JPS6221037Y2 - - Google Patents

Description

Detailed Description of the Invention This invention relates to an automatic electronic component assembly device that automatically mounts chip-type electronic components such as chip-type resistors and chip capacitors in predetermined positions on a printed circuit board.

In general, tape for enclosing chip-shaped electronic components has concave portions formed at a constant pitch, as shown in Figure 1 A and B.
The electronic component 5 is inserted into the recess 1 and enclosed by the cover tapes 3 and 4. Conventionally, in an electronic component automatic assembly apparatus, after peeling off the cover tape 3 on the surface, the chip-shaped electronic component 5 was sucked up by a vacuum chuck and mounted on a predetermined position on a printed circuit board.

However, when removing electronic components from the tape, simply sucking them up with a vacuum chuck as in the past may result in the electronic components being stuck to the tape, or
If the tape has burrs or the like, it is particularly difficult to take out the electronic component in a normal position.

In view of these points, the present invention provides a new electronic component automatic assembly device that can reliably take out chip-shaped electronic components from a tape.

Embodiments of the present invention will be described below with reference to the drawings.

In FIG. 2, 7 is a tape in which chip-shaped electronic components 5 are enclosed at approximately equal intervals, 8 is a tape reel on which the tape 7 is wound, and 9 is a tape feed hole provided in the tape 7 (FIG. 1). 11 is a gear that meshes with gear 9; 12 is a friction drum that rotates together with gear 11;
13 is a friction rotary disk whose surface is made of rubber and is pressed against the friction drum 12 by a spring 14; 15 is a cover tape take-up reel that rotates together with the friction rotary disk 13 and winds up the cover tape 3 on the surface; 16 is a cover tape 3 A tape peeling board that serves as a fulcrum when peeling off the
Further, 17 is a feed lever for feeding the gear 9 by a predetermined pitch by a gear feed pawl 18, 20 is a positioning pawl for fixing the rotational position of the gear 9 with a spring 21, and 22
23 is a vacuum chuck that sucks up chip-shaped electronic components by lifting and lowering operations; 23 is a vacuum chuck that sucks up chip-shaped electronic components 5 from the back side of the tape 7 in response to the lifting and lowering of the vacuum chuck 22;
This is a push-up pin with a sharp tip that pushes up.

Therefore, since the tape 7 wound on the tape reel 8 has the tape feed hole 6 engaged with the pin 10, when the feed lever 17 is pushed down, the gear 9 moves by one pitch to the right (arrow direction), and the tape 7 is also fed by one pitch. At the same time, the gear 11 rotates to the left (in the direction of the arrow), and the friction drum 12 and friction rotary disk 13 rotate.
The tape reel 15 is rotated clockwise due to the frictional force between the tape 7 and the cover tape 3 on the surface of the tape 7.
is peeled off using the tape peeling plate 16 as a fulcrum, and is wound onto the cover tape take-up reel 15. The chip-shaped electronic component 5 is then pushed up by the push-up pin 23, sucked up by the vacuum chuck 22, and taken out from the tape 7.

The operation of the vacuum chuck 22 and push-up pin 23 when the chip-shaped electronic component 5 is taken out will be described in detail below with reference to FIGS. 3A to 3D.

First, as shown in FIG. 3A, the vacuum chuck 22 descends onto the surface of the chip-shaped electronic component 5 from which the cover tape 3 has been peeled off. Then, as shown in FIG. 3B, the push-up pin 23 rises, breaks through the cover tape 4 on the back side of the tape 7, and comes into contact with the bottom surface of the chip-shaped electronic component 5. Then, as shown in FIG. 3C, the chip-shaped electronic component 5 is pushed up by the push-up pin 23 while being held by the vacuum chuck 22. When the push-up pin 23 reaches a predetermined position, it stops rising and then descends to prepare for the next operation. On the other hand, the vacuum chuck 22 further rises with the chip-shaped electronic component 5 attached to its tip, and then moves onto the printed circuit board and mounts the chip-shaped electronic component 5 at a predetermined position (FIG. 3D).

As described above, the electronic component automatic assembly device according to the present invention pushes up the chip-shaped electronic component through the bottom surface in response to the lifting and lowering of the vacuum chuck, so the electronic component can be reliably taken out from the tape, and therefore the printed circuit board can be removed. This has a great effect on improving the reliability of mounting electronic components on the device.

In this embodiment, the number of push-up pins is one, but a plurality of push-up pins may be used so that force is applied to the entire chip-shaped electronic component.

[Brief explanation of drawings]

Figure 1 A and B are diagrams showing a tape encapsulating chip-shaped electronic components, Figure 2 is a schematic diagram showing an embodiment of the electronic component automatic assembly device according to the present invention, and Figure 3 A to D are vacuum chucks and push-up. FIG. 3 is an explanatory diagram of pin operation. Explanation of main drawing numbers, 1... recess, 2... base tape, 3, 4... cover tape, 5... chip-shaped electronic component, 6... tape feed hole, 7... chip-shaped electronic component enclosed tape, 8...tape reel, 9, 11...gear, 12...friction drum, 1
3... Friction rotary disk, 15... Cover tape take-up reel, 16... Tape peeling plate, 17... Feed lever, 22... Vacuum chuck, 23... Push-up pin.

Claims (1)

[Scope of utility model registration request] a tape feeding mechanism that feeds out a tape in which chip-shaped electronic components are enclosed at approximately equal intervals at a predetermined pitch;
The vacuum chuck includes means for peeling off the surface side cover tape of the tape and a vacuum chuck for taking out the chip-shaped electronic component from the tape by lifting and lowering operations, and automatically mounts the electronic component at a predetermined position on the printed circuit board. An electronic component automatic assembly apparatus comprising: a push-up mechanism having a sharp tip that responds to the lifting and lowering of the vacuum chuck to break through the back side of the tape and push up the electronic component. Automatic assembly equipment.