JPH03133070A - Electronic part to be mounted on surface - Google Patents
Electronic part to be mounted on surfaceInfo
- Publication number
- JPH03133070A JPH03133070A JP1268548A JP26854889A JPH03133070A JP H03133070 A JPH03133070 A JP H03133070A JP 1268548 A JP1268548 A JP 1268548A JP 26854889 A JP26854889 A JP 26854889A JP H03133070 A JPH03133070 A JP H03133070A
- Authority
- JP
- Japan
- Prior art keywords
- pads
- mounting
- mounting board
- terminal leads
- elastic adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 239000000853 adhesive Substances 0.000 claims description 22
- 230000001070 adhesive effect Effects 0.000 claims description 22
- 238000009413 insulation Methods 0.000 abstract description 10
- 238000005476 soldering Methods 0.000 abstract description 7
- 238000003780 insertion Methods 0.000 description 12
- 230000037431 insertion Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000000085 cashmere Anatomy 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明は実装基板に対して表面実装可能なコネクタ等の
表面実装用電子部品に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to surface-mountable electronic components such as connectors that can be surface-mounted onto a mounting board.
［従来の技術］
従来、表面実装用コネクタ（以下単にコネクタと称する
）種々開発されている。その−例として、第８図（ａ）
、（ｂ）に示すようにコネクタ本体５０の側面から端子
リード５１を突出させると共に、このテール部に湾曲し
た弾性接着部５２を形成しｔごものがある。[Prior Art] Various types of surface mount connectors (hereinafter simply referred to as connectors) have been developed. As an example, Fig. 8(a)
, as shown in (b), a terminal lead 51 is made to protrude from the side surface of the connector body 50, and a curved elastic adhesive part 52 is formed on the tail part.
このようなコネクタを、実装基板５３に表面実装するに
あたって、実装基板５３の一方の板面に載せてコネクタ
本体５０を押圧させると、端子クー１５１０弾性接着部
５２の弾性（復元力）により実装基板５３に強力に密着
するので、この状態で表面実装を行うと、弾性接着部５
２と実装基板５３に印刷されているパッドとの半田付け
による接着が確実になる。When surface mounting such a connector on the mounting board 53, when the connector body 50 is pressed by placing it on one surface of the mounting board 53, the elasticity (restoring force) of the elastic adhesive part 52 of the terminal connector 1510 causes the mounting board to 53, so if surface mounting is performed in this state, the elastic adhesive part 5
2 and the pads printed on the mounting board 53 are securely bonded by soldering.
このようなことから、従来端子リードのテール部が弾性
を有していないものより、第８図に示すコネクタが多く
使用されている。For this reason, the connector shown in FIG. 8 is more commonly used than the conventional terminal lead whose tail portion does not have elasticity.
［発明が解決しようとする課題］
しかしながら、第８図のコネクタにあっては、端子リー
ド５１の弾性接着部５２の復元力が実装基板５３に直接
作用することから、該復元力で実装基板５３が反ってし
まうことがあり、場合によっては実装基板５３との密着
が不確実となり、信頼性が悪くなる。又、端子リード５
１を表面実装するまで、整列させた状態で保持すること
は非常に困難で、実際には第８図（ｂ）のように、端子
リード５１は不整列状態となることがほとんどであり、
□この場合には実装基板５３に表面実装する前の段階で
、実装基板５３の表面に第７図（ｄ）に示すように複数
−のパッド５４が一列に印刷されているパッドに合わせ
て端子リード５１を整列させる必要がある。そして、第
７図（ｄ）のパッド５４相互の間隔Ａが、従来例えば１
．２７ｍ＋ｇであったものが、最近さらにそれより狭い
間隔例えば０．６３５ｍｍとなりつつあることから、端
子リード５１を該パッド５４相互の間隔に合わせて整列
することは作業性が悪く、面倒であるばかりでなく、パ
ッド５４相互間隔Ａで所望の絶縁距離を確保することは
困難となっている。[Problems to be Solved by the Invention] However, in the connector shown in FIG. may be warped, and in some cases, the close contact with the mounting board 53 may become uncertain, resulting in poor reliability. Also, terminal lead 5
It is very difficult to maintain the terminal leads 51 in an aligned state until they are surface mounted, and in reality, the terminal leads 51 are often misaligned, as shown in FIG. 8(b).
