JPS5860599A - Electronic part assembly - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic component assembly suitable for supplying electronic components, particularly to a mounting device for electronic components having comb-shaped leads.

Conventional 1 flat package IC shown in Fig. 1 and 2
Comparatively small-sized ICs (hereinafter referred to as electronic components) using comb-shaped leads, such as the mini-package IC and 5OIC shown in the figure, are used with a mounting tool in devices that are mounted on a board that constitutes an electronic circuit. As shown in Fig. 3, there is a method of supplying electronic parts in an aligned manner using a vibrating feeder as shown in Fig. 4, or by aligning electronic parts as shown in Fig. 4.
There is a magazine method in which electronic components are taken out one by one, a carrier magazine method in which recesses are provided on the base at equal intervals as shown in Fig. 5, and electronic components are loaded and fed into the recesses, and a carrier magazine method in which electronic components are loaded and fed into the recesses as shown in Fig. 6. There is a tape method with storage holes in which storage holes are provided for storing electronic components and electronic components are loaded and supplied one by one into the storage holes.

However, the vibrating feeding method shown in Fig. 3 uses a vibrating feeder as a means for arranging the loose parts, but there are many problems such as the electronic parts becoming clogged or requiring a large space. Although the magazine feeding method shown in FIG. 4 can relatively reliably feed parts by using a push rod or the like, it has the disadvantage that it is generally not possible to increase the number of parts in stock. Still the 5th
The carrier magazine supply method shown in the figure provides a stable supply, but it requires a large carrier magazine for electronic components, and automatic supply of this carrier magazine still requires a large space and a complicated feeding device. There are drawbacks. Furthermore, in the tape supply method with storage holes shown in Fig. 6, although the supply is stable, electronic components cannot be removed from the storage holes.
When taking out individual leads, the comb-shaped leads come into contact with the storage hole and cannot be taken out, and even if they can be taken out, the comb-shaped leads are deformed and cannot be properly attached to the board. Furthermore, when mounting onto a board that makes up an electronic circuit, if an adhesive for temporary fixation is not applied to the board that makes up the electronic circuit in advance, the position of the electronic components may shift, making it impossible to mount them. There were drawbacks such as:

In order to eliminate these conventional drawbacks, the authors of the present invention have already proposed a method in which electronic components are loaded at regular intervals on a long strip material such as a tape to ensure continuous and stable supply.

The present invention has been made in order to be able to easily change the shape of the electronic components, mount them on a substrate constituting an electronic circuit, etc., in addition to the electronic component assembly of the invention proposed above.

An embodiment of the present invention will now be described with reference to the drawings. Figures 7 and 8 show an assembly of electronic components according to an embodiment of the present invention. This tape 1 has a reactive hot melt adhesive and a reactive adhesive (hereinafter referred to as adhesive) on one side.
2 are applied at equal intervals. The electronic components 3 are loaded one by one on the adhesive 2. Here, a releasable agent or the like is provided on the surface of the tape 1 on which the adhesive 2 is provided, and therefore the adhesive force between the electronic component 3 and the adhesive 2 is the same as that between the tape 1 and the adhesive 2. The adhesive strength has become much stronger.

゛ Furthermore, the tape 1 is provided with through holes 4 for loading electronic components 3 thereon.

According to this structure, by winding up the Qigu, a large number of parts storage areas are not required, and a large number of electronic parts 3 can be continuously and reliably fed using the through holes 4 provided at equal intervals. Also, when mounting the electronic component 3 externally,
Since the electronic components 3 are not covered with anything, they can be easily peeled off from the tape 1 by suction or mechanically, and can be reliably attached one by one. Furthermore, since the adhesive 2 is protruding above the surface of the comb 1, when the electronic component 3 is fixed to the adhesive 2, the comb-shaped lead of the electronic component 3 does not touch the comb-shaped lead. It will not transform. Therefore, even when mounting the electronic component 3 to the outside, accurate mounting is always possible. Furthermore, when the electronic component 3 is mounted on the substrate constituting the electronic circuit, the adhesive 2 is attached to the substrate constituting the electronic circuit in advance so that the electronic component 3 and the adhesive 2 are not integrated due to the difference in adhesive strength. Other embodiments of the present invention will be described with reference to FIGS. 9 and 10, with advantages such as no need to apply temporary fixing adhesive thereon. In this embodiment, holes 7 and 7I are provided through which the comb-shaped leads 9 and 9' of the electronic component 3 pass. According to this structure, even if the comb-shaped leads 9 and 9 degrees extend below the main body bottom surface 8 of the electronic component 3, if the thickness of the comb-shaped leads 9 and 1 are set in accordance with the extended dimension, the comb-shaped leads 9 and Electronic components 3 without deforming 9 degrees
．． can be supplied. As long as the size, shape, and spacing of the comb-shaped leads 9° and 9' of the electronic component 3 are still the same, the same tape 1. It is possible to use a tomb and adhesive 2, and there are effects such as great compatibility.

Furthermore, another embodiment of the present invention will be described with reference to FIGS. 11 and 12. In this embodiment, the adhesive 2 has a shape, a shape, and a shape. Electronic components of different sizes 10, 11, 12
. . . are loaded in the order in which they are attached to the outside. According to this structure, in addition to the effects described in the first embodiment shown in FIGS. 7 and 8,
By loading electronic components of different sizes and shapes onto the opposite tape 1 and adhesive 2, and by loading them according to the order in which they are attached to the outside,
A great effect is that electronic parts can be mounted easily and efficiently using one electronic component mounting device.

As described above, according to the present invention, electronic component 3.10.1
1.12 It is possible to provide a continuous and stable supply of..., and since the electronic parts and adhesive are integrated, it is possible to temporarily fix them to the board when mounting them on the board that makes up the electronic circuit. No need to apply adhesive.

Note that the present invention relates to electronic components 3, 10, 11, 12...
・Loading direction, holes 2, 7. This includes slight variations in the shape and position of y°, 20 types of adhesives, etc.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of a flat package IC, Fig. 2 is a perspective view of an IC called a MI package IC or SO package IC, Fig. 3 is a perspective view showing a conventional vibrating supply method, and Fig. 4 (, [Cross-sectional view showing Macazine, No. 6
The figure is a perspective view showing a carrier machining machine, FIG. 6 is a perspective view showing a tape with storage holes, FIG. Figure, No. 9
and FIG. 11 are top views showing other embodiments of the present invention;
FIG. 10 and FIG. 12 are the same sectional views. 1...Tape, 2...Adhesive, 3,10,1
1゜12...Electronic parts, 4...Through hole, 7
．． “…hole, agent’s name: Patent attorney Nakao
Toshio and 1 other person Figure 1 Figure 3 J Figure 4 Figure 5 Figure 6 Figure a 7th 8th cause 92 4/2 10th/

Claims (2)

[Claims] (1) Electronic components are loaded on the adhesive surface of the adhesive or adhesive of a strip-like elongated material having a plurality of adhesives or adhesives at equal intervals, and the adhesive surface of the electronic component is bonded to the adhesive or adhesive material. An electronic component assembly configured such that the adhesive force between the strip-like elongated material and the adhesive or adhesive is stronger than the adhesive force between the strip-like elongated material and the adhesive or adhesive. (2) The electronic component assembly according to claim 1, wherein the long strip material is provided with through holes for mechanical feeding in the longitudinal direction. (■ The electronic component assembly according to Claims 1 and 2, wherein the long strip material is provided with holes into which leads of electronic components are inserted.