JPH02112298A - Printed board and its manufacture and connection thereof - Google Patents

Printed board and its manufacture and connection thereof

Info

Publication number
JPH02112298A
JPH02112298A JP63265633A JP26563388A JPH02112298A JP H02112298 A JPH02112298 A JP H02112298A JP 63265633 A JP63265633 A JP 63265633A JP 26563388 A JP26563388 A JP 26563388A JP H02112298 A JPH02112298 A JP H02112298A
Authority
JP
Japan
Prior art keywords
board
connector
connection
sub
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63265633A
Other languages
Japanese (ja)
Inventor
Koji Kukida
久木田 浩二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP63265633A priority Critical patent/JPH02112298A/en
Publication of JPH02112298A publication Critical patent/JPH02112298A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/366Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Landscapes

  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE:To improve connection strength by making one end side of a connector support a surface of a main substrate through a close surface-contact, by supporting a sub-substrate thereon through a close surface contact and adhesion, and by bonding an L-shaped connection terminal on a surface of the sub-substrate. CONSTITUTION:When a connection terminal 20B is inserted into an insertion hole 114, a side line of the main body section 20A is brought into close contact with a substrate surface and an end side 200A is bonded to an end side of one side periphery section of a substrate 11 at a surface contact. Then, a projection section to a substrate surface of the connection terminal 20B is clinched to an end section conductor 113 of a circuit pattern 112 and connected by soldering. When extra substrates 10A..., 10B are cut at V-shaped cut grooves 111A, 111B and 121A, 121B, a sub-substrate 11 is manufactured. If connecting terminals 20C... of a connector 20 are inserted to terminal holes 31... until an end side 200B comes into close contact with a substrate surface, the sub-substrate 11 is temporarily fixed on a packaging surface of a main substrate 30. Then, a rear of the main substrate 30 is immersed in a solder tank to solder and fix the connecting terminals 20C... to a land 33 of a pattern 32. A substrate space can be used effectively in this way.

Description

【発明の詳細な説明】 産業上の利用分野 この発明は、ドーター・マザー方式でメインの基板に接
続されるプリント基板、いわゆるサブ基板の構造及びそ
の製法ならびにメイン基板への接続方法に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to the structure and manufacturing method of a printed circuit board, so-called sub-board, which is connected to a main board in a daughter-mother manner, and a method of connecting it to the main board.

従来の技術 近年、オーディオ機器・ビデオ機器等の分野において標
準化が著しく進められている。その要素の一つとして、
例えば全回路を機能別に複数のブロックに分け、このブ
ロック毎に形成されるプリント基板を標準化し、異なる
機種の製品にも同ブロックのプリント基板と共通化して
用いる方式が採用されている。このような標準化された
小形のプリント基板をドーター基板、これが結合される
メインの基板をマザー基板と称し、このようなプリント
基板の結合方式をドーター・マザー方式と称しているこ
とは周知のとおりである。このドーター・マザー方式に
よると回路基板の高密度化、高集積化を図ることができ
る。
BACKGROUND OF THE INVENTION In recent years, standardization has progressed significantly in the fields of audio equipment, video equipment, and the like. As one of the elements,
For example, a method has been adopted in which the entire circuit is divided into multiple blocks according to function, the printed circuit boards formed for each block are standardized, and the printed circuit boards of the same block are used in common for products of different models. It is well known that such a standardized small printed circuit board is called a daughter board, and the main board to which it is bonded is called a mother board, and the method of bonding such printed circuit boards is called the daughter-mother method. be. According to this daughter-mother method, higher density and higher integration of the circuit board can be achieved.

このドーター・マザー方式でドーター基板、いわゆるサ
ブ基板をマザー基板に接続させる手法として、従来より
コネクタを用いる方式があった。
Conventionally, a method using a connector has been used to connect a daughter board, a so-called sub-board, to a mother board in this daughter-mother system.

