JPH0890967A - Apparatus for manufacture of ic card - Google Patents

Abstract

PURPOSE: To manufacture an IC card without generating poor appearance or the like by a method wherein a positioning pin to be inserted into a hole for feeding a film of a film base material is provided to a bottom force of a mold for forming an IC module on the film base material, and besides a pressing member fitting to the positioning pin is provided to its top force. CONSTITUTION: An IC card-manufacturing apparatus has a film substrate-forming process wherein formation of a pattern and formation of an IC module are carried out on a film base material, and is equipped with a module- manufacturing mold in order to form an IC module on the film base material on which the pattern is formed. In that case, a positioning pin 12 to be inserted into a film feeding hole 6 of the film base material is provided to a bottom force 11 of a mold. Besides a recess part 14 in which the positioning pin 12 is inserted is formed to a top force 13. A pressing member 15 is mounted in a freely coming-in/out manner to a recess part 14 in which the positioning pin 12 is inserted, in a top force 13. The pressing member 15 is energized in the bottom force direction by an elastic material 16. Thereby, accuracy in mounting an IC package to an IC base material is improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card manufacturing apparatus, and more particularly, to a film substrate forming step including a film base material supplying step, a pattern forming step, and an IC module forming step, and The present invention relates to an IC card manufacturing apparatus including an IC card base material forming step and an IC package mounting step of separating an IC package from a film substrate and mounting the IC package in a recess of the IC card base material.

[0002]

2. Description of the Related Art An IC card manufacturing apparatus generally includes a film substrate forming step including a film base material supplying step, a pattern forming step, and an IC module forming step, and an IC.
Card base forming step, and separating IC package from film substrate and mounting in IC card base recess I
It consists of a C package mounting process.

That is, as shown in FIG. 9, in the film substrate supplying step, for example, a belt-shaped film made of glass / epoxy resin is cut at a predetermined interval and supplied.

Next, in a pattern forming step, a predetermined pattern is formed on the film base material. In FIG. 10, the film substrate 1 has a copper foil 3 bonded on one side surface 2 of the substrate, and then masked and etched to form predetermined patterns 4 and 4, and further, on the copper foil 3. Conductive plating 5 (usually gold plating) is applied, and thereafter, a plurality of holes 6 and 6 for feeding the film are formed in the film substrate 1 at an equal pitch.

Then, in the film substrate 1 formed as described above, in the IC module forming step, an IC (not shown) is placed on each of the patterns 4 and 4 and bonded to form the IC. Connect with each pattern. As a result, a film substrate is formed.

After that, each IC module is separated from the film substrate together with the film base material on which the IC module is mounted (IC package separating step). The film base material portion and the IC module form a set of IC packages. On the other hand, an IC card base material is formed by an injection molding method (IC card base material forming step), and each of the IC packages is mounted on the IC card base material (IC package mounting step) to form an IC card.

By the way, in the IC module forming step of forming the IC module on the film base material on which the above-mentioned pattern is formed, resin sealing is performed to protect the IC and the wires. In Europe and the like, an epoxy resin is used for resin encapsulation, and a method of dropping the epoxy resin to surround the IC portion is also used.
Since the shape of the C module is not constant, the positioning becomes unstable when the IC package is mounted in the recess of the IC card base material in the subsequent steps, especially the IC package mounting step described above. Will be incompletely fixed.

In view of the above points, the present applicant has found that IC
As a method of resin-sealing, a so-called transfer molding method using a mold for manufacturing a module is used.

[0009]

When using the mold for manufacturing the module, as shown in FIG. 11, in the lower mold 11 of the mold, in the hole 6 for feeding the film of the film substrate 1. A positioning pin 12 to be inserted is provided, and a recess 14 into which the positioning pin 12 is inserted is formed in the upper die 13 of the mold.