□In this case, before surface mounting on the mounting board 53, terminals are attached to the pads 54 printed in a row on the surface of the mounting board 53 as shown in FIG. 7(d). It is necessary to align the leads 51. The distance A between the pads 54 in FIG. 7(d) is conventionally, for example, 1.
．． The spacing used to be 27 m+g has recently become even narrower, for example, 0.635 mm, so aligning the terminal leads 51 to match the spacing between the pads 54 is not easy to work with and is troublesome. Therefore, it is difficult to secure a desired insulation distance with the spacing A between the pads 54.
本発明は、実装基体の表面に形成されている複数のパッ
ド相互間の絶縁距離を所望値に確保でき、パッド相互間
隔をさらに狭くすることができる表面実装用電子部品を
提供することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a surface mounting electronic component that can ensure a desired insulation distance between a plurality of pads formed on the surface of a mounting substrate, and further narrow the distance between the pads. do.
［課題を解決するための手段］
本発明は前記目的を達成するため、本体の一側面から複
数の端子リードが突出しこの各テール部に実装基体の表
面にそれぞれ形成されている複数のパッドに対して表面
実装が可能な複数の弾性接着部を有する表面実装用電子
部品において、前記実装基体の表面に形成されている複
数のパッドを少なくとも２列であって千鳥配列とし、か
つ前記各パッドに対応して前記各弾性接着部をそれぞれ
少なくとも２列であって千鳥配列としたものである。[Means for Solving the Problems] In order to achieve the above-mentioned object, the present invention has a plurality of terminal leads protruding from one side of the main body, and a plurality of terminal leads protruding from one side of the main body, and a plurality of pads formed on the surface of the mounting base at each tail portion. In a surface-mount electronic component having a plurality of elastic adhesive parts that can be surface-mounted, the plurality of pads formed on the surface of the mounting substrate are arranged in at least two rows in a staggered manner, and the plurality of pads are arranged in a staggered manner and correspond to each pad. The elastic adhesive portions are each arranged in at least two rows in a staggered arrangement.
［作用］
本発明によれば、複数のパッドを少なくとも２列であっ
て千鳥配列とし、かつ各パッドに対応して各弾性接着部
をそれぞれ千鳥配列としたので、パッド相互間で所望の
絶縁距離が確保できるとともに、パッド間隔をせまくす
ることが可能となる。[Function] According to the present invention, the plurality of pads are arranged in at least two rows in a staggered arrangement, and each elastic adhesive part is arranged in a staggered manner corresponding to each pad, so that a desired insulation distance can be achieved between the pads. This makes it possible to ensure the distance between the pads and to narrow the spacing between the pads.
［実施例］ 以下、発明の実施例について図面を参照して説明する。[Example] Embodiments of the invention will be described below with reference to the drawings.
第１図は、本発明の第１の実施例の構成を示す分解斜視
図である。ここでは、実装基板１に表面実装する対象物
としてコネクタをあげるが、これに限らず他の電子部品
であってもよい。FIG. 1 is an exploded perspective view showing the configuration of a first embodiment of the present invention. Here, a connector is used as an object to be surface mounted on the mounting board 1, but the object is not limited to this, and other electronic components may be used.
第１図に示すように、コネクタ本体４は、ハウジング２
と複数の端子リード３とからなり、ハウジング２の一側
面から端子リード３が突出し、このテール部は実装基板
１に対して表面実装が可能に、はぼＵ字状に湾曲した複
数の弾性接着部５が２列であって千鳥配列となっている
。As shown in FIG.
The terminal lead 3 protrudes from one side of the housing 2, and the tail part has a plurality of elastic adhesives curved in a U-shape to enable surface mounting on the mounting board 1. The sections 5 are arranged in two rows in a staggered arrangement.