第5図、第6図はそのコネクタを用いる結合構造を示し
ている。第5図はサブ基板を側面から見た状態を示し、
第6図はそのメインの基板への結合状態を示している。
FIGS. 5 and 6 show a coupling structure using the connector. Figure 5 shows the sub-board viewed from the side.
FIG. 6 shows how it is coupled to the main substrate.

なお、両基板には結合にあたって予め各種部品が実装さ
れているのであるが、渭1す1化のため図示を省略しで
ある。
It should be noted that various parts have been mounted on both boards in advance for connection, but illustrations are omitted because both boards are integrated into one board.

第5図において、サブ基板1の一辺部にコネクタ2が一
辺方向に沿って装着されている。コネクタ2は樹脂モー
ルド成形された本体部2Aの対向する両面に接続端子2
B、2Cを突出させたもので、一方の接続端子2Bに対
して他方の接続端子2CはL状に折曲され、本体部2A
の側方に略直交して突出し、L型端子を形成している。
In FIG. 5, a connector 2 is attached to one side of the sub-board 1 along one side. The connector 2 has connection terminals 2 on opposite sides of the resin-molded main body 2A.
B, 2C are protruded, one connecting terminal 2B is bent into an L shape, and the other connecting terminal 2C is bent into an L shape, and the main body part 2A
The terminal protrudes substantially perpendicularly to the side of the terminal to form an L-shaped terminal.

一方の接続端子2Bはサブ基板1の一辺部に形成した挿
入孔IAに挿入したのち、裏面側でパターン3のランド
3Aに半田付は固定されている。これで、サブ基板1の
一辺部にコネクタ2が装着され、辺縁部からし型端子2
Cが基板面と平行に突出するコネクタ接続部が形成され
る。この場合、L室端子2Cは基板面から高さdだけ突
出した位置で基板縁部から側方に延びている。メイン基
板4への接続にあたり、その挿入孔4Aにコネクタ2の
L形接続端子2Cが挿入され、裏面でパターン5のラン
ド5Aに半田付は固定される。これにより、サブ基板1
がメイン基板4上に第6図で示す如く直交した状態で支
持され、2つの基板1.4がコネクタ2を介して機械的
、電気的に接続される。
One of the connection terminals 2B is inserted into the insertion hole IA formed on one side of the sub-board 1, and then fixed by soldering to the land 3A of the pattern 3 on the back side. Now, the connector 2 is attached to one side of the sub-board 1, and the mustard-shaped terminal 2 is attached to the edge.
A connector connection portion is formed in which C protrudes parallel to the board surface. In this case, the L chamber terminal 2C extends laterally from the edge of the board at a position protruding from the board surface by a height d. When connecting to the main board 4, the L-shaped connecting terminal 2C of the connector 2 is inserted into the insertion hole 4A, and is fixed by soldering to the land 5A of the pattern 5 on the back side. As a result, sub board 1
are supported on the main board 4 in a perpendicular state as shown in FIG. 6, and the two boards 1.4 are mechanically and electrically connected via the connector 2.

発明が解決しようとする課題 上述した従来のプリント基板接続構造によると、サブ基
板1は一辺縁部のみでメイン基板4上に支えられ、しか
も、単に浮動状態で基板面に接しただけであり、その−
ト、基板を保持するコネクタ2のL室端子2Cとはその
突出高さdに見合う間隔dで離間しているので、取付姿
勢が不安定であり、支持の強度が弱く、結合強度の点で
問題がある。
Problems to be Solved by the Invention According to the conventional printed circuit board connection structure described above, the sub-board 1 is supported on the main board 4 only by one edge, and moreover, is merely in contact with the board surface in a floating state. That-
G, since it is separated from the L chamber terminal 2C of the connector 2 that holds the board by a distance d commensurate with its protrusion height d, the mounting posture is unstable, the support strength is weak, and the connection strength is poor. There's a problem.

また、コネクタ接続部の周りに間隔dを含むデッドスペ
ースが必ず生じるので、占有スペースを広く必要とし、
また、スペースの有効利用を図り得ないという欠点があ
る。
In addition, since a dead space including the interval d always occurs around the connector connection part, a large occupied space is required.
Another drawback is that space cannot be used effectively.

