JPS6023899Y2 - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS6023899Y2
JPS6023899Y2 JP1981005357U JP535781U JPS6023899Y2 JP S6023899 Y2 JPS6023899 Y2 JP S6023899Y2 JP 1981005357 U JP1981005357 U JP 1981005357U JP 535781 U JP535781 U JP 535781U JP S6023899 Y2 JPS6023899 Y2 JP S6023899Y2
Authority
JP
Japan
Prior art keywords
lead core
printed wiring
wiring board
protruding ends
core wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981005357U
Other languages
Japanese (ja)
Other versions
JPS57119481U (en
Inventor
潔 中出
Original Assignee
パイオニア株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to JP1981005357U priority Critical patent/JPS6023899Y2/en
Publication of JPS57119481U publication Critical patent/JPS57119481U/ja
Application granted granted Critical
Publication of JPS6023899Y2 publication Critical patent/JPS6023899Y2/en
Expired legal-status Critical Current

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Landscapes

  • Multi-Conductor Connections (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Description

【考案の詳細な説明】 本考案は、多芯平行線体の多数のリード芯線突出端部を
固着するために、対応する位置にリード芯線突出端部挿
入孔を開けであるプリント配線基板に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed wiring board in which lead core wire protruding end insertion holes are formed at corresponding positions for fixing a large number of lead core wire protruding ends of a multicore parallel wire body.

従来、プリント配線基板に開けである上記リード芯線突
出端部挿入孔に、多数のリード芯線突出端部を同時に挿
入し固着することは、極めて簡単な作業であると思われ
がちであるが、実際には、一つの多芯平行線体の多数の
リード芯線突出端部のすべてを対応すべき孔に対応して
おき、押圧して挿入する作業は作業員の視覚神経の疲労
を甚しくする非能率的な作業で、然も多数のリード芯線
突出端部のうちに一本でも対応すべき孔に先端が合わな
いものがあるとその多芯平行線体は挿入固着できなかっ
た。
Conventionally, it is often thought that it is an extremely simple task to simultaneously insert and secure a large number of lead core wire protruding ends into the lead core wire protrusion end insertion holes that are drilled in printed wiring boards, but in reality, it is difficult to do so. In order to do this, all of the protruding ends of the many lead core wires of one multi-core parallel wire body should be aligned with the corresponding holes, and the work of pressing and inserting them is a non-trivial task that causes severe visual nerve fatigue for the worker. Although this work is efficient, if even one of the many protruding ends of the lead core wire does not fit into the corresponding hole, the multi-core parallel wire body cannot be inserted and fixed.

又、位置形状の正確でないリード芯線突出端部があって
も挿入に支障ないように、プリント配線基板に開けてよ
る孔の全部を挿入されるリード芯線突出端部のそれぞれ
の太さよりも遥かに大きめに開けておくと、全部のリー
ド芯線突出端部を同時に容易に挿入できるが、圧接部分
がないので次の半田ディップ付で固着するまでに抜けや
浮き上りができやすい欠点があった。
In addition, in order to prevent insertion even if there is a protruding end of the lead core wire whose position and shape are not accurate, the thickness of all the holes drilled in the printed wiring board should be far greater than the thickness of each of the protruding ends of the lead core wire to be inserted. If the opening is made larger, it will be easier to insert all the protruding ends of the lead core wires at the same time, but since there is no pressure welding part, there is a drawback that they are likely to come off or come up before the next solder dip is applied.

本考案は、多芯平行線体の多数のリード芯線突出端部を
、対応する孔に容易に然も確実に挿入固着できるように
することを目的としたプリント配線基板である。
The present invention is a printed wiring board that allows the protruding ends of a large number of lead core wires of a multicore parallel wire body to be easily and securely inserted into corresponding holes.

次に図面について本考案の実施例を説明する。Next, embodiments of the present invention will be described with reference to the drawings.

本考案実施例は、第1図、第2図に示すように、挿入し
てて固着すべき多芯平行線体1の多数のリード芯線突出
端部11に対応させるプリント配線基板2の多数の孔3
を、上記リード芯線突出端部11の先端位置が多少挿入
横方向にずれていても、同時挿入が容易なように十分な
大きさとすると共に、上記多数の孔3の個々に挿入した
上記多数のリード芯線突出端部11を同時に横移動して
仮固着できるスリット4を設けてなる。
As shown in FIGS. 1 and 2, the embodiment of the present invention has a large number of printed wiring board 2 corresponding to a large number of lead core protruding ends 11 of a multicore parallel wire body 1 to be inserted and fixed. Hole 3
is made large enough to facilitate simultaneous insertion even if the tip position of the lead core wire protruding end portion 11 is slightly shifted in the insertion lateral direction, and the number of holes 3 inserted into each of the plurality of holes 3 is large enough to facilitate simultaneous insertion. A slit 4 is provided in which the protruding ends 11 of the lead core wires can be moved laterally at the same time and temporarily fixed.