補整機構−６は、端子リード３の弾性接着部５とハウジ
ング２の端子リード３の埋設固定部の間に配設した後述
する補整部材７と、これを実装基板１に対して固定する
ために、補整部材７に有する補整部材固定用ボス８と、
これが挿入固定できるように実装基板１に形成されたボ
ス挿入穴９とからなっている。The compensation mechanism-6 includes a compensation member 7, which will be described later, disposed between the elastic adhesive part 5 of the terminal lead 3 and the embedded fixing part of the terminal lead 3 of the housing 2, and a compensation member 7 for fixing this to the mounting board 1. , a compensation member fixing boss 8 provided on the compensation member 7;
It consists of a boss insertion hole 9 formed in the mounting board 1 so that it can be inserted and fixed.
補整部材７は、第２図（ａ）、（ｂ）の正面図および側
面図に示すように絶縁材からなり断面矩形状であって、
この対向する側面に端子リード３を挿通させるためのり
−ド挿通穴１０が複数個等間隔に形成され、また底面の
両端部および中央部には、先端が先細のテーバ状の補正
部材固定用ボス８がそれぞれ形成されている。The compensation member 7 is made of an insulating material and has a rectangular cross section, as shown in the front and side views of FIGS. 2(a) and 2(b).
A plurality of glued insertion holes 10 for inserting the terminal leads 3 are formed at equal intervals on the opposing side surfaces, and tapered correction member fixing bosses with tapered tips are provided at both ends and the center of the bottom surface. 8 are formed respectively.
実装基板１の一方の板面には、前記端子り−ド３の弾性
接着部５を半田付けするための複数の半田付用パッド１
１が２列であって千鳥配列となるように印刷され、この
各パッド１１にはそれぞれパターン１２が複数個等間隔
に印刷されている。A plurality of soldering pads 1 are provided on one surface of the mounting board 1 for soldering the elastic adhesive portion 5 of the terminal board 3.
1 is printed in two rows in a staggered arrangement, and each pad 11 has a plurality of patterns 12 printed at equal intervals.
そして、実装基板１には、本体取付用穴１３と、本体固
定用ボス挿入穴１４が複数個形成されている。A plurality of body mounting holes 13 and body fixing boss insertion holes 14 are formed in the mounting board 1.
なお、ハウジング２には基板取付用穴１５、パネル取付
用穴１６、本体固定用ボス１７が形成され、また図示し
ないプラグと図に示すコネクタ（レセプタクル）と嵌合
したとき、両者をロックするためのロック部１８が形成
されている。The housing 2 is formed with a board mounting hole 15, a panel mounting hole 16, and a main body fixing boss 17, and is used to lock the plug (not shown) and the connector (receptacle) shown in the drawing when they are mated together. A lock portion 18 is formed.
このような構成のコネクタを第３図のように実装基板１
に表面実装する前に、以下のような準備を行う。すなわ
ち、初めに複数の端子リード３を、補整部材７のリード
挿通穴１０にそれぞれ挿通固定した状態で、ハウジング
２に組み込んだコネクタ本体４を準備する。次に、この
準備されたコネクタ本体４の本体固定用ボス１７を、実
装基板１に形成されている本体固定用ボス挿入穴１４に
挿入固定させる。そ・の後、ハウジング２の基板取付用
穴１５と実装基板１の本体取付用穴１３に図示しないフ
ック、ねじ等により両者を固定する。A connector with such a configuration is mounted on the mounting board 1 as shown in Figure 3.
Before surface mounting the device, make the following preparations. That is, first, the connector main body 4 is prepared, which is assembled into the housing 2 with a plurality of terminal leads 3 inserted and fixed into the lead insertion holes 10 of the compensation member 7, respectively. Next, the main body fixing boss 17 of the prepared connector main body 4 is inserted and fixed into the main body fixing boss insertion hole 14 formed in the mounting board 1. Thereafter, both are fixed to the board mounting hole 15 of the housing 2 and the main body mounting hole 13 of the mounting board 1 using hooks, screws, etc. (not shown).
