JP2566808Y2 - Surface mount connector - Google Patents

Surface mount connector

Info

Publication number
JP2566808Y2
JP2566808Y2 JP1992000112U JP11292U JP2566808Y2 JP 2566808 Y2 JP2566808 Y2 JP 2566808Y2 JP 1992000112 U JP1992000112 U JP 1992000112U JP 11292 U JP11292 U JP 11292U JP 2566808 Y2 JP2566808 Y2 JP 2566808Y2
Authority
JP
Japan
Prior art keywords
insulator
circuit board
printed circuit
connector
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1992000112U
Other languages
Japanese (ja)
Other versions
JPH0557788U (en
Inventor
利則 吉野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1992000112U priority Critical patent/JP2566808Y2/en
Publication of JPH0557788U publication Critical patent/JPH0557788U/en
Application granted granted Critical
Publication of JP2566808Y2 publication Critical patent/JP2566808Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【産業上の利用分野】本考案は、通信機等に使用される
表面実装用コネクタに関し、特に、プリント基板に取り
付けられプリント基板の両面に半田付端子を接続してプ
ラグイン実装する表面実装用コネクタの構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount connector used for a communication device and the like, and more particularly, to a surface mount connector which is mounted on a printed circuit board and connected to soldered terminals on both sides of the printed circuit board and plug-in mounted. Related to the structure of the connector.

【0002】[0002]

【従来の技術】従来、この種のコネクタは、対向する半
田付端子片間隙寸法をプリント基板の板厚寸法より小さ
な寸法としていた。
2. Description of the Related Art Conventionally, in this type of connector, the gap between the opposed soldered terminal pieces is smaller than the thickness of the printed circuit board.

【0003】図4は従来におけるコネクタの斜視図、図
5は従来におけるコネクタの断面図、図6はプリント基
板をコネクタに装着した状態の断面図である。
FIG. 4 is a perspective view of a conventional connector, FIG. 5 is a cross-sectional view of a conventional connector, and FIG. 6 is a cross-sectional view of a state where a printed circuit board is mounted on the connector.

【0004】コンタクト2の半田付端子片2aとコンタ
クト3の半田付端子片3aは絶縁体1に対向状に配置さ
れ、半田付端子片2aと3aの半田付端子片間隙寸法t
3はプリント基板4の板厚寸法t2より小さな寸法で構
成されている。プリント基板4の端子片接続用パッド4
a、4bと半田付端子片2a、3aは絶縁体1に設けら
れたねじ止め用孔1a及びプリント基板4に設けられた
ねじ止め用孔(図示せず)を介してねじ5及びナット6
を締付固定することにより、ある接触圧力を持って接続
されている。
[0004] The soldering terminal piece 2a of the contact 2 and the soldering terminal piece 3a of the contact 3 are arranged to face the insulator 1, and the soldering terminal piece gap dimension t between the soldering terminal pieces 2a and 3a.
Numeral 3 is smaller than the thickness t2 of the printed circuit board 4. Terminal strip connection pad 4 of printed circuit board 4
a and 4b and the terminal pieces 2a and 3a with solder are connected to a screw 5 and a nut 6 through a screw hole 1a provided in the insulator 1 and a screw hole (not shown) provided in the printed circuit board 4.
Are connected with a certain contact pressure.

【0005】[0005]

【考案が解決しようとする課題】しかしながら、上述し
た従来の表面実装用コネクタは、対向する半田付端子片
間隙寸法がプリント基板板厚寸法より小さな寸法として
いる為に、コネクタをプリント基板に装着する場合に、
半田付端子片を押し広げなければならず、押し広げる際
に半田付端子片を変形させてしまう危険を有していた。
その変形により、半田付端子片と端子接続用パッドとの
接触圧が失われ、半田付端子片が端子接続用パッドから
浮いたり、半田付端子片のコネクタ長手方向ピッチ寸法
のずれにより半田付端子片端子接続用とパッドの位置ず
れが発生し、接続不良になる危険を有していた。
However, in the above-mentioned conventional surface mount connector, since the gap between the opposed soldered terminal pieces is smaller than the thickness of the printed circuit board, the connector is mounted on the printed circuit board. In case,
The soldered terminal pieces had to be spread out, and there was a risk that the soldered terminal pieces would be deformed during the spreading.
Due to the deformation, the contact pressure between the soldered terminal piece and the terminal connection pad is lost, the soldered terminal piece floats from the terminal connection pad, and the soldered terminal piece shifts due to a shift in the pitch dimension of the soldered terminal piece in the connector longitudinal direction. There is a risk that the misalignment between the pad for single-terminal connection and the pad may occur, resulting in poor connection.

