JP2007318026A - Film punching and pasting equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To highly precisely do positioning of a work film without inflicting any damage to it even if it has a tackiness or it is a thin film. <P>SOLUTION: The film punching and pasting equipment has a die 14 having a punching hole 30 that punches a film scrap 9 out of a work film 5, a holding member arranged below the die 14 to hold up a tape carrier 7 in a conveyance direction, a positioning mechanism for positioning the work film 5 and the tape carrier 7, a punch 6 for punching a film scrap 9 out of the predetermined position of the work film 5 set on the die 14 by the positioning mechanism as well as pressing the film scrap 9 against a predetermined position on the tape carrier 7 positioned on the holding member by the positioning mechanism, and a heater block 10 for heating up the tape carrier 7 by coming up from under the holding member and bringing the film scrap 9 in contact with the tape carrier 7, and the film scrap 9 pressed on the tape carrier 7, thus thermally press-bonding it. The positioning mechanism is prepared below the die 14. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  In the present invention, a long tape carrier such as a TAB tape including a lead frame or a tape carrier obtained by cutting a long tape carrier into strips (hereinafter referred to as a tape carrier) is punched and pasted from a work film. The present invention relates to a film punching and pasting apparatus.

In general, a film piece is affixed to a surface to be affixed of a tape carrier for thermal stress relaxation, reinforcement, and the like. For example, by attaching a film piece made of elastomer to a TAB tape in advance and connecting the TAB tape and the semiconductor device via the film piece, heat caused by the difference in linear expansion coefficient between the TAB tape and the semiconductor chip. The stress is relieved by the film piece. In the lead frame, for example, a letter-shaped film piece is attached to the tip of a plurality of radially arranged leads, and the tips of the lead frame are connected by a letter-shaped film piece to reinforce. Thus, deformation of the lead tip portion in the subsequent manufacturing process is prevented. For this reason, the film sticking apparatus uses a mold that can cope with various shapes by exchanging punches and dies. For example, as a conventional film sticking device, a piece of a film punched from a work film is pressed against a piece of a tape carrier positioned on a positioning plate by a die consisting of a die and a punch, and the positioning plate is opposite to the die side A film affixing device is used in which a punched film piece is thermocompression bonded to a piece of a tape carrier by pressing and heating a heat block (Patent Document 1).
JP-A-6-342869

In the affixing device as described above, the work film is disposed above and the tape carrier is disposed below the work film, the tape carrier is stopped every time the work film is pitched, and the work film is stopped, the work film, By inserting pilot pins provided in the mold into a plurality of positioning holes provided in advance in the tape carrier, the work film and the tape carrier are relatively positioned, and in this state, the mold, Productivity is improved by punching and pasting with heat blocks, designing a dedicated carrier system for the tape carrier, and supplying the tape carrier processed into strips to the conveyor system sequentially. However, even in this way, there are the following problems.
(1) The pilot pin is generally attached to the punch side, that is, the upper die, but generally in the punching process, the lowering speed of the upper die is generally faster than the rising speed of the heater block. For this reason, if the displacement of the positioning hole of the work film relative to the position of the pilot pin is large, when the pilot pin is inserted into the positioning hole, the workpiece is guided by the pilot pin guide surface, that is, the tapered surface of the pilot pin tip. The pilot pin may break through the positioning hole of the work film without being able to guide the film. In particular, such a work film is often damaged when the work film is thin (for example, 0.025 mm or less).
(2) Therefore, when the pilot pin is erected in the empty space of the base for fixing the lower mold, in this case, the distance between the punch for punching the work film and the pilot pin becomes large, and the temperature, humidity, It becomes susceptible to the effects of expansion and contraction due to tension and the like, and accumulated pitch errors in die machining. This makes it difficult to adjust the relative position between the pilot pin and the lower mold. In particular, it becomes difficult when the expansion rate and contraction rate of the work film change due to variations in lots.
(3) When the adhesive for thermocompression bonding, for example, a thermosetting or thermoplastic adhesive, is applied to the work film, the work film is attached to the lower mold by the tackiness (adhesiveness). The work film is in close contact with each other, making it difficult to move smoothly. In particular, when the film is punched out by another mold and then cut out by a film sticking device and attached to a tape carrier, it becomes easier to adhere when the work film is positioned from above, resulting in fluctuations in the accumulated pitch. And the problem (2) occurs.
(4) For this reason, a film positioning mechanism using image processing is mounted on the film transport mechanism on the apparatus side that supports the mold, and the work film positioning and positioning holes are image-recognized to position the work film. Although it is assumed that this eliminates the need for a mechanical work film positioning mechanism on the mold side, there is a problem that an expensive apparatus is required for image recognition processing. Further, the image recognition has a problem that the operation tact time becomes long due to the image recognition processing, and the production efficiency is lowered.