最後に、補整部材７の補整部材固定用ボス８を実装基板
１のボス挿入穴９に挿入固定する。Finally, the compensation member fixing boss 8 of the compensation member 7 is inserted and fixed into the boss insertion hole 9 of the mounting board 1.
このように、補整部材固定用ボス８をボス挿入穴９に挿
入固定することにより、補整部材７にそれぞれ挿入固定
されている端子リード３の各弾性接着部５が実装基板１
に対してほぼ均等に押圧されるので、各弾性接着部５の
接触圧が第８図に示す従来例よりかなり小さくても、実
装基板１との密着が確実となり、このため実装基板１の
反りの問題がなくなり、信頼性が向上する。In this way, by inserting and fixing the compensating member fixing boss 8 into the boss insertion hole 9, each elastic adhesive part 5 of the terminal lead 3 inserted and fixing to the compensating member 7 is fixed to the mounting board 1.
Even if the contact pressure of each elastic adhesive part 5 is considerably lower than that of the conventional example shown in FIG. 8, the tight contact with the mounting board 1 is ensured. problems will be eliminated and reliability will be improved.
また、各端子リード３は表面実装する前に、補整部材７
のリード挿通穴１０に挿通固定されているので、各弾性
接着部５の配列が乱れることはほとんどなく、従って各
弾性接着部５をノ＼ンダ付用バッド１１の間隔台わせる
ように整列する必要がなく表面実装の作業が簡単で作業
性が向上する。In addition, before each terminal lead 3 is surface mounted, the compensation member 7
Since the lead insertion holes 10 are inserted and fixed, the arrangement of each elastic adhesive part 5 is hardly disturbed, and therefore, each elastic adhesive part 5 is aligned so as to match the spacing of the soldering pad 11. There is no need for surface mounting, which simplifies surface mounting work and improves work efficiency.
さらに、プラグとレセプタクル等からなるツーピースコ
ネクタであっても、両者を挿抜するときの挿抜力が補整
部材７で吸収されるので、弾性接着部５と実装基板１の
ハンダ付は部に前記挿抜力が及ばないことから、極数の
大きなツーピースコネクタでも表面実装が可能となる。Furthermore, even in the case of a two-piece connector consisting of a plug and a receptacle, the insertion/extraction force when the two are inserted/extracted is absorbed by the compensating member 7. Since this is not the case, even two-piece connectors with a large number of pins can be surface-mounted.
また、補整部材７としてはリード挿通穴１０を形成した
形式であるので、補整部材固定用ボス８は、図のように
補整部材７の外周面に軸方向の両端部およびこの中間位
置に形成したり、あるいは補整部材７の外周面の任意の
位置に所望の数だけ形成できることから、補整部材７の
中央位置が反り等による変形を防止でき、これにより端
子リード３の数が多いものでも使用できる。Further, since the compensating member 7 is of a type in which a lead insertion hole 10 is formed, the compensating member fixing bosses 8 are formed on the outer peripheral surface of the compensating member 7 at both ends in the axial direction and at an intermediate position between these. Alternatively, the desired number of terminal leads can be formed at any position on the outer peripheral surface of the compensating member 7, so that the center position of the compensating member 7 can be prevented from being deformed due to warping, etc., and thus it can be used even with a large number of terminal leads 3. .
さらにまた、前記補整部材７を例えば薄くしたり、可撓
性の優れた材料で作ることで、実装基板１が何等かの理
由で反りが生じても問題なく使用できる。Furthermore, by making the compensation member 7 thin or made of a material with excellent flexibility, it can be used without any problem even if the mounting board 1 warps for some reason.
また、複数のパッド１１を２列であって千鳥配列とし、
かつ各パッド１１に対応して各弾性接着部５をそれぞれ
千鳥配列としたので、バッド１１相互間で所望の絶縁距
離が確保できるとともに、パッド１１間隔をせまくする
ことが可能となる。Further, the plurality of pads 11 are arranged in two rows in a staggered manner,
In addition, since the elastic adhesive portions 5 are arranged in a staggered manner corresponding to each pad 11, a desired insulation distance can be secured between the pads 11, and the spacing between the pads 11 can be narrowed.
