JPS626360B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic component assembly suitable for supplying electronic components, particularly to a leadless type microelectronic component mounting apparatus.

Conventionally, leadless type microelectronic components, such as chip resistors and chip multilayer capacitors, have been supplied to the mounting tool using vibrations as shown in Figure 1 in equipment that is mounted on a substrate that constitutes an electronic circuit. There is a method for aligning and feeding bulk parts using a type feeder, or a magazine method for aligning microelectronic components horizontally or vertically and taking them out one by one as shown in Figure 2 A and B, and furthermore, as shown in Figure 3. There is a carrier magazine method in which recesses are provided at equal intervals in the base and microelectronic components are loaded and supplied into the recesses. However, in the vibrating feeding method shown in Figure 1,
Since a vibrating feeder is used as a means for arranging loose parts, there are many problems such as the vibration having an adverse effect on other parts, the need for a large space, and the parts getting stuck during chute. In addition, in the magazine feeding method shown in Figure 2, parts can be fed relatively reliably by using a push rod, etc., but it takes time to recover in the event of a jam.
Moreover, it has the disadvantage that it is generally not possible to increase the number of parts in stock. Furthermore, with the carrier magazine method shown in Figure 3, the supply is stable, but
A large carrier magazine is required for minute parts, and automatic feeding of this carrier magazine has the disadvantage of requiring a large space and a complicated feeding device.

The present invention aims at continuous and stable supply of microelectronic components by loading them on a long strip material such as tape at equal intervals.The present invention eliminates the drawbacks of the conventional electronic components and makes it possible to supply ideal components. It is an attempt to provide the body.

Hereinafter, the present invention will be explained based on examples and with drawings.

4 and 5 show an assembly of leadless type microelectronic components (hereinafter referred to as chip components) according to an embodiment of the present invention, and in the figures, 1 indicates a second
A tape with a case 2 as a first strip-shaped long material (hereinafter referred to as tape) has recesses 2' arranged at equal intervals on one side of the tape 1 for guiding and placing chip parts 3. Fixed by thermocompression bonding or mechanical bonding. The chip parts 3 are wrapped one by one in the recess 2', and the tape 1 is
and are stacked at equal intervals along the cased tape 2. In addition, through holes 4 are provided in the tape 1 and the cased tape 2 to accommodate the loading of chip parts 3.

According to this structure, if the tape 1 and the cased tape 2 are wound up, a large component storage area is not required, and a large number of chip components 3 can be reliably fed in succession by using the through holes 4 provided at equal intervals. In addition, when adhering the chip part 3 to the outside, no adhesive is used, so the chip part 3 and the case-attached tape 2 or the tape 1 are incorrectly adhered by the adhesive and cannot be removed. Make sure to separate the tape 1 from the cased tape 2 without causing problems such as
This has great effects such as being able to reliably take out the chip parts 3 one by one from the chip.

As described above, according to the present invention, the electronic component is simply held between the recess of the first strip-like elongated material and the second strip-like elongate material without being fixed with an adhesive. It is easy to take out the electronic components from the recess, and it is possible to continuously and stably supply the electronic components while maintaining a stable posture without inverting them within the recess. In addition, the feeding guide means provided on the long material allows each electronic component to be reliably fed into the machine.
Furthermore, since the first long strip material and the second long strip material are fixed by thermocompression bonding or mechanical bonding without using an adhesive, there is a gap between the electronic component and the two long materials. This allows reliable removal of parts without the problem of incorrect adhesion due to adhesive material flowing out.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of a parts feeder showing a conventional vibrating feeding method, Fig. 2 A and B are sectional views of a magazine also showing a magazine feeding method, and Fig. 3 is a carrier magazine showing a carrier magazine feeding method. FIG. 4 is a top view showing one embodiment of the electronic component assembly according to the present invention, and FIG. 5 is a sectional view thereof. 1... (second) belt-like long material, 2... (first
) band-shaped long material, 2'... recess, 3... chip parts, 4... feeding guide means (feeding hole).

Claims (1)

[Claims] 1. A first recess having a plurality of recesses arranged in a row for storing approximately rectangular parallelepiped electronic components with a slight gap between them.
and a second strip-shaped elongated material that is on one side of the first elongated strip material and can cover the opening of the recess, and an adhesive is provided in the recess. The electronic components are stored without
The long strip material and the second long strip material are fixed by thermocompression bonding or mechanical bonding without using an adhesive, and are removable. An electronic component assembly that is equipped with a corresponding mechanical feed guide means.