JPH039355Y2 - - Google Patents
Info
- Publication number
- JPH039355Y2 JPH039355Y2 JP1986116504U JP11650486U JPH039355Y2 JP H039355 Y2 JPH039355 Y2 JP H039355Y2 JP 1986116504 U JP1986116504 U JP 1986116504U JP 11650486 U JP11650486 U JP 11650486U JP H039355 Y2 JPH039355 Y2 JP H039355Y2
- Authority
- JP
- Japan
- Prior art keywords
- pin
- conductor
- irregularly shaped
- alignment jig
- large number
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 50
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、プリント配線板等からなり電子部品
を搭載するための基板に、導通を取るため等に使
用される多数の導体ピンを打ち込んで、導体ピン
を有する電子部品搭載用基板を形成する場合に使
用され、特にその導体ピンを基板に打ち込む前工
程における、各導体ピンの異形頭部の方向づけを
行つて整列することを可能ならしめる治具に関す
るものである。[Detailed description of the invention] (Industrial application field) The invention is based on a method of driving a large number of conductor pins used for establishing continuity into a substrate made of a printed wiring board, etc., on which electronic components are mounted. is used when forming a board for mounting electronic components having conductor pins, and is used to orient and align the irregularly shaped heads of each conductor pin, especially in the process before driving the conductor pins into the board. It's about the ingredients.
（従来の技術）
従来、電子部品搭載用基板を形成する製造装置
において、特に導体ピンが異形頭部を有している
場合においては、実願昭60−065541号〓半導体用
パツケージ基板〓に開示されているように電子部
品搭載用基板の導体ピンの異形頭部の方向整列を
することがよいのであるが、導体ピンは非常に小
さく（直径0.5mm程度、長さ数mm程度）、さらに非
常に多数のものが通常2.54mmピツチのマトリツク
ス配列にあるので、一本ずつ方向整列することは
不可能に近く、また行つたとしても、時間効率の
非常に悪い作業となつていた。(Prior Art) Conventionally, in a manufacturing apparatus for forming a board for mounting electronic components, especially when a conductor pin has an irregularly shaped head, the method disclosed in Utility Model Application No. 60-065541〓Semiconductor Package Board〓 It is better to align the irregularly shaped heads of the conductor pins on the board for mounting electronic components as shown in the figure, but the conductor pins are very small (about 0.5 mm in diameter and several mm in length), and Since there are usually a large number of wires arranged in a matrix with a pitch of 2.54 mm, it is nearly impossible to align the wires one by one, and even if it were done, it would be a very time-inefficient task.
また、導体ピン３０の異形頭部３０ａを基板の
挿入口に押圧挿入して嵌合することにより電子部
品搭載用基板を製造するにあたり、異形頭部３０
ａを持つ導体ピン３０の挿入間隔が通常2.54mmで
マトリツクス状にあるので、基板側の挿入口の隣
同志の肉厚が少ないこともあつて、導体ピン３０
の異形頭部３０ａの方向によつては、導体ピン３
０が挿入された基板側に応力集中が生じ、基板を
構成している樹脂硬化体に微細なクラツクが発生
し、あるいは、樹脂硬化体とガラス繊維の界面に
剥離が発生する場合がある。これは各導体ピン３
０の異形頭部３０ａの偏平部分がたまたま対向し
た場合に起こり易いものであり、このようなこと
がないように各導体ピン３０を整列しておかなけ
ればならないのである。 In addition, when manufacturing a board for mounting electronic components by press-inserting and fitting the irregularly shaped head 30a of the conductor pin 30 into the insertion opening of the board, the irregularly shaped head 30a of the conductor pin 30 is
Since the insertion interval of the conductor pins 30 with a is usually 2.54 mm and they are arranged in a matrix, the thickness of the adjacent insertion holes on the board side is small, so the conductor pins 30
Depending on the direction of the irregularly shaped head 30a, the conductor pin 3
Stress concentration occurs on the side of the substrate into which the zero is inserted, and minute cracks may occur in the cured resin that constitutes the substrate, or peeling may occur at the interface between the cured resin and the glass fiber. This is each conductor pin 3
This is likely to occur if the flat portions of the irregularly shaped heads 30a of the 0.
（考案が解決しようとする問題点）
本考案は以上のような実状に鑑みてなされたも
ので、その解決しようとする問題点は、電子部品
搭載用基板の導体ピンの異形頭部の方向整列を如
何に効率よく行わせるかである。(Problem to be solved by the invention) The invention was made in view of the above-mentioned actual situation, and the problem to be solved is the alignment of the direction of the irregularly shaped heads of the conductor pins of the board for mounting electronic components. The question is how to do this efficiently.