On the other hand, as mentioned above, the film substrate is
It is configured by bonding a copper foil on one side of the resin, and since the resin and the copper foil have different coefficients of thermal expansion, by preheating performed in advance during transfer molding,
As shown in the figure, the film base material is twisted. Therefore, when the film base material is placed on the lower mold, the film feed holes of the film base material may not be inserted into the pins of the lower mold. The upper mold descends in this state,
When the film base material is sandwiched between the upper and lower molds, when the film feeding hole of the film base material is not located on the pin of the lower mold, the pin other than the hole is often inadvertently used. When a hole is punched or the film feeding hole is slightly deviated from the pin, the hole may be torn by the pin.

The first aspect of the present invention is to solve the above-mentioned drawbacks.
Is the purpose of.

Next, the second object of the present application will be described. In the molding method using a module manufacturing mold, when forming an IC module, a runner for feeding a molten resin to the IC module is required. As this runner structure, for example, as shown in FIG. 12, a plurality of runners 22 from the main runner 21 are provided.
To form a plurality of IC modules 31 at a time, and further, as shown in FIG. 13, a main runner 21 is arranged at the center of the film base 1 in the longitudinal direction,
It is conceivable to form a pair of IC modules 31, 31 on the left and right in the longitudinal direction. By arranging in this way, the runner can be saved as much as possible.

On the other hand, the present applicant has studied the runner structure of the film base material, which is adapted to the continuous process, when the production line of the film substrate is made continuous. That is, in order to make the production line of the film substrate continuous, it is necessary to make the film substrate after the IC module formation have a continuous shape of, for example, 50 to 100 m, and to bend the film substrate by winding it on a reel or the like. In this case, since the runner on the film substrate is a cured resin after the substrate is formed, how to arrange the runner is questioned. That is,
Depending on the arrangement of the runners, it may hinder the bending of the film substrate.

Therefore, a second object of the present invention is to obtain a reasonable runner structure of a film base material when the film substrate is curved.

Next, the third object of the present application will be described. As described above, the mold molding method using the module manufacturing mold is provided with a predetermined runner structure. Then, in order to feed the molten resin to the IC module molding planned portion without excess or deficiency, the runner is formed smaller than the IC module. Further, after the IC module is formed, the film substrates having a predetermined length are stacked and prepared for the next step. FIG. 14 shows a state in which the film substrates 10 are laminated. As described above, the film substrate 10 has the IC module 31 on one side of the film substrate 1.
However, the copper foil 3 is provided on the other side, and when the film substrate 10 is laminated, the IC module 31 comes into contact with the copper foil 3, and as a result, the copper foil 3 is scratched and an appearance defect occurs, Sometimes it causes product defects.

A third object of the present invention is to obtain a structure which does not cause a defective appearance or a defective product even if film substrates are laminated.

Next, the fourth object of the present application will be described. As described above, the mold molding method using the module manufacturing mold is provided with a predetermined runner structure. Then, the film substrate on which the IC module is formed is transported by the transport device. In this case, the guide rail of the conveying device conveys while guiding the edge of the film substrate. On the other hand, the film substrate is to be separated from the external runner, but at that time, burrs often occur at the edge of the film substrate. If there is a burr on the edge of the film substrate, the burr may be caught on the guide rail of the transfer device during the transfer of the film substrate, causing a problem called so-called jamming to stop the transfer.

A fourth object of the present invention is to obtain a guide device for a film substrate that does not cause a situation such as a stop of conveyance even if there is a burr on the edge of the film substrate.

Next, the fifth object of the present application will be described. In the IC package mounting step of separating the IC package from the film substrate and mounting it in the recess of the IC card base material, when separating the IC package from the film substrate and mounting it in the recess of the IC card base material, the positioning of both is performed. There is a need to. As described above, the IC module is separated from the film substrate together with the film base material on which the IC module is placed, and this IC package is mounted in the recess of the IC card base material.
There are two types of positioning methods for this.

