KR200328632Y1 - Apparatus for transferring carrier tape - Google Patents
Apparatus for transferring carrier tape Download PDFInfo
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- KR200328632Y1 KR200328632Y1 KR20-2003-0022691U KR20030022691U KR200328632Y1 KR 200328632 Y1 KR200328632 Y1 KR 200328632Y1 KR 20030022691 U KR20030022691 U KR 20030022691U KR 200328632 Y1 KR200328632 Y1 KR 200328632Y1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
본 고안은 전자부품이 수납된 캐리어테이프의 이송부재에 관한 것으로, 그 목적은 별도의 캐리어테이프용 릴 패키지 제품 없이 작업시 유실되거나 남은 여분의 자재를 회수하여 사용함으로써, 샘플제작이나 소량생산시 작업 공수를 줄여 생산성 증대를 달성할 수 있을뿐만 아니라 적은 수량의 전자부품 장착시 수작업으로부터 발생되는 불량률을 제로화할 수 있는 캐리어테이프의 이송부재를 제공함에 있다.The present invention relates to a transfer member of a carrier tape in which electronic components are stored. The purpose of the present invention is to collect and use extra materials lost or left during work without a separate reel package product for a carrier tape, so that the work can be performed during sample production or small quantity production. The present invention provides a carrier tape conveying member that can reduce productivity and achieve productivity gains, as well as zero a defect rate caused by manual operation when mounting a small number of electronic components.
상기 목적을 달성하기 위한 본 고안은 전자부품 수납용 엠보스 부(embossed portion) 및 피치홀(pitch hole)이 소정의 간격으로 배열된 캐리어테이프의 이송을 가이드하기 위해 띠 형태의 직사각판 형상으로 양측단부가 'ㄷ' 자 형상으로 절곡되어 캐리어테이프의 상단에 길이방향으로 결합되는 것을 요지로 한다.The present invention for achieving the above object is in the form of a rectangular plate in the form of a strip to guide the transfer of the carrier tape in which the embossed portion and pitch holes for electronic component storage are arranged at predetermined intervals. The end is bent in the '' 'shape is to be coupled to the longitudinal direction on the top of the carrier tape.
Description
본 고안은 전자부품이 수납된 캐리어테이프의 이송부재에 관한 것으로, 보다 상세하게는 전자부품 수납용 엠보스 부(embossed portion) 및 피치홀(pitch hole)이 소정의 간격으로 배열된 캐리어테이프의 이송을 가이드하기 위해 띠 형태의 직사각판 형상으로 양측단부가 'ㄷ' 자 형상으로 절곡되어 캐리어테이프의 상단에 길이방향으로 결합되는 캐리어테이프 이송부재에 관한 것이다.The present invention relates to a transfer member of a carrier tape in which electronic components are housed. More specifically, transfer of a carrier tape in which an embossed portion and a pitch hole for storing electronic components are arranged at predetermined intervals. It relates to a carrier tape conveying member which is bent in the shape of a strip-shaped rectangular plate in order to guide the both ends of the 'c' shape is coupled to the top of the carrier tape in the longitudinal direction.
캐리어테이프는 운송 및 저장 중에 물리적인 힘으로부터 IC 및 전기, 전자 부품을 보호하기 위한 포장재로써, 전자부품이 수납되는 엠보스 부(embossed portion)와 이송을 위한 피치홀(pitch hole)이 길이방향을 따라 소정간격으로 형성되어 띠 형상을 이루고 있으며, 개구된 엠보스 부 상단으로 투명한 비닐 재질 등의 커버 테이프가 부착되어 있다.Carrier tape is a packaging material that protects IC, electrical and electronic parts from physical force during transportation and storage. The embossed portion for storing electronic parts and the pitch hole for conveying Accordingly, the tape is formed at a predetermined interval to form a strip shape, and a cover tape such as a transparent vinyl material is attached to the upper portion of the open embossed portion.
이러한 캐리어테이프(10)는 도 4에 도시한 바와 같이, 중앙부에 회전축(31)이 형성된 릴(reel)(30)에 권취되어 하나의 패키지(package) 상품으로 거래 및 사용된다.As shown in FIG. 4, the carrier tape 10 is wound on a reel 30 having a rotation shaft 31 formed in the center thereof, and used as a packaged product.
