JPH08288690A - Electronic component supplying apparatus - Google Patents

Abstract

PURPOSE: To provide an electronic component supplying apparatus in which the component can be stably conveyed to the component taking-out position by eliminating the drop of the component from the conveying surface of an embossed carrier tape. CONSTITUTION: An apparatus for supplying an electronic component 18 to a predetermined chip type component taking-out position 11 by incorporating the component in the embossed mounting holes 17 arranged at equal intervals and conveying an embossed carrier tape 15 wound in a containing reel sealed by a top cover tape at a constant pitch has a recessed guide 16 matched to the holes 17 of the tape 15 near the position 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component supply device, and more particularly, to an embossed type carrier tape in which chip type electronic components such as resistors and capacitors are enclosed at predetermined intervals.
The present invention relates to an electronic component supply device that conveys and supplies at a constant pitch.

[0002]

2. Description of the Related Art An electronic component supply apparatus is used, for example, to automatically mount chip type electronic components on an electronic circuit board. The chip-type electronic components 45 are arranged at equal intervals in the respective embossing mounting holes 51 of the embossed type carrier tape 54 shown in FIG. 4, enclosed by a top cover tape 52, and wound around a storage reel 53. Is being supplied to. The electronic component supply device is configured to convey the carrier tape 54 thus formed at a constant pitch and supply the electronic component 45 to a predetermined component extraction position. Normally, as shown in FIG. 5, the electronic component supply device 61 has an X table 64 of the electronic component mounting device shown in FIG.
Are arranged side by side. Then, a predetermined electronic component is selected from the plurality of electronic component supply devices 61, and the selected electronic component 45 is mounted at a predetermined position on the electronic circuit board 65. In the electronic component mounting apparatus of FIG. 5, while feeding the carrier tape 54 at a constant pitch by the electronic component supply device 61, the electronic component is supplied to the vicinity of the component take-out position
The electronic component supplied to the component removal position is chucked by the mounting head 62. Moreover, by moving the mounting head 62 or the electronic circuit board 65 in the X and Y directions, the electronic component 45 can be mounted at a predetermined position on the electronic circuit board 65. Then, when each of the plurality of electronic components 45 is mounted at a predetermined position on the electronic circuit board 65, a predetermined circuit is formed on the electronic circuit board 65.

[0003]

However, in the conventional electronic component supplying apparatus 61, as shown in FIG. 6, the size of the concave groove 41a of the conveying surface 41 at the component take-out position P is the maximum. It is made according to the electronic components 45 of. For this reason, as illustrated in FIG. 6, when the electronic component 45 having the minimum size is supplied to the electronic component take-out position P,
The gap 43 between the transport surface 41 and the embossed mounting hole 42 of the embossed carrier tape 54 becomes large. Therefore, when the electronic component 45 is transported, the carrier tape 54 drops from the transport surface 41, so that the electronic component 45 falls in the direction of arrow Z in FIG. 6 and the electronic component 45 cannot be adsorbed by the mounting head 62 in FIG. Or the position accuracy of suction becomes low, or the electronic circuit board 6 of the electronic component 45
However, there was a defect that the mounting accuracy on the No. 5 device varied. Further, since it is necessary to prepare the electronic component supply device 61 having the concave groove 41a of the transport surface 41 that matches the size of the electronic component 45, the type of the electronic component supply device 61 There was a disadvantage that it would increase.

Therefore, the present invention has been made in order to solve the above problems, and it is possible to prevent an embossed type carrier tape from dropping from a conveying surface and to stably convey an electronic component to an electronic component taking-out position. It is intended to provide a component supply device.

[0005]

According to the invention of claim 1, an embossed type carrier tape in which electronic parts are housed in embossing mounting holes arranged at equal intervals and sealed with a cover tape. An electronic component supply device for feeding electronic components at a constant pitch to supply electronic components to a predetermined component extraction position, the electronic component supply device including a concave guide in the vicinity of the component extraction position, the concave guide being aligned with the embossing mounting hole of the carrier tape. Is achieved by

The above-mentioned object is, in the invention of claim 2,
In an electronic component supply device that conveys an embossed type carrier tape, in which electronic components are housed in embossed mounting holes arranged at equal intervals and sealed with a top cover tape, at a constant pitch and supplies electronic components to a predetermined component extraction position This is achieved by an electronic component supply device having a detachable concave guide that is fitted to the embossing mounting hole of the carrier tape near the component removal position.

[0007]

According to the first aspect of the present invention, by mounting the concave guide which is aligned with the embossing mounting hole of the carrier tape, it is possible to prevent the embossed carrier tape from dropping from the conveying surface. According to the second aspect of the present invention, by attaching the concave guide that is fitted to the embossing mounting hole of the carrier tape in a detachable manner, it is possible to prevent the embossed carrier tape from dropping from the conveying surface. Moreover, it is easy to replace the concave guide.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings. The examples described below are
Since it is a preferred specific example of the present invention, various technically preferable limitations are attached, but the scope of the present invention is, unless otherwise stated to limit the present invention, in the following description.
It is not limited to these modes.

FIG. 1 is a perspective view showing the external appearance of the electronic component supply apparatus of the present invention. In FIG. 1, the electronic component supply device 1 includes a transfer surface 12, a base chassis 13, and a storage reel 1.
4, an embossed type carrier tape 15, a component take-out position 11 and the like.