この発明は以上の点に鑑み提案されたもので、ドーター
・マザー方式で接続されるプリント基板のコネクタによ
る結合強度を高め、かつ、コネクタ接続部周囲のデッド
スペースを少なくしてスペースの有効利用を図り得るよ
うにすることを目的としている。
This invention was proposed in view of the above points, and it increases the bonding strength of printed circuit board connectors connected by the daughter-mother method, and also reduces the dead space around the connector connection part to make effective use of space. The purpose is to make it possible.

課題を解決するための手段 L起重的を達成するために、本発明は、コネクタ本体の
両側に突出する接続端子の一方をL状に折曲し、そのL
状の接続端子を基板一辺方向に形成した挿入孔に挿入し
て裏面で半田付は接続すると共に、基部側を基板面と平
行に密接させて基板端縁方向に延長し、その延長端でコ
ネクタ本体の一端面を基板端面に面接触で密着させ、他
端面側をメイン基板への接続方向へ突出させてコネクタ
接続部を形成して成る基板構成を採用した。
Means for Solving the Problems In order to achieve the L-shape, the present invention bends one of the connecting terminals protruding from both sides of the connector body into an L shape, and
Insert the shaped connection terminal into the insertion hole formed in the direction of one side of the board, connect it by soldering on the back side, and also extend it towards the edge of the board with the base side closely parallel to the board surface, and connect the connector at the extended end. A board configuration is adopted in which one end surface of the main body is brought into close surface contact with the end surface of the board, and the other end surface protrudes in the connection direction to the main board to form a connector connection part.

また、本発明は、基板母材にサブ基板を切り取り可能に
形成すると共に、その一辺と捨て基板との間に開口部を
打ち抜き形成し、コネクタ本体部の両側に突出する接続
端子の一方側をL状に折曲し、このL状折曲部をサブ基
板の一辺方向に形成した挿入孔に挿入して裏面で半田付
は接続すると共に、その基板表面側を基板面と平行に密
接させ、かつ、コネクタ本体部を上記間[」部に嵌め入
れその一端面をサブ基板の一辺端面に面接触で密着させ
コネクタ接続部を形成したのち、サブ基板を基板母材か
ら切り取るプリント基板の製法に特徴を有する。
In addition, the present invention forms the sub-board in a cuttable manner on the board base material, and punches out an opening between one side of the sub-board and the disposable board, so that one side of the connection terminals protruding from both sides of the connector main body can be cut out. Bend it in an L shape, insert this L-shaped bent part into an insertion hole formed in one side direction of the sub-board, connect it by soldering on the back side, and bring the front side of the board in close contact parallel to the board surface, In addition, the method for manufacturing a printed circuit board involves inserting the connector main body into the above-mentioned space [''] and bringing one end surface of the connector body into close contact with the end surface of one side of the sub-board to form a connector connection part, and then cutting the sub-board from the base material of the board. Has characteristics.

さらに、本発明は、メイン基板との接続側一辺部にL形
の接続端子を有するコネクタの本体部−端面を基板一辺
部端面と面接触で密着させ、そのL形接続端子の先端側
を上記一辺方向に沿って形成した挿入孔に挿入して裏面
側で半田付は接続し、その基板表面側を基板面と密接さ
せると共に、コネクタ本体部の他端面側をメイン基板と
の接続方向に突出させる一方、メイン基板の接続位置に
挿入孔を表裏に貫通形成し、コネクタの他方側接続端子
をメイン基板の挿入孔にコネクタ本体部の他端面が基板
面と密接する位置まで挿入したのち、裏面側で半田付は
接続する接続方法を要旨とするものである。
Further, the present invention provides a connector having an L-shaped connection terminal on one side of the connection side with the main board, in which the end face of the connector is brought into close surface contact with the end face of one side of the board, and the tip side of the L-shaped connection terminal is Insert into the insertion hole formed along one side and connect with solder on the back side, bring the front side of the board into close contact with the board surface, and protrude the other end side of the connector body in the connection direction with the main board. At the same time, form an insertion hole on the front and back sides at the connection position of the main board, insert the other side connection terminal of the connector into the insertion hole of the main board until the other end of the connector body comes into close contact with the board surface, and then On the other hand, soldering is the gist of the connection method.

