JPS58300Y2 - printed board - Google Patents

printed board

Info

Publication number
JPS58300Y2
JPS58300Y2 JP8662477U JP8662477U JPS58300Y2 JP S58300 Y2 JPS58300 Y2 JP S58300Y2 JP 8662477 U JP8662477 U JP 8662477U JP 8662477 U JP8662477 U JP 8662477U JP S58300 Y2 JPS58300 Y2 JP S58300Y2
Authority
JP
Japan
Prior art keywords
hole
component
printed board
lead
relatively small
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8662477U
Other languages
Japanese (ja)
Other versions
JPS5412857U (en
Inventor
越野邦治
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP8662477U priority Critical patent/JPS58300Y2/en
Publication of JPS5412857U publication Critical patent/JPS5412857U/ja
Application granted granted Critical
Publication of JPS58300Y2 publication Critical patent/JPS58300Y2/en
Expired legal-status Critical Current

Links

Description

【考案の詳細な説明】 この考案はプリント板、特に部品挿入と仮係止を容易に
するようにしたプリント板の挿通孔に関する。
[Detailed Description of the Invention] This invention relates to a printed board, and particularly to a through hole in the printed board that facilitates insertion and temporary locking of components.

電気回路装置の高密度実装と高信頼度とはプリント配線
による組立技法を利用することによりその小型化を含め
て達成され得るが、プリント配線における作業工程では
作業能率面での種々の問題が提起されていた。
High-density packaging and high reliability of electrical circuit devices can be achieved, including miniaturization, by using printed wiring assembly techniques, but the printed wiring work process poses various problems in terms of work efficiency. It had been.

例えば、プリント板に実装すべき部品を所定位置に配置
してそのリード部をはんだ付けするに際し、先ず、部品
リード部の折り曲げ等の予備加工、いわゆる、フォーミ
ングに多大の労力や時間が要求され1次いで1部品のプ
リント板への挿入とはんだ付けでは部品の脱落や位置ず
れを防ぐための注力が要求されていた。
For example, when placing a component to be mounted on a printed circuit board in a predetermined position and soldering its leads, a great deal of labor and time is required for preliminary processing such as bending the component leads, so-called forming. Next, when inserting and soldering a single component onto a printed board, special efforts were required to prevent the component from falling off or shifting its position.

特に、部品リードのフォーミング加工で挿入部品の仮係
止機能を得ることも行なわれているが、一般には。
In particular, a temporary locking function for inserted parts is obtained by forming parts leads, but in general.

仮係止機能の向上に伴なうに従って部品の挿入作業を困
難にしてその能率を低下させるという相反することとな
っていた。
As the temporary locking function improves, the work of inserting parts becomes more difficult and efficiency decreases, which is contradictory.

更には1通常のプリント配線ではプリント基板の挿通孔
が電子部品リードの挿入を容易にするために比較的余裕
ある太ぎさで形成されるとぎには、次のはんだ付は工程
においてはんだ盛り不良などの欠陥が生じていた。
Furthermore, in the case of normal printed wiring, the insertion hole of the printed circuit board is formed with a relatively generous thickness to facilitate the insertion of electronic component leads. defects had occurred.

すなわち1部品の挿着を容易にする目的で、例えば、0
.2m4度のクリアランスを設ける場合に、実装部品の
リード線とプリント板の導電ランド間のはんだ接続がク
リアランスの全域を覆うようにはんだ盛りすることが難
しくなり、部分的なはんだ付は箇所が生じて不完全なは
んだ接続となり易かった。
In other words, for the purpose of facilitating the insertion of one component, for example, 0
.. When creating a clearance of 2m4 degrees, it becomes difficult to apply solder between the lead wire of the mounted component and the conductive land of the printed circuit board so as to cover the entire area of the clearance, and partial soldering may result in spots. This tends to result in incomplete solder connections.

それ故に、このようなはんだ付けは信頼性の低下を招き
好ましくなく、時にははんだ付けの修正に余計な作業を
必要としていた。
Therefore, such soldering is undesirable because it reduces reliability and sometimes requires extra work to correct the soldering.

一方1部分的なはんだ接続に伴なう欠陥はクリアランス
を極力小さくすることで改善され得るであろうが、それ
は他方で部品リードの挿通作業に困難性を増すことにな
りこの種の問題を完全に解決することにはならない。
On the other hand, defects associated with partial solder connections could be improved by minimizing the clearance, but on the other hand, this would increase the difficulty of inserting component leads, and this type of problem could be completely eliminated. This will not solve the problem.