The first is, as shown in FIG. 15, the IC module 31 of the IC package 30 and the IC card substrate 4.
The first concave portion 41, which is the main concave portion among the concave portions of 0, is positioned, and the second portion is, as shown in FIG.
The film base 32 of the package 30 and the outer peripheral recess 42 of the recess of the IC card base 40 are used for positioning.

IC module 31 of IC package 30
And the first recessed portion 41 of the IC card base material 40 requires the accuracy of the IC module 31 when using a so-called gateless structure die, and as a result,
The mold structure for molding the module is complicated and expensive.

In the case of positioning the film base 32 of the IC package 30 and the outer peripheral recess 42 of the IC card base 40, one end of the outer peripheral recess 42 is used as a reference position for the film base 32. The one end portions are aligned with each other, and therefore, a clearance is required to align the one end portions of the film base material portion 32. That is, when the alignment is performed by the machine, the machine has a slight error and cannot be executed when the clearance is zero. Therefore, rather than adding a space more than the error of the machine, one end of the film base portion 32 is aligned with the outer peripheral concave portion 42 at the time of alignment.
The above-mentioned reference position is moved to match. The film base portion 32 of the IC package 30
However, it is not preferable that the IC package 30 be positioned by the outer peripheral recess 42 of the IC card substrate 40 because the IC package 30 is offset relative to the outer peripheral recess 42, and sometimes the reference position shifts to cause a problem in the positioning itself. is there.

Therefore, the present invention uses a relatively inexpensive and simple runner structure die without using an expensive and complicated gateless structure die, and has an IC card having a positioning structure with high positional accuracy. A fifth object is to obtain a device.

[0024]

Means for Solving the Problem and Its Action The present invention is
A film substrate forming process including a film substrate supplying process, a pattern forming process, and an IC module forming process, an IC card substrate forming process, and a recess of the IC card substrate by separating an IC package from the film substrate. In order to achieve the first object in an IC card manufacturing apparatus including an IC package mounting process for mounting on
A module manufacturing die for forming an IC module on a film substrate on which the pattern is formed, comprising: a die for feeding the film of the film substrate to a lower die of the die. A positioning pin to be inserted into the hole is provided, and a concave part into which the positioning pin is inserted, and a pressing member that is fitted in the concave part and fits with the positioning pin are provided in the upper die of the mold, and further, A first invention is a guide device for a film base material, in which an elastic member that constantly elastically urges the pressing member toward the lower mold is attached to the upper mold.

With this structure, the film base material is pressed by the pressing member before the film base material is clamped by the upper and lower molds. Is inserted and engaged with the hole. In this way, even if the film base material is twisted, the film base material is pressed by the pressing member and is sandwiched by the upper and lower molds in a state in which the posture is so corrected. It is possible to avoid the inconvenience that a portion other than the hole is accidentally drilled by the pin or the hole is torn by the pin.

A second invention is a film substrate supplying step,
A film substrate forming step including a pattern forming step and an IC module forming step, an IC card base material forming step, and an IC package mounting step of separating an IC package from the film board and mounting it in a recess of the IC card base material In the IC card manufacturing apparatus including the above, when forming an IC module using a module manufacturing die on the back surface of the film base material on which the pattern is formed, a runner for feeding molten resin is used as the film base. It is a runner structure of a film base material arranged in a direction orthogonal to the longitudinal direction of the material and at a position intersecting the IC module molding planned site.

With this structure, the runners remaining on the film base are accommodated within the width of the IC module, and when winding the film base or the film substrate, the film portion other than the IC module is curved. It will be possible. Therefore, when the film substrate after the IC module is formed is elongated, the film substrate can be easily wound.

