JPH03129681A - Electronic component for surface mounted - Google Patents
Electronic component for surface mountedInfo
- Publication number
- JPH03129681A JPH03129681A JP1265241A JP26524189A JPH03129681A JP H03129681 A JPH03129681 A JP H03129681A JP 1265241 A JP1265241 A JP 1265241A JP 26524189 A JP26524189 A JP 26524189A JP H03129681 A JPH03129681 A JP H03129681A
- Authority
- JP
- Japan
- Prior art keywords
- main body
- mounting
- mounting board
- fixing
- terminal lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001070 adhesive effect Effects 0.000 claims abstract description 20
- 239000000853 adhesive Substances 0.000 claims description 19
- 238000003780 insertion Methods 0.000 abstract description 13
- 230000037431 insertion Effects 0.000 abstract description 13
- 239000000758 substrate Substances 0.000 abstract description 6
- 239000011810 insulating material Substances 0.000 abstract description 2
- 238000009499 grossing Methods 0.000 abstract 3
- 238000010586 diagram Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000000085 cashmere Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明は実装基板に対して表面実装可能なコネクタ等の
表面実装用電子部品に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to surface-mountable electronic components such as connectors that can be surface-mounted onto a mounting board.
［従来の技術］
従来、表面実装用コネクタ（以下単にコネクタと称する
）種々開発されている。その−例として、第７図（ａ）
、（ｂ）に示すようにコネクタ本体５０の側面から端子
リード５１を突出させると共に、このテール部に湾曲し
た弾性接着部５２を形成したものがある。[Prior Art] Various types of surface mount connectors (hereinafter simply referred to as connectors) have been developed. As an example, Fig. 7(a)
, (b), there is one in which a terminal lead 51 is made to protrude from the side surface of a connector main body 50, and a curved elastic adhesive part 52 is formed in the tail part.
このようなコネクタを、実装基板５３に表面実装するに
あたって、実装基板５３の一方の板面に載せてコネクタ
本体５０を押圧させると、端子リード５１の弾性接着部
５２の弾性（復元力）により実装基板５３に強力に密着
するので、この状態で表面実装を行うと、弾性接着部５
２と実装基板５３に印刷されているパッドとの半田付け
による接着が確実になる。When surface mounting such a connector on the mounting board 53, when it is placed on one plate surface of the mounting board 53 and the connector body 50 is pressed, the mounting is performed due to the elasticity (restoring force) of the elastic adhesive part 52 of the terminal lead 51. Since it strongly adheres to the substrate 53, if surface mounting is performed in this state, the elastic adhesive portion 5
2 and the pads printed on the mounting board 53 are securely bonded by soldering.
このようなことから、従来端子リードのテール部が弾性
を有していないものより、第７図に示すコネクタが多く
使用されている。For this reason, the connector shown in FIG. 7 is used more often than the conventional terminal lead whose tail portion does not have elasticity.
［発明が解決しようとする課題］
しかしながら、第７図のコネクタにあっては、端子リー
ド５１の弾性接着部５２の復元力が実装基板５３に直接
作用することから、該復元力で実装基板５３が反ってし
まうことがあり、場合によっては実装基板５３との密着
が不確実となり、信頼性が悪くなる。又、端子リード５
１を表面実装するまで、整列させた状態で保持すること
は非常に困難で、実際には第７図（ｂ）のように、端子
リード５１は不整列状態となることがほとんどであり、
この場合には実装基板５３に表面実装する前の段階で、
実装基板５３に印刷されているパッド（図示せず）に合
わせて端子リード５１を整列させる必要がある。実装基
板５３に印刷されるパッド相互の間隔が、従来例えば１
、２７■であったものが、最近さらにそれより狭い間
隔となりつつあることから、端子リード５１を該パッド
間隔に合わせて整列することは作業性が悪く、面倒であ
る。[Problems to be Solved by the Invention] However, in the connector shown in FIG. may be warped, and in some cases, the close contact with the mounting board 53 may become uncertain, resulting in poor reliability. Also, terminal lead 5
It is very difficult to maintain the terminal leads 51 in an aligned state until they are surface mounted, and in reality, the terminal leads 51 are often misaligned, as shown in FIG. 7(b).