【0006】また、半田付端子片と端子接続用パッドの
適度な接触圧力を得る為に、半田付端子片間隔寸法の管
理を厳しく実施せねばならず、コネクタ製造性に多くの
課題を有していた。
In addition, in order to obtain an appropriate contact pressure between the soldered terminal piece and the terminal connection pad, the distance between the soldered terminal pieces must be strictly controlled, and there are many problems in connector manufacturability. I was

【0007】本考案は従来の上記実情に鑑みてなされた
ものであり、従って本考案の目的は、従来の技術に内在
する上記諸課題を解決することを可能とした新規な表面
実装用コネクタを提供することにある。
[0007] The present invention has been made in view of the above-mentioned conventional circumstances, and accordingly, an object of the present invention is to provide a novel surface mount connector which can solve the above-mentioned problems inherent in the prior art. To provide.

【0008】[0008]

【課題を解決するための手段】上記目的を達成する為
に、本考案に係る表面実装用コネクタは、プリント基板
の板厚よりも大きな寸法で構成した半田付端子片間隙寸
法を有し、対をなす半田付端子片の上部に半田付端子片
を加圧し、プリント基板の端子接続用パッドと半田付端
子片を接触させる絶縁体を備えて構成される。
In order to achieve the above object, a surface mount connector according to the present invention has a solder terminal piece gap dimension larger than the thickness of a printed circuit board. And an insulator for pressing the soldering terminal piece on the upper part of the soldering terminal piece to make contact with the terminal connection pad of the printed circuit board and the soldering terminal piece.

【0009】[0009]

【実施例】次に本考案をその好ましい一実施例について
図面を参照して具体的に説明する。
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing a preferred embodiment of the present invention;

【0010】図1は本考案に係る表面実装用コネクタの
一実施例を示す斜視図、図2はプリント基板とコネクタ
の断面図、図3はプリント基板をコネクタに装着した時
の断面図である。
FIG. 1 is a perspective view showing one embodiment of a surface mount connector according to the present invention, FIG. 2 is a cross-sectional view of a printed circuit board and a connector, and FIG. 3 is a cross-sectional view when the printed circuit board is mounted on the connector. .

【0011】図1〜図3を参照するに、コンタクト2、
3はそれぞれ一端に相手コネクタのコンタクトと接触す
る接触片2b、3bを有し、他端にはプリント基板4の
端子接続用パッド4a、4bと表面実装半田付によりそ
れぞれ接続される半田付端子片2a、3aを有してい
る。半田付端子片2a、3aの間隙寸法t1はプリント
基板4の板厚寸法t2より大きな寸法で構成されてい
る。
Referring to FIG. 1 to FIG.
3 has a contact piece 2b, 3b at one end for contacting a contact of a mating connector, and a soldered terminal piece connected to the terminal connection pads 4a, 4b of the printed circuit board 4 by surface mounting soldering at the other end. 2a and 3a. The gap t1 between the soldered terminal pieces 2a and 3a is larger than the thickness t2 of the printed circuit board 4.

【0012】加圧用絶縁体7とプリント基板4及び絶縁
体1をねじ5及びナット6で締付固定することにより、
加圧用絶縁体7に設けられた段部7aは半田付端子片3
aを押し下げ、半田付端子片3aは端子接続用パッド4
bと、半田付端子片2aは端子接続用パッド4aとそれ
ぞれある接触圧力を持って加圧配置される。半田付用端
子片2a、3aはそれぞれ端子接続用パッド4a、4b
と手作業による半田付け及びリフロー炉等による端子接
続用パッドに設けられた半田ペーストの加熱により、電
気的・機械的に接続される。
By pressing and fixing the insulator 7 for pressurization, the printed circuit board 4 and the insulator 1 with screws 5 and nuts 6,
The step 7 a provided on the pressurizing insulator 7 is a soldered terminal strip 3.
a is pushed down, and the terminal strip 3a with solder is
b and the soldered terminal pieces 2a are pressurized and arranged with a certain contact pressure with the terminal connection pads 4a. The soldering terminal strips 2a, 3a are terminal connection pads 4a, 4b, respectively.
The connection is made electrically and mechanically by manual soldering and by heating the solder paste provided on the terminal connection pads by a reflow furnace or the like.

【0013】[0013]

【考案の効果】以上説明したように、本考案によれば、
対向する半田付端子片間隙寸法をプリント基板板厚寸法
より大きな寸法にすることにより、表面実装用コネクタ
をプリント基板に装着する際に半田付端子片を押し広げ
ることなしに装着することが可能となり、作業性が大幅
に向上する。
[Effects of the Invention] As described above, according to the present invention,
By setting the gap between the opposed soldered terminal pieces to be larger than the thickness of the printed circuit board, it is possible to mount the surface mounted connector on the printed circuit board without expanding the soldered terminal pieces. , Greatly improves workability.

【0014】本考案によればまた、半田付端子片を変形
させることがなくなる為に、高い半田付の信頼性を得る
ことが可能となる。
According to the present invention, since the soldered terminal piece is not deformed, high soldering reliability can be obtained.