第７図はこれを説明するための図であり、（ａ）は実装
基板１のみを示す平面図、（ｂ）および（Ｃ）はそれぞ
れ実装基板１と弾性接着部５の関係を説明するための側
面図および平面図である。FIG. 7 is a diagram for explaining this, in which (a) is a plan view showing only the mounting board 1, and (b) and (C) are diagrams for explaining the relationship between the mounting board 1 and the elastic adhesive part 5, respectively. FIG.
（ｄ）は従来の実装基板５３の平面図である。(d) is a plan view of a conventional mounting board 53.
この図から明らかなように、従来例は（ｄ）に示すよう
に複数のパッド５４は１列に配列されているだけである
ので、パッド５４相互間隔Ａによって絶縁距離が決まり
、パッド５４相互間隔Ａを例えば０．８３５ｍと狭くす
ると、本来必要とする絶縁距離が確保されないことがあ
る。これに対し、（ａ）（Ｃ）のようにパッド１１を２
列で千鳥配列とすると、前記絶縁距離はパッド１１相互
間隔Ａに関係なく、パッド１１の列間距離Ｂで管理でき
る。As is clear from this figure, in the conventional example, as shown in FIG. If A is made narrow, for example, 0.835 m, the originally required insulation distance may not be secured. On the other hand, as shown in (a) and (C), the pad 11 is
When the rows are arranged in a staggered manner, the insulation distance can be managed by the distance B between the rows of pads 11, regardless of the spacing A between the pads 11.
このようなことから、パッド１１相互間で所望の絶縁距
離が確保できるとともに、パッド１１間隔をせまくする
ことが可能となる。For this reason, it is possible to ensure a desired insulation distance between the pads 11 and to narrow the spacing between the pads 11.
第４図は本発明の第２の実施例を示すものである。前述
ルた実施例はコネクタ本体４に対して端子リード３が一
方側に突出した場合であるが、この実施例はコネクタ本
体４の両側に端子リード３を突出させた場合である。こ
の実施例においても、前述の実施例と同様に補整部材７
の補整部材固定用ボス８を実装基板１に挿入固定するこ
とは言うまでもない。FIG. 4 shows a second embodiment of the invention. In the embodiment described above, the terminal leads 3 protrude from one side of the connector body 4, but in this embodiment, the terminal leads 3 protrude from both sides of the connector body 4. In this embodiment as well, the compensating member 7
Needless to say, the compensation member fixing boss 8 is inserted and fixed into the mounting board 1.
第５図は前述の補正部材７の他の例を示すもので、（ａ
）、（ｂ）はそれぞれ補整部材２７の正面図および側面
図であり、前述の実施例は端子リード３を挿通固定させ
るため穴１０を形成したものであるが、この例は端子リ
ード挿通用溝２９を形成したものである。補整部材固定
用ボス２８が形成されているのは、前述の実施例と同様
である。第５図の補整部材７の場合には、実装基板１に
表面実装する直前に補整部材７を使用できることから、
第２図の補整部材７に比べて実装作業が容易になる。FIG. 5 shows another example of the above-mentioned correction member 7, in which (a
) and (b) are respectively a front view and a side view of the compensating member 27. In the above-mentioned embodiment, the hole 10 was formed in order to insert and fix the terminal lead 3, but in this example, the hole 10 was formed in order to insert and fix the terminal lead 3. 29 was formed. The formation of the compensation member fixing boss 28 is the same as in the previous embodiment. In the case of the compensation member 7 shown in FIG. 5, since the compensation member 7 can be used immediately before surface mounting on the mounting board 1,
The mounting work is easier compared to the compensation member 7 shown in FIG. 2.
