JP3161914B2 - IC card manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card manufacturing apparatus, and more particularly, to a film substrate forming step including a film base supply step, a pattern forming step, and an IC module forming step. The present invention relates to an IC card manufacturing apparatus including an IC card base material forming step and an IC package mounting step of separating an IC package from a film substrate and mounting the IC package in a concave portion of the IC card base material.

[0002]

2. Description of the Related Art An IC card manufacturing apparatus generally comprises a film substrate supply step, a pattern formation step, an IC module formation step, and a film substrate formation step.
Card base material forming step, and separating the IC package from the film substrate and mounting the IC package in the concave part of the IC card base material
It consists of a C package mounting process.

That is, as shown in FIG. 9, in a film base supply step, a band-like film made of, for example, glass / epoxy resin is cut at predetermined intervals and supplied.

Next, in a pattern forming step, a predetermined pattern is formed on the film substrate. In FIG. 10, a film substrate 1 is formed by bonding a copper foil 3 on one side surface 2 of a substrate, performing masking and etching to form predetermined patterns 4 and 4, and furthermore, on the copper foil 3 Conductive plating 5 (usually gold plating) is applied. Thereafter, a plurality of holes 6 and 6 for feeding the film are formed in the film substrate 1 at an equal pitch.

In the IC module forming step, an IC (not shown) is placed on each of the patterns 4 and 4 in the IC module forming step, and the IC is formed by bonding. Connect with each pattern. Thereby, a film substrate is formed.

Thereafter, each IC module is separated from the film substrate together with the film substrate on which the IC module is mounted (IC package separation step). The film base and the IC module constitute a set of IC packages. On the other hand, an IC card substrate is formed by an injection molding method (IC card substrate forming step), and each of the IC packages is mounted on the IC card substrate (IC package mounting step) to form an IC card.

By the way, in an IC module forming step of forming an IC module on a film substrate on which the above-described pattern is formed, resin sealing is performed to protect ICs and wires. In Europe and the like, an epoxy resin is used for resin encapsulation, and the epoxy resin is dropped to surround the IC portion.
Since the shape of the C module is not fixed, the positioning becomes unstable when the IC package is mounted in the concave portion of the IC card base material in the subsequent steps, especially in the above-described IC package mounting step, and thus the IC package is extended. Is incompletely fixed.

[0008] In view of the above, the present applicant has proposed an IC
As a method of resin sealing, a mold molding method using a mold for manufacturing a module, which is called a so-called transfer mold, is employed.

[0009]

When the mold for manufacturing a module is used, as shown in FIG. 11, the lower mold 11 of the mold is inserted into the hole 6 for feeding the film of the film substrate 1. A positioning pin 12 for insertion is provided, and a concave portion 14 for inserting the positioning pin 12 is formed in the upper die 13 of the mold.

On the other hand, as described above, the film substrate
It is configured by bonding copper foil on one side of the resin, and since the coefficient of thermal expansion between the resin and the copper foil is different, by preheating performed in advance during transfer molding,
As shown in the figure, the film substrate is twisted. Therefore, when the film substrate is placed on the lower mold, a situation occurs in which the film feeding hole of the film substrate is not inserted into the lower mold pin. The upper die descends in such a state,
When the film base is sandwiched between the upper and lower molds, when the hole for film feeding of the film base is not located on the pin of the lower mold, a place other than the hole is often inadvertently caused by the pin. When a hole is made or the hole for feeding the film is slightly shifted with respect to the pin, there is a problem that the hole is torn by the pin.

[0011]

[0012] In the molding method using the module manufacturing mold, in forming the IC module requires a runner for feeding the molten resin to the IC module. As this runner structure, for example, FIG.
As shown in FIG. 1, a plurality of runners 22 are provided from the main runner 21 and a plurality of IC modules 31, 31 are formed from each runner 22 at one time.
As shown in FIG. 3, the main runner 21 is
At the center in the longitudinal direction, and a pair of I
It is conceivable to form the C modules 31, 31.
With this arrangement, the runner can be saved as much as possible.

