JPH0936291A - Method and apparatus for cutting tie bar - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively avoid the biting of a lead or the deviation of the lead in a tie bar cutting step by a simple structure in the manufacture of a resin- package type electronic component using a lead frame. SOLUTION: The method for cutting a tie bar comprises the steps of punching to remove the unnecessary part of the bar 3 for coupling each lead 4 in a frame F for manufacturing an electronic component formed with a resin package 5. Before the cutting surface 4 of a tie bar cutting punch 15 is brought into contact with the surface of the manufacturing frame, the protrusion 16b integrally provided with the punch 16 is connected by the bar to be removed to protrude between the adjacent leads 4.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a tie bar cutting method and a device for manufacturing a resin package type electronic component.

[0002]

2. Description of the Related Art For resin package type electronic parts such as IC and LSI, a manufacturing frame called a lead frame is used, and a chip bonding process, a wire bonding process, a resin molding process, a tie bar cutting process, a marking process, a lead cutting forming process. It is manufactured through processes.

FIG. 9 shows an example of a lead frame F for manufacturing an IC. This lead frame F is
It is formed by subjecting a thin metal plate to a punching press, and is an island supported by support leads 2a so as to bridge the left and right side frame parts 1, 1 and the left and right side frames 1, 1. 2, a tie bar 3 formed so as to bridge the left and right side frame portions 1 and 1 on both sides of the island 2 in the longitudinal direction of the lead frame, and formed so as to be connected to the tie bar 3, and the inside of the tip The leads are provided with a plurality of lead portions 4 and 4 reaching the vicinity of the island 2,
The area indicated by reference character A in FIG. 9 is defined as one unit and is formed at equal pitches in the longitudinal direction of the lead frame F. The reason why the plurality of lead portions 4, 4 are connected by the tie bar 3 in the lead frame state is that each lead portion 4,
This is because the spacing between the lead portions 4 and 4 is defined until the resin 4 is attached to the resin package portion 5 described later. Further, the side frame portions 1 and 1 are engaged with a conveying means such as a feed sprocket or the like to feed holes 6 for feeding the lead frame F in the longitudinal direction, or with positioning pins to engage the lead frame F with the lead frame F. Positioning holes 7 for positioning are formed. The feed hole and the positioning hole may be commonly used.

The above-mentioned process steps are performed while the lead frame F is fed one pitch at a time. First, as shown in FIG. 10, a predetermined semiconductor chip 8 is bonded onto the island 2 of the lead frame F.
Next, as shown in FIG. 11, the pads of the semiconductor chip 8 and the tips of the lead portions are connected by the bonding wires 9. Next, as shown in FIG. 12, the semiconductor chip 8 or the bonding wire is sealed with the resin mold package 5. Then, as shown in FIG. 13, the portion of the tie bar 3 located between the lead portions 4 and 4 (the area indicated by the phantom line in FIG. 12) is removed by punching and is connected by the tie bar 3. The respective lead portions 4 and 4 are separated. This process is called a tie bar cutting process. Next, the resin package portion 5 or all the portions where the lead portions are connected to the frame are separated from the frame F. This process is called a lead cutting process. Then, if necessary, a lead forming step is performed so as to obtain a lead form such as a surface mount type or an insert type according to the form of mounting on the circuit board. Of course, in addition to the above steps, a necessary inspection step or a marking step for printing a maker name, a product number, a lot number, or the like on the resin package may be performed.

As described above, the tie bar cutting step is performed by the punching press. FIG. 14 shows an outline of a conventional tie bar cutting process device 10. Code 12
Shows a tie bar cut die formed on the lower mold 11. Reference numeral 13 denotes a stripper block which is supported by an upper mold 14 which moves up and down so as to be movable by a certain distance in the vertical direction and is always urged downward. On the stripper block 13, a pilot pin 15 that engages with the positioning hole 7 of the lead frame F and positions the lead frame F with respect to the mold is formed so as to project downward.
The tip of the pilot pin 15 has a tapered taper portion 15a.
Is provided. Reference numeral 16 indicates a tie bar cut punch attached to the upper mold 14. The sectional shape and arrangement of the tie bar cut punch 16 correspond to the removal region shown by the phantom line in FIG.