  The present invention has been devised in view of the above problems, and its purpose is to accurately and accurately position the work film and the tape carrier without damage even when the work film has tackiness or is thin. An object of the present invention is to provide a film punching and pasting apparatus capable of punching and pasting a film piece.

  1st invention supports the workpiece | work film along a conveyance direction, the die | dye which has the punching hole which punches a film piece from a workpiece | work film, and the support | carrier which is arrange | positioned under the said die and supports a tape carrier along a conveyance direction A member, a positioning mechanism for positioning the work film and the tape carrier, and punching out a film piece from a predetermined position of the work film positioned on the die by the positioning mechanism, and positioning on the support member by the positioning mechanism A punch that presses the film piece to a predetermined position on the tape carrier, and the tape carrier that is raised from below the support member and brought into contact with the tape carrier to be heated and pressed onto the tape carrier. Heater block for thermocompression bonding the film piece When, wherein the positioning mechanism is intended to provide a film punching pasting device provided below the die including the die.

  As described above, since the positioning mechanism for positioning the work film and the tape carrier is not provided on the punch side and is provided below the die including the die, the work film and the tape carrier are positioned by a predetermined pitch. Therefore, the film pieces can be sequentially thermocompression-bonded to the part to be attached of the tape carrier from the die and punch.

  According to a second invention, in the first invention, the positioning mechanism includes a pin mounting base that moves up in conjunction with the heater block, a work film pilot pin and a tape carrier pilot pin attached to the pin mounting base. A through hole through which the work film pilot pin penetrates together with a positioning hole previously formed in the work film supported on the die when positioning the work film provided on the die; When positioning the tape carrier, a through hole through which the tape carrier pilot pin penetrates is provided together with a positioning hole formed in advance in the tape carrier supported by the support.

When the pin mount rises in conjunction with the heater block, the work film pilot pin attached to the pin mount is formed in advance on the work film supported on the die while penetrating the through hole of the die. The work film is positioned through the positioning hole. The pilot pin for the tape carrier attached to the pin mounting base penetrates the through hole of the support that supports the tape carrier and also passes through the positioning hole formed in advance on the tape carrier supported on the support. The relative positioning of the work film and the tape carrier is performed. In addition, the work film pilot pin moves from the bottom to the top and guides the work film in the direction of floating the work film, so that the tacky surface of the work film is not pressed against the mold parts, Smooth movement in the mold makes it easier to follow the pilot pin.
In this case, the ascent speed of the work film pilot pin can be increased at a speed slower than that of the upper mold irrespective of the lowering speed of the upper mold. As a result, the dynamic friction between the tapered guide surface of the pilot pin for the work film and the positioning hole of the work film is suppressed, and the work film can easily follow the pilot pin.

  According to a third aspect of the present invention, in the second aspect, the die is composed of a insert piece type die and a die plate into which the insert piece type die is inserted.

  In a fourth aspect based on the second aspect, the pin mount is provided between the punch and the heater block so as to be movable up and down.

According to a fifth invention, in the fourth invention, a stroke adjusting member for adjusting a stroke amount of the work film pin and the tape carrier pin is provided between the pin mounting base and the heater block. It is.
By providing this stroke adjusting member, the stroke amount for raising the work film pilot pin and the tape carrier pilot pin can be determined separately from the stroke amount by which the heater block rises.