第3図に示すように、多芯平行線体1を第1図に示す状
態から下げて多数のリード芯線突出端部11を多数の孔
3に挿入し、スリット4内を横移動して第2図、第3図
において点線で示す状態にスリット4の狭い巾に挾まれ
て仮固着される。
As shown in FIG. 3, the multicore parallel wire body 1 is lowered from the state shown in FIG. It is held between the narrow width of the slit 4 and temporarily fixed in the state shown by dotted lines in FIGS. 2 and 3.

次に続く半田デイツプ付作業により、仮固着されたリー
ド芯線突出端部1□のすべては、図示しないが、スリッ
ト4に挾持されたままの位置で半田ディップ付されてプ
リント配線基板2に固着され配線は接合される。
In the subsequent solder dipping operation, all of the temporarily fixed lead core protruding ends 1 □ are soldered and fixed to the printed wiring board 2 while being held in the slits 4 (not shown). The wiring is joined.

第4図は、多数のスリット41をプリント配線基板21
の端縁に設けた本考案の他の実施例で、多芯平行線体の
多数のリード芯線突出端部をプリント配線基板の端縁に
近く固着する場合に、スリット加工及び多芯平行線体の
多数のリード芯線突出部を移動しての上記スリット41
への仮固着を極めて容易に且つ確実に行うことができる
FIG. 4 shows how many slits 41 are inserted into the printed wiring board 21.
In another embodiment of the present invention, when the protruding ends of a large number of lead core wires of a multi-core parallel wire body are fixed close to the edge of a printed wiring board, the slit processing and the multi-core parallel wire body are The slit 41 is formed by moving a large number of lead core wire protrusions.
Temporary fixation to can be performed extremely easily and reliably.

上述の通り本考案によれば、多芯平行線体の多数のリー
ド芯線突出端部をプリント配線基板に固着する際に、極
めて容易に且つ確実に半田付前の仮固着ができるので、
作業能率向上のために極めて有効である。
As described above, according to the present invention, when fixing the protruding ends of a large number of lead core wires of a multi-core parallel wire body to a printed wiring board, temporary fixing before soldering can be performed extremely easily and reliably.
It is extremely effective for improving work efficiency.

【図面の簡単な説明】[Brief explanation of drawings]

第1図乃至第3図は本考案実施例に関し、第1図は多芯
平行線体の多数のリード芯線突出端部をプリント配線基
板の多数の孔に対向させた状態を示す斜視図である。 第2図は、第1図の状態をプリント配線基板の裏面から
眺めた要部裏面図である。 第3図は、多芯平行線体のリード芯線突出端部をプリン
ト配線基板の孔に挿入した状態を示す断面図である。 第4図は、本考案の他の実施例の要部平面図である。 1・・・・・・多芯平行線体、11・・・・・・リード
芯線突出端部、2,2□・・・・・・プリント配線基板
、3・・・・・・孔、4,4.−−−−−−スリット。
1 to 3 relate to an embodiment of the present invention, and FIG. 1 is a perspective view showing a state in which the protruding ends of a large number of lead core wires of a multicore parallel wire body are opposed to a large number of holes in a printed wiring board. . FIG. 2 is a rear view of essential parts of the state shown in FIG. 1, viewed from the back surface of the printed wiring board. FIG. 3 is a sectional view showing a state in which the protruding end portion of the lead core wire of the multicore parallel wire body is inserted into the hole of the printed wiring board. FIG. 4 is a plan view of main parts of another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Multi-core parallel wire body, 11... Lead core wire protruding end, 2, 2□... Printed wiring board, 3... Hole, 4 ,4. ---------Slit.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 挿入して固着するべき多芯平行線体の多数のリード芯線
突出端部に対応させるプリント配線基板の多数の孔を、
上記多数のリード芯線突出端部が多少機にずれていても
同時挿入が容易なための十分な大きさとすると共に、挿
入した上記リード芯線突出端部をそのまま同時に横移動
した際に該リード芯線突出部を挾持して仮固着できるス
リットを上記十分な大きさの孔に連ねて設けてなる、プ
リント配線基板。
A large number of holes in a printed wiring board are formed to correspond to the protruding ends of a large number of lead core wires of a multicore parallel wire body to be inserted and fixed.
The large number of protruding ends of the lead core wires should be of sufficient size to facilitate simultaneous insertion even if the protruding ends of the lead core wires are slightly misaligned, and the protrusion of the lead core wires should be ensured when the protruding ends of the lead core wires that have been inserted are moved laterally at the same time. A printed wiring board comprising a hole of sufficient size and a slit that can be used to clamp and temporarily fix parts.
JP1981005357U 1981-01-20 1981-01-20 printed wiring board Expired JPS6023899Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981005357U JPS6023899Y2 (en) 1981-01-20 1981-01-20 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981005357U JPS6023899Y2 (en) 1981-01-20 1981-01-20 printed wiring board

Publications (2)

Publication Number Publication Date
JPS57119481U JPS57119481U (en) 1982-07-24
JPS6023899Y2 true JPS6023899Y2 (en) 1985-07-16

Family

ID=29803736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981005357U Expired JPS6023899Y2 (en) 1981-01-20 1981-01-20 printed wiring board

Country Status (1)

Country Link
JP (1) JPS6023899Y2 (en)

Also Published As

Publication number Publication date
JPS57119481U (en) 1982-07-24

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