JPH0513636A - Device and method for manufacturing semiconductor - Google Patents

Abstract

PURPOSE:To lengthen the life of a punch blade, facilitate the replacement of the punch and prevent the punch from becoming expensive. CONSTITUTION:A punch is separated into two parts and a top punch 11a is provided on a top die set 3. A bottom punch 11b is provided so as to be freely slid in a strip plate 9. A coil spring 4 is a coil spring which pushes back a push pin 8 and a coil spring 12a is a coil spring which pushes back the bottom punch 11b. The top die set 3 is pressed down by a shank 1, and such initial pressing down permits a semiconductor device 14 to be held by a stopper piece 12b and a die piece 16. The subsequent pressing down permits the spring 12a to be bent and the bend permits the cutting part of the semiconductor device 14 to be processed by the bottom punch 11b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing apparatus and a manufacturing method for cutting a lead portion or a die of a semiconductor device.

[0002]

2. Description of the Related Art FIG. 4 is a front view of a conventional semiconductor manufacturing apparatus. In the figure, 1 is a shank provided on the known press side, 2 is a shank holder connected to the shank 1, 3 is an upper die set, 4 is a coil spring for pushing back the push pin 8, 5 is a backing plate, 6
Is a punch plate for setting the punch 11, 7 is a bush for guiding the post 13, 8 is a stripper plate 9
A push pin for pushing back the punch 11c, a pressing plate for pressing the punch 11c, a stripper piece 12c for guiding the punch 11c, a semiconductor device to be processed, a rail 15 for guiding the semiconductor device 14, a die piece 16 and A die plate for setting the die piece 16,
18 is a lower die set.

Next, the operation will be described. The semiconductor device 14 guided and conveyed by the rails 15 is held by the die piece 16 and the stripper piece 12 that descends, and when the press side shank 1 further descends, the stripper plate 9 bends the coil spring 4 via the push pin 8. Therefore, the punch 11 processes the cut portion of the semiconductor device 14. At this time, the stroke amount L of the punch 11c is formed to be substantially the same as the bending amount of the coil spring 4. After processing, shank 1 for upper die set 3
The stripper plate 9 until the coil spring 4 which has been bent is returned to its original position.
With the coil spring 4 returning to its original position and the upper die set 3 further rising, the stripper plate 9 leaves the die plate 17 and the punch 11c lifted to the original position is the upper die set 3 As the coil spring 4 is bent, the punch 11c comes into contact with the guide portion 42 of the stripper piece 12c by the amount of the stroke.

[0004]

Since the conventional semiconductor manufacturing apparatus is constructed as described above, the guide contact stroke L of the punch 11c with the stripper piece 12c is as shown in FIG. The punch cutting edge portion 41 is inevitably brought into contact with the bending portion by friction with the guide portion 42.
Accelerate wear. Then, the punch 11c is set on the punch plate 6, but the dimension up to the stripper piece 12c is large, and therefore the total length of the punch 11c becomes long, which increases the outer dimension of the punch 11c and increases the material cost. It is the cause. Further, it is necessary to remove the stripper plate 9 when exchanging the punch 11c, and care must be taken when setting the stripper plate after exchanging the punch because the punch guide groove 42 and the punch cutting tooth surface 41 of the stripper piece 12c have an acute angle. Yes, it also causes punch damage. In addition, it is necessary to release the punching precision required dimension, that is, the straight dimension of the cutting edge portion 41 by the operation of the stripper plate 9, and as a result, the total length of the punch becomes long, resulting in an increase in punching cost, an increase in processing time, and accuracy. Is causing the decrease of. The present invention has been made in view of the above problems, and an object thereof is to extend the life of the punch cutting edge portion, facilitate the replacement of the punch, and make the punch expensive. It is an object of the present invention to provide a semiconductor manufacturing apparatus and a manufacturing method that prevent

[0005]

In order to achieve this object, a semiconductor manufacturing apparatus according to the present invention comprises a lower die on which a semiconductor is placed, a punch arranged to face the lower die, and a punch.
An upper die to which the punch is attached, and pressing the upper die to move the punch in the direction of the lower die to process a portion to be cut of the semiconductor by the punch and divide the punch to divide the punch. The divided punch on the lower die side of the punch is slidably attached to a member for removing cutting dust. Further, in order to achieve the above object, the present invention is
A method of manufacturing a semiconductor in which a cut portion of a semiconductor placed on a lower die is processed by a punch attached to an upper die, wherein the divided punch on the lower die side of the punch obtained by dividing the punch is cut. It is slidably attached to a detaching member, and the semiconductor is held by the lower die and the punch by the first depression of the upper die, and the punch is slid in the detaching member by the next depression of the upper die. It is moved to process the cut portion of the semiconductor.