A third invention is a film substrate supplying step,
A film substrate forming step including a pattern forming step and an IC module forming step, an IC card base material forming step, and an IC package mounting step of separating an IC package from the film board and mounting it in a recess of the IC card base material In the IC card manufacturing apparatus including the above, when forming an IC module using a module manufacturing die on the back surface of the film base material on which the pattern is formed, a runner for feeding molten resin is used as the film base. It is arranged at a position orthogonal to the longitudinal direction of the material and at a position intersecting with the IC module molding planned site, and further, protrusions having a height higher than that of the IC module molding section are formed on both sides of the runner. It is a runner structure of a film base material.

With this structure, when the film substrates are stacked, the protrusions provided on both sides of the runner come into contact with the lower edge of the upper film substrate. It is possible to avoid a situation where the copper foil is scratched by coming into contact with. Therefore, even if the film substrates are laminated, the appearance and the product are not defective.

A fourth invention is a film substrate supplying step,
A film substrate forming step including a pattern forming step and an IC module forming step, an IC card base material forming step, and an IC package mounting step of separating an IC package from the film board and mounting it in a recess of the IC card base material In the IC card manufacturing apparatus including the above, when forming an IC module using a module manufacturing die on the back surface of the film base material on which the pattern is formed, a runner for feeding molten resin is used as the film base. The film base material is arranged in a direction orthogonal to the longitudinal direction of the material and at a position intersecting with the IC module molding planned site, and further, a projection is formed on at least one of both sides of the runner. A guide for feeding is provided, and this guide is provided with a guide groove that engages with the protrusion of the runner. Lum is the substrate of the guide device.

With this structure, since the runner protrusions of the film substrate are guided to the guide grooves of the guide for feeding the film base material, even if the film substrate has burrs on its edges, It is possible to avoid such a problem that burrs are caught on the guide rails of the transfer device and jamming during the transfer of the film substrate, such as
Therefore, according to the present invention, the inconvenience that the transportation is stopped is prevented.

A fifth aspect of the present invention comprises a film substrate supplying step,
A film substrate forming step including a pattern forming step and an IC module forming step, an IC card base material forming step, and an IC package mounting step of separating an IC package from the film board and mounting it in a recess of the IC card base material In separating the IC package from the film substrate and mounting it in the recess of the IC card base, the separated IC package has an IC module and a height lower than that of the IC module. And a film base material portion, wherein the recessed portion of the IC card base material has a first recessed portion with which the IC module of the IC package engages, and the IC
It is an IC card device provided with a 2nd crevice with which the runner part of a package engages, and a 3rd crevice with which the above-mentioned film substrate part engages.

With this configuration, the IC module of the IC package and the first concave portion of the IC card base, the runner portion and the second concave portion of the IC package, and the film base portion and the third concave portion, respectively, are formed. Positioning is achieved by engagement. Therefore, it is possible to obtain an IC card device having a positioning structure with high positional accuracy, using a relatively inexpensive and simple runner structure die without using an expensive and complicated gateless structure die.

[0034]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the illustrated embodiments. In this embodiment, the same components as those described above are designated by the same reference numerals, and detailed description thereof will be omitted.

The present invention, as shown in FIG. 9, includes a film substrate forming step including a film base material supplying step, a pattern forming step, and an IC module forming step, and I.
C card base material forming process and IC from film substrate
A module manufacturing gold for forming an IC module on a film base material on which the pattern is formed in an IC card manufacturing apparatus including an IC package mounting process for separating a package and mounting the package in the recess of the IC card base material. It is provided on the mold.

According to the present invention, as shown in FIG. 1, a lower die 11 of a die is provided with a positioning pin 12 to be inserted into a hole 6 for feeding a film of a film substrate 1, and an upper die 13 of the die is provided with a positioning pin 12. Is provided with a concave portion 14 into which the positioning pin 12 is inserted, and a pressing member 15 which is removably mounted in the concave portion 14 and fits with the positioning pin 12. And upper mold 1
An elastic member 16 for elastically urging the pressing member 15 in the lower mold direction is attached to the member 3.

