JP2719356B2 - Manufacturing method of pin grid array - Google Patents
Manufacturing method of pin grid arrayInfo
- Publication number
- JP2719356B2 JP2719356B2 JP63185809A JP18580988A JP2719356B2 JP 2719356 B2 JP2719356 B2 JP 2719356B2 JP 63185809 A JP63185809 A JP 63185809A JP 18580988 A JP18580988 A JP 18580988A JP 2719356 B2 JP2719356 B2 JP 2719356B2
- Authority
- JP
- Japan
- Prior art keywords
- pin
- external connection
- connection terminal
- printed board
- grid array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Description
本発明はピングリッドアレイのプリントボードから突
出する外部接続端子ピンの突出長を一定にする技術に関
する。The present invention relates to a technique for keeping the length of external connection terminal pins protruding from a printed board of a pin grid array constant.
従来にあっては、第５図に示すように金型12のピン挿
入孔４′に鍔部７で係止させて複数本の外部接続端子ピ
ン１の先端部1aを挿入し、外部接続端子ピン１の後端部
1bをプリントボード２のスルホール５に挿着させてピン
グリッドアレイＡ′が製造されている。Conventionally, as shown in FIG. 5, the distal end portions 1a of the plurality of external connection terminal pins 1 are inserted into the pin insertion holes 4 'of the mold 12 with the flanges 7, and the external connection terminals are inserted. Pin 1 rear end
1b is inserted into the through hole 5 of the printed board 2 to manufacture the pin grid array A '.
従来の製造方法においては、外部接続端子ピン１の長
さにばらつきがあるため、プリントボード２からの外部
接続端子ピン１の突出長Ｌは不揃いとなってしまってい
た。このピングリッドアレイＡ′はその外部接続端子ピ
ン１の先端をマザーボード６のランド10に半田11を介し
て電気的に接続させて表面実装されるが、この場合、外
部接続端子ピン１の突出長Ｌは不揃いであり、しかもプ
リントボード２には反りも発生しているので、第６図に
示すように外部接続端子ピン１の先端とマザーボード６
のランド10との間には比較的大きい間隙を形成してしま
い半田11での電気的接続ができない外部接続端子ピン１
も存在し、接続不良が発生してしまっていた。In the conventional manufacturing method, the length L of the external connection terminal pins 1 protruding from the printed board 2 is not uniform because the length of the external connection terminal pins 1 varies. The pin grid array A 'is surface-mounted by electrically connecting the ends of the external connection terminal pins 1 to the lands 10 of the motherboard 6 via solder 11. In this case, the protruding length of the external connection terminal pins 1 L are irregular, and the printed board 2 is also warped. Therefore, as shown in FIG.
A relatively large gap is formed between the external connection terminal pin 1 and the land 10 so that electrical connection with the solder 11 cannot be made.
Also existed, and a connection failure had occurred.
本発明は複数本の外部接続端子ピン１をプリントボー
ド２に挿着するピングリッドアレイの製造方法におい
て、外部接続端子ピン１の先端部1aをピン整列用プレー
ト３の一定深さのピン挿入孔４に挿入した後に、プリン
トボードを加圧することによって外部接続端子ピン１の
後端部1bをプリントボード２のスルホール５に挿着する
ことを特徴とするものであり、この構成により上記課題
が解決されたものである。 ［作用］ 外部接続端子ピン１の先端部1aをピン整列用プレート
３の一定深さのピン挿入孔４に挿入した後に外部接続端
子ピン１の後端部1bをプリントボード２のスルホール５
に挿着するので、外部接続端子ピン１のプリントボード
２からの突出長Ｌはピン挿入孔４により規制されて一定
になり、外部接続端子ピン１の先端が揃うため、マザー
ボード６への確実な電気的接続が可能となるものであ
る。 ［実施例］ 外部接続端子ピン１は導電体により形成されており、
プリントボード２に挿着される後端部1bとプリントボー
ド２から突出する先端部1aとの間に鍔部７が周設されて
形成されている。 まず、この外部接続端子ピン１の先端部1aを第１図に
示すようにピン整列用プレート３のピン挿入孔４に挿入
して、複数本の外部接続端子ピン１をピン整列用プレー
ト３上で整列させる。ピン挿入孔４の深さＤは一定であ