In this case, before surface mounting on the mounting board 53,
It is necessary to align the terminal leads 51 with pads (not shown) printed on the mounting board 53. Conventionally, the distance between the pads printed on the mounting board 53 is 1, for example.
, 27■, but recently the spacing has become even narrower, so it is difficult and troublesome to align the terminal leads 51 according to the pad spacing.
本発明は、実装基板との密着が□確実になり、信頼性が
高く、端子リードを整列する必要が少なく表面実装の作
業が簡単で作業性が向上する表面実装用電子部品を提供
することを目的とする。The present invention aims to provide an electronic component for surface mounting, which ensures close contact with the mounting board, has high reliability, eliminates the need to align terminal leads, makes surface mounting work simple, and improves workability. purpose.
［課題を解決するための手段］
本発明は前記目的を達成するため、本体の一側面から端
子リードが突出し、このテール部に実装基板に対して表
面実装が可能な弾性接着部を有する表面実装用電子部品
において、
前記弾性接着部および前記端子リードの本体の埋設固定
部の間に、前記端子リードの弾性接着部を整列すると共
に、前記実装基板に対して固定する補整機構を設けたも
のである。[Means for Solving the Problems] In order to achieve the above object, the present invention provides a surface mount device in which a terminal lead protrudes from one side of a main body, and the tail portion thereof has an elastic adhesive portion that can be surface mounted to a mounting board. In the electronic component, an adjustment mechanism is provided between the elastic adhesive part and the embedded fixing part of the main body of the terminal lead to align the elastic adhesive part of the terminal lead and fix it to the mounting board. be.
［作用］
本発明によれば、弾性接着部および端子リードの本体の
埋設固定部の間に、端子リードの弾性接着部を整列する
と共に、実装基板に対して固定する補整機構を設けたの
で、実装基板との密着が確実になり、信頼性が高く、端
子リードを整列する必要が少なく表面実装の作業が簡単
で作業性が向上する。[Function] According to the present invention, a compensation mechanism is provided between the elastic adhesive portion and the embedded fixing portion of the terminal lead body to align and fix the elastic adhesive portion of the terminal lead to the mounting board. Close contact with the mounting board is ensured, reliability is high, there is less need to align terminal leads, surface mounting work is simple, and workability is improved.
［実施例〕 以下、発明の実施例について図面を参照して説明する。[Example〕 Embodiments of the invention will be described below with reference to the drawings.
第１図は、本発明の第１の実施例の構成を示す分解斜視
図である。ここでは、実装基板１に表面実装する対象物
としてコネクタをあげるが、これに限らず他の電子部品
であってもよい。FIG. 1 is an exploded perspective view showing the configuration of a first embodiment of the present invention. Here, a connector is used as an object to be surface mounted on the mounting board 1, but the object is not limited to this, and other electronic components may be used.
第１図に示すように、コネクタ本体４は、ハウジング２
と複数の端子リード３とからなり、ハウジング２の一側
面から端子リード３が突出し、このテール部は実装基板
１に対して表面実装が可能にほぼＵ字状に湾曲した弾性
接着部５を有している。As shown in FIG.
and a plurality of terminal leads 3, the terminal lead 3 protrudes from one side of the housing 2, and this tail part has an elastic adhesive part 5 curved into a substantially U-shape to enable surface mounting on the mounting board 1. are doing.