【0015】さらに本考案によれば、半田付端子片とプ
リント基板端子接続用のパッドは加圧用絶縁体の寸法に
より加圧量が決定される為に、半田付端子片間隔寸法の
管理が不要となるほど効果が大である。
Further, according to the present invention, since the amount of pressure applied to the soldered terminal pieces and the pads for connecting the printed circuit board terminals is determined by the size of the pressurizing insulator, there is no need to control the distance between the soldered terminal pieces. The greater the effect, the greater the effect.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本考案の一実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.

【図2】本考案による一実施例に於けるプリント基板と
コネクタの断面図である。
FIG. 2 is a sectional view of a printed circuit board and a connector according to an embodiment of the present invention.

【図3】本考案による一実施例に於けるプリント基板を
コネクタに装着した時の断面図である。
FIG. 3 is a cross-sectional view of the connector according to the embodiment of the present invention when the printed circuit board is mounted on the connector.

【図4】従来技術の一例を示す斜視図である。FIG. 4 is a perspective view showing an example of a conventional technique.

【図5】従来例に於けるプリント基板とコネクタの断面
図である。
FIG. 5 is a sectional view of a printed circuit board and a connector in a conventional example.

【図6】従来例に於けるプリント基板をコネクタに装着
した時の断面図である。
FIG. 6 is a cross-sectional view when a printed circuit board in a conventional example is mounted on a connector.

【符号の説明】[Explanation of symbols]

1…絶縁体 2、3…コンタクト 2a、3a…半田付端子片 2b、3b…接触片 4…プリント基板 4a、4b…端子接続用パッド 5…ねじ 6…ナット 7…加圧用絶縁体 7a…段部 t1、t3…半田付端子片間隙寸法 t2…プリント基板板厚 DESCRIPTION OF SYMBOLS 1 ... Insulator 2, 3 ... Contact 2a, 3a ... Solder terminal piece 2b, 3b ... Contact piece 4 ... Printed circuit board 4a, 4b ... Terminal connection pad 5 ... Screw 6 ... Nut 7 ... Pressing insulator 7a ... Step Part t1, t3: Solder terminal piece gap dimension t2: Printed circuit board board thickness

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】 一端に相手コネクタと嵌合する接触片
を設け、他端にプリント基板の両面に配置した端子接続
用パッドと接続される半田付端子片を設けたコンタクト
を第1の絶縁体に対毎に対向させて収容したコネクタに
おいて、前記対向する各対の半田付端子片の間隔をプリ
ント基板の板厚より大きくするとともに、前記半田付端
子片の対向方向上部に半田付端子片を加圧押し下げする
第2の絶縁体を有し、該第2の絶縁体の前記対になるコ
ンタクトの一方に対向する部分に全コンタクトに共通の
段部を設け、前記第2の絶縁体を第1の絶縁体にねじに
より接続し、該ねじを回動調整することにより前記段部
が前記一方のコンタクトを押圧する押圧力を調整すると
ともに前記半田付端子片を対応する前記端子接続用パッ
ドに接触させることを特徴とする表面実装用コネクタ。
A contact having a contact piece fitted at one end with a mating connector and a soldered terminal piece connected to terminal connection pads arranged on both sides of a printed circuit board at the other end is provided as a first insulator. In the connector housed facing each other in pairs, the spacing between the opposed pairs of soldered terminal pieces is made larger than the thickness of the printed circuit board, and the soldered terminal pieces are placed above the soldered terminal pieces in the facing direction. have a second insulator for depressing pressure, the said pair of the second insulator co
Common to all contacts on the part facing one of the contacts
A step is provided, and the second insulator is screwed to the first insulator.
And the screw is rotated to adjust the stepped portion.
When adjusting the pressing force to press the one contact
Both of the soldered terminal pieces correspond to the corresponding terminal connection pads.
A surface mount connector characterized by being brought into contact with a pad.
JP1992000112U 1992-01-07 1992-01-07 Surface mount connector Expired - Lifetime JP2566808Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1992000112U JP2566808Y2 (en) 1992-01-07 1992-01-07 Surface mount connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1992000112U JP2566808Y2 (en) 1992-01-07 1992-01-07 Surface mount connector

Publications (2)

Publication Number Publication Date
JPH0557788U JPH0557788U (en) 1993-07-30
JP2566808Y2 true JP2566808Y2 (en) 1998-03-30

Family

ID=11464986

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1992000112U Expired - Lifetime JP2566808Y2 (en) 1992-01-07 1992-01-07 Surface mount connector

Country Status (1)

Country Link
JP (1) JP2566808Y2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4584505B2 (en) * 2001-08-22 2010-11-24 富士通コンポーネント株式会社 Connector connected to the board edge
JP5565790B2 (en) * 2009-06-30 2014-08-06 日本モレックス株式会社 Edge connector

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6361786U (en) * 1986-10-09 1988-04-23
JP3116571U (en) * 2005-04-13 2005-12-15 孝雄 日比野 Fall-off prevention hanger

Also Published As

Publication number Publication date
JPH0557788U (en) 1993-07-30

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