[0006]

Since the die-side split punch according to the present invention moves simultaneously with the detaching member, the punch stroke is only the machining stroke.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a side view of the present invention. In the figure, the same reference numerals as those in the prior art indicate the same configurations, and detailed description thereof will be omitted. The feature of the present invention is that the punch 11 is divided into two and is attached to the punch plate 6, and the upper punch 11a and the strip plate 9 and the strip piece 1 which are parts for removing cutting dust.
2b and a lower plate 11b slidably attached thereto. The lower punch 12b of the semiconductor device 12a is the semiconductor device 1
4 is a return spring for processing the part to be cut and returning it to its original state. This spring a has a bending amount substantially the same as the stroke 1 (see FIG. 3) required for the lower punch 11b to process.

The operation will be described below. First, the press shank 1 causes the upper die set 3 to start descending, and the stripper plate 9 contacts the die plate 17 to push the push pin 8
The coil spring 4 bends via the. However, since the upper punch 11a is set on the stripper piece 12b and the stripper plate 9, it does not move. When the upper die set 3 is first pressed, the semiconductor device 14 is held by the stripper piece 12b and the die piece 16. Next, when the upper die set 3 is further lowered, the semiconductor device 14 held by the stripper piece 12b and the die piece 16 is lowered, and the upper punch 11a that has been lowered pushes the lower punch 11b, whereby the coil spring 12a.
And the cut portion of the semiconductor device 14 is processed. The moving amount for lowering the lower punch 11b at this time is l.
The portion to be cut in this embodiment is the tie bar 20 connecting the lead 21 in the lead frame 19 on which the semiconductor device 14 shown in FIG.
2b, the diver 20 in FIG. 2A is cut.
As shown in (B). Next, as the upper die set 3 rises, the upper punch 11a simultaneously rises, and the stripper plate 9 abuts the die plate 17 when the upper die set 3 rises because the coil spring 4 is bent. Holds state and is stationary. Similarly, the lower punch 11b is stationary together with the stripper piece 12b. When the upper die set 3 further rises, the bending of the coil spring 4 begins to return to its original state, the stripper piece 9 starts to rise, and the lower punch 11b also returns to its original state, and the processing ends. In the present embodiment, the example of the tie bar cutting punch for cutting the tie bar of the semiconductor device has been described, but the present invention is not limited to this. For example, a punch for cutting the lead portion of the semiconductor device or a semiconductor device Of course, it may be applied to a lead bend punch for forming the lead portion. In addition, the upper punch 11a in this embodiment
Of course, it may be a block or a pin.

[0009]

As described above, according to the present invention,
Since the punch is divided and it is slidably attached to the cutting scrap removal member on the die side, the split punch moves only the stroke required for processing the semiconductor device, so the cutting teeth of the punch are worn. As a result, the life of the cutting teeth can be extended, the cause of damage to the cutting teeth can be reduced, and stable long-term productivity can be improved. Further, since the punch can be made to have the necessary minimum length, the processing cost can be reduced, and thus various effects such as an inexpensive punch can be obtained.

[Brief description of drawings]

FIG. 1 is a front view of the present invention.

FIG. 2 is a plan view of a lead frame that is a workpiece.

FIG. 3 is a front view of relevant parts showing a sliding state of a punch according to the present invention.

FIG. 4 is a conventional front view.

FIG. 5 is a front view of relevant parts showing a sliding state of a conventional punch.

[Explanation of symbols]

6 punch plate 11a Upper punch 11b Lower punch 12b strip piece 14 Semiconductor device 16 die pieces 31 Punch cutting edge 32 Guide

Claims (2)

[Claims] 1. A lower die for mounting a semiconductor, a punch arranged to face the lower die, and an upper die to which the punch is attached. The upper die is pressed to push the punch. In a semiconductor manufacturing apparatus in which the punch is used to process a portion to be cut of the semiconductor by moving in the direction of the lower die, the divided punch on the lower die side of the divided punch is slidable as a removing member for cutting chips. A semiconductor manufacturing apparatus characterized by being attached to. 2. A method of manufacturing a semiconductor, wherein a cut portion of a semiconductor mounted on a lower die is processed by a punch attached to an upper die, wherein the punch is divided into pieces and the punch is divided on the side of the lower die. The punch is slidably attached to a removing member for cutting waste, and the semiconductor is held by the lower die and the punch by the first depression of the upper die, and the punch is attached by the next depression of the upper die. A method of manufacturing a semiconductor, characterized in that a cut portion of the semiconductor is processed by sliding in a removing member.