作用 サブ基板の一辺部に形成したコネクタ接続部の接続端子
をメイン基板の挿入孔に挿入後、裏面で半田付は固定す
ると、サブ基板がメイン基板−Eに交差した角度関係で
接続される。
After inserting the connection terminal of the connector connection portion formed on one side of the working sub-board into the insertion hole of the main board and fixing it by soldering on the back surface, the sub-board is connected to the main board -E at an intersecting angle.

コネクタは、その本体部がメイン基板上に面接触で密着
した状態で装着される。このコネクタ」、に−一辺端面
と本体部端面とが面密着した状態でサブ基板が支持され
る。しかも、L形の接続端子はサブ基板の面と密接した
状態で挿入接続されている。したがって、サブ基板は、
コネクタの本体部と面密着し、そのL形接続端子と密接
した状態で接続され、メイン基板上に装着されたコネク
タの本体部上に保持される。サブ基板の接続部には密着
接合によって空隙はなくなり、その接続の支t4強度、
結合強度が高くなる。
The connector is mounted with its main body in close contact with the main board. In this connector, the sub-board is supported with the end face of one side and the end face of the main body in close contact with each other. Furthermore, the L-shaped connection terminal is inserted and connected in close contact with the surface of the sub-board. Therefore, the sub-board is
It is in close contact with the main body of the connector, is closely connected to the L-shaped connecting terminal, and is held on the main body of the connector mounted on the main board. There are no gaps in the connection part of the sub-board due to tight bonding, and the support t4 strength of the connection,
Bond strength increases.

さらに、コネクタ本体部の周りには端子突出部分などは
一切なく、その」二にサブ基板を密接状態で支持してい
るのみであるから、コネクタによる基板接続部の占有ス
ペースを最小限に少なくし、その周囲のデッドスペース
をなくすことができる。
Furthermore, there are no terminal protruding parts around the connector body, and the sub-board is only closely supported, so the space occupied by the connector at the board connection area can be minimized. , the dead space around it can be eliminated.

実施例 以下、本発明の実施例を図面に基づいて説明する。Example Embodiments of the present invention will be described below based on the drawings.

第1図、第2図、及び第3図は本発明に係るプリント基
板、いわゆるサブ基板の製作工程・手順を示すもので、
大型の基板母材10の長手方向にサブ基板11.12の
形成位置が2列で例えば8個所に並設されている。なお
、図ではそのうち、相対する左右一対のサブ基板lL1
2のみが示されている。各サブ基板lL12の周縁には
Vカット溝111A1111B、及び121A、121
Bが形成されており、このVカット溝の部分で夫々のサ
ブ基板11.12が切り取り可能になっている。人々の
サブ基板11.12の周囲には基板母材10の捨て基板
10A110BがVカット溝111A1111B及び1
21A、121Bを境に切断除去可能に形成されている
。サブ基板11と中央側の捨て基板10Bとの間、及び
サブ基板11と右側端の捨て基板10Bとの間には、開
口部101.102がプレス加工により打ち抜き形成さ
れている。
Figures 1, 2, and 3 show the manufacturing process and procedure of a printed circuit board, a so-called sub-board, according to the present invention.
In the longitudinal direction of the large substrate base material 10, the sub-substrates 11, 12 are formed in two rows, for example, eight locations. In addition, in the figure, a pair of opposing left and right sub-boards LL1
Only 2 is shown. V-cut grooves 111A, 1111B, 121A, 121 are provided at the periphery of each sub-board LL12.
B is formed, and each of the sub-boards 11 and 12 can be cut out at this V-cut groove. Around the sub-boards 11 and 12 of the people, there are V-cut grooves 111A1111B and 1
It is formed so that it can be cut and removed with 21A and 121B as boundaries. Openings 101 and 102 are punched out by press working between the sub-board 11 and the sacrificial substrate 10B on the center side, and between the sub-substrate 11 and the sacrificial substrate 10B on the right side.