On the other hand, the present applicant has studied a runner structure of a film base material which is compatible with the continuity in making the production line of the film substrate continuous. That is, in order to make the production line of the film substrate continuous, it is necessary to keep the film substrate after the IC module is formed in a continuous shape of, for example, 50 to 100 m, and wind the film substrate around a reel to bend. In this case, since the runner on the film substrate is a cured resin after the formation of the substrate, how to arrange the runner is questioned. That is,
Depending on the arrangement of the runners, it may hinder the bending of the film substrate.

[0014] Therefore, the present invention is a basic purpose of obtaining a runner structure reasonable film substrate when bending the film substrate.

That is, in the mold forming method using the module manufacturing mold, a predetermined runner structure is provided as described above. Then, in order to supply the molten resin to the IC module molding scheduled portion without excess or shortage, the runner is formed smaller than the IC module. Further, the film substrate after the IC module is formed is laminated with a predetermined length and is prepared for the next step. FIG.
This shows a state where the film substrates 10 are stacked. As described above, the film substrate 10 is provided with the IC module 31 on one side of the film substrate 1 and the copper foil 3 on the other side. As a result, the copper foil 3 is scratched, resulting in poor appearance, sometimes causing a product defect.

The present invention aims at obtaining a structure which does not cause appearance defects or product defects even when film substrates are laminated .
This is one of the purposes.

Next, a second object of the present invention will be described. In the mold forming method using the mold for manufacturing a module, a predetermined runner structure is provided as described above. Then, the film substrate after the IC module is formed is transported by the transport device. In this case, the film is conveyed while guiding the edge of the film substrate by a guide rail of the conveying device. On the other hand, the film substrate is separated from the external runner, and in that case, burrs often occur at the edge of the film substrate. If there is a burr at the edge of the film substrate, the burr may be caught on the guide rail of the transfer device during the transfer of the film substrate, causing a so-called jamming problem and stopping the transfer.

It is a second object of the present invention to provide a film substrate guide device which does not cause a stoppage of transport even if burrs are present at the edge of the film substrate.

[0019]

[0020]

[0021]

[0022]

[0023]

[0024]

[0025]

[0026]

[0027]

[0028]

SUMMARY OF THE INVENTION The present invention provides
A film substrate forming step including a film substrate supplying step, a pattern forming step, and an IC module forming step, and an IC card substrate forming step, and a concave portion of the IC card substrate by separating the IC package from the film substrate. In an IC card manufacturing apparatus including an IC package mounting step of mounting a module, a molten resin is supplied to form an IC module on a back surface of the film base on which the pattern is formed using a module manufacturing mold. The runner is disposed in a direction perpendicular to the longitudinal direction of the film substrate and at a position intersecting with the IC module forming scheduled portion, and further, on both sides of the runner, a height higher than the IC module forming portion. It is a runner structure of a film substrate on which a high protrusion is formed.

According to this structure, when the film substrates are stacked, the projections provided on both sides of the runner come into contact with the lower surface edge of the upper film substrate. , And the copper foil is prevented from being damaged. Therefore, even if the film substrates are laminated, no defective appearance or defective product occurs.

The second invention comprises a film base supply step,
A film substrate forming step including a pattern forming step and an IC module forming step, an IC card base material forming step, and an IC package mounting step of separating an IC package from the film substrate and mounting the IC package in a concave portion of the IC card base material An IC card manufacturing apparatus comprising: a runner for feeding a molten resin when forming an IC module using a module manufacturing die on the back surface of the film base on which the pattern is formed; A direction perpendicular to the longitudinal direction of the material and at a position intersecting with the part to be molded with the IC module, and further forming a projection on at least one of both sides of the runner; A guide for feeding is provided, and the guide has a guide groove that engages with the protrusion of the runner. Lum is the substrate of the guide device.

With this configuration, the protrusion of the runner of the film substrate is guided by the guide groove of the guide for feeding the film substrate. It is possible to avoid such a problem that burrs are caught on the guide rail of the transfer device and jamming occurs during the transfer of the film substrate, such as
Therefore, according to the present invention, the inconvenience of stopping the conveyance is prevented.

[0032]

[0033]

[0034]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the illustrated embodiments. In this embodiment, the same components as those described above are denoted by the same reference numerals, and detailed description will be omitted.