The holding member 15 has a hollow portion 15a into which the positioning pin 12 is swallowed, the upper portion of which is formed in a flange shape, and the holding plate 17 holds the flange portion. The elastic member 16 is, for example, a coil spring, and is mounted inside the recess 14.

In the state shown in FIG. 1, the film substrate 1
When the film base material 1 is placed on the lower mold 11 when the pin is twisted, the hole 6 near the portion bent downward is pin 1
2, the hole 6 in the upwardly curved portion is separated from the pin 12. Then, from this state, the upper mold 1
When 3 is lowered, in the case of FIG. 1, the central pressing member 15 presses the film base material 1 around the hole 6 fitted in the pin 12, and the left and right pressing members 15 are raised film base materials. The film base material is pressed against the lower mold 11 by making contact with the vicinity of the hole 6 of No. 1. In the case of the conventional type die not provided with the pressing member 15, the film base material 1 is instantly sandwiched when both the die and the film base material 1 come into contact with each other. When there is no match with the pin 12, there is no room to correct the position of the film base material 1, and the above-mentioned accidental punching or tearing of the hole may occur, but in the case of the present invention, both Since the pressing member 15 has an elastic contacting action before the film base material 1 is clamped by the mold, when the hole 6 does not coincide with the pin 12,
A time margin is provided for correcting the position of the film substrate 1, so that it is possible to avoid the above-described conventional situation of accidental punching or tearing of the hole.

FIG. 2 shows a runner structure of a film base material. That is, as shown in FIG. 9, a film substrate forming process including a film substrate supplying process, a pattern forming process, and an IC module forming process, an IC card substrate forming process, and an IC package separated from the film substrate. IC to be installed in the recess of the IC card substrate
In a IC card manufacturing apparatus including a package mounting process, a runner for feeding a molten resin to form an IC module 31 on a back surface of a film base material 1 on which the pattern is formed by using a module manufacturing die. 22 is arranged in a direction orthogonal to the longitudinal direction of the film substrate 1 and at a position intersecting with the IC module molding planned site.

With this structure, the runner 22 remaining on the film substrate 1 is accommodated within the width of the IC module 31, and when the film substrate or film substrate is wound, the film other than the IC module is wound. The part can be bent. Therefore, when the film substrate after the IC module is formed is elongated, the film substrate can be easily wound.

FIGS. 3 and 4 are views showing a film substrate, and like the previous example, a film substrate forming process including a film substrate supplying process, a pattern forming process and an IC module forming process, and an IC card substrate. Material forming process, and
The present invention relates to an IC card manufacturing apparatus including an IC package mounting process in which an IC package is separated from a film substrate and mounted in a recess of an IC card base material. In this embodiment, an IC module 31 is formed on the back surface of the film substrate 1 on which the pattern 4 is formed by using a module manufacturing die.
Runner 22 that feeds molten resin when forming
In a direction orthogonal to the longitudinal direction of the film substrate 1, and
The IC module 31 is arranged at a position intersecting with the IC module molding planned site, and further, projections 23, 23 having a height higher than that of the IC module 31 are formed on both sides of the runner 22.

With this structure, as shown in FIG. 5, when the film substrates 10 and 10 are stacked, the protrusions 23 and 23 provided on both sides of the runner 22 form the lower surface of the upper film substrate 10. Since it comes into contact with the edge, it is possible to avoid the situation where the IC module 31 comes into contact with the copper foil 3 and the copper foil 3 is damaged. Therefore, even if the film substrates are laminated, the appearance and the product are not defective.

FIG. 6 shows a guide for feeding the film base material,
It is a figure which shows the film base material in this guide, and similarly to the previous example, a film base material supply process, a pattern formation process, I
A film substrate forming step including a C module forming step, an IC card base material forming step, and an IC package mounting step of separating an IC package from the film board and mounting the IC package in a recess of the IC card base material.
This is in a C card manufacturing device. In the same manner as in the previous example, when forming the IC module 31 using the module manufacturing die on the back surface of the film base material 1 on which the pattern 4 is formed, the runner 22 for feeding the molten resin is attached to the back surface of the film base material 1. The direction perpendicular to the longitudinal direction and
The C module is arranged at a position that intersects with the planned molding site, and further, a projection 23 is formed on at least one of both sides of the runner 22. In this embodiment, the protrusion is provided on the runner 2
It is formed on both sides of 2.