夫々のサブ基板lL12の開口部101.102側の辺
縁部に裏面の回路パターン112・・−1122−・・
が隣接して延長されており、そ1〇− の端部導体113.123がレジスト被膜の除去により
露出されている。夫々の端部導体113.123の中心
を貫通して挿入孔114.124が形成されている。挿
入孔t 14−・・、124・・・はサブ基板11.1
2の開[二1部101.102と接する一辺方向に所定
ピッチで間隔をあけて形成されている。
Circuit patterns 112...-1122-... on the back side are formed on the edges of the openings 101 and 102 of each sub-board LL12.
are extended adjacent to each other, and the end conductors 113 and 123 of the resist film are exposed by removing the resist film. An insertion hole 114.124 is formed through the center of each end conductor 113.123. Insertion holes t14-..., 124... are sub-board 11.1
The openings of 2 are formed at predetermined intervals in the direction of one side in contact with the 21 parts 101 and 102.

サブ基板lL12の開口部側の一辺部にコネクタ20が
夫々装着されている。コネクタ20は、樹脂モールド成
形された絶縁性基材よりなる本体部2OAと、本体部2
OAの一端面200Aと他端面200Bから夫々突出す
る複数本(図示の場合は8ピン)の接続端子20B・・
・、20C・・・とにより形成されている。一方の接続
端子20Bは、一端面20OAから垂直に、基板面と平
行になる様に延出され、その先端部が本体部20Aの一
側方へL字の形状で折曲され、L形端子を形成している
。他方の接続端子20C・・・は、他端dii20OB
からメインの基板との接続方向に垂直に突出している。
Connectors 20 are respectively attached to one side of the sub-board LL12 on the opening side. The connector 20 includes a main body 2OA made of an insulating base material molded with a resin, and a main body 2OA made of an insulating base material molded with a resin.
A plurality of (8 pins in the illustrated case) connection terminals 20B protrude from one end surface 200A and the other end surface 200B of the OA, respectively.
, 20C... One connection terminal 20B extends perpendicularly from one end surface 20OA so as to be parallel to the substrate surface, and its tip is bent in an L shape toward one side of the main body 20A, and is an L-shaped terminal. is formed. The other connection terminal 20C... is the other end dii20OB
It protrudes perpendicularly to the connection direction with the main board.

コネクタ20のサブ基板11(12)への装着にあたり
、一方の接続端子20Bを挿入孔114(124)に挿
入すると、その本体部2OA側線が基板表面に密接され
る。同時に、コネクタ20の本体部2OAの一端面20
0Aが基板11(12)の一辺縁部の端面に面接触で密
着される。次に接続端7−20Bの基板裏面への突出部
分か回路パターン112 (122)の端部導体113
(123)にカシメ付はクリンチされ、そののち、f1
11付は接続される。コネクタ本体部2OAは、端面2
00Aがサブ基板11(12)の一辺端面と面密着した
状態で捨て基板10Bとの間に形成された開[二1部1
01 (102)内に介在される。
When the connector 20 is attached to the sub-board 11 (12), when one connecting terminal 20B is inserted into the insertion hole 114 (124), the side wire of the main body 2OA is brought into close contact with the surface of the board. At the same time, one end surface 20 of the main body 2OA of the connector 20
0A is brought into close contact with the end face of one edge of the substrate 11 (12) in surface contact. Next, the protruding portion of the connection end 7-20B to the back surface of the board or the end conductor 113 of the circuit pattern 112 (122)
(123), the caulking is clinched, and then f1
11 is connected. The connector main body 2OA has an end face 2
The opening [21 part 1
01 (102).