  In a sixth aspect based on the fifth aspect, the stroke adjusting member is provided on the heater block side.

  In a seventh aspect based on the fifth aspect, the stroke adjusting member is provided on the lower surface of the pin mounting base.

According to the present invention, the work film as the punched member can be positioned accurately and without damage even when the work film has tackiness or is thin, and is supplied to the subsequent process as a long tape carrier. Therefore, productivity is improved as compared with a conventional film pasting apparatus.
Further, if the tape carrier transport system is designed exclusively using a gripper or the like, it is possible to cope with a tape carrier processed into a strip.

Embodiments according to the present invention will be described below with reference to the accompanying drawings.
FIG. 2 is an explanatory diagram for explaining the entire film punching and pasting system.
As shown in the drawing, in the film punching and pasting system, the work film 5 and the tape carrier 7 below the work film 3 are vertically crossed and conveyed at a constant pitch in a certain direction indicated by arrows. A film punching device 23 provided with a punching die (described later) having a hollow punch 1 and a positioning hole punch 2 on the upstream side of the work film 5 when viewed from the three-dimensional intersection 101 of the work film 5 and the tape carrier 7 is provided. A film punching and pasting apparatus which is disposed and has a film punching and pasting die (described later) having an outer punch 6 and a die (described later) and a heater block 10 arranged vertically at the three-dimensional intersection 101. 24 is provided.
In the film punching device 23, the punching punch 1 punches the workpiece film 5, and the positioning hole punch 2 punches the positioning hole.
Thereby, for example, rectangular hollow holes 4 are formed in the work film 5, and a total of four positioning holes 3 for positioning are formed before and after the hollow holes 4.
In the film punching and pasting device 24, the positioning holes 3 provided in the work film 5 by the positioning hole punch 2 and the positioning holes 8 provided in advance at regular intervals on both edges of the tape carrier 7 are used. The relative positioning of the work film 5 and the tape carrier 7 is performed, and with this positioning maintained, the film piece 9 is punched out into a rectangle from the work film 5 by the outer punch 6, and the tape carrier 7 is attached as it is. Pasting to press on the surface is performed.
At this time, the heater block 10 ascends from the lower side of the tape carrier 7 as the pressing means and the thermocompression bonding means, is in contact with the lower surface of the tape carrier 7, and is heated to a predetermined temperature. Waiting for the film piece 9 to be pressed by the punch 6.
At this time, the temperature of the tape carrier 7 is heated to the thermocompression bonding temperature of the film piece 9 by heating by the heater block 10.
For this reason, when the film piece 9 is pressed against the surface to be attached of the tape carrier 7, the film piece 9 is thermocompression bonded to the surface to be attached of the tape carrier 7 and integrated with the tape carrier 7.

Next, each part of the film punching and pasting apparatus will be described.
FIG. 3 is an explanatory view of the main components of the film punching and pasting device 24 excluding the positioning mechanism as seen from the front.
In FIG. 3, reference numeral 12 denotes a bolster serving as a mounting base for the apparatus.
The bolster 12 is arranged at a predetermined distance from the floor surface, and is supported by a fixed system. A punching and pasting die 11 having an upper guide post 26 extending upward from the base plate 19 or the die 14 is positioned on the upper surface of the bolster 12, and a lower guide post 28 extending downward is provided on the lower surface of the bolster 12. Provided. Each of the upper guide post 26 and the lower guide post 28 is desirably four.
The punching and pasting die 11 includes an elevating block 25 that is moved up and down along the upper guide post 26, an upper die (also referred to as a punch plate) 27 that is fixed to the lower surface of the elevating block 25, and a lower die. The die 14 and an elevating device (not shown) for elevating and lowering the elevating block 25 are provided.
The die 14 is fixed to the upper surface portion of the bolster 12 via the base plate 19, and the outer punch 6 is attached to the lower surface portion of the upper mold 27 in a replaceable manner.
From the viewpoint of guiding the punched film piece 9, the die 14 is further preferably inserted into the die plate 14d as the insert die 14c so as to penetrate the die backing plate 15, as shown in FIG. 4B. . In this way, the gap between the die 14c and the tape carrier 7 that guides the punched film piece 9 and pushes it up to the tape carrier 7 to be equal to or less than the film thickness and is displaced when the film piece 9 is attached to the tape carrier 7. Can be prevented.

The heater block unit 13 for thermocompression bonding includes an elevator 29 that is moved up and down along the lower guide post 28 under the bolster 12, an elevator (not shown) for moving the elevator 29 up and down, and an elevator 29 and the heater block 10 fixed to the upper surface portion.
The punching and pasting die 11 and the heater block unit 13 are positioned by a precise positioning method using a positioning member such as a knock pin in order to improve assembly accuracy, and the heater block unit 13 and the upper die 27 are moved up and down. In order to do so, the lifting device is provided with actuators (all shown) such as motors, pneumatic and hydraulic cylinders as drive sources. The heater block 10 includes a resistance heater or induction heater and a temperature sensor, and heats the upper surface of the heater block 10 to a predetermined temperature or higher.

4A is a cross-sectional view taken along the line VI-VI in FIG. 3, and shows the inside of the film punching device 23 and the film punching and pasting device 24. FIG. In FIG. 4A, the bolster 12 is not displayed.
As shown in the drawing, in order to support and guide the work film 5 in the transport direction, a first concave portion 14a having a width wider than that of the work film 5 is appropriately formed at the center of the upper surface of the die 14, and the tape carrier The second concave portion 14b for partitioning the conveyance space 7 is provided at the center of the lower surface of the die 14 along the conveyance direction. The first concave portion 14a and the second concave portion 14b are orthogonal to each other at twisted positions, and both end portions are open in the conveying direction of the work film 5 and the conveying direction of the tape carrier 7, respectively. The die backing plate 15 is engaged with the second recess 14b. The die backing plate 15 is fixed to the base plate 19 via the die 14, and the tape carrier 7 travels in the die backing plate 15 with the base plate 19 as a support member and the die backing plate 15 as a guide member.
A punching hole 30 into which the outer punch 6 is inserted is provided at the center of the die 14 and the die backing plate 15.
The work film 5 supported by the bottom of the first concave portion 14a of the die 14 and guided to both sides of the first concave portion 14a is punched by the outer punch 6 and the punching hole 30, and the punched film piece 9 is outside. It is conveyed to the tape carrier 7 side by the front end surface of the punching punch 6.

Next, a positioning mechanism for the work film 5 and the tape carrier 7 will be described with reference to FIG. 1 which is an enlarged view of FIG.
The pin positioning mechanism includes a pin mounting base 20 that moves up in conjunction with the heater block 10, a work film pilot pin 17 and a tape carrier pilot pin 18 that are in contact with the pin mounting base 20, and a work film 5 provided on the die 14. When positioning the tape carrier 7, the through hole 31 for guiding the work film pilot pin 17 to the positioning hole 3 of the work film 5 and the positioning hole 8 of the tape carrier 7 when positioning the tape carrier 7 are provided. And a through hole 32 for guiding the pilot pin 18 for the tape carrier.
The pin positioning mechanism is interlocked with the lifting platform 29 so that the work film pilot pin 17 and the tape carrier pilot pin 18 are respectively inserted into the work film positioning hole 3 and the tape carrier positioning hole 8 from below. By inserting, the work film 5 is positioned on the die 14, and the tape carrier 7 is positioned on the support member 16 on the base plate 19. At this time, the through hole 31 of the die 14 functions as a precise guide hole of the work film pilot pin 17, and the through hole 32 of the support member 16 functions as a precise guide hole of the tape carrier pilot pin 18.

In the central portion of the base plate 19, an opening 33a, an opening 33b, and an opening 33c are formed in three upper and lower stages. A support member 16 is fitted into the opening 33a, and relative positional accuracy with the die backing plate 15 is ensured. The support member 16 is positioned and fixed, and functions as a support member that supports the tape carrier 7 together with the base plate 19.
A through hole 34 is provided in the central portion of the support member 16 for allowing the heater block 10 rising from the lower side to pass through and contacting the lower surface of the tape carrier 7.
In addition, a pin mounting base 20 on which the work film pilot pin 17 and the tape carrier pilot pin 18 are mounted upward is installed in the opening 33b so as to be movable up and down, and the heater block 10 is provided at the center of the pin mounting base 20. An opening 35 is provided for allowing the air to pass therethrough. In this case, it is desirable that the pin mounting base 20 moves up and down smoothly by a guide post (not shown) or the like.

Between the pin mount 20 and the heater block 10, a stroke adjusting member for adjusting the stroke amount of the work film pilot pin 17 and the tape carrier pilot pin 18 is provided.
In the present embodiment, the stroke adjusting member is composed of a pair of push-up members 21 fixed on the upper surface of the elevator block 29 of the heater block unit 13.
When the push-up members 21 and 21 are brought into contact with the lower surface of the pin mounting base 20 through the opening 33c opened on the lower surface of the base plate 19, the pin mounting base 20 can be pushed up. In addition, a stopper block (not shown) can be provided independently on the lifting platform 29 to set the rising limit position of the lifting platform 29. In this case, the stopper block is preferably a columnar metal block such as a cylinder or a prism.
The work film pilot pin 17 and the tape carrier pilot pin 18 incorporate a return spring so as to apply a return elastic force to both, and the spring force of the spring causes the work film pilot pin to be applied. 17. The structure may be such that the pilot pin 18 for the tape carrier is lowered, or the spring force of the return spring is directly applied to the pin mount 20.
In this way, the responsiveness regarding the return of the work film pilot pin 17 and the tape carrier pilot pin 18 is improved, and the continuous operation is improved. Further, the die 14 and the die backing plate 15 are provided with a movable lifter pin facing downward for receiving the work film pilot pin 17 and the tape carrier pilot pin 18 and preventing the work film 5 and the tape carrier 7 from being lifted up, respectively. May be.

Next, the operation of the film punching and pasting system will be described with reference to FIGS.
First, the pin positioning mechanism is in a standby state shown in FIG.
In this standby state, the hollow punch 1 and the positioning hole punch 2 of the film punching device 23 are in the non-operating position above the work film 5.
In the film punching and pasting device 24, the work film pilot pin 17 and the tape carrier pilot pin 18 are in the non-operating positions in the positioning hole 3 of the work film 5 and the positioning hole 8 of the tape carrier 7. Therefore, in such a state, the tape carrier 7 and the work film 5 can be transported, and pitch feed is possible. In this standby state, the heater block 10 is also in a non-operating position spaced a predetermined distance below the lower surface of the tape carrier 7.

Next, as shown in FIG. 5, the heater block 10 is raised together with the lifting platform 29 of the heater block unit 13, and the heater block 10 enters the through hole 34 of the support member 16 through the opening 35 of the pin mounting base 20. The heater block 10 is inserted into the through hole 34 up to a height at which the upper surface of the heater block 10 is substantially at the same position as the upper surface of the support member 16. At this time, when the heater block 10 is raised to a certain height, the push-up pin 21 comes into contact with the lower surface of the pin mount 20 and the push-up of the pin mount 20 is started.
The pin mounting base 20 moves upward by a fixed stroke amount out of the total stroke amount until it comes into contact with a stopper block (not shown) provided on the elevator base 29 of the heater block unit 13 and the back surface of the base plate 19. When the pin mounting base 20 is pushed up by the push-up member 21, the work film pilot pin 17 and the tape carrier pilot pin 18 are moved by the predetermined stroke amount determined by the total stroke amount and the length of the push-up member 21 as the stroke adjusting member. Move upward.

The work film pilot pin 17 passes through the through hole 34 provided in the support member 16, the through hole 15 a provided in the die backing plate 15, and the through hole 31 provided in the die 14 to the positioning hole 3 of the work film 5. Inserted.
The tape carrier pilot pin 18 is inserted into the positioning hole 8 of the tape carrier 7 through the through hole 32 provided in the support member 16.
At this time, if the positioning hole 3 of the work film 5 is misaligned, the positioning hole 3 is guided by the tapered guide surface at the tip of the work film pilot pin 17 and the position of the work film 5 is smoothly corrected. . The positioning hole 8 of the tape carrier 7 is also guided by the guide surface at the tip of the tape carrier pilot pin 18 so that the position of the tape carrier 7 is smoothly corrected.
When the work film pilot pin 17 and the tape carrier pilot pin 18 are respectively inserted into the positioning hole 3 of the work film 5 and the positioning hole 8 of the tape carrier 7, the positioning is completed.

Next, as shown in FIG. 6, in the film punching device 23, the punching punch 1 and the positioning hole punch 2 are lowered to punch the punching hole 4 and the positioning hole 3 from the work film 5. In synchronism with this, in the film punching and pasting device 24, the outer punch 6 is lowered, and the film piece 9 is punched from a predetermined position of the work film 5 to perform the outer punching. Subsequently, the punching punch 6 feeds the punched film piece 9 onto the tape carrier 7 heated by the heater block 10, and thermocompression-bonds it so as to be sandwiched from above and below by the punching punch 6 and the heater block 10. Then, it is affixed to a predetermined position on the tape carrier 7, that is, a surface to be adhered. The affixing pressure at this time is adjusted by, for example, adjusting the push-up pressure of the heater block 10 and the lift of the outer punch 6.
Thereafter, the outer punch 6 rises to the original punching position shown in FIG. 4A, and the punching and pasting device 23 raises the punching punch 1 and the positioning hole punch 2 so that the heater block 10 It is lowered to the lowered position. When the heater block 10 returns to the original position, the work film pilot pin 17 and the tape carrier pilot pin 18 of the positioning mechanism also return to the standby position as shown in FIG. 3 and the positioning hole 8 of the tape carrier 7. Thereafter, when the work film 5 and the tape carrier 7 are transported by one pitch, the punching and pasting process of one cycle is completed.
As described above, in the positioning mechanism, the workpiece film 5 is positioned by inserting the workpiece film pilot pins 17 into the positioning holes 3 of the workpiece film 5 from below, which is the direction in which the workpiece film 5 is lifted from the die 14. Since the work film pilot pin 17 is inserted at an optimum speed for the work film 5, the work film 5 can be inserted into the work film 5 or the work film 5 having tackiness on the lower surface from above. As compared with the case where the film pilot pins 17 are inserted, the work film 5 is prevented from being damaged and positioned stably.
Further, in the present embodiment, the work film pilot pin 17 is lifted by using the lifting force of the heater block unit 13 as it is, so that no other driving source is required, and the work film pilot pin 17 can be configured at a lower cost. It becomes possible.
Furthermore, the positioning mechanism can be easily finished to the required accuracy as a component of the stamping and pasting mold 11 by utilizing polishing and finishing techniques, which are the main processing techniques of the mold, at the time of mold manufacture. For this reason, once the adjustment is made, the work of performing the fine adjustment every time the mold is placed becomes almost unnecessary.

  Further, since the work film pilot pin 17 is provided in the immediate vicinity of the punching hole 30 for punching and pasting in the punching and pasting die 11, it is almost unnecessary to adjust the punching error with respect to the expansion and contraction of the work film 5. Become.

  In addition, since the stamping and pasting die 11 is originally finished with a high-precision processing technique mainly based on grinding rather than grinding or cutting, all the positioning mechanisms that require precision are stamped and pasting die 11. There is also an advantage that the cost of the punching and pasting die 11 is not greatly increased even if it is contained in the die.