従って、本考案の目的は上記に鑑み提案されたものであ
り、電子部品のプリント板への装着作業能率を低下させ
ることなく2信頼性の高いはんだ接続を達成することの
できるプリント板を提供することにある。
Therefore, the object of the present invention was proposed in view of the above, and is to provide a printed board that can achieve highly reliable solder connections without reducing the efficiency of mounting electronic components onto the printed board. There is a particular thing.

本考案によれば、プリント板には装着用部品リードを自
由に挿通することのできる比較的大ぎな透孔部、この部
品リードと略同等の比較的小さな透孔部、および前述の
両送孔部を連通ずる中間の透孔部とを有する挿通孔が設
けられる。
According to the present invention, the printed board has a relatively large through hole through which the component lead for mounting can be freely inserted, a relatively small through hole that is approximately equivalent to the component lead, and both of the above-mentioned feed holes. An insertion hole is provided that has an intermediate through-hole portion that communicates with the two portions.

通常の一対のリードを有する実装部品に対しては、前述
する挿通孔が実装部品の所定位置□対応して点対称にな
るようにして一対が設けられる。
For a mounting component having a normal pair of leads, a pair of leads are provided so that the aforementioned insertion holes correspond to a predetermined position □ of the mounting component and are point symmetrical.

従って、このようなプリント板を用いたプリント配線作
業では実装部品のリード線が、先ず、比較的大さな透孔
部に挿入され1次いで、挿入されたリード線を比較的小
さな透孔部に動かして引続く半田作業に備えることがで
きる。
Therefore, in printed wiring work using such a printed board, the lead wire of the mounted component is first inserted into a relatively large through hole, and then the inserted lead wire is inserted into a relatively small through hole. It can be moved and prepared for subsequent soldering work.

この場合、部品リードの挿通は容易に行なわれるので予
備処理としてのフォーミングが省略でき又は著じるしく
簡素化し得る。
In this case, since the component leads can be easily inserted, forming as a preliminary process can be omitted or significantly simplified.

また、挿入した部品リードの移動に際し比較的小さな透
孔部で摩擦的に係合し得るので仮係止機能も得られる。
Further, when the inserted component lead moves, it can be frictionally engaged with the relatively small through hole, so that a temporary locking function can be obtained.

この仮係止力は、一対のリード線間の距離をその移動に
伴って変化するように予め挿通孔を配設することにより
、リード線の弾性を利用しても得ることができる。
This temporary locking force can also be obtained by utilizing the elasticity of the lead wires by providing an insertion hole in advance so that the distance between the pair of lead wires changes as the lead wires move.

例えば、一対の挿通孔を点対称にして配置するものにお
いて、大きな透孔部の中心間距離と小さな透孔部の中心
間距離を異にして設けることで部品リードの弾性を利用
した仮係止機能を得ることができる。
For example, in a device in which a pair of insertion holes are arranged point-symmetrically, the distance between the centers of the large through-hole and the distance between the centers of the small through-hole can be set differently to temporarily lock the parts using the elasticity of the component lead. function can be obtained.

以下1本考案に係る実施例を図面を参照しつつ説明する
An embodiment of the present invention will be described below with reference to the drawings.

第1図は本考案に係るプリント板1を示す。FIG. 1 shows a printed board 1 according to the present invention.

このプリント板1には一対の部品リード用挿通孔2゜3
が設けられている。
This printed board 1 has a pair of insertion holes 2°3 for component leads.
is provided.

これらの挿通孔2,3はそれぞれ比較的大ぎな透孔部4
,7.比較的小さな透孔部5,8.および両送孔部を連
通ずる中間の透孔部6,9を有しており、互に点10に
対して対称形に設けられている。
These insertion holes 2 and 3 each have a relatively large through hole portion 4.
,7. Relatively small through holes 5, 8. and intermediate through-hole portions 6 and 9 that communicate the two feeding hole portions, and are provided symmetrically with respect to a point 10.

第2図はプリント板1に対する実装部品11の仮係止状
態を示す部分断面図であり1部品の各リード線12,1
3がやや変形されて比較的小さな透孔部5,8で係止さ
れている。
FIG. 2 is a partial cross-sectional view showing the state in which the mounted component 11 is temporarily secured to the printed board 1.
3 is slightly deformed and is secured by relatively small through holes 5 and 8.

すなわち1部品11のプリント板1の挿通孔2,3に対
する挿入は比較的大ぎな透孔部4,7で行なわれ、挿入
後この部品11を捩るようにしてそれぞれのリード線位
置を変えている。
In other words, one component 11 is inserted into the insertion holes 2 and 3 of the printed board 1 through relatively large through holes 4 and 7, and after insertion, the component 11 is twisted to change the position of each lead wire. .