これで、基板一端面からメインの基板への接続方向にコ
ネクタ接続部200が突出して形成される。
In this way, the connector connecting portion 200 is formed to protrude from one end surface of the board in the direction of connection to the main board.

次に、周囲の捨て基板10A6・・、10B・番・がV
カット溝111A、IIIB及び121A、121Bの
部分で切断除去されると、一辺端縁部からコネクタ接続
部200が突出されたサブ基板11(12)が第3図に
示すように作製される。
Next, the surrounding disposable boards 10A6..., 10B number...
When the cut grooves 111A, IIIB, 121A, and 121B are cut and removed, the sub-board 11 (12) with the connector connecting portion 200 protruding from one edge is produced as shown in FIG.

一方、メイン基板30のサブ基板11(12)の接続位
置にコネクタ20の接続端子20C・・・と対応する端
子孔31・・・が表裏に貫通して形成されている。この
端子孔31は基板裏面に形成した回路パターン32のラ
ンド33の中心に貫通している。
On the other hand, terminal holes 31 corresponding to the connection terminals 20C of the connector 20 are formed at the connection positions of the sub-boards 11 (12) of the main board 30 so as to penetrate from the front and back sides. This terminal hole 31 penetrates through the center of a land 33 of a circuit pattern 32 formed on the back surface of the substrate.

サブ基板11(12)をメイン基板30に接続させるに
あたり、コネクタ20の他方側接続端子20C・・・を
対応する端子孔31・・・へ本体部他端面200Bが基
板面と密接するところまで挿入すると、サブ基板11(
12)が7472人板30の実装面上に直交した角度関
係で仮固定される。次に、メイン基板30の裏面を半日
1槽に浸漬すると、サブ基板11(12)の接続端子2
0C・・・がパターン32のランド33に半日l付は固
定される。これにより、サブ基板11(12)が第4図
に示すようにコネクタ接続部200を介してメイン基板
30に電気的、機械的に接続される。
To connect the sub board 11 (12) to the main board 30, insert the other side connection terminal 20C of the connector 20 into the corresponding terminal hole 31 until the other end surface 200B of the main body comes into close contact with the board surface. Then, the sub board 11 (
12) is temporarily fixed on the mounting surface of the 7472 person board 30 at an angle perpendicular to the mounting surface. Next, when the back side of the main board 30 is immersed in a bath for half a day, the connection terminals 2 of the sub board 11 (12)
0C... is fixed to the land 33 of the pattern 32 with the half day mark. Thereby, the sub-board 11 (12) is electrically and mechanically connected to the main board 30 via the connector connecting portion 200, as shown in FIG.

発明の効果 以」−のように、本発明によれば、コネクタの−・方の
端面がメイン基板の表面と面接触で密接支持され、その
上にサブ基板が面接触で密着支持されると共に、L状の
接続端子がサブ基板の面に密着しているので、サブ基板
がコネクタ本体部を介して安定した取付姿勢で支持され
る。したがって、ドーター・マザー方式によるプリント
基板の結合強度、支持強度が向−LI L 、高くなる
。また、コネクタ接続部の占有スペースは本体部の設置
スペースのみあれば良く、占有スペースを最小限に削減
することができる。これにより、基板接続部周りのデッ
ドスペースを少なくしてスペースの有効利用を図ること
ができる。
According to the present invention, the end face of the connector is closely supported in surface contact with the surface of the main board, and the sub-board is closely supported on top of it in surface contact. Since the L-shaped connection terminals are in close contact with the surface of the sub-board, the sub-board is supported in a stable mounting posture via the connector main body. Therefore, the bonding strength and support strength of the printed circuit board by the daughter-mother method are increased. Further, the space occupied by the connector connection section is only the installation space of the main body, and the space occupied can be reduced to a minimum. This makes it possible to reduce the dead space around the board connection portion and make effective use of the space.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係るプリント基板の製作工程・f順を
説明する平面図、第2図は同じく工程・手順を説明する
側断面図、第3図は本発明に係るプリント基板の側面図
、第4図はドーター・マザー方式による本発明のプリン
ト基板の接続状態を示す側面図、第5図は従来のプリン
ト基板を示す側面図、第6図はそのメイン基板への接続
状態を示す側面図である。 10・・・基板母材、 11.12・・・サブ基板、 200・・・コネクタ接続部、 20・・・コネクタ、 20A・・・本体部、 20B・・・L状接続端子、 20C・・φ他方の接続端子、 200A・・・一端面、 101.102・・・開口部、 30・・・メイン基板、 31・・・端子孔。 第3 図 00A 第5 図
Fig. 1 is a plan view illustrating the manufacturing process and f order of the printed circuit board according to the present invention, Fig. 2 is a side cross-sectional view illustrating the same process and procedure, and Fig. 3 is a side view of the printed circuit board according to the present invention. , FIG. 4 is a side view showing how the printed circuit board of the present invention is connected using the daughter-mother method, FIG. 5 is a side view showing a conventional printed circuit board, and FIG. 6 is a side view showing how it is connected to the main board. It is a diagram. DESCRIPTION OF SYMBOLS 10... Board base material, 11.12... Sub board, 200... Connector connection part, 20... Connector, 20A... Main body part, 20B... L-shaped connection terminal, 20C... φThe other connection terminal, 200A...One end surface, 101.102...Opening, 30...Main board, 31...Terminal hole. Figure 3 Figure 00A Figure 5