本発明は前述した実施例に限定されず例えば次のように
することもできる。第６図はこの一つを説明するための
断面図（第１図の縦断面図）であり、補整部材７の上部
に、端子リード３を保護すると共に、補整部材７を実装
基板１に圧入する際に補整部材７に対して押圧力を与え
るための断面り字状のカバー３０を配置し、弾性接着部
５を実装基板１に表面実装後に、例えばハウジング２の
側面板に固定するものである。また、補整部材７と端子
リード３の固定は、補整部材７を製作した後挿入固定せ
ずに、インサート成形でもよい。The present invention is not limited to the embodiments described above, but can also be implemented as follows, for example. FIG. 6 is a cross-sectional view (vertical cross-sectional view of FIG. 1) for explaining one of these, in which the terminal lead 3 is protected on the upper part of the compensating member 7, and the compensating member 7 is press-fitted into the mounting board 1. A cover 30 having an angular cross-section is arranged to apply a pressing force to the compensating member 7 during the process, and after the elastic adhesive part 5 is surface mounted on the mounting board 1, it is fixed to the side plate of the housing 2, for example. be. Further, the compensation member 7 and the terminal lead 3 may be fixed by insert molding instead of being inserted and fixed after the compensation member 7 is manufactured.
さらに、補整部材７または２７を実装基板１に固定する
ための手段として、前述のようにボスをテーバ形状とせ
ずに、フック形状としたり、あるいは実装基板固定部材
を実装基板に挿入後融着したりカシメルようにしてもよ
い。Furthermore, as a means for fixing the compensating member 7 or 27 to the mounting board 1, the boss may be made into a hook shape instead of the tapered shape as described above, or the mounting board fixing member may be fused after being inserted into the mounting board. You can also use it as a cashmere.
また、前述の実施例では、複数のパッド１１を２列であ
って千鳥配列とし、弾性接着部５を２列であって千鳥配
列としたものをあげたが、これに限らず複数のパッド１
１を３列以上であって千鳥配列とし、弾性接着部５を３
列以上であって千鳥配列としたものでも前述の実施例と
同様な効果が得られることは言、うまでもない。；
［発明の効果］
以上述べた本発明によれば、複数のパッドを少なくとも
２列であって千鳥配列とし、かつ各パッドに対応して各
弾性接着部をそれぞれ千鳥配列としたので、パッド相互
間で所望の絶縁距離が確保できるとともに、パッド間隔
をせまくすることが可能となる表面実装用電子部品を提
供することができる。Further, in the above embodiment, the plurality of pads 11 are arranged in two rows in a staggered arrangement, and the elastic adhesive parts 5 are arranged in two rows in a staggered arrangement. However, the present invention is not limited to this.
1 in three or more rows in a staggered arrangement, and the elastic adhesive part 5 in three or more rows.
It goes without saying that the same effects as in the above-mentioned embodiment can be obtained even if the arrangement is more than a row and is arranged in a staggered manner. [Effects of the Invention] According to the present invention described above, the plurality of pads are arranged in at least two rows in a staggered manner, and each elastic adhesive part is arranged in a staggered manner corresponding to each pad. It is possible to provide a surface-mounted electronic component that can secure a desired insulation distance between pads and narrow the spacing between pads.