FIG. 7 shows another embodiment of the positioning mechanism. In this embodiment, the same components as those in the above embodiment are given the same reference numerals and different configurations will be described.
In the above embodiment, the push-up member 21 is provided on the heater block 10 side as a stroke adjustment member. However, in this embodiment, as shown in FIG. 7, the stroke adjustment member is composed of the pin mounting base 20 and the heater block 10. Specifically, a push-up pin 22 as a stroke adjusting member is provided on the lower surface of the pin mounting base 20. In this way, it is not necessary to widen the opening 33c of the opening 33 to the size including the push-up member 21, and the processing time of the opening 33 is shortened accordingly, so that it can be formed at low cost also in this respect. Become.

The pin mount 20 may be divided into a right side and a left side, and a work film pilot pin 17 and a tape carrier pilot pin 18 may be provided, respectively. Also, the work film pilot pin 17 and the tape carrier pilot pin 18 may be provided. It is also possible to provide a through hole for allowing the work film pilot pin 17 and the tape carrier pilot pin 18 to pass therethrough.
Further, when the work film pilot pin 17 and the tape carrier pilot pin 18 are inserted into the work film 5 or the tape carrier 7, an appropriate timing is provided on the film transport device and the tape carrier transport device side for transporting them. Thus, it is more desirable to release the tape carrier 7 and the work film 5 to be free.

It is sectional drawing of the film punching and sticking apparatus which concerns on one embodiment of this invention. It is a perspective view which shows the outline | summary of the whole structure of the film punching and sticking system which concerns on one embodiment of this invention. 1 is a front view of a film punching and pasting apparatus according to an embodiment of the present invention. FIG. 4A is a sectional view showing a film punching and pasting system according to an embodiment of the present invention, FIG. 4A is a sectional view showing in a standby state, and FIG. 4B is a partial sectional view showing an essential part of the film punching and pasting system. It is. It is sectional drawing which showed the film punching and sticking system which concerns on one embodiment of this invention in the positioning completion state. It is sectional drawing which showed the film punching and sticking system which concerns on one embodiment of this invention in the punching state. It is sectional drawing which shows other embodiment of the film punching and sticking system which concerns on one embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 Positioning hole 5 Work film 6 External punch 7 Tape carrier 8 Positioning hole 9 Film piece 10 Heater block 11 Punching die 14 Die 15a Through hole 16 Support member 17 Pilot pin for work film 18 Pilot pin for tape carrier 31 Through Hole 32 Through hole

Claims (7)

A die having a punching hole for supporting a work film along a conveying direction and punching a film piece from the work film;
A support member disposed below the die and supporting the tape carrier along the transport direction;
A positioning mechanism for positioning the work film and the tape carrier;
A punch for punching a film piece from a predetermined position of a work film positioned on the die by the positioning mechanism and pressing the film piece to a predetermined position on the tape carrier positioned on the support member by the positioning mechanism; ,
A heater block that heats and presses the film piece pressed onto the tape carrier by heating the tape carrier by raising from below the support member and contacting the tape carrier;
A film punching and pasting apparatus, wherein the positioning mechanism is provided below a die including the die. The positioning mechanism is
A pin mount that rises in conjunction with the heater block;
A pilot pin for a work film and a pilot pin for a tape carrier attached to the pin mount;
When positioning the work film provided on the die, a through hole through which the work film pilot pin penetrates together with a positioning hole previously formed in the work film supported on the die,
A through hole through which the pilot pin for the tape carrier penetrates together with a positioning hole formed in advance in the tape carrier supported by the support when positioning the tape carrier provided in the support;
The film punching and pasting apparatus according to claim 1, comprising:   The film punching and pasting apparatus according to claim 2, wherein the die is composed of a frame piece die and a die plate into which the frame piece die is inserted.   The film punching and pasting apparatus according to claim 2, wherein the pin mounting base is provided between the punch and the heater block so as to be vertically movable.   The film punching and pasting apparatus according to claim 4, wherein a stroke adjusting member for adjusting a stroke amount of the work film pilot pin and the tape carrier pilot pin is provided between the pin mounting base and the heater block. .   The film punching and pasting apparatus according to claim 5, wherein the stroke adjusting member is provided on the heater block side.   The film punching and pasting apparatus according to claim 5, wherein the stroke adjusting member is provided on a lower surface of the pin mounting base.

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