JP2807018B2 - Tape-like electronic component assembly - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape-shaped electronic component assembly, and more particularly to a DIPI
The present invention relates to a tape-shaped electronic component assembly which can be suitably applied to an electronic component having a relatively large size, such as an IC socket, a resistor network, and a lead terminal protruding in a direction perpendicular to the bottom of a main body.

2. Description of the Related Art Conventionally, among electronic components, odd-shaped components with lead terminals and the like have been manually mounted on a printed circuit board. In recent years, such electronic components have also been automatically inserted into the printed circuit board by automatic insertion. There is a trend to increase the automation rate of mounting work.

There is a serious problem in the method of supplying such irregularly shaped parts when automating the mounting of the parts, and the problems have been conventionally solved by various methods.

For example, as shown in FIG. 9, as a supplying means of the small DIPIC 41, the DIPIC 41 is housed in the stick 42, the stick 42 is stacked and held in the magazine holder 43, and the lowermost stick 42 is sequentially placed in a predetermined position. The DIPIC 41 in the stick 42 is slid down along the chute 44, separated from the end of the chute 44 by the escape 45 one by one, and the DIPIC 41 on the escape 45 is dropped.
There is known a configuration in which the chuck unit 46 is taken out by a chuck unit 46 and mounted on a printed circuit board.

Also, as shown in FIGS. 12 to 14, connector 51, DI
Connect PIC61, transformer 71, etc. to their lead terminals 52, 62, 72
15 (a), (b), and (c) as a component assembly by sandwiching the
As shown in the figure, switch 81 and its terminal 82
It is known that a component assembly is formed by penetrating and holding the component through an 83.

However, in the configuration of FIG. 9, the DIPIC 41 does not take the normal posture in the stick 42 as shown in FIG.
As shown in the figure, the posture may be inclined, and the sticking in the stick 42 may cause a transfer failure to the chute 44. Also shoot as in stick 42
In some cases, parts may be overlapped inside the part 44, or the posture of the parts on the escape 45 may become unstable. Furthermore, the use of various sticks 42 for each component manufacturer may cause problems such as falling in the magazine holder 43 and clogging when the sticks 42 drop due to variations in the external dimensional accuracy. And so on.

Also, a tape-shaped backing sheet 53 as shown in FIGS. 12 to 14,
In the case where the lead terminals 52, 62, 72 are sandwiched by using 63, 73, there is a problem that the supply posture is unstable, and it is difficult to separate them from the backing paper. Even when the lead terminals 82 are inserted into the mount 83, there is a problem that the lead terminals 82 may be bent or parts may come off when wound around a reel or the like.

SUMMARY OF THE INVENTION In view of the above-mentioned conventional problems, the present invention provides a tape-shaped electronic device that can reliably position electronic components while protecting their lead terminals while protecting the lead terminals, and is easy to take out, and can supply highly reliable components. An object is to provide a component assembly.

Means for Solving the Problems In order to achieve the above object, the present invention provides a plurality of lead terminals having an accommodation space for accommodating an electronic component protruding downward from each of both sides of the main body, and transporting and positioning. A holding tape formed of a long band having a feed hole for use therein, and a cover tape formed of a long band for covering the opening of the housing space portion and preventing detachment of the housed electronic components. A support base for substantially supporting the main body of the electronic component, a lead terminal receiving recess for receiving a plurality of lead terminals of each of the electronic components in a non-ground state on both sides of the support base, and a lead terminal receiving recess formed therein. And restricting projections for restricting the movement of the lead terminals in the direction in which the lead terminals are arranged.

According to the configuration of the present invention, in the housing space, the electronic component is supported on the support base, and the lead terminal is housed in the lead terminal housing recess in a non-grounded state. The lead terminal is accommodated in a protected state, the position of the lead terminal in the direction in which the lead terminals are arranged is regulated by the regulating protrusion, and the detachment of the electronic component is prevented by the cover tape. As a result, the electronic component is securely held in a state where the lead terminals are not damaged and the position is accurately regulated, and can be easily taken out by removing the cover tape.

Embodiment An embodiment of the present invention will be described below with reference to FIGS.

1 and 2, reference numeral 1 denotes a DIPIC as an example of an electronic component, and a plurality of lead terminals 3 protrude downward from both sides of the elongated main body 2 in the longitudinal direction. The DIPIC 1 is accommodated in an accommodation space 5 formed by embossing the holding tape 4 at a predetermined pitch in the longitudinal direction. On both sides of the holding tape 4, feed holes 6 are formed at predetermined pitches for engagement with feed claws formed on the outer periphery of the ratchet wheel for carrying and positioning. A support base 7 for mounting and supporting the main body 2 of the electronic component 1 over the entire width is formed at a central portion in the longitudinal direction of the holding tape 4 in the housing space portion 5, and the lead terminals 3 are housed and protected on both sides thereof. A lead terminal receiving recess 8 is formed. The lead terminal 3 is accommodated in the lead terminal accommodating recess 8 in a non-grounded state. At an appropriate place in the lead terminal accommodating recess 8, a fourth
As shown in detail in the figure, a regulating projection 9 formed by projecting a bottom wall toward the inside is provided, and a lead terminal regulating hole 10 into which the lead terminal 3 is fitted is drilled at the top.
On the upper surface of the holding tape 4, the DIPIC1
A cover tape 11 made of a thin long body is fixed so as to cover at least a part of the opening of the accommodation space 5 in order to prevent detachment.