25 is a guide for feeding the film substrate,
The guide 25 is provided with a guide groove 26 that engages with the protrusion 23 of the runner 22. In the embodiment, the guide grooves 26 are formed due to the protrusions 23 formed on the left and right.
Also, two are provided corresponding to this. Since the burr on the edge of the film substrate is usually formed on one edge, the protrusion 23 formed on the edge side with the burr, in other words, on at least one of both sides of the runner 22. Also, one guide groove corresponding to the protrusion may be provided.

With this structure, since the protrusion of the runner of the film substrate is guided to the guide groove of the guide for feeding the film substrate, even if there is a burr on the edge of the film substrate, It is possible to avoid such a problem that burrs are caught on the guide rails of the transfer device and jamming during the transfer of the film substrate, such as
Therefore, according to the present invention, the inconvenience that the transportation is stopped is prevented.

7 and 8 are views showing the recess of the IC card base and the IC package separated from the film substrate. The film base supply step, the pattern formation step, and the IC module formation step are the same as in the previous example. A film substrate forming step, an IC card base material forming step, and
The present invention relates to an IC card manufacturing apparatus including an IC package mounting process in which an IC package is separated from a film substrate and mounted in a recess of an IC card base material. Then, the IC package 30 is separated from the film substrate 10 and mounted in the recess 7 of the IC card substrate 1.

When the IC package 30 is mounted in the recess 7, the separated IC package 30 is
A module 31, a runner portion 22a having a height lower than that of the IC module, and a film base portion 1a are provided. On the other hand, the recess 43 of the IC card substrate 40 includes a first recess 44 with which the IC module 31 of the IC package 30 engages, a second recess 45 with which the runner portion 22a of the IC package 30 engages, and the film base. The third concave portion 46 with which the material portion 1a is engaged is provided.

The IC package 30 including the IC module 31, the runner portion 22a having a height lower than that of the IC module, and the film base material portion 1a is the film base material shown in FIGS. 1 to the film substrate 10, and is obtained by separating them.

With this structure, the IC module of the IC package and the first concave portion of the IC card base, the runner portion and the second concave portion of the IC package, and the film base portion and the third concave portion, respectively, are formed. Positioning is achieved by engagement. Therefore, it is possible to obtain an IC card device having a positioning structure with high positional accuracy, using a relatively inexpensive and simple runner structure die without using an expensive and complicated gateless structure die.

[0050]

According to the first aspect of the invention configured as described above, the film base material is provided before being sandwiched between the upper and lower molds.
Since the film base material is pressed by the pressing member, the positioning pin and the film feeding hole are inserted and engaged by the pressing member. In this way, even if the film base material is warped or twisted, the film base material is pressed by the pressing member and is sandwiched by the upper and lower molds in a state in which the posture is corrected, It is possible to avoid such an inconvenience that the pin accidentally drills a portion other than the hole and the hole is torn by the pin.

In a second aspect of the present invention, in the IC card manufacturing apparatus having the above-mentioned structure, a molten resin is fed to the back surface of the film base on which the pattern is formed, when the IC module is formed using the module manufacturing die. The runner to be supplied is a runner structure of a film base material arranged in a direction orthogonal to the longitudinal direction of the film base material and at a position intersecting with the IC module molding planned site, and the runner remaining on the film base material is Since it fits within the width of the IC module, the film portion other than the IC module can be curved when the film base material or the film substrate is wound. Therefore, when the film substrate after the IC module is formed is elongated, the film substrate can be easily wound.