As shown in FIG. 14, while the upper mold 14 is moving upward, the lead frame F is advanced by one pitch by a not-shown transport mechanism and set at a predetermined position on the lower mold 12. Next, as shown in FIG. 15, the upper mold 14 moves downward. At that time, first, the pilot pin 15 of the stripper block 13 is inserted into and engaged with the positioning hole 7 of the lead frame F and the mold 11 is moved. , 14, and by extension, the lead frame F is positioned with respect to the tie bar cut die 12 and the tie bar cut punch 16, and the positioned lead frame F is sandwiched between the lower surface of the stripper block 13 and the upper surface of the tie bar cut die 12. Next, as shown in FIG. 16, the upper die 14 is further moved downward, and the tie bar cutting punch 16 and the tie bar cutting die 12 cooperate with each other to punch and remove the unnecessary portion of the tie bar 3 as described above.

[0007]

In the conventional tie bar cutting device described above, the lead frame is positioned only by engaging the pilot pin 15 projecting from the stripper block 13 with the positioning hole 7 of the side frame portion. Therefore, the accuracy of positioning the lead frame F cannot be increased to a certain level or higher, and the position punched by the tie bar cut punch 16 and the die 12 deviates from the position to be punched originally, as shown in FIG. There was a case where so-called lead cutting or lead leaning occurred. Such lead biting or lead lean gives a bad result to the lead coplanarity and is not preferable.

As described above, the problem of lead biting or lead deviation becomes more serious as the lead pitch becomes finer.

The present invention has been devised under the circumstances as described above, and in manufacturing a resin package type electronic component using a lead frame, the lead biting in the tie bar cutting process is performed with a simple structure. It is an object of the present invention to provide a tie bar cutting method and apparatus that effectively avoids the occurrence of lead deviation.

[0010]

DISCLOSURE OF THE INVENTION In order to solve the above problems, the present invention employs the following technical means.

According to the first aspect of the present invention, a new tie bar cutting method is provided, and this tie bar cutting method is for a tie bar for connecting the lead parts in the electronic component manufacturing frame in which the resin package part is formed. A tie bar cutting method for punching and removing an unnecessary portion by the cooperation of a tie bar cutting die and a tie bar cutting punch, wherein the tie bar cutting is performed before the cutting action surface of the tie bar cutting punch contacts the surface of the manufacturing frame. It is characterized in that the convex portion integrally provided on the punch is connected by a tie bar to be removed so as to protrude between the adjacent lead portions.

According to this structure, since the ridge bar cut punch is integrally provided on the tie bar cut punch, the tie bar cut punch in the manufacturing frame is immediately attached to the tie bar cut punch immediately before the tie bar cut punch punches out an unnecessary portion of the tie bar. It is possible to perform positioning with respect to the tie bar cut punch at an extremely close position. Therefore, the tie bar cut punch can accurately remove the portion of the manufacturing frame to be punched out, and the possibility of lead biting or lead deviation can be dramatically reduced. Such an advantage can be compared with the conventional tie bar cutting method in which the manufacturing frame is positioned by engaging the pilot pin with the positioning hole of the side frame portion which is two-dimensionally separated from the tie bar cutting punch. If so, it will be easily understood. Such a point is also particularly advantageous in manufacturing an electronic component having a fine pitch lead portion. In addition, the tie bar cutting punch of the conventional tie bar cutting device can be implemented at a very low cost without adding a special member, an operating mechanism or the like only by forming a predetermined convex portion on the tie bar cutting punch.

In the tie bar cutting method according to the preferred embodiment, the unnecessary portion of the tie bar connecting the lead parts in the electronic component manufacturing frame in which the resin package part is formed is formed by the cooperation of the tie bar cutting die and the tie bar cutting punch. A tie bar cutting method of punching and removing by action, comprising: first positioning by engaging a pilot pin attached to a movable member provided with the tie bar cutting punch and a positioning hole provided in the manufacturing frame; and the tie bar cutting punch. By contacting the protrusions integrally formed on the tie bar cutting punch with the tie bar to be removed and causing the protrusions to be inserted between the adjacent lead portions before the cutting action surface of the tie bar contacts the surface of the manufacturing frame. Is positioned.

With this configuration, the pilot pin is positioned in the positioning hole of the manufacturing frame before or at the same time as the second positioning by the protrusion provided on the tie bar cut punch protruding between the adjacent lead portions. Since the first positioning is performed by plunging into, the second positioning can be performed more smoothly.