Next, the configuration of the component supply unit using the above-described tape-shaped component assembly will be described with reference to FIGS. 1 and 2. The tape guide groove 12 is provided along the transport path of the holding tape 4. And a ratchet wheel 13 that engages with the feed hole 6 near the component supply position to perform transport driving and positioning.
And a holding tape 4 at a component supply position.
A support piece 14 that supports the bottom surface of the support base 7 from below to secure the height position of the DIPIC 1 is disposed at a lower portion of the lower part of the table. Reference numeral 15 denotes a cylinder for driving the support piece 14 up and down. Then, the DIPIC 1 housed in the housing space 5 with the lead terminal 3 positioned by being fitted into the lead terminal regulating hole 10 is sandwiched by the chuck means 16 and taken out, and is directly mounted on a printed circuit board. It is configured as follows. Further, a means (not shown) for pulling the cover tape 11 upward and separating it from the holding tape 4 is provided at a position before the component supply position.

FIG. 3 shows a configuration of a component supply unit in a parts cassette in which a holding unit for a tape-shaped component assembly and a component supply unit are unitized, and the basic configuration is the same as FIGS. 1 and 2; The description of the common parts is omitted. The support piece 14 has a hanging shaft portion 14a supported by a bush 17 so as to be able to move up and down and is urged downward by a spring 18, and swings in conjunction with a pitch feeding operation of the holding tape 4 by the ratchet wheel 13. The operation lever 19 is configured to be able to be lifted.

Next, the component supply operation will be described with reference to FIG. 1, FIG. 2, and FIG. The tape-shaped component assembly is intermittently transported by the ratchet wheel 13 engaged with the feed hole 6 while being guided by the tape guide groove 12, and the cover tape 11 is peeled off at a position before the component supply position. Thus, the DIPIC 1 accommodated in the accommodation space 5 of the holding tape 4 is supplied to the component supply position while being positioned at the lead terminal regulating hole 10. At the part supply position, DIPIC1
The support piece 14 is moved up by the cylinder 15 or the operation lever 19 before the pinching operation, and supports the force pressed from above when the DIPIC 1 is pinched, thereby securing the pinching position of the lead terminal 3. Thereafter, the lead terminal 3 of the DIPIC 1 in the accommodation space 5 is directly sandwiched and taken out by the chuck means 16, and the process proceeds to a process of mounting the printed circuit board. After the DIPIC 1 is taken out by the chuck means 16, the support piece 14 immediately descends, and the above operation is repeated.

In the above description, as the configuration of the position restricting portion of the lead terminal 3, as shown in FIG.
Although an example in which 10 is formed is shown, as shown in FIG. 5, one or a plurality of lead terminals 3 may be sandwiched and positioned between a pair of restricting projections 9a and 9b. As shown in (1), the regulating protrusion 9 may be formed so as to fit between the pair of adjacent lead terminals 3 and engage with both.

In the above description, the case where the electronic component is DIPIC1 has been described as an example.
As shown in the figure, a tape-shaped electronic component assembly can be formed using the holding tape 4 and the cover tape 11 having the same configuration.

Further, since the above-mentioned tape-like electronic component assembly is a tape-like body, it can be wound around the reel 22 as shown in FIGS. 8 (a) and 8 (b), and as a result, more space can be obtained in a compact space. The electronic components can be stocked, can be easily mounted on a parts cassette as shown in FIG. 3, and can be easily and reliably pulled out.

Effect of the Invention According to the present invention, even when wound on a reel, the electronic component can be securely held in a state where the lead terminals are not damaged and the position is accurately regulated, and by removing the cover tape, Since electronic components can be easily removed with their position accurately controlled, there is no problem such as clogging of components or instability of component supply posture, even for odd-shaped components, realizing reliable component mounting. It has the effect of being able to do it.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a state in which an electronic component is taken out of a tape-shaped electronic component assembly according to an embodiment of the present invention, FIG. 2 is a sectional view taken along the line II-II of FIG. 1, and FIG. FIG. 4 is a longitudinal sectional front view showing a state in which the tape-like electronic component assembly is applied to a cassette, and FIG.
6 and 7 are sectional views similar to FIG. 4 of the modified embodiment,
8 (a) and 8 (b) are a front view and a side view in a state of being wound on a reel, FIG. 9 is a front view showing a schematic configuration of a conventional example, and FIG.
10 is a sectional view taken along the line XX of FIG. 9, FIG. 11 is a sectional view similar to FIG. 10 showing the trouble state, FIGS. 12 to 14 are perspective views of other conventional examples, respectively. 15 (a), (b),
(C) is a plan view, a front view, and a side view of still another conventional example. 1 DIPIC 3, 33 Lead terminal 4 Retaining tape 5, 35 Housing space 6 Feed hole 9, 9a, 9b Regulatory protrusion 10 Lead terminal restrictor hole 11 Cover Tape 21 IC socket 31 Resistor network 37 Hold-down hole.

──────────────────────────────────────────────────続 き Continuation of front page (72) Inventor Akio Yamagami 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-62-235075 (JP, A) JP-A-62- 271858 (JP, A) JP-A-62-128599 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H05K 13/02

Claims (1)

(57) [Claims] A plurality of lead terminals each have an accommodation space for accommodating an electronic component protruding downward from each side of the main body, and are formed of a long strip having a feed hole for carrying and positioning. A support tape that includes a holding tape and a long band cover tape that covers the opening of the housing space portion and prevents the electronic component housed therein from coming off, and the support space portion substantially supports a main body of the electronic component. And a lead terminal receiving recess for receiving a plurality of lead terminals of each of the electronic components in a non-ground state on both sides of the support base, and a lead terminal receiving recess formed in the lead terminal receiving recess to move the lead terminals in the lead terminal row setting direction. A tape-shaped component assembly provided with a regulating projection for regulating.