In a third aspect of the present invention, in the IC card manufacturing apparatus having the above-mentioned structure, a molten resin is sent to the back surface of the film base on which the pattern is formed by using a mold for manufacturing a module to form an IC module. The runner to be supplied is arranged in a direction orthogonal to the longitudinal direction of the film base material and at a position intersecting with the IC module molding planned site, and further, on both sides of the runner, higher than the IC module molding section. It is a runner structure of a film base material having a high protrusion formed, and when the film substrates are laminated, the protrusions provided on both sides of the runner come into contact with the lower edge of the upper film substrate. ,
It is possible to avoid a situation where the IC module comes into contact with the copper foil and the copper foil is damaged. Therefore, even if the film substrates are laminated, the appearance and the product are not defective.

In a fourth aspect of the present invention, in the IC card manufacturing apparatus having the above-mentioned structure, a molten resin is sent to the back surface of the film base on which the pattern is formed when forming an IC module using a module manufacturing die. A runner to be supplied is arranged in a direction orthogonal to the longitudinal direction of the film base material and at a position intersecting with the IC module molding planned site, and a projection is formed on at least one of both side parts of the runner. In addition, a guide for feeding the film base material is provided, and this guide is a guide device for a film substrate having a guide groove that engages with the protrusion of the runner, and the film substrate is Since the protrusion is guided in the guide groove of the guide for feeding the film substrate, even if there is a burr on the edge of the film substrate, the film substrate of Bali feeding developing it is possible to avoid the inconvenience resulting jamming caught on the guide rails of the transport device, thus, according to the present invention,
The inconvenience that the transportation is stopped is prevented.

According to a fifth aspect of the invention, in the IC card manufacturing apparatus having the above structure, when the IC package is separated from the film substrate and mounted in the recess of the IC card base, the separated IC package is an IC module. The I
The IC card substrate includes a runner portion having a height lower than that of the C module and a film substrate portion,
An IC card including a first recess for engaging the IC module of the IC package, a second recess for engaging the runner portion of the IC package, and a third recess for engaging the film base portion. A device, the IC module of the IC package, the first recess of the IC card base, and the IC
The package is positioned by engaging the runner portion and the second concave portion of the package and the film base portion and the third concave portion. Therefore, it is possible to obtain an IC card device having a positioning structure with high positional accuracy, using a relatively inexpensive and simple runner structure die without using an expensive and complicated gateless structure die.

Thus, according to the invention, this type of I
In the C card manufacturing apparatus, there are advantages that the appearance and the product are not defective, the defects are less likely to occur in the transportation process, and the IC package is accurately mounted on the IC card base material. Is.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing a mold for manufacturing a module according to the present invention.

FIG. 2 is a plan view showing a film substrate on which an IC module is formed according to the present invention.

FIG. 3 is a plan view showing a film substrate on which an IC module is formed according to the present invention.

FIG. 4 is a main part perspective view showing a film base material on which an IC module is formed according to the present invention.

FIG. 5 is a vertical cross-sectional view showing a state in which film substrates are laminated.

FIG. 6 is a vertical sectional view showing a guide for feeding a film base material and a film base material in the guide.

FIG. 7 is a perspective view showing a recess of an IC card substrate and an IC package separated from a film substrate.

FIG. 8 is a vertical cross-sectional view showing the recess of the IC card base and the IC package separated from the film substrate.

FIG. 9 is a diagram showing a process of manufacturing an IC card.

FIG. 10 is a plan view showing a film base material.

FIG. 11 is a vertical sectional view showing a mold for manufacturing a module.

FIG. 12 is a plan view showing a film substrate on which an IC module is formed.

FIG. 13 is a plan view showing a film substrate on which an IC module is formed.

FIG. 14 is a vertical cross-sectional view showing a state in which film substrates are laminated.

FIG. 15 is a vertical cross-sectional view showing the recess of the IC card base and the IC package separated from the film substrate.