이처럼 캐리어테이프가 권취된 릴(30)은 이송장치인 칩마운터(chip mounter) (90) 일측에 장착되고, 캐리어테이프(10)의 피치홀이 칩마운터의 피더(feeder)(80) 상에 구비된 걸림돌기에 위치하게되어 상기 캐리어테이프(10)는 인쇄회로기판(PCB) 상에 수납된 전자부품을 장착(Pick and Place)하는 자동조립기(40)가 위치하는 지점으로 이송된다.The reel 30 wound around the carrier tape is mounted on one side of a chip mounter 90 which is a transfer device, and the pitch hole of the carrier tape 10 is provided on the feeder 80 of the chip mounter. The carrier tape 10 is transferred to a point where the automatic assembly 40 for picking and placing electronic components stored on a printed circuit board (PCB) is positioned.
이때, 피더(80)에 구비된 캐리어테이프 고정부재(70)에 의해 커버테이프(50)가 커버테이프용 릴(60)에 권취되며, 캐리어테이프(10)의 엠보스 부가 개방되게 되는 것이다.At this time, the cover tape 50 is wound around the reel 60 for the cover tape by the carrier tape fixing member 70 provided in the feeder 80, and the embossed portion of the carrier tape 10 is opened.
이와 같이 전자부품이 수납된 캐리어테이프가 권취된 릴 패키지 제품은 동일한 전자부품이 많이 소요되는 PCB 제품 등을 조립 및 생산하는데에 매우 유용하나, 샘플제작이나 소량의 PCB 제품 생산에 있어서는 소요되는 전자부품에 따라 작업자가 캐리어테이프가 권취된 릴을 매번 교체해 주어야 하는 번거로움이 있다.The reel package product in which the carrier tape containing the electronic components is stored is very useful for assembling and producing PCB products that require many of the same electronic parts, but the electronic parts required for sample production or production of small quantities of PCB products. As a result, the worker has to change the reel on which the carrier tape is wound each time.
또한, 일반적인 제품 조립 및 생산에 있어서 적은 수량의 전자부품이 필요한 경우에도 작업자가 직접 별도의 캐리어테이프용 릴 패키지 전체를 교체해야하므로, 이로 인한 공수가 증가되어 생산성이 저하되는 문제점이 있는 것이다.In addition, even if a small number of electronic components are required for assembly and production of a general product, the operator must directly replace the entire reel package for a separate carrier tape, thereby increasing the number of labors resulting in a decrease in productivity.
한편, 소규모의 산업장에서는 적은 수량의 전자부품을 장착할 경우 작업자가 수작업으로 행하는 경우가 허다하여 완제품의 불량률이 높아 생산효율이 떨어지는 문제점도 있다.On the other hand, in small industrial sites, when a small number of electronic components are mounted, the worker is often performed by hand, and thus there is a problem in that the production efficiency is lowered because the defective rate of the finished product is high.
더욱이, 이와 같은 작업공정에서 캐리어테이프로부터 떨어진 전자부품이나 기타 작업수행이 곤란할 정도로 캐리어테이프용 릴에 잔존하는 부재의 경우 재사용이 제한되는 문제점이 있다.In addition, in such a work process, there is a problem in that reusability is limited in the case of a member remaining in the reel for the carrier tape to the extent that it is difficult to perform an electronic component or other work away from the carrier tape.
본 고안은 상기와 같은 문제점을 해결하기 위해 안출된 것으로, 별도의 캐리어테이프용 릴 패키지 제품 없이 작업시 유실되거나 남은 여분의 자재를 회수하여 사용함으로써, 샘플제작이나 소량생산시 작업 공수를 줄여 생산성 증대를 달성할 수 있을뿐만 아니라 적은 수량의 전자부품 장착시 수작업으로부터 발생되는 불량률을 제로화할 수 있는 캐리어테이프의 이송부재를 제공함을 목적으로 한다.The present invention was devised to solve the above problems, and by using the retrieval material lost or left during work without a separate reel packaged product for carrier tape, it increases productivity by reducing the number of work during sample production or small quantity production. It is an object of the present invention to provide a conveying member of a carrier tape that can achieve not only and achieve zero defect rate resulting from manual operation when mounting a small quantity of electronic components.
도 1 은 본 고안에 의한 캐리어테이프 이송부재의 사시도1 is a perspective view of a carrier tape transfer member according to the present invention
도 2 는 본 고안에 의한 캐리어테이프 이송부재의 단면도2 is a cross-sectional view of the carrier tape transfer member according to the present invention
도 3 은 본 고안에 의한 캐리어테이프 이송부재의 사용 상태도Figure 3 is a state of use of the carrier tape transfer member according to the present invention
도 4 는 종래의 캐리어테이프 이송수단의 사용 상태도.4 is a state diagram used in the conventional carrier tape transfer means.
