JPS58153400A - Method of producing electronic part series - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a series of electronic components without any omissions.

FIG. 1 shows an example of the shape of a general electronic component series. Referring to FIG. 1, parallel lead type electronic components 2 are distributed along the length jt of the holder 1 on one side of a long holder 1 made of relatively thick paper, for example. will be placed. The electronic component 2 is provided with feed holes 6 at equal intervals in accordance with the amount of the element body 3 and two lead wire adhesive tapes 5, for example.

This kind of electronic component series is applied in this form to an automatic insertion machine for printed circuit boards, etc., but in this case, it is desirable to be able to automatically insert it into printed circuit boards etc. smoothly and in a short time. It is rare.

However, the electronic components held by the holder 1 (also
Some products are determined to be defective after subsequent inspection (inspection of electrical characteristics and appearance), and these are removed from the electronic component series. this .

The removed state is shown in FIG. In other words, the lead wire 4 of the electronic component 2 is cut at or near the end of the holder 1. When these two methods are applied to an automatic insertion machine for a set of electronic parts in a state of failure, the automatic insertion operation is not smooth and time is wasted unnecessarily.

Therefore, conventionally, the part where the electronic component 2 shown in FIG. 2 has been removed, that is, the lead wire 4 remaining on the holder 1
Attempts are being made to eliminate missing teeth by attaching new electronic components to the device by soldering their lead wires. However, such tooth extraction prevention measures usually have to be done manually one by one, but soldering as in the previous two is extremely complicated and requires accurate positioning. It was extremely difficult to do so, and it was not very practical.

This is what I did.

To summarize this invention, it is an electronic component series in which a new electronic component is fixed by the lead wire to the horizontal plane of a holder whose lead wires have been cut and defective products have been removed.

Other objects and features of the present invention will become more apparent from the detailed description given below with reference to the drawings.

FIG. 3 is a front view for explaining one embodiment of the present invention;
FIG. 4 is a back view. In these figures, Figure 1,
Portions corresponding to those shown in FIG. 2 are indicated with the same reference numbers to avoid duplication of explanation. First, one of the electronic components 2 fixed on one plane of the holder 1 by the adhesive chip 75 is determined to be a defective product. Next, new electronic component 2a
The lead wire 4a is placed on the other plane of the holder 1, and is bonded and held by the adhesive 17). In this case, it is necessary to align the new electronic component 2a so that it accurately faces the remaining lead WA4 of the removed electronic component 2 via the holder 1. The length of the lead wire 4a of the new electronic component 2a is not particularly determined, but it is selected so that it can be held by the adhesive tape 7 and is aligned with the height of the other electronic component 2. Note that the adhesive tape 7 does not need to be attached at the center of the holder as shown in the figure. Moreover, instead of the adhesive tape 7, an adhesive may be used for fixation.

As described above, according to the present invention, a new electronic component is fixed to the horizontal plane of the holder from which the defective product has been removed by its lead wire. This can prevent the chain from falling out. In addition, this invention makes it easy to align the electronic parts, improves the accuracy of the electronic parts assembly, and even when applied to automatic insertion machines, etc., there is no problem in operation, making it an excellent product. The practical effects are significant.

Note that the drawings and the above description are for embodying the present invention, and are not intended to limit the invention in any way. In particular, the elongated adhesive tape 5 does not have to be used at all to hold the electronic component 2 which has been fixed to the holder 1 from the beginning. Further, the shape of the electronic component, the number of lead wires, the shape of the feed hole, etc. are also arbitrary.

[Brief explanation of drawings]

Fig. 1 is a cross-sectional view of a general electronic component series, Fig. 2 is a front view of a conventional electronic component series, and Fig. 3 shows an example of the four subcomponents obtained by the present invention. Front view, Figure 4 GJ
It is a back view. 1...Holding body, 2...Electronic component, 2...Adhesive tape. Patent applicant Murata Manufacturing Co., Ltd.

Claims (1)

[Scope of Claims] A series of electronic components in which lead wires of a plurality of electronic components are held at regular intervals on one plane of a long holding body, and a defective one of the electronic components is connected to the lead wire. is removed by cutting, and a new electronic component is held by the lead wire on the other side of the holder corresponding to the position of the lead wire remaining on the holder,
Manufacturing method for electronic parts.