According to the present invention, as shown in FIG. 9, a film substrate supplying step, a pattern forming step, an IC module forming step, and a film substrate forming step,
C card base material forming process and IC from film substrate
In an IC card manufacturing apparatus comprising an IC package mounting step of separating a package and mounting the IC module in a concave portion of an IC card base, a module manufacturing metal for forming an IC module on the film base on which the pattern is formed. It is provided on the mold.

In the present invention, as shown in FIG. 1, a positioning pin 12 to be inserted into a film feeding hole 6 of a film substrate 1 is provided on a lower mold 11 of a mold, and Is provided with a concave portion 14 into which the positioning pin 12 is inserted, and a pressing member 15 which is attached to the concave portion 14 so as to be able to protrude and retract and which fits with the positioning pin 12. And upper mold 1
3 is provided with an elastic member 16 which constantly urges the holding member 15 in the lower die direction.

The holding member 15 has a hollow portion 15a into which the positioning pin 12 is swallowed. The upper portion is formed in a flange shape, and the flange portion is held by the holding plate 17. The elastic member 16 is, for example, a coil spring and is mounted in the recess 14.

In the state shown in FIG.
When the film substrate 1 is placed on the lower mold 11 in a case where is twisted, the hole 6 near the downwardly bent portion becomes the pin 1
2, but the hole 6 in the upwardly curved portion is separated from the pin 12. Then, from this state, the upper mold 1
When the lowering member 3 is lowered, in the case of FIG. 1, the pressing member 15 at the center presses the film substrate 1 around the hole 6 fitted into the pin 12, and the pressing members 15 on the left and right move together with the floating film substrate. The film substrate is pressed against the lower mold 11 by making contact with the vicinity of the first hole 6. In the case of a conventional mold having no holding member 15, when both molds abut against the film substrate 1, the film substrate 1 is instantaneously sandwiched. When there is no match with the pin 12, there is no room for correcting the position of the film substrate 1, and the above-described accidental drilling or tearing of the hole occurs. In the case of the present invention, both of the holes are torn. Before the holding of the film substrate 1 by the mold, there is a resilient abutting action by the pressing member 15, so that when the hole 6 does not match the pin 12,
The time allowance for the position correction of the film substrate 1 is provided, so that it is possible to avoid the above-mentioned conventional accidental drilling or tearing of the hole.

FIG. 2 shows a runner structure of a film substrate. That is, as shown in FIG. 9, a film substrate supplying step, a pattern forming step, and an IC module forming step, a film substrate forming step, an IC card substrate forming step, and an IC package are separated from the film substrate. To be mounted in the recess of the IC card substrate
In an IC card manufacturing apparatus including a package mounting step, a runner for feeding a molten resin when forming an IC module 31 by using a module manufacturing mold on the back surface of the film substrate 1 on which the pattern is formed. 22 is arranged in a direction orthogonal to the longitudinal direction of the film substrate 1 and at a position intersecting the IC module forming scheduled portion.

With such a configuration, the runner 22 remaining on the film substrate 1 fits within the width of the IC module 31, and when the film substrate or the film substrate is wound, a film other than the IC module is used. The part can be bent. Therefore, when the film substrate after the IC module is formed is long, the film substrate can be easily wound.

FIGS. 3 and 4 are views showing a film substrate. As in the previous example, a film substrate supply step, a pattern formation step, and an IC module formation step, and an IC card base are performed. Material forming process, and
This is an IC card manufacturing apparatus including an IC package mounting step of separating an IC package from a film substrate and mounting the IC package in a concave portion of an IC card base material. In this embodiment, the IC module 31 is mounted on the back surface of the film substrate 1 on which the pattern 4 is formed by using a module manufacturing mold.
For forming the melter, a runner 22 for feeding the molten resin.
In the direction perpendicular to the longitudinal direction of the film substrate 1 and
It is arranged at a position intersecting with the part to be molded with the IC module. Further, on both sides of the runner 22, projections 23, 23, which are higher than the IC module 31, are formed.