補整機構６は、端子リード３の弾性接着部５とハウジン
グ２の端子リード３の埋設固定部の間に配設した後述す
る補整部材７と、これを実装基板１に対して固定するた
めに、補整部材７に有する補整部材固定用ボス８と、こ
れが挿入固定できるように実装基板１に形成されたボス
挿入穴９とからなっている。The compensation mechanism 6 includes a compensation member 7, which will be described later, disposed between the elastic adhesive portion 5 of the terminal lead 3 and the embedded fixing portion of the terminal lead 3 of the housing 2, and a compensation member 7, which will be described later, in order to fix this to the mounting board 1. It consists of a compensation member fixing boss 8 provided on the compensation member 7 and a boss insertion hole 9 formed in the mounting board 1 so that the compensation member fixing boss 8 can be inserted and fixed.
補整部材７は、第２図（ａ）、（ｂ）の正面図および側
面図に示すように絶縁材からなり断面矩形状であって、
この対向する側面に端子リード３を挿通させるためのり
−ド挿通穴１ｏが複数個等間隔に形成され、また底面の
両端部および中央部には、先端が先細のテーバ状の補正
部材固定用ボス８がそれぞれ形成されている。The compensation member 7 is made of an insulating material and has a rectangular cross section, as shown in the front and side views of FIGS. 2(a) and 2(b).
A plurality of glued insertion holes 1o for inserting the terminal leads 3 are formed at equal intervals on the opposing sides, and tapered correction member fixing bosses with tapered tips are provided at both ends and the center of the bottom. 8 are formed respectively.
実装基板１の一方の板面には、前記端子リード３の弾性
接着部５を半田付けするためのパッド１１およびパター
ン１２が複数個等間隔に印刷され、さらに本体取付用穴
１３と、本体固定用ボス挿入穴１４が複数個形成されて
いる。On one plate surface of the mounting board 1, a plurality of pads 11 and patterns 12 for soldering the elastic adhesive portions 5 of the terminal leads 3 are printed at equal intervals. A plurality of boss insertion holes 14 are formed.
なお、ハウジング２には基板取付用穴１５、パネル取付
用穴１６、本体固定用ボス１７が形成され、また図示し
ないプラグと図に示すコネクタ（レセプタクル）と嵌合
したとき、両者をロックするためのロック部１８が形成
されている。The housing 2 is formed with a board mounting hole 15, a panel mounting hole 16, and a main body fixing boss 17, and is used to lock the plug (not shown) and the connector (receptacle) shown in the drawing when they are mated together. A lock portion 18 is formed.
このような構成のコネクタを第３図のように実装革板１
に表面実装する前に、以下のような準備を行う。すなわ
ち、初めに複数の端子リード３を、補整部材７のリード
挿通穴１ｏにそれぞれ挿通固定した状態で、ハウジング
２に組み込んだコネクタ本体４を準備する。次に、この
準備されたコネクタ本体４の本体固定用ボス１７を、実
装基板１に形成されている本体固定用ボス挿入穴１４に
挿入固定させる。その後、ハウジング２の基板取付用穴
１５と実装基板１の本体取付用穴１３に図示しないフッ
ク、ねじ等により両者を固定する。A connector with such a configuration is mounted on a mounting leather board 1 as shown in Figure 3.
Before surface mounting the device, make the following preparations. That is, first, the connector main body 4 is prepared, which is assembled into the housing 2 with a plurality of terminal leads 3 inserted and fixed into the lead insertion holes 1o of the compensation member 7, respectively. Next, the main body fixing boss 17 of the prepared connector main body 4 is inserted and fixed into the main body fixing boss insertion hole 14 formed in the mounting board 1. Thereafter, both are fixed to the board mounting hole 15 of the housing 2 and the main body mounting hole 13 of the mounting board 1 using hooks, screws, etc. (not shown).
最後に、補整部材７の補整部材固定用ボス８を実装基板
１のボス挿入穴９に挿入固定する。Finally, the compensation member fixing boss 8 of the compensation member 7 is inserted and fixed into the boss insertion hole 9 of the mounting board 1.