According to the second aspect of the present invention, a new tie bar cutting device is provided, and the tie bar cutting device is a tie bar connecting the lead parts in the electronic component manufacturing frame in which the resin package part is formed. A tie bar cutting device for punching out and removing an unnecessary portion, the tie bar cutting die formed on a supporting member on which the manufacturing frame is set, and provided on a movable member that moves close to and away from the supporting member, A tie bar cut punch that cooperates with the tie bar cut die to punch out unnecessary portions of the tie bar, and is integrally formed with the tie bar cut punch. Between adjacent leads connected by tie bars that should be removed before contacting the frame A positioning protrusion for positioning the manufacturing frame for tie bar cutting punch by entering,
It is characterized by having.

It is obvious that the tie bar cutting device according to the second aspect can obtain the same advantages as the lead cutting method according to the first aspect of the present invention.

A tie bar cutting device according to a preferred embodiment is a tie bar cutting device for punching out and removing an unnecessary part of a tie bar connecting each lead part in a frame for electronic parts in which a resin package part is formed, The tie bar cut die formed on the support member on which the manufacturing frame is set, and the movable member that moves close to and away from the support member are provided, and cooperate with the tie bar cut die to remove unnecessary portions of the tie bar. Provided on the stripper block, a tie bar cut punch that performs punching operation, a stripper block that is relatively movable in the moving direction of the movable member with respect to the movable member, and is elastically biased toward the support member. Position of the manufacturing frame by inserting and engaging in the positioning hole of the manufacturing frame. And a lead pin that is integrally formed with the tie bar cut punch and that is connected with the tie bar that is to be removed before the cutting action surface contacts the manufacturing frame when the tie bar cut punch is operated. And a positioning projection for positioning the manufacturing frame with respect to the tie bar cut punch by penetrating between the parts.

With this configuration as well, the pilot pin is attached to the manufacturing frame before or at the same time as the second positioning by the protrusion provided on the tie bar cut punch protruding between the adjacent lead portions as described above. Since the first positioning is performed by plunging into the positioning hole,
The second positioning can be performed more smoothly,
The same advantages as described above are obtained.

In the tie bar cutting device according to a preferred embodiment, the pilot pin also includes a positioning action portion extending with a constant outer diameter and a fixed length, and a tapered taper portion at the tip of the positioning action portion. When the punching operation is performed, the pilot pin is projected into the positioning hole of the manufacturing frame up to the positioning action portion, and then the positioning protrusion of the tie bar cut punch is projected between the adjacent lead portions. ing.

With this configuration, even if the set manufacturing frame is largely deviated from the predetermined position, as long as the tip of the tapered portion of the pilot pin can penetrate into the positioning hole of the manufacturing frame, the manufacturing by the pilot pin is performed. Since the positioning of the manufacturing frame is properly performed, there is no problem even if the manufacturing frame is roughly set. This makes it possible to simplify the transport mechanism of the manufacturing frame, and enables high-speed operation of the manufacturing frame set or the tie bar cutting device, which simplifies the tie bar cutting device and improves the efficiency of electronic component manufacturing. It means that it can be realized. In addition, since the second positioning is performed by the positioning protrusion of the tie bar cut punch after the first positioning is performed by the pilot pin, the accuracy of the second positioning is increased and more accurate positioning is performed. It becomes possible.
As a result, it is possible to completely eliminate the lead cutting or the lead deviation.

Further, in the lead cutting device according to the preferred embodiment, the positioning convex portion is tapered toward the tip.

In this way, even if there is a plane deviation of the portion to be tie-bar cut with respect to the tie-bar cutting punch even by the first positioning, the above-mentioned convex portion causes no problem between adjacent lead portions. It becomes possible to perform the second positioning by rushing in to, and it is possible to enjoy the advantages of the present invention described above to a higher degree.

Other features and advantages of the present invention will become more apparent by the following description of preferred embodiments with reference to the accompanying drawings.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described below with reference to FIGS. 1 to 8. In these figures, the conventional tie bar cutting apparatus shown in FIGS. The same reference numerals are given to the same or similar members or portions as. Further, in the following description, the lead frame F shown in FIGS.
The tie bar cut shall be performed.

FIG. 1 schematically shows the structure of an example of a tie bar cutting device 10 according to the present invention. This tie bar cutting device 10 basically punches and removes unnecessary parts of the tie bar 3 in the lead frame F by the cooperation of a tie bar cutting die 12 and a tie bar cutting punch 16 which move relative to each other in the vertical direction. is there.

In the tie bar cutting device 10 shown in the figure, the tie bar cutting die 12 is connected to the lead frame F.
Is provided in the lower mold mechanism 11 as a support member on which is set. When the tie bar cut of the lead frame F shown in FIG. 12 is performed, the region B surrounded by an imaginary line in FIG. 12 or 8 is punched out. In this case, the tie bar cut die 12 is The support surface 12a supporting the lower surface has holes 12 corresponding to the respective areas B.
b is formed.

