JPS58116800A - Electronic part series - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic component chain for continuously supplying so-called parallel lead type electronic components, in which lead wires are led out in parallel, to an automatic insertion machine.

2. Description of the Related Art Automatic insertion machines are widely used for automatically inserting a parallel lead type electronic component, in which a plurality of lead wires are led out in parallel from an electronic component element, into a printed circuit board. In order to supply parallel lead type electronic components to an automatic insertion machine, an electronic component series including a flexible holder holding a plurality of parallel lead type electronic components is used. By the way, in order to accurately and automatically insert an electronic component into a printed circuit board in an automatic insertion machine, accurate positioning of the electronic component is required. Therefore, the plurality of electronic components held in the electronic component series must already be positioned in appropriate postures while being held in the electronic component series.

For this purpose, electronic component chains are usually provided with some kind of holding means.

FIG. 1 is a partially cutaway plan view showing a part of an example of a conventional electronic component series. Referring to FIG. 1, a plurality of electronic components 3 are arranged in the length direction of a flexible elongated holding body 2 made of, for example, cardboard (in FIG. 1, for ease of understanding, , only a part of the state in which a series of electronic components 3 are held is shown). The parallel lead type electronic component 3 includes an electronic component element 4 and lead wires 5.6 drawn out in parallel from the electronic component element 4. A hole 7 is formed in the holder 2 at the center in the width direction, passing through an adhesive tape 8 which will be described later. The hole 1 is provided to engage a sprocket (not shown) during feeding of the electronic component series 1, and also functions as an index for achieving positioning on the printed circuit board in an automatic insertion machine. . Holder 2
An adhesive tape 8 is bonded to the lead wires 5 and 6 between them. The adhesive tape 8 achieves the holding of the parallel lead type electronic component 3 to the holder 2. When bonding the adhesive tape 8, the electronic component 3 is placed in advance in an appropriate posture required by the automatic insertion machine.

However, in the conventional electronic component assembly 1 shown in FIG. Even if they are arranged, there is a drawback that when bonding with the adhesive tape 8, the lead wires 5, 6 may be inadvertently bonded to the adhesive surface, and the electronic component 3 is likely to be displaced. Further, once the adhesive tape 8 is attached in a shifted state, the electronic component 3 is fixed in that state, and it becomes extremely difficult to correct its posture. Furthermore, the adhesive tape 8 occupies a considerable weight in the cost of the electronic component series 1, and therefore has the disadvantage of increasing the cost of the electronic component series 1.

By the way, when manufacturing the electronic components 3 used in the electronic component series 1, the same structure as that of the above-mentioned electronic component series is used. That is, a U-shaped lead wire is placed on a flexible elongated holder similar to the holder 2, and after positioning, the U-shaped lead wire is fixed with an adhesive tape, and then, for example, by soldering dip, etc. The electronic component 3 is manufactured by fixing electronic component elements to both open ends of the U-shaped lead wire, and finally cutting the curved portion of the U-shaped lead wire. As a means for holding this U-shaped lead wire to a holder, an adhesive tape is used as in the case of the electronic component series described above. In this case as well, the use of adhesive tape has the disadvantage that the cost of the electronic component increases by the cost of the adhesive tape, and it is extremely difficult to position and fix the electronic component using the adhesive tape.

Therefore, the main object of the present invention is to provide an inexpensive electronic component series in which parallel lead type electronic components can be easily positioned and securely held.

In summary, the present invention is an electronic component series in which lead wires placed on a long holding body are fixed with an adhesive.

The above objects and other objects and features of the present invention will become more apparent from the following detailed description with reference to the drawings.

FIG. 2 is a partially cutaway plan view showing a part of an embodiment of the present invention, and FIG. 3 is a partially sectional view taken along line 1--I in FIG. 2.

Referring to FIGS. 2 and 3, lead wires 15 and 16 of a plurality of parallel lead type electronic components 13 are mounted on a flexible elongated holder 12 made of, for example, cardboard. Layers 21, 22, which are in contact with each other, are arranged at regular intervals.
It is adhesively fixed by 23 and 24.