Claims (5)

【特許請求の範囲】[Claims] (1)ドーター・マザー方式でコネクタを介してメイン
の基板に接続されるプリント基板において、コネクタ本
体の両側に突出する接続端子の一方をL状に折曲し、そ
のL状の接続端子を基板一辺方向に形成した挿入孔に挿
入して裏面で半田付け接続すると共に、基部側を基板面
と密接させて基板端縁方向に延長し、その延長端で前記
コネクタ本体の一端面を基板端面に面接触で密着させ、
他端面側を前記メイン基板への接続方向へ突出させてコ
ネクタ接続部を形成して成ることを特徴とするプリント
基板。
(1) In a printed circuit board that is connected to the main board via a connector using the daughter-mother method, one of the connecting terminals protruding from both sides of the connector body is bent into an L shape, and the L-shaped connecting terminal is connected to the board. It is inserted into an insertion hole formed in one side direction and connected by soldering on the back side, and the base side is brought into close contact with the board surface and extended toward the edge of the board, and the extended end connects one end surface of the connector body to the end surface of the board. Bring it into close contact with each other,
A printed circuit board, characterized in that the other end surface side protrudes in a connection direction to the main board to form a connector connection part.
(2)基板母材にメイン基板に接続されるサブ基板を切
り取り可能に形成すると共に、その一辺と捨て基板との
間に開口部を打ち抜き形成し、コネクタ本体部の両側に
突出する接続端子の一方側をL状に折曲し、この折曲部
を前記サブ基板の一辺方向に形成した挿入孔に挿入して
裏面で半田付け接続すると共に、その基板表面側を基板
面と密接させ、かつ、前記コネクタ本体部を前記開口部
に嵌め入れ、その一端面を前記サブ基板の一辺端面に面
接触で密着させコネクタ接続部を形成したのち、前記サ
ブ基板を前記基板母材から切り取ることを特徴としたプ
リント基板の製法。
(2) A sub-board to be connected to the main board is formed on the board base material so that it can be cut out, and an opening is punched out between one side of the sub-board and the waste board, so that connecting terminals protrude from both sides of the connector body. One side is bent into an L shape, this bent part is inserted into an insertion hole formed in one side direction of the sub-board, and the back side is soldered and connected, and the front side of the board is brought into close contact with the board surface, and , the connector body is fitted into the opening, one end surface thereof is brought into close contact with one side end surface of the sub-board to form a connector connection portion, and then the sub-board is cut from the substrate base material. A manufacturing method for printed circuit boards.
(3)ドーター・マザー方式でコネクタを介してメイン
の基板に接続されるプリント基板において、前記メイン
基板との接続側一辺部にL形の接続端子を有するコネク
タの本体部一端面を前記一辺部端面と面接触で密着させ
、そのL形端子の先端側を前記一辺方向に形成した挿入
孔に挿入して裏面側で半田付け接続し、基板表面側を基
板面と密接させると共に、前記本体部他端面側をメイン
基板との接続方向に突出させる一方、前記メイン基板の
接続位置に挿入孔を表裏に貫通形成し、前記コネクタの
他方側接続端子を前記メイン基板の挿入孔に前記本体部
他端面が基板面と密接する位置まで挿入したのち、裏面
側で半田付け接続することを特徴としたプリント基板の
接続方法。
(3) In a printed circuit board that is connected to the main board via a connector in the daughter-mother method, one end surface of the main body of the connector that has an L-shaped connection terminal on one side of the connection side with the main board is connected to the one side of the connector. The end surface of the L-shaped terminal is brought into close contact with the surface of the board, and the tip end of the L-shaped terminal is inserted into the insertion hole formed in the direction of one side, and connected by soldering on the back side, and the front side of the board is brought into close contact with the board surface, and the main body part While the other end side protrudes in the connection direction with the main board, an insertion hole is formed through the front and back at the connection position of the main board, and the other side connection terminal of the connector is inserted into the insertion hole of the main board. A printed circuit board connection method characterized by inserting the printed circuit board until the end surface is in close contact with the board surface and then soldering the connection on the back side.
(4)メイン基板に対して直角に交差した角度関係で接
続することを特徴とした請求項(3)記載のプリント基
板の接続方法。
(4) The printed circuit board connection method according to claim (3), wherein the connection is performed in an angular relationship perpendicular to the main board.
(5)メイン基板上に密接したコネクタ本体部に支持さ
れて直立状態で保持されることを特徴とした請求項(3
)又は(4)記載のプリント基板の接続方法。
(5) Claim (3) characterized in that the connector body is supported by the connector body in close contact with the main board and held in an upright state.
) or the printed circuit board connection method described in (4).
JP63265633A 1988-10-21 1988-10-21 Printed board and its manufacture and connection thereof Pending JPH02112298A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63265633A JPH02112298A (en) 1988-10-21 1988-10-21 Printed board and its manufacture and connection thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63265633A JPH02112298A (en) 1988-10-21 1988-10-21 Printed board and its manufacture and connection thereof