第１図は本発明による表面実装用電子部品の第１の実施
例の構成を示す分解斜視図、第２図は第１図の補整部材
を説明するための図、第３図は第１図のコネクタを実装
基板に表面実装した状態を示す図、第４図は本発明の第
２の実施例を示す正面図、第５図は本発明の補整部材の
他の例を説明するための図、第６図は本発明の詳細な説
明するための断面図、第７図は本発明の実施例の作用効
果を説明するための図、第８図は従来の表面実装用コネ
クタの一例を示す図である。
１・・・実装基板、２・・・ハウジング、３・・・端子
リード、４・・・コネクタ本体、５・・・弾性接着部、
６・・・補整機構、７・・・補整部材、８・・・補整部
材固定用ボス、９・・・ボス挿入穴、１１・・・半田付
用パッド、１２・・・パターン、１３・・・本体取付用
穴、１４・・・本体固定用ボス挿入穴、１５・・・基板
取付用穴、１６・・・パネル取付用穴、１７・・・本体
固定用ボス。
第２図
り
第３図FIG. 1 is an exploded perspective view showing the structure of a first embodiment of a surface mount electronic component according to the present invention, FIG. 2 is a diagram for explaining the compensation member shown in FIG. 1, and FIG. FIG. 4 is a front view showing the second embodiment of the present invention, and FIG. 5 is a diagram illustrating another example of the compensation member of the present invention. , FIG. 6 is a sectional view for explaining the present invention in detail, FIG. 7 is a diagram for explaining the operation and effect of the embodiment of the present invention, and FIG. 8 is an example of a conventional surface mount connector. It is a diagram. DESCRIPTION OF SYMBOLS 1... Mounting board, 2... Housing, 3... Terminal lead, 4... Connector body, 5... Elastic adhesive part,
6... Compensation mechanism, 7... Compensation member, 8... Compensation member fixing boss, 9... Boss insertion hole, 11... Soldering pad, 12... Pattern, 13... - Body mounting hole, 14...Boss insertion hole for fixing the main body, 15...Hole for board mounting, 16...Hole for panel mounting, 17...Boss for fixing the main body. 2nd diagram 3rd diagram
Claims (1)
ル部に実装基体の表面にそれぞれ形成されている複数の
パッドに対して表面実装が可能な複数の弾性接着部を有
する表面実装用電子部品において、 前記実装基体の表面に形成されている複数のパッドを少
なくとも２列であって千鳥配列とし、かつ前記各パッド
に対応して前記各弾性接着部をそれぞれ少なくとも２列
であって千鳥配列とした表面実装用電子部品。[Claims] A plurality of terminal leads protrude from one side of the main body, and each tail portion of the terminal leads has a plurality of elastic adhesive portions that can be surface-mounted to a plurality of pads formed on the surface of the mounting base. In the electronic component for surface mounting, the plurality of pads formed on the surface of the mounting substrate are arranged in at least two rows in a staggered manner, and each of the elastic adhesive parts is arranged in at least two rows corresponding to each of the pads. Surface-mount electronic components arranged in a staggered pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1268548A JPH0665083B2 (en) | 1989-10-16 | 1989-10-16 | Electronic components for surface mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1268548A JPH0665083B2 (en) | 1989-10-16 | 1989-10-16 | Electronic components for surface mounting |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3226439A Division JPH0567484A (en) | 1991-08-12 | 1991-08-12 | Surface mounting type electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03133070A true JPH03133070A (en) | 1991-06-06 |
| JPH0665083B2 JPH0665083B2 (en) | 1994-08-22 |
Family
ID=17460063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1268548A Expired - Fee Related JPH0665083B2 (en) | 1989-10-16 | 1989-10-16 | Electronic components for surface mounting |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0665083B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0511340U (en) * | 1991-07-19 | 1993-02-12 | ケル株式会社 | Surf es mount type electronic parts |
| US5346404A (en) * | 1992-06-16 | 1994-09-13 | Minnesota Mining And Manufacturing Company | Surface mounting connector |
| US5354207A (en) * | 1991-09-17 | 1994-10-11 | Kel Corporation | Electrical connector with contact aligning member |
| US5487674A (en) * | 1993-07-06 | 1996-01-30 | Motorola, Inc. | Surface mountable leaded package |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004111112A (en) * | 2002-09-13 | 2004-04-08 | Fujikon Kk | Terminal board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01135667U (en) * | 1988-03-10 | 1989-09-18 |
-
1989
- 1989-10-16 JP JP1268548A patent/JPH0665083B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01135667U (en) * | 1988-03-10 | 1989-09-18 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0511340U (en) * | 1991-07-19 | 1993-02-12 | ケル株式会社 | Surf es mount type electronic parts |
| US5354207A (en) * | 1991-09-17 | 1994-10-11 | Kel Corporation | Electrical connector with contact aligning member |
| US5346404A (en) * | 1992-06-16 | 1994-09-13 | Minnesota Mining And Manufacturing Company | Surface mounting connector |
| US5487674A (en) * | 1993-07-06 | 1996-01-30 | Motorola, Inc. | Surface mountable leaded package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0665083B2 (en) | 1994-08-22 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |