JP3372481B2 - Positioning apparatus and positioning method for metal sheet processing equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positioning apparatus and a positioning method for a metal thin plate processing apparatus that processes a metal thin plate such as a resin-molded lead frame of an LSI or the like with an upper die and a lower die.

[0002]

2. Description of the Related Art As a processing device using a thin metal plate, for example, a package type semiconductor device in which a semiconductor is resin-molded is provided with an upper die and a lower die after a semiconductor element mounted on a lead frame is molded with resin. The tie bar is pressed by a lead frame processing device to trim the tie bar, and then the lead frame is conveyed to form the external lead into a desired shape in the next step (for example, Japanese Laid-Open Patent Publication No.
(See Japanese Patent No. 312315/1993).

Positioning of the lead frame at the time of trimming and forming is performed by the feed pin of the transfer arm and the positioning pin provided on the mold. The positioning pin of the mold is inserted into the positioning hole of the lead frame. In doing so, the feed pin of the transfer arm is previously inserted into the positioning hole of the lead frame.

[0004]

However, when the positioning pin provided on the mold is inserted into the positioning hole of the lead frame, the positional machining accuracy of the mold and the apparatus is poor, and the feed pin of the transfer arm and the positioning of the mold are positioned. Due to improper clearance between the pin and the thin metal plate, the positioning pin and the positioning hole do not completely match, and the feed pin of the transfer arm is inserted and positioned in the positioning hole of the lead frame. Sometimes, the positioning hole of the lead frame was deformed. If the positioning holes of the lead frame are deformed, the positioning accuracy in the next process deteriorates, and as a result, trimming of the tie bar and lead forming cannot be performed with high accuracy.

According to the present invention, in the positioning of a metal thin plate of a metal thin plate processing apparatus for processing a metal thin plate with an upper die and a lower die, the metal thin plate machining can be performed without deforming the positioning holes of the metal thin plate. A positioning device and a positioning method for a device are provided.

[0006]

A positioning device of a metal thin plate processing apparatus, which includes a mold including a lower mold and an upper mold according to the present invention and processes a metal thin plate by elevating and lowering the mold, uses a positioning pin of the mold. Before the positioning of the thin metal plate, the mold is provided with a timing pin for releasing the positioning of the feed pin of the transport arm for transporting the thin metal plate.

Further, according to the positioning method of the metal thin plate processing apparatus of the present invention, which is provided with a mold including a lower mold and an upper mold, and processes a metal thin plate by raising and lowering the mold, the metal thin plate is conveyed by raising and lowering the mold. It is characterized in that the positioning of the feed pin of the transfer arm is released, and the positioning of the thin metal plate is performed by the positioning pin in the mold in accordance with the release.

[0008]

1 is a schematic plan view showing an example of a lead frame processing apparatus equipped with a metal thin plate positioning apparatus of the present invention, and FIG. 2 is a time series example of the operation of the lead frame positioning apparatus of the present invention. It is a side sectional view shown in.

1 and 2, in the lead frame processing apparatus, a guide rail 2 for supporting the lead frame 1 is attached to the upper surface of an adapter block 4 with a lower mold 3 under the guide rail 2 interposed therebetween. The adapter block 4 is biased upward and is vertically movable. The guide rail 2 is provided with a long hole 6 vertically extending at a position corresponding to the positioning hole 5 of the lead frame 1 and having a length for feeding the lead frame 1 by 1 pitch.

The transfer arm 7 arranged above the guide rail 2 is provided with a feed pin 8 corresponding to the long hole 6 in a state of protruding straight downward from the lower surface side of the transfer arm 7. The feed pin 8 of the transfer arm 7 is inserted into the positioning hole 5 of the lead frame 1 and moved along the long hole 6 by the movement of the transfer arm 7, so that the lead frame 1 can be fed by 1 pitch.

A positioning pin 11 which is arranged facing the lower mold 3 and moves up and down is provided with a positioning pin 11 which goes in and out of a through hole 10 provided in the guide rail 2 corresponding to the positioning hole 5 of the lead frame 1. Has been. The upper mold 9 is provided with a timing pin 12 that projects to the upper surface side of the adapter block 4. The timing pins 12 are arranged on the input side and the output side of the lead frame 1, respectively.