On the other hand, the tie bar cut punch 16 is
It is attached to the upper mold mechanism 14 as a movable member which is vertically driven relative to the lower mold mechanism 11 by a hydraulic actuator (not shown) or the like. The upper and lower mold mechanisms 11 and 14 can move relative to each other only in the vertical direction, and the relative movement in the horizontal direction is strictly regulated.
Therefore, as long as the upper and lower mold mechanisms 11 and 14 operate normally, no positional deviation occurs in the horizontal direction between them. The tie bar cut punch 16 cooperates so as to fit into each hole 12b of the tie bar cut die 12. Therefore, a plurality of tie bar cut punches 16 having a sectional shape and a planar arrangement corresponding to the planar shape of each area B shown in FIG. 8 are provided in the upper mold mechanism in a downward protruding shape.

In the present invention, the plurality of tie bar cut punches 16 are provided on the lower surface cutting action surface 16 thereof.
A positioning protrusion 16b is provided that protrudes further downward than a. The positioning convex portion 16b is formed so as to avoid the tie bar 3 to be cut and project into the gap C between the lead portions 4 and 4 which are connected by the tie bar 3 and are adjacent to each other. Then, the positioning protrusion 16b
As shown in FIG. 6 or FIG.
4 is tapered toward the tip. The positioning protrusion may be provided on all of the plurality of tie bar cut punches 16 or a part thereof.

A stripper block 13 is attached to the upper die mechanism 14 so as to be movable relative to the upper die mechanism 14 by a predetermined distance while being accurately guided in the vertical direction. Always biased downward. The stripper block 13 is formed with a pressing surface 13a for elastically sandwiching the lead frame F between the stripper block 13 and the supporting surface 12a of the tie bar cutting die 12, and at the side frame portion of the lead frame F to be set. A pilot pin 15 is formed so as to project downward so as to be inserted into and engaged with the formed positioning hole 7. As shown in FIG. 1, the pilot pin 15 includes a positioning action portion 15b having the same outer diameter and extending for a certain length, and a tapered portion 1 tapered at the tip of the positioning action portion.
And 5a. The outer diameter of the positioning acting portion 15b should correspond to the inner diameter of the positioning hole 7 on the lead frame F side.

The stripper block 13 is also formed with a guide hole 13b for slidingly guiding the tie bar cut punches 16 described above.

When the upper die mechanism 14 is in the upper moving position with respect to the lower die mechanism 11, the stripper block 13 is in the lowermost position of its vertical movement stroke. At this time, the pilot pin 15 provided on the stripper block 13
And the vertical positional relationship between the tie bar cut punch 16 fixed to the upper mold mechanism 14 are set as follows. First, as shown in FIG. 1, the cutting action surface 16a of the tie bar cut punch 16 is inserted into the guide hole 13b by a predetermined length with respect to the lower surface pressing surface 13a of the stripper block 13, but the positioning protrusion 16b is Pressing surface 13a
Is made to project downward. Secondly, the lowermost position of the positioning protrusion 16b of the tie bar cut punch 16 is positioned higher than the boundary position between the positioning action portion 15b of the pilot pin 15 and the tapered portion 15a, preferably about 0.5 mm above. Done The significance of this will be clarified in the operation description described later.

Next, the operation of the tie bar cutting device having the above structure will be described.

When the upper die mechanism 14 is in the upper moving position with respect to the lower die mechanism 11 (FIG. 1), the lead frame F is fed forward by one pitch by a transport mechanism (not shown).

Next, the upper die mechanism 14 starts moving downward. In the process, first, the pilot pin 15 plunges into the positioning hole 7 of the lead frame F (FIG. 2), and the tip tapered portion 15a of the pilot pin 15 guides the edge of the positioning hole 7 to form a regular hole. Lead frame F, which is displaced in plan with respect to position
Are positioned (first positioning action). Since the tip of the pilot pin 15 is a tapered taper portion 15a, even if the pitch feed movement of the lead frame F by the transfer mechanism is rough, the positional deviation after the pitch feed is almost equivalent to the radius of the pilot pin. If the distance is less than
The first positioning action by the pilot pin 15 can be performed without any problem.