With this configuration, as shown in FIG. 5, when the film substrates 10, 10 are stacked, the projections 23, 23 provided on both sides of the runner 22 become lower surfaces of the upper film substrate 10. As a result, the IC module 31 comes into contact with the copper foil 3 to prevent the copper foil 3 from being damaged. Therefore, even if the film substrates are laminated, no defective appearance or defective product occurs.

FIG. 6 shows a guide for feeding a film substrate.
FIG. 4 is a view showing a film base material in the guide, as in the previous example, a film base supply step, a pattern formation step,
A film substrate forming step including a C module forming step, an IC card base material forming step, and an IC package mounting step of separating an IC package from the film substrate and mounting the IC package in a concave portion of the IC card base material.
This is in a C card manufacturing apparatus. In the same manner as in the previous example, a runner 22 that feeds a molten resin is formed on the back surface of the film substrate 1 on which the pattern 4 is formed by using a mold for manufacturing a module. In a direction perpendicular to the longitudinal direction and the I
The runner 22 is disposed at a position intersecting with the C module forming scheduled portion, and further, a protrusion 23 is formed on at least one of both side portions of the runner 22. In this embodiment, the protrusions are
2 are formed on both sides.

25 is a guide for feeding the film substrate.
The guide 25 has a guide groove 26 that engages with the projection 23 of the runner 22. In the embodiment, since the protrusions 23 are formed on the left and right, the guide grooves 26 are formed.
Two are provided in response to this. Since the burrs at the edges of the film substrate are usually formed on one edge, the projections 23 formed on at least one of the two sides of the runner 22 are provided on the edge with the burrs. And one guide groove corresponding to the projection may be provided.

With this configuration, the protrusion of the runner of the film substrate is guided by the guide groove of the guide for feeding the film substrate. It is possible to avoid such a problem that burrs are caught on the guide rail of the transfer device and jamming occurs during the transfer of the film substrate, such as
Therefore, according to the present invention, the inconvenience of stopping the conveyance is prevented.

FIGS. 7 and 8 are views showing the concave portion of the IC card base material and the IC package separated from the film substrate. As in the previous example, the film base material supply step, the pattern formation step, and the IC module formation step are performed. Consisting of a film substrate forming step, and an IC card base material forming step, and
This is an IC card manufacturing apparatus including an IC package mounting step of separating an IC package from a film substrate and mounting the IC package in a concave portion of an IC card base material. Then, the IC package 30 is separated from the film substrate 10 and mounted in the concave portion 7 of the IC card substrate 1.

In mounting the IC package 30 in the concave portion 7, the separated IC package 30
A module 31, a runner portion 22a having a lower height than the IC module, and a film base portion 1a are provided. On the other hand, the concave portion 43 of the IC card base material 40 has a first concave portion 44 with which the IC module 31 of the IC package 30 is engaged, a second concave portion 45 with which the runner portion 22a of the IC package 30 is engaged, and the film base. A third concave portion 46 with which the material portion 1a is engaged.

The IC package 30 including the IC module 31, the runner portion 22a having a lower height than the IC module, and the film base portion 1a is formed by using the film base shown in FIGS. 1 to the film substrate 10 and obtained separately from them.

With this configuration, each of the IC module of the IC package and the first concave portion of the IC card base, the runner portion and the second concave portion of the IC package, and the film base portion and the third concave portion of the IC package are formed. Positioning is performed by engagement. Therefore, it is possible to obtain an IC card device that uses a relatively inexpensive and simple mold with a runner structure and has a positioning structure with high position accuracy without using an expensive and complicated mold with a gateless structure.

[0050]

[0051]

[0052]

The first embodiment constructed as described above.
Akira, in the IC card manufacturing apparatus having the above configuration, when forming an IC module using a mold for manufacturing a module on the back surface of the film base on which the pattern is formed, a runner for feeding molten resin, In the direction perpendicular to the longitudinal direction of the film substrate and at a position intersecting with the IC module forming scheduled portion, furthermore, on both sides of the runner, projecting portions higher in height than the IC module forming portion are provided. This is a runner structure of the formed film base material. When the film substrates are laminated, the protrusions provided on both sides of the runner come into contact with the lower surface edge of the upper film substrate. , And the copper foil is prevented from being damaged. Therefore, even if the film substrates are laminated, no defective appearance or defective product occurs.