り、従って、外部接続端子ピン１の挿入量は一定とな
る。 次に、回路形成されたプリントボード２をそのスルホ
ール５が外部接続端子ピン１の後端部1bに対応するよう
に外部接続端子ピン１に載置する。 この後、ピン整列用プレート３の両側、あるいは周縁
部にストッパー８を載置して加圧シリンダー９の降下位
置を規制した状態で、第２図に示すように加圧シリンダ
ー９を降下させ、プリントボード２を加圧してスルホー
ル５に外部接続端子ピン１の後端部1bを圧入させる。 このようにして、外部接続端子ピン１の突出長Ｌが一
定となったピングリッドアレイＡを製造する。 このピングリッドアレイＡは第４図に示すようにその
外部接続端子ピン１の先端をマザーボード６のランド10
に半田11を介して電気的に接続させて表面実装される。
この場合、外部接続端子ピン１の突出長Ｌは一定であ
り、先端が揃っているので、確実な電気的接続が可能と
なるものである。The present invention relates to a method for manufacturing a pin grid array in which a plurality of external connection terminal pins 1 are inserted into a printed board 2, wherein a tip 1 a of the external connection terminal pins 1 is inserted into a pin insertion hole of a fixed depth in a pin alignment plate 3. After insertion into the printed circuit board 4, the rear end 1b of the external connection terminal pin 1 is inserted into the through hole 5 of the printed board 2 by pressurizing the printed board. It was done. [Operation] After the tip 1a of the external connection terminal pin 1 is inserted into the pin insertion hole 4 of a fixed depth of the pin alignment plate 3, the rear end 1b of the external connection terminal pin 1 is inserted into the through hole 5 of the printed board 2.
, The length L of the external connection terminal pins 1 protruding from the printed board 2 is regulated by the pin insertion holes 4 and becomes constant. Electrical connection becomes possible. [Example] The external connection terminal pin 1 is formed of a conductor.
A flange 7 is formed around the rear end 1b inserted into the print board 2 and the front end 1a protruding from the print board 2. First, the tip 1a of the external connection terminal pin 1 is inserted into the pin insertion hole 4 of the pin alignment plate 3 as shown in FIG. Align with. The depth D of the pin insertion hole 4 is constant, and therefore, the insertion amount of the external connection terminal pin 1 is constant. Next, the printed board 2 on which the circuit is formed is mounted on the external connection terminal pins 1 such that the through holes 5 correspond to the rear ends 1b of the external connection terminal pins 1. Thereafter, with the stoppers 8 placed on both sides of the pin alignment plate 3 or on the peripheral edge thereof to restrict the lowering position of the pressure cylinder 9, the pressure cylinder 9 is lowered as shown in FIG. The rear end 1b of the external connection terminal pin 1 is pressed into the through hole 5 by pressurizing the printed board 2. Thus, the pin grid array A in which the protruding length L of the external connection terminal pin 1 is constant is manufactured. In this pin grid array A, as shown in FIG.
Are electrically connected to each other via solder 11 to be surface-mounted.
In this case, since the protruding length L of the external connection terminal pin 1 is constant and the ends are aligned, reliable electrical connection is possible.