When the pilot pin 15 is inserted into the positioning hole 7 up to the positioning acting portion 15b, the tie bar cut punch 16 positioned so as to further project from the lower surface pressing surface of the stripper block 13. The positioning protrusion 16b projects into the gap between the adjacent lead portions 4 and 4 (FIG. 3), and the tie bar cut punch 16 is located in the immediate vicinity of the tie bar cut punch 16.
The lead frame F, in particular, the lead portion forming region is positioned with respect to (the second positioning action). This second
The positioning action of is performed after the above-described first positioning action by the pilot pin 15, so that the second positioning accuracy can be significantly enhanced. Further, in the embodiment shown in the drawing, the positioning protrusion 16b formed at the lower end of the tie bar cut punch 16 is tapered, so
Even if the lead frame F is deviated from the regular position with respect to the tie bar cut punch in the tie bar forming portion by the positioning action of each of the positioning protrusions 16b without any problem.
Can penetrate into the gap between the lead portions 4 and 4 to perform the second positioning action.

In this way, the lead frame F is accurately positioned with respect to the tie bar cut punch 16 especially at the tie bar forming portion, and when the upper die mechanism 14 continues to move downward, the pressing surface 13a of the stripper block 13 is moved to the lead frame F. Of the tie bar cutting die 12 and the lead frame F is clamped and held between the pressing surface 13a and the supporting surface 12a of the tie bar cutting die 12 (FIG. 4). This clamping pressure holding force is mainly interposed between the upper die mechanism 14 and the stripper block 13, and the upper die mechanism 1
It is obtained by the stored force of the spring which is compressed with the downward movement of 4. Although the downward movement of the stripper block 13 is prevented, the upper mold mechanism 14 continues downward movement, and the lower end cut surface 16a of each tie bar cut punch 16 is connected to the lead frame F.
The hole 12 of the die 12 while penetrating in the thickness direction.
It plunges into b (Fig. 5). By the cooperative action of the punch 16 and the die 12 at this time, unnecessary portions of the tie bar 3,
That is, each area B shown by a virtual line in FIG. 8 is punched out and removed.

When the above tie bar cut operation is completed,
The upper mold mechanism 14 returns to the upper moving position shown in FIG. 1, and thereafter, the lead frame F is further fed by one pitch, and the above-described operation is repeated to perform the tie bar cut for each region in the longitudinal direction of the lead frame. It is performed sequentially.

As a result of the above, according to the present invention, an extremely accurate tie bar cut is achieved, and particularly in the manufacture of a fine pitch resin package type electronic component,
It is possible to drastically reduce the bite into the lead after the tie bar cutting or the lead deviation. Moreover, in carrying out the present invention, it is sufficient to make a slight improvement to the tie bar cutting punch in the tie bar cutting device, and there is almost no increase in cost.

Of course, the scope of the present invention is not limited to the embodiments shown in the drawings, and all modifications within the scope of the inventive concept described in each claim belong to the scope of the present invention.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a schematic configuration of a tie bar cutting device according to an embodiment of the present invention, showing a state in which a movable member is in an upper moving position.

FIG. 2 is an explanatory view of the operation of the tie bar cutting device shown in FIG. 1, showing a state in which a pilot pin is about to enter a positioning hole of a lead frame.

FIG. 3 is an explanatory view of the operation of the tie bar cutting device shown in FIG. 1, showing a state in which a positioning convex portion at the lower end of the tie bar cutting punch is about to enter between adjacent lead portions.

FIG. 4 is an explanatory view of the operation of the tie bar cutting device shown in FIG. 1, showing a state in which the stripper block is in contact with the lead frame.

5 is an explanatory view of the operation of the tie bar cutting apparatus shown in FIG. 1, showing a state in which a tie bar cutting punch cooperates with a tie bar cutting die to punch out and remove an unnecessary portion of the tie bar.

FIG. 6 is a perspective view showing details of a tie bar cut punch.

FIG. 7 is a view taken in the direction of the arrow VII in FIG. 6;

FIG. 8 is an explanatory diagram of a region to be punched and removed in the lead frame.

FIG. 9 is a partial plan view showing an example of a lead frame.

10 is a partial plan view showing a state where chip bonding is applied to the lead frame shown in FIG. 9.

11 is a partial plan view showing a state where wire bonding is applied to the lead frame shown in FIG.

12 is a partial plan view showing a state where a resin mold package is formed on the lead frame shown in FIG.

13 is a partial plan view showing a state in which a tie bar cutting process is applied to the lead frame shown in FIG.

FIG. 14 is a partial cross-sectional view showing a schematic configuration of a conventional tie bar cutting device, showing a state where a movable member is in an upper moving position.