従って、リード線12゜13は挿入時の状態(想像線で
示す)から変形され、それに伴なって元に戻ろうとする
復元力が働らき仮係止機能を発揮する。
Therefore, the lead wires 12 and 13 are deformed from the state at the time of insertion (as shown by imaginary lines), and a restoring force is exerted to return them to their original state, thereby exerting a temporary locking function.

尚14はプリント板1の導電パターンであり、本考案に
よれば比較的小さな透孔部5,8においてはほとんどク
リアランスが形成されない。
Note that 14 is a conductive pattern on the printed board 1, and according to the present invention, almost no clearance is formed in the relatively small through holes 5 and 8.

換言すれば、比較的小さな透孔部5,8は部品リードの
切断面と略同等の太ぎさで形成されとおり、自動はんだ
付は工程でのはんだ付けを確実に行なう。
In other words, the relatively small through holes 5 and 8 are formed to have a thickness substantially equal to the cut surface of the component lead, and automatic soldering ensures reliable soldering in the process.

前述する実施例は一対の挿通孔を点対称にして設けた通
常の電子部品実装に適するものであるが、プリント板を
貫通するようにして設ける単一ノリード支柱等のプリン
ト配線体においては同様の形状の挿通孔を1側設ければ
よい。
The above-mentioned embodiment is suitable for ordinary electronic component mounting in which a pair of insertion holes are provided point-symmetrically, but a similar method can be used for a printed wiring body such as a single lead support that is provided so as to penetrate through a printed board. A shaped insertion hole may be provided on one side.

この場合、リード支柱は比較的大きな透孔部に挿入した
後連通ずる透孔を経て比較的小さな透孔部に移動させる
In this case, the lead strut is inserted into a relatively large through hole and then moved to a relatively small through hole through a communicating through hole.

そして、例えば、くさび形にした比較的小さな透孔部で
リード支柱をくい込ませて仮係止させることができる。
For example, the lead support can be inserted into the relatively small wedge-shaped through hole to temporarily lock the lead support.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係るプリント板の一部分の平面図、お
よび第2図は第1図のプリント板に実装部品を仮係止し
た状態を示す部分断面図である。 1・・・・・・プリント板、2,3・・・・・・挿通孔
、4゜7・・・・・・比較的大ぎな透孔部、5,8・・
・・・・比較的小さな透孔部、6,9・・・・・・連通
透孔部、10・・・・・・対称点、11・・・・・・実
装部品、12,13・・・・・・リード線。
FIG. 1 is a plan view of a portion of a printed board according to the present invention, and FIG. 2 is a partial sectional view showing a state in which mounted components are temporarily secured to the printed board of FIG. 1. 1... Printed board, 2, 3... Insertion hole, 4゜7... Relatively large through hole, 5, 8...
...Relatively small through hole, 6,9...Communication through hole, 10...Symmetry point, 11...Mounted component, 12,13... ·····Lead.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] (1)部品リードを自由に挿通する比較的大きな透孔部
、この部品リード断面と略同等の比較的小さな透孔部、
および前記両送孔部を連通ずる中間の透孔部とを有する
挿通孔を設けたことを特徴とするプリント板。
(1) A relatively large through hole through which the component lead can be freely inserted, a relatively small through hole approximately equivalent to the cross section of this component lead,
and an intermediate through-hole portion that communicates with both the feeding hole portions.
(2)一対の挿通孔が実装部器の所定位置に対応して点
対称的に設けられ、実装部品の挿入後の捩りによりこれ
を所定位置□仮係止するようにしたことを特徴とする実
用新案登録請求の範囲第(1)項記載のプリント板。
(2) A pair of insertion holes are provided point-symmetrically corresponding to a predetermined position of the mounting component, and the mounting component is temporarily locked in a predetermined position by twisting after insertion. A printed board according to claim (1) of the utility model registration claim.
JP8662477U 1977-06-29 1977-06-29 printed board Expired JPS58300Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8662477U JPS58300Y2 (en) 1977-06-29 1977-06-29 printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8662477U JPS58300Y2 (en) 1977-06-29 1977-06-29 printed board

Publications (2)

Publication Number Publication Date
JPS5412857U JPS5412857U (en) 1979-01-27
JPS58300Y2 true JPS58300Y2 (en) 1983-01-06

Family

ID=29011385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8662477U Expired JPS58300Y2 (en) 1977-06-29 1977-06-29 printed board

Country Status (1)

Country Link
JP (1) JPS58300Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60161668U (en) * 1984-04-04 1985-10-26 株式会社 大阪タイユ− Transport vehicle

Also Published As

Publication number Publication date
JPS5412857U (en) 1979-01-27

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