FIG. 3 is an enlarged view showing the operation of the positioning pin and the feed pin of the positioning device shown in FIG. 2 in time series. Regarding the positioning operation of the lead frame in the lead processing device with reference to FIGS. explain.

With the feed pin 8 inserted into the positioning hole 5 of the lead frame 1, the lead frame 1 is fed to the predetermined position by one pitch by the movement of the carrying arm 7 (FIG. 2A). See FIG. 3 (a).

When the lead frame 1 is conveyed to a predetermined position, the upper die 9 is lowered and the timing pin 12 and the positioning pin 11 are lowered. The timing pin 12 comes into contact with the upper surface of the adapter block 4 when it descends, and in this state, the sharp tip of the positioning pin 11 slightly enters the positioning hole 5 of the lead frame 1 (FIG. 2B).
See FIG. 3B).

When the timing pin 12 is continuously lowered, the timing pin 12 pushes down the vertically movable adapter block 4, the guide rail 2 is also lowered accordingly, and the feed pin 8 is positioned in the positioning hole 5 of the lead frame 1.
Completely out of (Fig. 2 (c) and (d), Fig. 3 (c)
And (d)).

When the timing pin 12 is further lowered, the positioning pin 11 is completely inserted into the positioning hole 5 of the lead frame 1 (see FIGS. 2 (e) and 3 (e)).
After the positioning is performed in this manner, the lead frame 1 is processed by the lower mold and the upper mold by lowering the upper mold 9.

As described above, since the feed pin 8 is extracted from the positioning hole 5 of the lead frame 1 and then the positioning pin 11 is inserted into the positioning hole 5 of the lead frame 1 for positioning, the positioning accuracy of the mold and the apparatus is poor. The positional deviation of the lead frame is absorbed (corrected), and the deformation of the lead frame 1 can be prevented. As a result, smooth positioning is performed, so that the upper die does not bite into the lead in tie bar cutting due to trimming, and a desired shape is accurately formed by forming. As a result, the lead shape of the final product can be improved, so that it is possible to prevent processing defects due to positioning errors.

In the above embodiment, the positioning of the lead frame processing apparatus has been described. However, the present invention is not limited to the lead frame processing apparatus, and includes a die including a lower die and an upper die. It can also be applied to a positioning device of a metal thin plate processing device that processes a metal thin plate by elevating and lowering.

[0019]

According to the present invention, since one pin is inserted by the timing pin when the other pin is disengaged, both positioning pins are not positioned at the same time, and therefore the positioning hole is not deformed.

Further, since the positioning pin of the transfer arm is released by the timing pin provided on the upper die, the positioning pin of the transfer arm can be released at a proper timing with a simple structure.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing an example of a lead frame processing apparatus provided with a metal thin plate positioning apparatus of the present invention.

FIG. 2 is a side sectional view showing an operation example of the lead frame positioning device according to the present invention in time series.

3 is an enlarged view showing the operation of a positioning pin and a feed pin of the positioning device shown in FIG. 2 in time series.

[Explanation of symbols]

1: Lead frame 2: Guide rail 3: Lower mold 4: Adapter block 5: Positioning hole 6: Long hole 7: Transfer arm 8: Feed pin 9: Upper mold 10: Through hole 11: Positioning pin 12: Timing pin

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Claims (2)

(57) [Claims] 1. A positioning device for a metal thin plate processing apparatus, comprising a mold comprising a lower mold and an upper mold, for processing a metal thin plate by raising and lowering the mold, before positioning the metal thin plate by a positioning pin of the mold. A metal thin plate positioning device, wherein a timing pin for releasing positioning of a feed pin of a transfer arm for transferring a metal thin plate is provided on a mold. 2. A method of positioning a metal thin plate processing apparatus, comprising a mold including a lower mold and an upper mold, for processing a metal thin plate by raising and lowering the mold, wherein the metal thin plate is conveyed by raising and lowering the mold. A method for positioning a thin metal plate, characterized in that the positioning of the feed pin of the arm is released and the thin metal plate is positioned by the positioning pin in the mold in accordance with the release.