Publications (1)

Publication Number Publication Date
JPH02112298A true JPH02112298A (en) 1990-04-24

Family

ID=17419848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63265633A Pending JPH02112298A (en) 1988-10-21 1988-10-21 Printed board and its manufacture and connection thereof

Country Status (1)

Country Link
JP (1) JPH02112298A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04156609A (en) * 1990-10-19 1992-05-29 Gurafuiko:Kk Substrate connecting device in radiated-type parallel systme bus
EP0586841A1 (en) * 1992-07-30 1994-03-16 Reichle + De-Massari AG Elektro-Ingenieure Printed circuit board and mounting module for connection of a shielded cable and distribution system for low-voltage installation construction
JP2010262871A (en) * 2009-05-09 2010-11-18 Fujitsu Ltd Connection terminal and transmission line

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04156609A (en) * 1990-10-19 1992-05-29 Gurafuiko:Kk Substrate connecting device in radiated-type parallel systme bus
EP0586841A1 (en) * 1992-07-30 1994-03-16 Reichle + De-Massari AG Elektro-Ingenieure Printed circuit board and mounting module for connection of a shielded cable and distribution system for low-voltage installation construction
US5402315A (en) * 1992-07-30 1995-03-28 Reichle+De-Massari Ag Printed circuit board and assembly module for connection of screened conductors for distribution boards and distribution systems in light-current systems engineering
JP2010262871A (en) * 2009-05-09 2010-11-18 Fujitsu Ltd Connection terminal and transmission line
US8491316B2 (en) 2009-05-09 2013-07-23 Fujitsu Limited Connection terminal and transmission line

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