このように、補整部材固定用ボス８をボス挿入穴９に挿
入固定することにより、補整部材７１；それぞれ挿入固
定されている端子リード３の各弾性接着部５が実装基板
１に対してほぼ均等に押圧されるので、各弾性接着部５
の接触圧が第７図に示す従来例よりかなり小さくても、
実装基板１との密着が確実となり、このため実装基板１
の反りの問題がなくなり、信頼性が向上する。In this way, by inserting and fixing the compensating member fixing boss 8 into the boss insertion hole 9, the compensating member 71; , each elastic adhesive part 5
Even if the contact pressure is much smaller than that of the conventional example shown in Fig. 7,
The close contact with the mounting board 1 is ensured, and therefore the mounting board 1
This eliminates the problem of warpage and improves reliability.
また、各端子リード３は表面実装する前に、補整部材７
のリード挿通穴１０に挿通固定されているので、各弾性
接着部５の配列が乱れることはほとんどなく、従って各
弾性接着部５をハンダ併用バッド１１の間隔台わせるよ
うに整列する必要がなく表面実装の作業が簡単で作業性
が向上する。In addition, before each terminal lead 3 is surface mounted, the compensation member 7
Since the lead insertion holes 10 are inserted and fixed, the arrangement of each elastic adhesive part 5 is hardly disturbed, and therefore there is no need to align each elastic adhesive part 5 so as to match the spacing between the solder pads 11. Surface mounting work is easy and workability is improved.
さらに、プラグとレセプタクル等からなるツーピースコ
ネクタであっても、両者を挿抜するときの挿抜力が補整
部材７で吸収されるので、弾性接着部５と実装基板１の
ハンダ付は部に前記挿抜力が及ばないことから、極数の
大きなツーピースコネクタでも表面実装が可能となる。Furthermore, even in the case of a two-piece connector consisting of a plug and a receptacle, the insertion/extraction force when the two are inserted/extracted is absorbed by the compensating member 7. Since this is not the case, even two-piece connectors with a large number of pins can be surface-mounted.
また、補整部材７としてはり−ド挿通穴１゜を形成した
形式であるので、補整部材固定用ボス８は、図のように
補整部材７の外周面に軸方向の両端部およびこの中間位
置に形成したり、あるいは補整部材７の外周面の任意の
位置に所望の数だけ形成できることから、補整部材７の
中央位置が反り等による変形を防止でき、これにより端
子リード３の数が多いものでも使用できる。In addition, since the compensating member 7 has a beam insertion hole of 1°, the compensating member fixing bosses 8 are provided on the outer peripheral surface of the compensating member 7 at both ends in the axial direction and at an intermediate position therebetween, as shown in the figure. The center position of the compensation member 7 can be prevented from being deformed due to warping, etc., because the center position of the compensation member 7 can be formed in a desired number or at any position on the outer peripheral surface of the compensation member 7. Can be used.
さらにまた、前記補整部材７を例えば薄くしたり、可撓
性の優れた材料で作ることで、実装基板１が何等かの理
由で反りが生じても問題なく使用できる。Furthermore, by making the compensation member 7 thin or made of a material with excellent flexibility, it can be used without any problem even if the mounting board 1 warps for some reason.
第４図は本発明の第２の実施例を示すものである。前述
した実施例はコネクタ本体４に対して端子り７ド３が一
方側に突出した場合であるが、この実施例はコネクタ本
体４の両側に端子リード３を突出させた場合である。こ
の実施例においても、前述の実施例と同様に補整部材７
の補整部材固定用ボス８を実装基板１に挿入固定するこ
とは言うまでもない。FIG. 4 shows a second embodiment of the invention. In the embodiment described above, the terminal leads 3 protrude from one side of the connector body 4, but in this embodiment, the terminal leads 3 protrude from both sides of the connector body 4. In this embodiment as well, the compensating member 7
Needless to say, the compensation member fixing boss 8 is inserted and fixed into the mounting board 1.
第５図は前述の補正部材７の他の例を示すもので、（ａ
）、（ｂ）はそれぞれ補整部材２７の正面図および側面
図であり、前述の実施例は端子リード３を挿通固定させ
るため穴１０を形成したものであるが、この例は端子リ
ード挿通用溝２９を形成したものである。補整部材固定
用ボス２８が形成されているのは、前述の実施例と同様
である。第５図の補整部材７の場合には、実装基板１に
表面実装する直前に補整部材７を使用できることから、
第２図の補整部材７に比べて実装作業が容易になる。FIG. 5 shows another example of the above-mentioned correction member 7, in which (a
) and (b) are respectively a front view and a side view of the compensating member 27. In the above-mentioned embodiment, the hole 10 was formed in order to insert and fix the terminal lead 3, but in this example, the hole 10 was formed in order to insert and fix the terminal lead 3. 29 was formed. The formation of the compensation member fixing boss 28 is the same as in the previous embodiment. In the case of the compensation member 7 shown in FIG. 5, since the compensation member 7 can be used immediately before surface mounting on the mounting board 1,
The mounting work is easier compared to the compensation member 7 shown in FIG. 2.
本発明は前述した実施例に限定されず例えば次のように
することもできる。第６図はこの一つを説明するための
断面図（第１図の縦断面図）であり、補整部材７の上部
に、端子リード３を保護すると共に、補整部材７を実装
基板１に圧入する際に補整部材７に対して押圧力を与え
るための断面り字状のカバー３０を配置し、弾性接着部
５を実装基板１に表面実装後に、例えばハウジング２の
側面板に固定するものである。また、補整部材７と端子
リード３の固定は、補整部材７を製作した後挿入固定せ
ずに、インサート成形でもよい。The present invention is not limited to the embodiments described above, but can also be implemented as follows, for example. FIG. 6 is a cross-sectional view (vertical cross-sectional view of FIG. 1) for explaining one of these, in which the terminal lead 3 is protected on the upper part of the compensating member 7, and the compensating member 7 is press-fitted into the mounting board 1. A cover 30 having an angular cross-section is arranged to apply a pressing force to the compensating member 7 during the process, and after the elastic adhesive part 5 is surface mounted on the mounting board 1, it is fixed to the side plate of the housing 2, for example. be. Further, the compensation member 7 and the terminal lead 3 may be fixed by insert molding instead of being inserted and fixed after the compensation member 7 is manufactured.
さらに、補整部材７または２７を実装基板１に固定する
ための手段として、前述のようにボスをテーパ形状こせ
ずに、フック形状としたり、あるいは実装基板固定部材
を実装基板に挿入後融着したりカシメルようにしてもよ
い。Furthermore, as a means for fixing the compensating member 7 or 27 to the mounting board 1, the boss may be made into a hook shape instead of having a tapered shape as described above, or the mounting board fixing member may be fused after being inserted into the mounting board. You can also use it as a cashmere.
［発明の効果］
以上述べた本発明によれば、実装基板との密着が確実に
なり、信頼性が高く、端子リードを整列する必要が少な
く表面実装の作業が簡単で作業性が向上する表面実装用
電子部品を提供することができる。[Effects of the Invention] According to the present invention described above, a surface is provided that ensures close contact with the mounting board, has high reliability, eliminates the need to align terminal leads, makes surface mounting work easier, and improves workability. Electronic components for mounting can be provided.