The storage reel 14 is a reel in which the embossed type carrier tape 15 is wound and stored. As shown in FIG. 1, this embossed type carrier tape 15 stores a chip type electronic component 18 in each embossed mounting hole 17,
It is a tape in which the electronic component 18 is enclosed by a top cover 28. FIG. 3 shows a sectional structure of the component take-out position 11 on the transport surface 12. That is, FIG. 3 shows the arrow A- in FIG.
FIG. 6 is a cross-sectional view of the base chassis 13 taken along the line A. The transfer surface 12 of the base chassis 13 has a groove 12a along the longitudinal direction of the transfer surface 12 as shown in FIG. A concave guide 16 having a concave cross section as shown in FIGS. 2 and 3 is preferably removably mounted near the component take-out position 11 on the conveying surface 12. The concave guide 16 has a bottom portion 16a, and has a shape substantially matched with the embossing mounting hole 17 of the embossing type carrier tape 15 into which various electronic components 18 are inserted.

The electronic component 18 stored in the embossed carrier tape 15 pulled out from the storage reel 14 of FIG.
Is transported in the direction of arrow Y at a constant pitch along the transport surface 12 to the component take-out position 11. At this time, as shown in FIG. 3, the concave guide 16 has the embossed carrier tape 1
Since the shape is matched with the embossing mounting hole 17 of No. 5, the embossed type carrier tape 15 does not drop from the conveying surface 12,
The electronic component 18 does not fall, and the electronic component 18 is transferred onto the transport surface 12
It is possible to stably convey the parts up to the position 11 for taking out the parts. That is, since the gap 19 between the embossing mounting hole 17 of the embossed carrier tape 15 and the bottom portion 16a of the concave guide 16 is small, the electronic component 18 is prevented from falling from the transport surface 12 side to the base chassis 13 side. is there. As described above, in the embodiment of the present invention, the carrier tape 15 containing the electronic components is conveyed at a constant pitch and supplied to the predetermined component removal position 11. In this case,
Since the concave guide 16 matching the size of the electronic component 18 is preferably detachably arranged near the component take-out position 11, the electronic component 18 is attached to the base chassis 1.
It is possible to prevent the electronic component 18 from dropping to the 3 side and stably supply the electronic component 18 to the component removal position 11.

As shown in FIGS. 2 and 3, in the electronic component supply apparatus of the present invention, the concave guide 16 has a substantially U-shaped cross section, but the invention is not limited to this. Other cross-sectional shapes can be adopted according to the shape of the embossed carrier tape 15.

Further, since the concave guide 16 having various concave grooves 16b corresponding to the size of various electronic components can be removably arranged on the base chassis 13, it is possible to supply the electronic components to be supplied. Even if the sizes are different, it is possible to deal with it by preparing a concave guide 16 that matches the size in advance. Therefore, if a plurality of types of concave guides are prepared, it is possible to supply electronic components of various sizes without preparing a large number of electronic component supply devices as in the conventional case. As a result, the types of electronic component supply devices can be unified, and the cost can be reduced. Moreover, when the electronic components of different sizes are transported, the carrier tape does not drop from the transport surface, and the electronic components can be stably transported to the component removal position. Thus, if the electronic components are sucked and held and mounted on, for example, an electronic circuit board, the accuracy of the electronic component suction rate and the suction position or the mounting accuracy of the electronic component on the electronic circuit board should be improved. You can

The present invention is not limited to the above embodiment. Although the above-described embodiments show the case where chip-type electronic components such as capacitors and resistors are transported and supplied, the present invention is not limited to this, and can be applied to the case where carrier-type electronic components other than chip-type are transported and supplied. .

[0015]

As described above, according to the present invention, the embossed carrier tape is prevented from falling from the conveying surface,
The electronic component can be stably transported to the electronic component take-out position.

[Brief description of drawings]

FIG. 1 is a perspective view showing a preferred embodiment of an electronic component supply device of the present invention.

FIG. 2 is a perspective view showing a concave guide arranged in the vicinity of a component take-out position of the electronic component supply device of FIG.

FIG. 3 is a cross-sectional view taken along the line AA of FIG. 1 showing an example in which a concave guide is attached to the base chassis of the electronic component supply device.

FIG. 4 is a perspective view showing a commonly used embossed carrier tape and reel.

5 is a perspective view showing an electronic component mounting device provided with a plurality of electronic component supply devices for the carrier tape of FIG.

FIG. 6 is a cross-sectional view in the vicinity of a component take-out position in a conventional electronic component supply device.

[Explanation of symbols]

 11 Parts Extraction Position 12 Transport Surface 13 Base Chassis 14 Storage Reel 15 Embossed Carrier Tape (Carrier Tape) 16 Recessed Guide 17 Embossed Mounting Hole 18 Electronic Component 19 Gap 28 Top Cover Tape (Cover Tape)

Claims (2)

[Claims] 1. An embossed type carrier tape, in which electronic components are housed in embossed mounting holes arranged at equal intervals and sealed with a cover tape, is conveyed at a constant pitch to supply the electronic components to a predetermined component take-out position. The electronic component supply device is characterized in that a concave guide that matches the embossing mounting hole of the carrier tape is provided near the component take-out position. 2. An embossed type carrier tape in which electronic components are housed in embossed mounting holes arranged at equal intervals and sealed with a cover tape is conveyed at a constant pitch to supply the electronic components to a predetermined component take-out position. The electronic component supply device is provided with a detachable concave guide that is fitted to an embossing mounting hole of a carrier tape near a component extraction position.