そして、本考案の目的とするところは、導体ピ
ンの異形頭部の方向整列、特に電子部品搭載用基
板を形成する製造装置における、効率のよい方向
整列治具を提供することにある。 An object of the present invention is to provide an efficient directional alignment jig for directional alignment of irregularly shaped heads of conductor pins, particularly in manufacturing equipment for forming electronic component mounting boards.
（問題点を解決するための手段）
以上の問題点を解決するために本考案が採つた
手段は、実施例に対応する第１図を参照して説明
すると、
「多数の導体ピン３０を収納したパレツト２０
上に組み付けられて、導体ピン３０の異形頭部３
０ａが挿入される多数の楕円穴１１を有したピン
方向整列治具１０であつて、
各楕円穴１１を、導体ピン３０に形成されて、
その直径方向に大きく突出させた凸状の偏平部で
ある異形頭部３０ａを挿入し得るものとするとと
もに、
これら多数の楕円穴１１を複数の列状に配置し
て、各列毎の楕円穴１１の長軸方向を当該列方向
に対して斜めにするとともに各方向を同一にし、
かつ隣接する各列における各楕円穴１１の長軸方
向を略直交させたことを特徴とするピン方向整列
治具１０」
である。(Means for Solving the Problems) The means taken by the present invention to solve the above problems are explained with reference to FIG. 1 corresponding to the embodiment. Palette 20
The deformed head 3 of the conductor pin 30 is assembled on top.
A pin direction alignment jig 10 having a large number of oval holes 11 into which 0a are inserted, each oval hole 11 being formed in a conductor pin 30,
The irregularly shaped head 30a, which is a convex flat part that largely protrudes in the diametrical direction, can be inserted, and the large number of elliptical holes 11 are arranged in a plurality of rows, and each row has an elliptical hole. The long axis direction of 11 is made oblique to the row direction, and each direction is made the same,
and a pin direction alignment jig 10 characterized in that the long axis directions of the respective elliptical holes 11 in each adjacent row are substantially perpendicular to each other.
すなわち、本考案にかかわるピン方向整列治具
１０は、その多数の楕円穴１１を利用して、例え
ば、特願昭61−121756号〓カムを用いた三次元変
位装置〓に開示されている作業台と一体的に変位
するごとく構成し、導体ピン３０を所定配列で多
数収納したパレツト２０に被せ、前後、左右方向
に変位させて使用することにより、パレツト２０
に挿入された導体ピン３０の異形頭部３０ａの方
向整列をさせるものである。 That is, the pin direction alignment jig 10 according to the present invention utilizes the large number of elliptical holes 11 to perform the work disclosed in, for example, Japanese Patent Application No. 121756/1983 (Three-dimensional displacement device using a cam). The pallet 20 is constructed so that it can be displaced integrally with the base, and is placed over the pallet 20 in which a large number of conductor pins 30 are stored in a predetermined arrangement.
This is to align the direction of the irregularly shaped head 30a of the conductor pin 30 inserted into the conductor pin 30.
（考案の作用）
本考案が以上のような手段を採ることによつて
以下のような作用がある。(Function of the invention) By adopting the above-mentioned means, the present invention has the following effects.
まず、このピン方向整列治具１０は、多数の導
体ピン３０を挿入したパレツト２０上に被せられ
るのであるが、その各楕円穴１１は各導体ピン３
０の異形頭部３０ａよりも少し大きめのものであ
るので、各導体ピン３０がどのような位置にあつ
ても、このピン方向整列治具１０によつて各導体
ピン３０の特に異形頭部３０ａが一定方向に列と
なつたものとして配列されるのである。 First, this pin direction alignment jig 10 is placed over a pallet 20 into which a large number of conductor pins 30 are inserted, and each oval hole 11 is placed on a pallet 20 in which a large number of conductor pins 30 are inserted.
Since the head 30a of each conductor pin 30 is slightly larger than the irregular head 30a of the conductor pin 30, no matter where the conductor pin 30 is located, the pin direction alignment jig 10 can be used to adjust the irregular head 30a of each conductor pin 30. are arranged in rows in a certain direction.
