JPS5886799A - Electronic part series - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic component series for supplying so-called parallel lead type electronic components, in which a plurality of lead wires are drawn out in parallel, to an automatic insertion machine.

The present invention can be used not only in a series of electronic components for supplying electronic components to an automatic insertion machine, but also in the process of manufacturing electronic components themselves.

An electronic component series generally includes a flexible holding band, and electronic components held by the holding band by some kind of holding means and distributed along the length of the holding band. When automatically pushing electronic components onto a printed circuit board, the electronic components must be continuously fed while being held in an appropriate posture. For this purpose, the electronic components must be held in an appropriate position in the electronic component series.

FIGS. 1 and 2 are partially cutaway plan views showing a conventional electronic component series that gave rise to the present invention. Figure 1 shows
The electronic component 3 is held on the holding band 2 by adhering the adhesive tape 2' to the holding band 2 while sandwiching the lead wires 8.9 of the electronic component 3. However, in this example, since the adhesive tape 2- is adhered to almost the entire width of the holding band 2, a large amount of the adhesive tape 2' is used, making it very expensive. Taking a capacitor, which is a common type of electronic component, as an example, the cost of the adhesive tape is so expensive that it accounts for about 10% of the total cost of the electronic component. Therefore,
A system which does not use such an adhesive tape 2' has been attempted, and is shown in FIG. Referring to the second factor, the electronic component series 1 is composed of a holding band 2 and an electronic component 3. Although not particularly illustrated, a large number of electronic components 3 are arranged on the holding band 2 so as to be distributed in the length direction of the holding band 2 . For example, a flexible retaining band 2 made of cardboard has a pair of slits 4 parallel to the longitudinal direction of the retaining band 2.
．． 5 is formed. Furthermore, round holes 6 are formed at predetermined intervals in the widthwise central portion of the holding band 2. This round hole 6
is formed to engage with a sprocket for feeding the electronic component series 1 in the longitudinal direction, and also functions as a positioning index in the automatic insertion machine. The electronic component 3 is a so-called parallel lead type electronic component consisting of an electronic component element 7 and lead wires 8 and 9 led out in parallel from the electronic component element 7. This electronic component 3 is held against the holding band 2 by lead wires 8.9. That is, the lead wire 8°9 is connected to one surface of the retaining band 2 (
It is inserted into the slit 4 from the front side (the front side of the paper in FIG.
It is then returned to the surface of the retaining band 2 again.

The distance of the slit 4.5 in the longitudinal direction of the holding band 2 is selected to be longer than the distance between the lead wires 8 and 9. This means that the lead 118.9 of the electronic component 3 is connected to the slit 4.5.
This is because it can be easily inserted into and maintained in the state shown in FIG. This retention is achieved by a force that causes the portion of the retaining band 2 between the slits 4 and 5 to return to its original position from the state where it has been raised to the surface side due to the insertion of the lead wire 8.9. . By doing so, an electronic component series for automatic insertion was constructed without using any adhesive tape. By the way, as described above, when automatically inserting the electronic component 3 into the printed circuit board, the electronic component 3 must be supplied to the automatic insertion machine while being held in an appropriate posture in the electronic component series 1.

However, since the width in the longitudinal direction of the holding band 2 of the slit 4.5 is selected to be larger than the interval between the lead wires 8 and 9, when the lead 118.9 is inserted into the slit 4.5, Even if the posture of the electronic component 3 is set correctly, there is a drawback that the bolt supplied to the automatic insertion machine tends to shift in the length direction of the holding band 2, causing the electronic component 3 to tilt. In particular, when the electronic component series 1 is supplied, various vibrations from the machine are applied, so that it is easy to shift not only in the length direction of the holding band 2 but also in the insertion direction of the lead wires 8 and 9, causing severe damage. In some cases, the electronic component 3 even fell out of the holding band 2. Therefore, it is desired to develop an electronic component series that can reliably hold the electronic component 3 in an appropriate posture.

Incidentally, a similar problem occurs when manufacturing parallel lead type electronic components 3. In other words, the parallel lead type electronic component 3 is manufactured by first holding a U-shaped lead wire in a holding band similar to the holding band 2 through a slit, and then holding the U-shaped lead wire in a holding band similar to the holding band 2. This is done by fixing electronic components to both open ends of the wire, for example, by solder dipping, and then cutting the U-shaped curved portion. In this case as well, unless the U-shaped lead wire held by the holding band is held firmly to some extent, the electronic component element cannot be accurately connected to the lead wire.

