JP2797849B2 - Surface mount connector - Google Patents
Surface mount connectorInfo
- Publication number
- JP2797849B2 JP2797849B2 JP4214844A JP21484492A JP2797849B2 JP 2797849 B2 JP2797849 B2 JP 2797849B2 JP 4214844 A JP4214844 A JP 4214844A JP 21484492 A JP21484492 A JP 21484492A JP 2797849 B2 JP2797849 B2 JP 2797849B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- connector
- circuit board
- printed circuit
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子機器及び電子計算
機を構成する電子回路基板に実装されるサーフェイスマ
ウント用コネクタに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount connector mounted on an electronic circuit board constituting an electronic apparatus and an electronic computer.
【０００２】[0002]
【従来の技術】従来この種のサーフェイスマウント用コ
ネクタは、図２および図３に示すように、コネクタ１の
上下より突出した端子２の先端の広がり部に、プリント
基板３の先端を位置合せしてから、上下より出ている端
子２をプリント基板３によって上下に広げながらプリン
ト基板３を端子２間に挿入し、端子２の先端がプリント
基板３上のパッド４上に位置するようにセットしてい
た。2. Description of the Related Art Conventionally, in this type of surface mount connector, as shown in FIGS. 2 and 3, the front end of a printed circuit board 3 is aligned with a widened portion of a front end of a terminal 2 projecting from above and below a connector 1. FIG. Then, the printed circuit board 3 is inserted between the terminals 2 while spreading the terminals 2 projecting up and down by the printed circuit board 3, and set so that the tip of the terminal 2 is located on the pad 4 on the printed circuit board 3. I was
【０００３】[0003]
【発明が解決しようとする課題】上述した従来のサーフ
ェイスマウント用コネクタでは、コネクタ嵌合面とは反
対側の背面から出ている端子間にプリント基板を挿入す
る時、端子間にプリント基板を挿入し易くする為、端子
先端を多少広げているだけであり、プリント基板挿入時
にはプリント基板により端子を上下に広げながら端子間
にプリント基板を挿入する為、端子に負荷が加わり端子
を変形させる恐れがあった。In the above-described conventional surface mount connector, when a printed circuit board is inserted between terminals protruding from the back surface opposite to the connector fitting surface, the printed circuit board is inserted between the terminals. To make it easier to do, the terminal ends are only slightly widened.When inserting the printed circuit board, the printed circuit board inserts the printed circuit board between the terminals while spreading the terminal up and down. there were.
【０００４】又、端子がプリント基板のパッド上の所定
の位置にセットされる段階において、パッド上に印刷さ
れたクリーム半田が端子のパッド上移動によって除去さ
れ半田付け時に半田付け不良になる恐れがあった。In the stage where the terminal is set at a predetermined position on the pad of the printed circuit board, the cream solder printed on the pad may be removed by the movement of the terminal on the pad, resulting in poor soldering at the time of soldering. there were.
【０００５】[0005]
【課題を解決するための手段】本発明のコネクタは、コ
ネクタ嵌合面と反対側の背面の上下２方向から突出した
端子を有するサーフェイスマウント用コネクタにおい
て、前記端子はその先端が接近し、プリント基板表面の
パッドに接触し押圧状態にするようにフォーミングさ
れ、また該端子のコネクタ本体に近い部分には、コネク
タから突出した絶縁物が端子の内側に接近した位置に設
けられ、さらに前記絶縁物は端子方向に開いた凹状の段
差があり、この凹状の段差に圧入可能なブッシングを設
けたことを特徴とする。According to the present invention, there is provided a connector for a surface mount having terminals protruding from two upper and lower directions on a back surface opposite to a connector fitting surface. Formed so as to contact and press the pad on the surface of the substrate, and at a portion of the terminal near the connector body, an insulator protruding from the connector is provided at a position close to the inside of the terminal. Is characterized in that there is a concave step that opens in the terminal direction, and a bushing that can be pressed into the concave step is provided.
【０００６】[0006]
【実施例】次に本発明について図面を参照して説明す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.
【０００７】図１は本発明の第１の実施例の断面図を示
している。図１において、コネクタ１２の上下より出て
いる端子６は、プリント基板７がセットされる前は、図
１（Ａ）に示すようにコネクタ１２の突出部１１とブッ
シング１０の間に位置し、ブッシング１０の押圧力と突
出部１１の凹部によって端子６の先端間が広がる方向に
成形されている。FIG. 1 is a sectional view of a first embodiment of the present invention. In FIG. 1, the terminals 6 projecting from the top and bottom of the connector 12 are located between the projecting portion 11 of the connector 12 and the bushing 10 as shown in FIG. The pressing force of the bushing 10 and the concave portion of the protruding portion 11 are formed so as to widen the space between the tips of the terminals 6.