According to a second aspect of the present invention, in the IC card manufacturing apparatus having the above-described structure, a molten resin is fed to the back surface of the film base on which the pattern is formed, when forming an IC module using a module manufacturing die. A runner to be supplied is arranged in a direction perpendicular to a longitudinal direction of the film base and at a position intersecting with a site where the IC module is to be formed. Further, at least one of both side portions of the runner is provided with a projection. In addition, a guide for feeding the film substrate is provided, and the guide is a guide device for a film substrate provided with a guide groove that engages with the protrusion of the runner. Since the projections are guided by the guide grooves of the guide for feeding the film substrate, even if there are burrs on the edge of the film substrate, the film substrate is not moved as in the conventional case. Bali feeding developing it is possible to avoid the inconvenience resulting jamming caught on the guide rails of the transport device, thus, according to the present invention,
The inconvenience of stopping the conveyance is prevented.

[0054]

Thus, according to the present invention, this type of I
A C card manufacturing device that has the advantages that it does not cause appearance defects or product defects, does not easily cause problems in the transport process, and has the advantage that the IC package can be accurately mounted on the IC card base material. It is.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a module manufacturing mold according to the present invention.

FIG. 2 is a plan view showing a film substrate on which an IC module is formed according to the present invention.

FIG. 3 is a plan view showing a film substrate on which an IC module is formed according to the present invention.

FIG. 4 is a perspective view of a main part showing a film substrate on which an IC module is formed according to the present invention.

FIG. 5 is a longitudinal sectional view showing a state in which film substrates are stacked.

FIG. 6 is a longitudinal sectional view showing a film substrate feeding guide and a film substrate inside the guide.

FIG. 7 is a perspective view showing a concave portion of an IC card base and an IC package separated from a film substrate.

FIG. 8 is a longitudinal sectional view showing a concave portion of an IC card base and an IC package separated from a film substrate.

FIG. 9 is a diagram showing a process of manufacturing an IC card.

FIG. 10 is a plan view showing a film substrate.

FIG. 11 is a longitudinal sectional view showing a mold for manufacturing a module.

FIG. 12 is a plan view showing a film substrate on which an IC module is formed.

FIG. 13 is a plan view showing a film substrate on which an IC module is formed.

FIG. 14 is a longitudinal sectional view showing a state where film substrates are stacked.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-6-190858 (JP, A) JP-A-4-276414 (JP, A) JP-A 64-54737 (JP, A) JP-A-4-54 184944 (JP, a) JitsuHiraku flat 2-33443 (JP, U) (58 ) investigated the field (Int.Cl. ^7, DB name) G06K 19/077 B42D 15/10 521 H01L 21/56 B29C 45/02

Claims (2)

(57) [Claims] 1. A film substrate supply step and a pattern forming step
Substrate consisting of a process and an IC module forming process
Forming step, IC card base material forming step, and
Separates the IC package from the film substrate and
It consists of an IC package mounting process for mounting in the recess of the material
IC card manufacturing apparatus, wherein the film substrate on which the pattern is formedOn the back of the moji
To form an IC module using a tool manufacturing die
Per The runner for feeding the molten resin is
Molding of the IC module in a direction perpendicular to the hand direction
Place it at the position that intersects the planned site, Further, the IC module is provided on both sides of the runner.
It is characterized by forming protrusions that are taller than the shape
Runner structure of film base. 2. A film substrate supplying step, and a pattern forming step.
Substrate consisting of a process and an IC module forming process
Forming step, IC card base material forming step, and
Separates the IC package from the film substrate and
It consists of an IC package mounting process for mounting in the recess of the material
An IC card manufacturing apparatus, comprising:
To form an IC module using a metal mold
The runner that feeds the molten resin is
Molding of the IC module in a direction perpendicular to the hand direction and
Place it at a location that crosses the planned site, Further, at least one of both side portions of the runner has a projection.
Form a part, In addition, when a guide for feeding the film substrate is provided,
The guide is engaged with the protrusion of the runner.
Guidance of film substrate characterized by providing guide grooves
Device.