従つて、導体ピン３０の異形頭部３０ａを押圧
挿入し嵌合により電子部品搭載用基板を製造する
にあたり、異形頭部３０ａを持つ導体ピン３０の
挿入間隔が通常2.54mmでマトリツクス状にあるの
で挿入口の隣同志の肉厚が少く、導体ピン３０の
異形頭部３０ａの方向によつては、応力集中が生
じ、樹脂硬化体に微細なクラツクが発生し、ある
いは、樹脂硬化体とガラス繊維の界面に剥離が発
生する場合があるが、導体ピン３０の異形頭部３
０ａを方向整列することにより上記の不都合が確
実に回避され得るのである。 Therefore, when manufacturing a board for mounting an electronic component by press-inserting and fitting the irregularly shaped heads 30a of the conductor pins 30, the insertion interval of the conductor pins 30 having the irregularly shaped heads 30a is usually 2.54 mm, and they are arranged in a matrix. Depending on the direction of the irregularly shaped head 30a of the conductor pin 30, where the thickness of the wall adjacent to the insertion opening is small, stress concentration may occur, causing minute cracks in the cured resin body, or causing damage to the cured resin body and glass fibers. Although peeling may occur at the interface of the conductor pin 30,
By aligning the directions of Oa, the above-mentioned disadvantages can be reliably avoided.
つまり、本考案に係るピン方向整列治具１０に
よつて、各導体ピン３０の異形頭部３０ａがその
偏平部の方向が一定した状態で配列されるから、
隣接する各導体ピン３０の異形頭部３０ａは互い
に接近しないのである。従つて、このように配列
された多数の導体ピン３０を基板の挿入口に強制
嵌合したとしても、基板側にクラツクが発生した
り、剥離が生じたりするようなことはないのであ
る。 In other words, with the pin direction alignment jig 10 according to the present invention, the irregularly shaped heads 30a of each conductor pin 30 are arranged with the direction of the flat part thereof constant.
The irregularly shaped heads 30a of adjacent conductor pins 30 do not come close to each other. Therefore, even if a large number of conductor pins 30 arranged in this manner are forcibly fitted into the insertion opening of the board, no cracks or peeling will occur on the board side.
以下に、本考案を図面に示した実施例に基づい
て詳細に説明する。 The present invention will be explained in detail below based on embodiments shown in the drawings.
（実施例）
第１図には、本考案に係る、ピン方向整列治具
１０、および電子部品搭載用基板１００を製造す
るに使用されるパレツト２０、さらに該パレツト
２０の挿入口２１に異形頭部３０ａが、かつてな
方向を向いている導体ピン３０が挿入された斜視
図が示してあり、第２図は第１図に示された方向
整列治具１０が導体ピン３０の異形頭部３０ａに
対して動作位置にあるところの部分断面図であ
る。このピン方向整列治具１０は例えば特願昭61
−121756号〓カムを用いた三次元変位装置〓に開
示されているような装置に取付穴１２でもつて一
体的に取付けられている。(Example) FIG. 1 shows a pin direction alignment jig 10 according to the present invention, a pallet 20 used for manufacturing an electronic component mounting board 100, and an irregularly shaped head inserted into an insertion opening 21 of the pallet 20. A perspective view is shown in which the conductor pin 30 is inserted, with the portion 30a facing in the conventional direction, and FIG. 2 shows that the direction alignment jig 10 shown in FIG. FIG. This pin direction alignment jig 10 is, for example,
It is integrally attached to a device such as that disclosed in No. 121756 (Three-dimensional displacement device using a cam) through the attachment hole 12.
このピン方向整列治具１０は、例えば、第５図
に示した電子部品搭載用基板１００に対応した楕
円穴１１があり、またその楕円穴１１の方向につ
いては、実願昭60−065541号〓半導体用パツケー
ジ基板〓に開示されているように、より効果が大
きい穴明方向にしてある。 This pin direction alignment jig 10 has, for example, an oval hole 11 corresponding to the electronic component mounting board 100 shown in FIG. As disclosed in ``Package Substrates for Semiconductors'', the hole direction is set to have a greater effect.
すなわち、これらの楕円穴１１は、第１図に示
したように、ピン方向整列治具１０の短手方向に
平行な列として（実施例では５列）形成してあ
り、各列毎の楕円穴１１の長軸方向は当該列の方
向に対して斜め（実施例においては約45゜の方向）
であつてすべて一致したものとしてある。また、
本実施例においては、第１図に示したように、楕
円穴１１の長軸方向は列毎、すなわち交互に反対
向きとなるようにしてあつて、これにより、隣接
する各楕円穴１１の長軸方向は略直交した状態に
してあるものである。 That is, as shown in FIG. 1, these elliptical holes 11 are formed in rows (5 rows in the embodiment) parallel to the width direction of the pin direction alignment jig 10, and each row has an ellipse. The long axis direction of the hole 11 is oblique to the direction of the row (approximately 45° direction in the embodiment)
It is assumed that everything is consistent. Also,
In this embodiment, as shown in FIG. 1, the long axis directions of the elliptical holes 11 are arranged in opposite directions for each row, that is, alternately. The axial directions are substantially orthogonal.