第１図は本発明による表面実装用電子部品の第１の実施
例の構成を示す分解斜視図、第２図は第１図の補整部材
を説明するための図、第３図は第１図のコネクタを実装
基板に表面実装した状態を示す図、第４図は本発明の第
２の実施例を示す正面図、第５図は本発明の補整部材の
他の例を説明するための図、第６図は本発明の詳細な説
明するための断面図、第７図は従来の表面実装用コネク
タの一例を示す図である。
１・・・実装基板、２・・・ハウジング、３・・・端子
リード、４・・・コネクタ本体、５・・・弾性接着部、
６・・・補整機構、７・・・補整部材、８・・・補整部
材固定用ボス、９・・・ボス挿入穴、１１・・・ハンダ
併用パッド、１２・・・パターン、１３・・・本体取付
用穴、１４・・・本体固定用ボス挿入穴、１５・・・基
板取付用穴、１６・・・パネル取付用穴、１７・・・本
体固定用ボス。FIG. 1 is an exploded perspective view showing the structure of a first embodiment of a surface mount electronic component according to the present invention, FIG. 2 is a diagram for explaining the compensation member shown in FIG. 1, and FIG. FIG. 4 is a front view showing the second embodiment of the present invention, and FIG. 5 is a diagram illustrating another example of the compensation member of the present invention. , FIG. 6 is a sectional view for explaining the present invention in detail, and FIG. 7 is a diagram showing an example of a conventional surface-mount connector. DESCRIPTION OF SYMBOLS 1... Mounting board, 2... Housing, 3... Terminal lead, 4... Connector body, 5... Elastic adhesive part,
6... Compensation mechanism, 7... Compensation member, 8... Boss for fixing compensation member, 9... Boss insertion hole, 11... Solder combination pad, 12... Pattern, 13... Hole for mounting the main body, 14...Boss insertion hole for fixing the main body, 15... Hole for mounting the board, 16... Hole for panel mounting, 17... Boss for fixing the main body.
Claims (1)
実装基板に対して表面実装が可能な弾性接着部を有する
表面実装用電子部品において、前記弾性接着部および前
記端子リードの本体の埋設固定部の間に、前記端子リー
ドの弾性接着部を整列すると共に、前記実装基板に対し
て固定する補整機構を設けた表面実装用電子部品。A surface mounting electronic component in which a terminal lead protrudes from one side of the main body and has an elastic adhesive part in the tail part that can be surface mounted to a mounting board, wherein the elastic adhesive part and the embedded fixing part of the terminal lead in the main body. The electronic component for surface mounting is provided with a compensating mechanism for aligning the elastic adhesive portions of the terminal leads and fixing them to the mounting board between the terminal leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1265241A JP2544977B2 (en) | 1989-10-13 | 1989-10-13 | Electronic components for surface mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1265241A JP2544977B2 (en) | 1989-10-13 | 1989-10-13 | Electronic components for surface mounting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03129681A true JPH03129681A (en) | 1991-06-03 |
| JP2544977B2 JP2544977B2 (en) | 1996-10-16 |
Family
ID=17414489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1265241A Expired - Lifetime JP2544977B2 (en) | 1989-10-13 | 1989-10-13 | Electronic components for surface mounting |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2544977B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04366575A (en) * | 1991-06-13 | 1992-12-18 | Fujitsu Ltd | Surface mounting type connector |
| JP2007294993A (en) * | 1994-03-11 | 2007-11-08 | Quantum Leap Packaging Inc | Assembling type semiconductor chip carrier |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6083957B2 (en) | 2012-06-12 | 2017-02-22 | 日本航空電子工業株式会社 | Connector and connector manufacturing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5013726U (en) * | 1973-06-08 | 1975-02-13 | ||
| JPS6343363U (en) * | 1986-09-06 | 1988-03-23 | ||
| JPH01225073A (en) * | 1988-03-03 | 1989-09-07 | Fujitsu Ltd | Multi-connector |
| JPH01143084U (en) * | 1988-03-28 | 1989-09-29 |
-
1989
- 1989-10-13 JP JP1265241A patent/JP2544977B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5013726U (en) * | 1973-06-08 | 1975-02-13 | ||
| JPS6343363U (en) * | 1986-09-06 | 1988-03-23 | ||
| JPH01225073A (en) * | 1988-03-03 | 1989-09-07 | Fujitsu Ltd | Multi-connector |
| JPH01143084U (en) * | 1988-03-28 | 1989-09-29 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04366575A (en) * | 1991-06-13 | 1992-12-18 | Fujitsu Ltd | Surface mounting type connector |
| JP2007294993A (en) * | 1994-03-11 | 2007-11-08 | Quantum Leap Packaging Inc | Assembling type semiconductor chip carrier |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2544977B2 (en) | 1996-10-16 |
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