However, when a holding band similar to the holding band 2 shown in FIG. The drawback was that it could not be connected.

Therefore, the main object of the present invention is to eliminate the above-mentioned drawbacks and provide an electronic component series in which electronic components and the like can be reliably held in appropriate postures.

In summary, the present invention provides at least one slit for adhering and holding the electronic component to the holding band by sandwiching the lead wire on the side of the holding band in which at least one pair of slits are formed, on which the electronic component element is located. This is a series of electronic components to which adhesive tape is attached.

The above-mentioned objects and other objects and features of this invention are as follows:
It will become clearer from the following detailed description with reference to the drawings.

FIG. 3 is a partially cutaway plan view showing a part of an embodiment of the present invention. Referring to FIG. 3, this embodiment mainly includes a retaining band 12, an electronic component 13, and an adhesive tape 20.
．． Consists of 21. The holding band 12 is a flexible band-shaped body made of cardboard, for example, and has slits 14 and 15 formed at predetermined intervals in the length direction. In addition, round holes 16 are provided at predetermined intervals in the center of the retaining band 12 in the width direction.
is formed. Instead of the round hole 16, holes of various shapes such as a square hole or a triangular hole may be formed. The round hole 16, like the round hole 6 in the conventional electronic component series 1 shown in FIG. 2, is a hole for feeding the electronic component series, and can also serve as a positioning index in an automatic insertion machine. . The parallel lead type electronic component 13 is also similar to the electronic component 3 in the conventional electronic component series 1, and includes an electronic component element 17 and lead wires 18 and 19 led out from the electronic component element 17 in parallel. The lead wires 18 and 19 are inserted into the slit 14 from one surface (the front side of the paper in FIG. 3) of the holding band 12, extend along the other surface, and then extend through the slit 5. The street has been brought back to the surface. The process up to this point is the same as the conventional electronic component series 1 shown in FIG. In this case, the slit 14.1
The distance in the longitudinal direction of the retention band 12 of No. 5 does not necessarily have to be larger than the spacing between the lead wires 18 and 19; on the contrary, it should be made smaller so that the lead wires 18 and 19 are separated after insertion.
．． Using the outward restoring force of 19, lead wire 18.19
may be further held. A feature of this embodiment is that two adhesive tapes 20.21 are provided. That is, the adhesive tape 20 is attached to the holding band 12 with the lead wires 18 and 19 sandwiched between the edge 12a of the holding band 12 on the side where the electronic component element 17 is present and the slit 14.
is glued to. Similarly, the slit 15 and the retaining band 12
The end 1i12 opposite to the side where the electronic component element 17 is present
An adhesive tape 21 is bonded to the circle b, sandwiching the lead wires 18 and 19.

As described above, in this embodiment, since the adhesive tapes 20 and 21 sandwich the lead wires 18 and 19 and are bonded to the holding band 12, the electronic component 3, once placed in an appropriate position, remains in that position. Strongly held. Therefore, even if various vibrations are applied by the feeding device or the automatic insertion device, the electronic component 13 will not be displaced from its correct position, and the electronic component 13 will be reliably positioned when inserted into the printed circuit board (not shown). Is possible. Also, before adhesion with tape 20.21, lead wire 18.
Since the electronic component 19 is introduced into the slit 14.15 and held in advance, the electronic component 1
3 does not wobble, and it is possible to easily perform taping while maintaining an appropriate posture. Furthermore, the holding of the lead wires 18.19 is ultimately caused by the slits 14.15
20.21 and tape 20.21, it is desirable to make the width of the tape 20.21 as thin as possible to minimize the amount of tape 20.21 used.

In the embodiment described above, one pair of slits 14,15 are formed, but a plurality of pairs, ie, two or more pairs of slits may be formed. Further, the number of adhesive tapes is not limited to two, and more adhesive tapes may be used for adhesion, or only one of the above-mentioned adhesive tapes 20 and 21 may be used. However, it is preferable that the adhesive tape does not cover the round hole 16. Otherwise, the adhesive from the adhesive tape may seep into the round hole 16 and adhere to the sprocket (not shown) for supplying the electronic parts, which may interfere with the supply of the electronic parts. .

