifies the shape of each lead terminal of the IC with a simple and inexpensive structure and that can be easily mounted on an IC socket. The purpose is to provide a jig for use.

(e) Structure of the invention According to the invention, the purpose is to provide a jig for mounting a dual line package type IC component to an IC socket while adjusting the interval width between the lead terminal groups provided on both sides of the IC component. The two rows of terminal insertion holes of the IC socket are inserted into a plate-shaped jig main body that has a thickness that allows the terminals of the IC component to be inserted therethrough and has a mounting surface for the IC socket on the bottom surface. Two rows of elongated terminal correction slits are provided at equal intervals and parallel to each other, and one end of the terminal correction slits is opened at one end of the jig main body, and the lead of the IC component is opened at the top of the jig main body. A tapered insertion opening is formed to guide insertion of the terminal group, and a jig drawer handle is provided at the other end of the jig body to assist in removal of the jig body after inserting the IC component. This is achieved by providing an IC mounting jig characterized by the following.

(f) Embodiments of the invention Hereinafter, preferred embodiments of the invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of the IC mounting jig according to the present invention together with a DIP type IC, in which 1 is a jig main body made of a light metal thin plate such as aluminum (Al), 2 and 3 are semiconductor devices. , that is, a plurality of lead terminals 10 and 11 arranged on both sides of the DIP type IC 9.
The insertion openings 4 and 5 are open at one end 6 and tapered at the top in order to match the interval width in the width direction of the terminal insertion holes provided in the IC socket.
A pair of terminal correction slits are provided in parallel to the jig main body 1 so as to have the following characteristics. Reference numeral 7 denotes a jig drawer piece provided vertically at the other end of the jig main body 1. Also, the back side of the jig body 1 is not shown.
A stepped portion 8 is provided to facilitate positioning when placed on the IC socket.

Thus, the IC mounting jig 1 configured in this way
For example, the DIP type IC 9 is attached to the printed board 21 using
To attach it to the upper IC socket 22, first
A pair of terminal correction slits 2 of the IC mounting jig 1,
3, the plurality of lead terminals 10 and 11 arranged in a widening manner on both sides of the IC 9 are forcibly inserted, respectively, and the gap width between the plurality of lead terminals 10 and 11 is corrected to be approximately parallel. . and like this
Place the IC mounting jig 1 on which the IC 9 is placed onto its stepped portion 8.
is arranged on the printed board 21 in contact with one end surface of the IC socket 22 as shown in FIG.
Place it on the IC socket 22. In this case, the tips of the lead terminals 10 and 11 of the IC 9 guided downward from the terminal correction slits 2 and 3 of the jig 1 are such that the interval width between both terminal groups is equal to the width of each terminal insertion (not shown) of the IC socket 22. Since the width is the same as the interval between the holes, it can be easily inserted into the insertion hole group. Thereafter, the jig 1 is pulled out in the direction of arrow A by holding the jig drawer piece 7 provided at the other end, and the IC 9 is further pressed onto the IC socket 22 to remove the IC 9. You can modify the shape of each lead terminal 10, 11 individually,
Furthermore, it can be installed extremely easily without being accidentally bent.

(g) Effects of the invention As is clear from the above explanation, the effects of the invention
According to the IC mounting jig, the gap width between the lead terminal groups provided on both sides of the IC can be easily corrected.
Mounting the IC in the IC socket becomes extremely easy, and the efficiency of the mounting work can be improved. In addition, electrostatic damage to the IC can be prevented by connecting a grounding lead wire shown with reference numeral 12 in each figure to the jig body and using it in a grounded state during IC mounting work. , has excellent practical effects.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing an embodiment of the IC mounting jig according to the present invention together with a DIP type IC, and Fig. 2 shows how the IC mounting jig according to the present invention is used to mount an IC into an IC socket. It is a perspective view explaining work. In the drawing, 1 is the IC mounting jig (main body), 2,
3 is a slit for terminal correction, 4 and 5 are insertion ports,
7 is a jig drawer piece, 8 is a stepped part, 9 is a DIPIC,
10 and 11 indicate lead terminal groups.

Claims (1)

[Claims for Utility Model Registration] A jig for mounting a dual line package type IC component 9 to an IC socket 22 while correcting the interval width between the lead terminal groups 10 and 11 provided on both sides thereof, which comprises: It has a thickness that allows the terminals 10 and 11 of the IC component 9 to be inserted therethrough, and the IC socket 22 is provided on the bottom surface.
A plate-shaped jig main body 1 forming a mounting surface for
Two rows of elongated terminal correction slits 2 and 3 are provided at one end of the IC socket 22 at an interval equal to and parallel to the two rows of terminal insertion hole groups. is opened at one end of the jig main body 1, and tapered insertion ports 4 and 5 are formed in the upper part to guide insertion of the lead terminal groups 10 and 11 of the IC component 9, and the jig Main body 1
An IC mounting jig characterized in that a jig drawer handle 7 is provided at the other end to assist in removing the jig main body 1 after the IC component 9 has been inserted.