導体ピン３０は第３図イ，ロに示したように、
鍔３１の上に異形頭部３０ａがあり、前記導体ピ
ン３０は金属線を加工されてなるものであり、材
質はコバール、42アロイ、リン青銅、銅などであ
る。異形頭部３０ａは、金属線の直径方向に突出
した凸状の扁平部を持ち、その幅は金属線外径よ
り大きく、第５図に示した、電子部品搭載用基板
１００を形成するための基板４０のスルーホール
の直径より大きく設定し、その直角方向の幅は、
前記金属線より小さく、前記基板４０のスルーホ
ールの直径より小さくなつている。 The conductor pin 30 is as shown in Fig. 3 A and B.
There is a deformed head 30a on the collar 31, and the conductor pin 30 is made of processed metal wire, and the material is Kovar, 42 alloy, phosphor bronze, copper, etc. The irregularly shaped head 30a has a convex flat part that protrudes in the diameter direction of the metal wire, and its width is larger than the outer diameter of the metal wire, and is suitable for forming the electronic component mounting board 100 shown in FIG. It is set larger than the diameter of the through hole of the board 40, and its width in the perpendicular direction is
It is smaller than the metal wire and smaller than the diameter of the through hole in the substrate 40.
ここで第２図のようにピン方向整列治具１０
が、例えば特願昭61−121756号〓カムを用いた三
次元変位装置〓により、この状態から、図におい
て、左右方向および紙面に垂直上下方向に微小な
変位を繰り返し加えることにより、第４図に異形
頭部を模式的にて示すごとく、ピン方向整列治具
１０の楕円穴１１の方向に導体ピン３０の異形頭
部３０ａの方向が習い、Ａの状態からＢ状態に整
列させられる。 Here, as shown in FIG. 2, the pin direction alignment jig 10
However, by using, for example, a three-dimensional displacement device using a cam in Japanese Patent Application No. 61-121756, from this state, by repeatedly applying minute displacements in the left-right direction and in the vertical direction perpendicular to the plane of the paper, as shown in FIG. As shown schematically in FIG. 1, the direction of the irregularly shaped head 30a of the conductor pin 30 is aligned in the direction of the oval hole 11 of the pin direction alignment jig 10, and the conductor pin 30 is aligned from state A to state B.
次にピン方向整列治具１０をパレツト２０の挿
入口２１に挿入された導体ピン３０の異形頭部３
０ａから逃がし、導体ピン３０に基板４０を嵌合
圧入することにより、電子部品搭載用基板１００
を製造することができる。 Next, the pin direction alignment jig 10 is inserted into the irregularly shaped head 3 of the conductor pin 30 inserted into the insertion opening 21 of the pallet 20.
By fitting and press-fitting the board 40 to the conductor pins 30, the electronic component mounting board 100 is assembled.
can be manufactured.
（考案の効果）
以上詳述した通り、本考案にあつては上記実施
例にて例示した如く、
「多数の導体ピン３０を収納したパレツト２０
上に組み付けられて、導体ピン３０の異形頭部３
０ａが挿入される多数の楕円穴１１を有したピン
方向整列治具１０であつて、
各楕円穴１１を、導体ピン３０に形成されて、
その直径方向に大きく突出させた凸状の偏平部で
ある異形頭部３０ａを挿入し得るものとするとと
もに、
これら多数の楕円穴１１を複数の列状に配置し
て、各列毎の楕円穴１１の長軸方向を当該列方向
に対して斜めにするとともに各方向を同一にし、
かつ隣接する各列における各楕円穴１１の長軸方
向を略直交させたこと」
にその特徴があり、これにより電子部品搭載用基
板１００の製造時における基板４０に導体ピン３
０の異形頭部３０ａの方向によつて、応力集中を
生じ、樹脂硬化体に微細なクラツクが発生する不
都合、あるいは、樹脂硬化体とガラス繊維の界面
に剥離が発生する不都合を確実に回避され得るの
である。(Effects of the invention) As detailed above, in the present invention, as exemplified in the above embodiment, "a pallet 20 containing a large number of conductor pins 30"
The irregularly shaped head 3 of the conductor pin 30 is assembled on top of the conductor pin 30.