【０００８】次に、プリント基板７をコネクタ１２の端
子６間の所定の位置にセットし、図１（Ｂ）に示すよう
に、ブッシング１０を取り除く。端子６はその先端がパ
ッド８上に接触し、押圧状態となる。この時パッド８上
にあるクリーム半田９は端子６の先端をつつみこむの
で、クリーム半田９部に熱を加えることにより端子６の
先端とパッド８が半田付けが完了する。Next, the printed circuit board 7 is set at a predetermined position between the terminals 6 of the connector 12, and the bushing 10 is removed as shown in FIG. The tip of the terminal 6 comes into contact with the pad 8 to be in a pressed state. At this time, since the cream solder 9 on the pad 8 wraps around the tip of the terminal 6, by applying heat to the cream solder 9, the soldering of the tip of the terminal 6 and the pad 8 is completed.
【０００９】[0009]
【００１０】[0010]
【００１１】[0011]
【００１２】[0012]
【００１３】[0013]
【００１４】[0014]
【００１５】[0015]
【発明の効果】以上説明したように本発明は、コネクタ
の端子を成形する構造を採り入れ、プリント基板セット
前は、端子がプリント基板表面にあるパッドに接触し押
圧状態にすることにより、下記のような効果がある。As described above, the present invention adopts a structure for forming a terminal of a connector. Before setting the printed circuit board, the terminal is brought into contact with a pad on the surface of the printed circuit board so as to be in a pressed state. It has the following effects.
【００１６】１．端子に負荷が加わらずプリント基板が
セットできる為端子の変形がなくなる。1. Since the printed circuit board can be set without applying a load to the terminal, the terminal is not deformed.
【００１７】２．端子先端がプリント基板表面に接触し
ない状態でプリント基板がセットできる為パッド上のク
リーム半田が除去されることがない。このような効果に
より、半田付け不良を無くすることができる。2. Since the printed circuit board can be set in a state where the terminal end does not contact the printed circuit board surface, the cream solder on the pad is not removed. With such an effect, it is possible to eliminate soldering defects.
【図１】本発明の第１実施例の断面図である。FIG. 1 is a sectional view of a first embodiment of the present invention.
【図２】従来のコネクタにプリント基板が組み込まれた
状態の立体図である。FIG. 2 is a three-dimensional view showing a state where a printed circuit board is incorporated in a conventional connector.
【図３】従来例の断面図である。FIG. 3 is a sectional view of a conventional example.
１ コネクタ ２ 端子 ３ プリント基板 ４ パッド ５ クリーム半田 ６ 端子 ７ プリント基板 ８ パッド ９ クリーム半田 １０ ブッシング １１ 突出部 １２ コネクタ 1 Connector 2 Terminal 3 Printed Circuit Board 4 Pad 5 Cream Solder 6 Terminal 7 Printed Circuit Board 8 Pad 9 Cream Solder 10 Bushing 11 Projection 12 Connector
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H01R 9/09 H01R 23/68──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 6 , DB name) H01R 9/09 H01R 23/68
Claims (1)
方向から突出した端子を有するサーフェイスマウント用
コネクタにおいて、前記端子はその先端が接近し、プリ
ント基板表面のパッドに接触し押圧状態にするようにフ
ォーミングされ、また該端子のコネクタ本体に近い部分
には、コネクタから突出した絶縁物が端子の内側に接近
した位置に設けられ、さらに前記絶縁物は端子方向に開
いた凹状の段差があり、この凹状の段差に圧入可能なブ
ッシングを設けたことを特徴とするサーフェイスマウン
ト用コネクタ。 An upper and lower rear surface opposite to the connector fitting surface;
For surface mount with terminals protruding from the direction
The connector, the terminal is approaching its end, pre
Are forming so as to contact with the cement substrate surface pad pressing state, also in a portion close to the connector body of the terminal, provided at a position where the insulator projecting from the connector approaches the inner side of the terminal, further the insulation A surface mount connector characterized in that the object has a concave step that opens in the terminal direction, and a bushing that can be press-fitted into the concave step is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4214844A JP2797849B2 (en) | 1992-08-12 | 1992-08-12 | Surface mount connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4214844A JP2797849B2 (en) | 1992-08-12 | 1992-08-12 | Surface mount connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0660926A JPH0660926A (en) | 1994-03-04 |
| JP2797849B2 true JP2797849B2 (en) | 1998-09-17 |
Family
ID=16662484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4214844A Expired - Lifetime JP2797849B2 (en) | 1992-08-12 | 1992-08-12 | Surface mount connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2797849B2 (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0347264Y2 (en) * | 1987-05-29 | 1991-10-08 | ||
| DE8907845U1 (en) * | 1989-06-27 | 1989-08-24 | Siemens AG, 1000 Berlin und 8000 München | Pressure adjustment connector |
| JPH0442078U (en) * | 1990-08-10 | 1992-04-09 | ||
| JP2507313Y2 (en) * | 1990-10-16 | 1996-08-14 | ヒロセ電機株式会社 | Electrical connector for circuit board |
| JPH0459069U (en) * | 1990-09-28 | 1992-05-20 | ||
| JP3116571U (en) * | 2005-04-13 | 2005-12-15 | 孝雄 日比野 | Fall-off prevention hanger |
-
1992
- 1992-08-12 JP JP4214844A patent/JP2797849B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0660926A (en) | 1994-03-04 |
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