FIG. 4 is a partially cutaway plan view showing a part of another embodiment of the invention. As is clear from FIG. 4, in this embodiment the slits 14, 15 are U-shaped.

Thus, it can be seen that the shape of the slit is not limited to that shown in FIG. 3, and that various shapes can be used.

The other parts are the same as those in the embodiment shown in FIG. 3, so their explanation will be omitted by giving corresponding reference numerals.

By the way, as mentioned above, when manufacturing parallel lead type electronic components, a holding band similar to the holding band for electronic component chains is used. It should be pointed out that the electronic component series of the present invention can also be advantageously used in the production of electronic components. That is, similar to the state of the electronic component series shown in FIG. 3, after inserting the U-shaped lead wire into at least one pair of slits formed in the holding band and holding it in advance,
By adhering the adhesive tape from one side of the holding band, it is possible to hold the U-shaped lead wire firmly to some extent. As a result, the U-shaped lead wire can be held at an appropriate position on the holding band, and the electronic component element can be accurately fixed to both ends of the U-shaped lead wire on the open side by, for example, soldering dip. becomes possible. However, when holding the U-shaped lead wire during the manufacturing process, a thinner adhesive tape with weaker adhesive strength is used because no holding force is required to maintain the posture of the electronic components in the electronic component series as described above. May be used. Therefore, the manufacturing cost of parallel lead type electronic components is not made unnecessary. Preferably, it can be used as an electronic component series after the manufacturing process. That is, in the past, after an electronic component element was fixed to a U-shaped lead wire held on a holding band, the U-shaped curved portion of the U-shaped lead wire was usually cut to complete the electronic component. Remove from the retaining band,
In some cases, electronic components are held in a holding band for another electronic component series, but without removing the completed electronic component from the holding band used during manufacturing, it is possible to use electronic components for automatic insertion as is. It can be used as a series of parts. However, in this case, it is necessary to use a retaining band of the same quality as the retaining band normally used for electronic parts from the time of manufacture. However, the fact that the retaining band can be used continuously during the manufacturing process up to automatic insertion is
It is possible to eliminate the need for a retaining band in the manufacturing process, which has conventionally been discarded, and it becomes possible to effectively eliminate the high manufacturing costs of electronic components.

As described above, according to the present invention, the adhesive tape allows
Since the lead wires of parallel lead type electronic components are bonded and held by the holding band, it is possible to hold the electronic components in the correct posture for proper feeding to the automatic insertion machine. Furthermore, since the electronic component is introduced into the slit in advance and preliminarily fixed, the electronic component does not wobble when adhering with the adhesive tape, and it is possible to perform taping while maintaining an appropriate posture. Furthermore, by using the holding band for electronic parts from the manufacturing process of electronic parts, it is possible to eliminate the holding band used in the manufacturing process, which was previously discarded, and the manufacturing process of electronic parts and electronic parts is possible. The process can be effectively simplified, and as a result, the manufacturing cost of electronic components can be significantly reduced.

[Brief explanation of drawings]

FIGS. 1 and 2 are partially cutaway plan views showing a part of the conventional electronic component that gave rise to the present invention. FIG. 13 is a partially cutaway plan view showing a part of an embodiment of the present invention. FIG. 4 is a partially cutaway plan view showing a part of another embodiment of the invention. In the figure, 12 is a holding band, 13 is an electronic component, and 14.1
5 is a slit, 18.19 is a lead wire, and 20.21 is an adhesive tape. Patent applicant Murata Manufacturing Co., Ltd. (and 2 others) 1st drawing 3rd figure 2nd figure 4th figure 41

Claims (1)

[Scope of Claims] The retaining band includes a flexible retaining band and a plurality of parallel lead type electronic components distributed in the length direction of the retaining band and held by the retaining band. The electronic component is provided with at least one pair of slits for receiving each lead wire of the electronic component from one side of the holding band, arranging the lead wire along the other surface, and returning the lead wire to the one surface again. In this series, at least one narrow adhesive tape is adhered to one side of the holding band for sandwiching the lead wire and adhering and holding the electronic component to the holding band. , Electronic Components.