FIG. 16 is a vertical cross-sectional view showing the recess of the IC card base and the IC package separated from the film substrate.

[Explanation of symbols]

 1 Film Base Material 3 Copper Foil 4 Pattern 7 Recess 10 Film Substrate 11 Lower Mold 12 Pins 13 Upper Mold 14 Recess 15 Presser Member 16 Elastic Material 22 Runner 23 Projection 30 IC Package 31 IC Module 32 Film Base 40 IC Card Base Material 43 Recessed portion 44 First recessed portion 45 Second recessed portion 46 Third recessed portion

Claims (5)

[Claims] 1. A film substrate forming step comprising a film base material supplying step, a pattern forming step, and an IC module forming step, an IC card base material forming step, and
In an IC card manufacturing apparatus including an IC package mounting process of separating an IC package from a film substrate and mounting it in a recess of an IC card base, an IC module is formed on the film base on which the pattern is formed. What is provided in a mold for manufacturing a module, the lower mold of the mold is provided with a positioning pin to be inserted into the hole for film feeding of the film base material, and the upper mold of the mold, A concave portion into which the positioning pin is inserted and a pressing member that is fitted in the concave portion and fits into the positioning pin are provided. Further, the upper mold always elastically biases the pressing member in the lower mold direction. A guide device for a film base material, which is equipped with an elastic material. 2. A film substrate forming step comprising a film base material supplying step, a pattern forming step, and an IC module forming step, an IC card base material forming step, and
In an IC card manufacturing apparatus including an IC package mounting process of separating an IC package from a film substrate and mounting it in a recess of an IC card base, a mold for manufacturing a module is provided on a back surface of the film base on which the pattern is formed. In forming an IC module by using, a runner for feeding a molten resin is arranged in a position orthogonal to the longitudinal direction of the film base material and at a position intersecting the IC module molding planned site. A film-based runner structure. 3. A film substrate forming step including a film base material supplying step, a pattern forming step, and an IC module forming step, an IC card base material forming step, and
In an IC card manufacturing apparatus including an IC package mounting process of separating an IC package from a film substrate and mounting it in a recess of an IC card base, a mold for manufacturing a module is provided on a back surface of the film base on which the pattern is formed. In forming an IC module by using, a runner for feeding a molten resin is arranged at a position orthogonal to the longitudinal direction of the film base material and at a position intersecting the IC module molding planned site. A runner structure of a film base material, wherein protrusions having a height higher than that of the IC module molding portion are formed on both sides of the runner. 4. A film substrate forming step including a film base material supplying step, a pattern forming step, and an IC module forming step, an IC card base material forming step, and
In an IC card manufacturing apparatus including an IC package mounting process of separating an IC package from a film substrate and mounting it in a recess of an IC card base, a mold for manufacturing a module is provided on a back surface of the film base on which the pattern is formed. In forming an IC module by using, a runner for feeding a molten resin is arranged at a position orthogonal to the longitudinal direction of the film base material and at a position intersecting the IC module molding planned site. A protrusion is formed on at least one of both sides of the runner. In addition, a guide for feeding the film base material is provided, and this guide is provided with a guide groove that engages with the protrusion of the runner. A film substrate guide device characterized by the above. 5. A film substrate forming step including a film base material supplying step, a pattern forming step, and an IC module forming step, an IC card base material forming step, and
In an IC card manufacturing apparatus comprising an IC package mounting process in which an IC package is separated from a film substrate and mounted in a recess of an IC card base, the IC package is separated from the film substrate and mounted in a recess of the IC card base. In doing so, the separated IC package includes an IC module, a runner portion having a height lower than that of the IC module,
A film base material portion, wherein the recessed portion of the IC card base material includes a first recessed portion with which the IC module of the IC package engages, a second recessed portion with which the runner portion of the IC package engages, An IC card device, comprising: a third recess with which the film base member is engaged.