A pin direction alignment jig 10 having a large number of oval holes 11 into which the pins 0a are inserted, each oval hole 11 being formed in a conductor pin 30,
The irregularly shaped head 30a, which is a convex flat part that largely protrudes in the diametrical direction, can be inserted, and a large number of elliptical holes 11 are arranged in a plurality of rows, and each row has an elliptical hole. The long axis direction of 11 is made oblique to the row direction, and each direction is made the same,
The major axis direction of each elliptical hole 11 in each adjacent row is substantially orthogonal to each other.
Depending on the direction of the irregularly shaped head 30a of 0, it is possible to reliably avoid the inconvenience of causing stress concentration and causing minute cracks in the cured resin body, or the inconvenience of peeling at the interface between the cured resin body and the glass fiber. You get it.
第１図は本考案に係るピン方向整列治具と、導
体ピンが挿入されたパレツトの斜視図、第２図は
第１図においてピン方向整列治具が動作位置にお
ける部分断面図、第３図は導体ピンイ，ロの図
面、第４図は導体ピンの異形頭部の整列状態を表
す模式図、第５図は電子部品搭載用基板の斜視
図、第６図は当該ピン方向整列治具を適用してな
る電子部品搭載用基板の自動製造装置の斜視図で
ある。
符号の説明、１０……ピン方向整列治具、１１
……楕円穴、２０……パレツト、３０……導体ピ
ン、３０ａ……異形頭部。
Fig. 1 is a perspective view of a pin direction alignment jig according to the present invention and a pallet with conductor pins inserted, Fig. 2 is a partial sectional view of the pin direction alignment jig in the operating position in Fig. 1, and Fig. 3 Figure 4 is a schematic diagram showing the alignment of the irregularly shaped heads of the conductor pins, Figure 5 is a perspective view of the electronic component mounting board, and Figure 6 is the pin direction alignment jig. FIG. 2 is a perspective view of an automatic manufacturing apparatus for electronic component mounting substrates to which the present invention is applied. Explanation of symbols, 10...Pin direction alignment jig, 11
... Oval hole, 20 ... Pallet, 30 ... Conductor pin, 30a ... Irregular head.
Claims (1)
けられて、前記導体ピンの異形頭部が挿入される
多数の楕円穴を有したピン方向整列治具であつ
て、 前記各楕円穴を、前記導体ピンに形成されて、
その直径方向に大きく突出させた凸状の偏平部で
ある前記異形頭部を挿入し得るものとするととも
に、 これら多数の楕円穴を複数の列状に配置して、
各列毎の楕円穴の長軸方向を当該列方向に対して
斜めにするとともに各方向を同一にし、かつ隣接
する各列における各楕円穴の長軸方向を略直交さ
せたことを特徴とするピン方向整列治具。[Claims for Utility Model Registration] A pin direction alignment jig that is assembled on a pallet containing a large number of conductor pins and has a large number of oval holes into which irregularly shaped heads of the conductor pins are inserted, the jig comprising: each oval hole is formed in the conductor pin,
The irregularly shaped head, which is a convex flat part that largely protrudes in the diametrical direction, can be inserted, and the large number of elliptical holes are arranged in a plurality of rows,
The long axis direction of the elliptical holes in each row is made oblique to the direction of the row, and the directions are the same, and the long axis direction of each elliptical hole in each adjacent row is made substantially orthogonal. Pin direction alignment jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986116504U JPH039355Y2 (en) | 1986-07-29 | 1986-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986116504U JPH039355Y2 (en) | 1986-07-29 | 1986-07-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6322799U JPS6322799U (en) | 1988-02-15 |
| JPH039355Y2 true JPH039355Y2 (en) | 1991-03-08 |
Family
ID=31001158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986116504U Expired JPH039355Y2 (en) | 1986-07-29 | 1986-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH039355Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4977271A (en) * | 1972-11-29 | 1974-07-25 | ||
| JPS502258A (en) * | 1975-04-26 | 1975-01-10 | ||
| JPS541532U (en) * | 1977-06-03 | 1979-01-08 |
-
1986
- 1986-07-29 JP JP1986116504U patent/JPH039355Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4977271A (en) * | 1972-11-29 | 1974-07-25 | ||
| JPS502258A (en) * | 1975-04-26 | 1975-01-10 | ||
| JPS541532U (en) * | 1977-06-03 | 1979-01-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6322799U (en) | 1988-02-15 |
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