In the embodiment shown in FIGS. 2 and 3, the adhesive @
21, 22, 23, 24, the lead wires 15, 16 led out in parallel from the electronic component element 14 of the parallel lead type electronic component 13 are adhesively fixed to the holder 12, so even if it is slightly Even if the lead wires 15, 16 become misaligned, they can be easily corrected before the adhesive hardens, and they can also be automatically positioned by an automatic machine. Furthermore, compared to the conventional electronic component chain 1 shown in FIG. 1, since no adhesive tape 8 is used, the cost of the electronic component chain can be dramatically reduced.

FIG. 4 is a partially cutaway plan view showing a part of another embodiment of the invention. A feature of this embodiment is that the adhesive layer 25 is formed in a band shape in the longitudinal direction of the holder 12. That is, the lead wires 15 and 16 are made of the same adhesive-2
5 is continuously adhesively fixed. Forming the adhesive layer in the form of a strip is much easier than forming the adhesive layer locally and in dots as in the embodiment shown in FIG. 2, so the bonding process can be carried out more efficiently. obtain. Further, in the embodiment shown in FIG. 2, adhesive layers were formed on both ends of the holding body 12 in the width direction, but in the embodiment shown in FIG. Only one strip is formed near the edge on the 14 side. Thus, it will be appreciated that the adhesive layer may be formed at any location and may be provided to span and cover both leads 15, 16. Other points are the same as those of the embodiment described with reference to FIGS. 2 and 3, so corresponding reference numerals are given and explanation thereof will be omitted.

Note that as the adhesive for forming the adhesive layer, it is preferable to use an adhesive that is as far away as possible. For example, cyanoacrylate adhesives, silicone adhesives, epoxy adhesives,
A photocurable resin adhesive, a hot melt adhesive, or the like may be used. Among these adhesives, hot melt adhesives are prepared in advance into tape, linear, or
The lead wire 1 is formed into a label shape etc. and placed on the holder 12.
After being placed through 5.16, heating, melting and assimilation can be easily carried out.

As described above, according to the present invention, since the lead wires of the parallel lead type electronic component are fixed to the holder with adhesive, the position can be easily corrected before the adhesive is assimilated. Electronic components can be accurately and reliably positioned with respect to the holder. Furthermore, since an extremely inexpensive adhesive is used instead of the conventionally used adhesive tape, it is possible to effectively reduce the cost of electronic component series and parallel lead type electronic components.

Note that the present invention is not limited to electronic component series using completed electronic components, but can also be utilized in the manufacturing process of parallel lead type electronic components. That is, as mentioned above, in the conventional manufacturing process of electronic components, the U-shaped lead wire is held on something similar to a holding body using adhesive tape, but in this case, By adhering and fixing the U-shaped lead wire with an adhesive, it is possible to manufacture cheaper electronic components.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway plan view showing a part of a conventional electronic component series. FIG. 2 is a partially cutaway plan view showing a part of an embodiment of the present invention. Figure 3 is a degeneracy of Figure 2.
It is a partial sectional view along (2). FIG. 4 is a partially cutaway plan view showing a part of another embodiment of the invention. In the figure, 12 is a holding body, 13 is an electronic component, and 15
．． 16 is a lead wire, and 21, 22, 23, 24, and 25 are adhesive layers. Patent applicant Murata Manufacturing Co., Ltd. 451 Procedures Amendment (Method) May 1980
June 26th, Commissioner of the Patent Office, 1. Indication of the case, Patent Application No. 213266 of 1982, 2. Name of the invention, Electronic Components Series 3. Relationship with the person making the amendment. Address of the patent applicant: Inugami 2, Kyoto City, Chofuku, Kyoto Prefecture. Chome 26-10 Name (
623) Mura Co., Ltd. 1) Manufactured April 27, 1980 (shipment date) 5. Application to be amended ■ and the full text of the specification 6. Contents of the amendment (1) Engraving of the application (no change in content) 452-

Claims (1)

[Claims] It includes a flexible elongated holder, and parallel lead type electronic components distributed in the length direction of the holder, and the lead wire is adhesively fixed on the holder with an adhesive. Electronic components.