15 is an explanatory view of the operation of the tie bar cutting device of FIG. 14, showing a state in which the pilot pin is projected into the positioning hole of the lead frame and the stripper block is in contact with the lead frame.

16 is an explanatory view of the operation of the tie bar cutting device of FIG. 14, showing a state in which a tie bar cutting punch and a tie bar cutting die cooperate to punch out and remove an unnecessary portion of the tie bar.

FIG. 17 is an explanatory diagram showing a state in which lead cutting has occurred in a lead portion after tie bar cutting.

[Explanation of symbols]

 F Lead frame 1 Side frame part 3 Tie bar 4 Lead part 5 Resin package part 7 Positioning hole 10 Tie bar cutting device 12 Tie bar cutting die 13 Stripper block 15 Pilot pin 15a (Pilot pin) Tapered part 15b (Pilot pin) Positioning action part 16 Tie bar cut punch 16a Cutting action part (of tie bar cut punch) 16b Positioning convex part (of tie bar cut punch)

Claims (6)

[Claims] 1. A tie bar cutting method for punching and removing an unnecessary part of a tie bar connecting each lead part in a frame for manufacturing electronic parts in which a resin package part is formed, by a cooperative action of a tie bar cutting die and a tie bar cutting punch. Before the cutting action surface of the tie bar cut punch comes into contact with the surface of the manufacturing frame, the convex portion integrally provided on the tie bar cut punch is connected by the tie bar to be removed between the adjacent lead portions. A tie bar cutting method characterized by making it rush. 2. A tie bar cutting method for punching and removing an unnecessary part of a tie bar connecting each lead part in a frame for manufacturing electronic parts on which a resin package part is formed, by punching out by a cooperation action of a tie bar cutting die and a tie bar cutting punch. The first positioning by engaging the pilot pin attached to the movable member provided with the tie bar cut punch and the positioning hole provided in the manufacturing frame, and the cutting action surface of the tie bar cut punch is the same as that of the manufacturing frame. Before contacting the surface, the second positioning is performed by connecting the protrusion integrally provided on the tie bar cutting punch with the tie bar to be removed and causing the protrusion between the adjacent lead parts. The characteristic is the tie bar cutting method. 3. A tie bar cutting device for punching out and removing an unnecessary part of a tie bar connecting each lead part in a frame for manufacturing an electronic component in which a resin package part is formed, and a support on which the manufacturing frame is set. A tie bar cutting die formed on the member, a tie bar cutting punch provided on a movable member that moves closer to and away from the supporting member, and cooperates with the tie bar cutting die to punch out unnecessary portions of the tie bar, The tie bar cut punch is integrally formed with the tie bar cut punch, and when the tie bar cut punch is actuated, the cutting surface is connected by a tie bar to be removed before contacting the manufacturing frame, and the tie bar cut punch protrudes between adjacent lead portions. A positioning protrusion for positioning the manufacturing frame with respect to the tie bar cut punch; Characterized in that, tie bar cutting apparatus. 4. A tie bar cutting device for punching and removing an unnecessary part of a tie bar connecting each lead part in a frame for manufacturing an electronic component in which a resin package part is formed, the support on which the frame for manufacturing is set. A tie bar cutting die formed on the member, and a tie bar cutting punch which is provided on a movable member that moves closer to and away from the supporting member and cooperates with the tie bar cutting die to punch out unnecessary portions of the tie bar. A stripper block that is movable relative to the movable member in the moving direction of the movable member by a certain distance and that is elastically biased toward the support member; and a positioning hole for the manufacturing frame that is provided in the stripper block. A pilot pin that inserts into and engages with to position the manufacturing frame, and the tie bar cover. The tie bar cut punch is integrally formed with the topunch, and when the tie bar cut punch is operated, the cutting surface is connected by the tie bar to be removed before the tie bar cut punch is brought into contact with the manufacturing frame and the tie bar cut punch is pierced between the adjacent lead portions. A tie bar cutting device, comprising: a positioning protrusion that positions the manufacturing frame with respect to. 5. The pilot pin is formed with a positioning action portion extending with a constant length with the same outer diameter, and a tapered taper portion at the tip of the positioning action portion. After the pin penetrates into the positioning hole of the manufacturing frame up to its positioning acting part,
The tie bar cutting device according to claim 4, wherein the positioning protrusions of the tie bar cutting punch are configured to protrude between adjacent lead parts. 6. The tie bar cutting device according to claim 3, 4 or 5, wherein the positioning projection is tapered toward the tip.