本発明は、複数本の外部接続端子ピンをプリントボー
ドに挿着するピングリッドアレイの製造方法において、
外部接続端子ピンの先端部をピン整列用プレートの一定
深さのピン挿入孔に挿入した後に、プリントボードを加
圧することによって外部接続端子ピンの後端部をプリン
トボードのスルホールに挿着するので、外部接続端子ピ
ンの後端部をプリントボードのスルホールに挿着する
際、プリントボードの加圧に伴って外部接続端子ピンの
後端部はプリントボードのスルホールに差し込まれるも
のであり、外部接続端子ピンの後端に直接押圧力が作用
することがなく、外部接続端子ピンが曲がることを防ぐ
ことができるものであり、また外部接続端子ピンのプリ
ントボードからの突出長はピン挿入孔により規制されて
一定になり、外部接続端子ピンの先端が揃うため、プリ
ントボードに反りがあったとしても、マザーボードへの
確実な電気的接続が可能となるものである。The present invention provides a pin grid array manufacturing method for inserting a plurality of external connection terminal pins into a printed board,
After inserting the tip of the external connection terminal pin into the pin insertion hole with a certain depth of the pin alignment plate, press the printed board to insert the rear end of the external connection terminal pin into the through hole of the printed board. When the rear end of the external connection terminal pin is inserted into the through hole of the printed board, the rear end of the external connection terminal pin is inserted into the through hole of the printed board due to the pressurization of the printed board. No pressing force acts directly on the rear end of the terminal pin, preventing the external connection terminal pin from bending.The length of the external connection terminal pin protruding from the printed board is restricted by the pin insertion hole. And the external connection terminal pins are aligned, so that even if the printed board is warped, a reliable electrical connection to the motherboard is ensured. And it serves as a performance.
第１図及び第２図は本発明の一実施例の工程を示す概略
断面図、第３図は第１図のＸ部の拡大図、第４図は同上
により製造したピングリッドアレイの表面実装を示す概
略断面図、第５図は従来例の製造工程を示す概略断面
図、第６図は同上により製造したピングリッドアレイの
表面実装を示す概略断面図であって、Ａはピングリッド
アレイ、１は外部接続端子ピン、1aは先端部、1bは後端
部、２はプリントボード、３はピン整列用プレート、４
はピン挿入孔、５はスルホールである。1 and 2 are schematic sectional views showing the steps of an embodiment of the present invention, FIG. 3 is an enlarged view of a portion X in FIG. 1, and FIG. 4 is a surface mounting of a pin grid array manufactured by the above. FIG. 5 is a schematic cross-sectional view showing a manufacturing process of a conventional example, and FIG. 6 is a schematic cross-sectional view showing a surface mounting of the pin grid array manufactured according to the above, wherein A is a pin grid array; 1 is an external connection terminal pin, 1a is a front end, 1b is a rear end, 2 is a printed board, 3 is a plate for pin alignment, 4
Is a pin insertion hole, and 5 is a through hole.
Claims (1)
ドに装着するピングリッドアレイの製造方法において、
外部接続端子ピンの先端部をピン整列用プレートの一定
深さのピン挿入孔に挿入した後に、プリントボードを加
圧することによって外部接続端子ピンの後端部をプリン
トボードのスルホールに挿着することを特徴とするピン
グリッドアレイの製造方法。1. A method of manufacturing a pin grid array in which a plurality of external connection terminal pins are mounted on a printed board.
After inserting the tip of the external connection terminal pin into the pin insertion hole of a certain depth of the pin alignment plate, press the printed board to insert the rear end of the external connection terminal pin into the through hole of the printed board. A method for manufacturing a pin grid array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63185809A JP2719356B2 (en) | 1988-07-26 | 1988-07-26 | Manufacturing method of pin grid array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63185809A JP2719356B2 (en) | 1988-07-26 | 1988-07-26 | Manufacturing method of pin grid array |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0237688A JPH0237688A (en) | 1990-02-07 |
| JP2719356B2 true JP2719356B2 (en) | 1998-02-25 |
Family
ID=16177269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63185809A Expired - Lifetime JP2719356B2 (en) | 1988-07-26 | 1988-07-26 | Manufacturing method of pin grid array |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2719356B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2808885B2 (en) * | 1990-11-02 | 1998-10-08 | 松下電器産業株式会社 | Carrying base for connector pin mounting |
| JP2772190B2 (en) * | 1992-01-27 | 1998-07-02 | 松下電工株式会社 | How to attach connection pins |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5155954A (en) * | 1974-11-11 | 1976-05-17 | Standard Radio Corp | Purintokiban nitaisuru denkipaatsu oyobi waiyaratsupuyopinno toritsukehoho |
-
1988
- 1988-07-26 JP JP63185809A patent/JP2719356B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0237688A (en) | 1990-02-07 |
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