<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>
10 : 캐리어 테이프 11 : 엠보스 부10: carrier tape 11: embossed portion
12 : 피치 홀 20 : 캐리어 테이프 이송부재12: pitch hole 20: carrier tape transfer member
30 : 캐리어 테이프용 릴 31 : 회전축30 reel for carrier tape 31: rotating shaft
40 : 전자부품 자동 조립기 50 : 커버테이프40: automatic assembly of electronic parts 50: cover tape
60 : 커버테이프용 릴 61 : 회전축60: cover tape reel 61: rotating shaft
70 : 캐리어 테이프 고정부재70 carrier carrier fixing member
80 : 피더(feeder)80 feeder
90 : 칩마운터(chip mounter)90 chip mounter
상기의 목적을 달성하기 위한 본 고안의 캐리어테이프 이송부재는 전자부품 수납용 엠보스 부(embossed portion) 및 피치홀(pitch hole)이 소정의 간격으로 배열된 캐리어테이프의 이송을 가이드하기 위해 띠 형태의 직사각판 형상으로 양측단부가 'ㄷ' 자 형상으로 절곡되어 캐리어테이프의 상단에 길이방향으로 결합된다.Carrier tape conveying member of the present invention for achieving the above object is in the form of a band to guide the transfer of the carrier tape in which the embossed portion and pitch holes for the electronic component storage arranged at predetermined intervals Both sides of the rectangular plate shape is bent in the '' 'shape is coupled in the longitudinal direction to the top of the carrier tape.
한편, 상기 'ㄷ'자 형상으로 절곡된 양측 단부는 캐리어테이프의 엠보스 부 및 피치 홀에 간섭을 주지 않도록 소정의 길이만큼 절곡되는 것이 바람직하다.On the other hand, the both ends bent in the '' 'shape is preferably bent by a predetermined length so as not to interfere with the embossed portion and the pitch hole of the carrier tape.
또한, 상기 캐리어테이프 이송부재는 투명 또는 불투명한 합성수지 재질로 이루어지되 표면저항률이 1×1011Ω 이하인 것이 바람직하다.In addition, the carrier tape conveying member is made of a transparent or opaque synthetic resin material, the surface resistivity is preferably 1 × 10 11 × or less.
이하, 본 고안의 바람직한 실시예를 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in detail.
도 1 은 본 고안에 의한 이송부재에 캐리어테이프가 결합된 사시도이고, 도 2 는 본 고안에 의한 캐리어테이프 이송부재의 단면도이다.1 is a perspective view of a carrier tape coupled to a transfer member according to the present invention, Figure 2 is a cross-sectional view of the carrier tape transfer member according to the present invention.
도 1에 도시한 바와 같이, 본 고안의 캐리어테이프 이송부재(20)는 전자부품 수납용 엠보스 부(embossed portion)(11) 및 피치홀(pitch hole)(12)이 소정의 간격으로 배열된 캐리어테이프(10)의 이송을 가이드하기 위해 띠 형태의 직사각판 형상으로 양측단부가 'ㄷ' 자 형상으로 절곡되어 캐리어테이프의 상단에 길이방향으로 결합된다. 이와같은 캐리어테이프 이송부재(20)는 칩 마운터(chip mounter)에서 발생한 유실된 자재 등을 수납한 캐리어테이프와 결합되어 칩마운터의 피더 상단에 장착 사용된다.As shown in FIG. 1, the carrier tape transfer member 20 according to the present invention includes an embossed portion 11 and a pitch hole 12 for accommodating electronic components arranged at predetermined intervals. In order to guide the transfer of the carrier tape 10, both side ends of the strip-shaped rectangular plate shape are bent in a 'c' shape and are coupled to the upper end of the carrier tape in the longitudinal direction. The carrier tape transfer member 20 is coupled to a carrier tape containing a lost material generated in a chip mounter and mounted on the top of the feeder of the chip mounter.
상기 캐리어테이프(10)는 운송 및 저장 중에 물리적인 힘으로부터 IC 및 전기, 전자 부품을 보호하기 위한 포장재로써, 전자부품이 저장되는 엠보스 부(embossed portion)(11) 및 이송을 위한 피치홀(pitch hole)(12)이 소정의 간격으로 배열된다. 또한 캐리어테이프(10)의 엠보스 부(11)는 전자부품의 크기에 따라 규격화되어 제작될 수 있다. 이러한 캐리어테이프(10)의 규격에 맞게 본 고안의 캐리어테이프 이송부재(20)도 폭이 8mm, 12mm, 16mm, 24mm 등으로 다양하게 제작될 수 있다. 즉, 띠 형태의 직사각판 형상으로 양측단부가 'ㄷ' 자 형상으로 절곡되어 캐리어테이프(10)의 상단에 길이방향으로 결합되는 구성이면, 그외의 다양한 크기로 제작하여 적용 가능할 것이다.The carrier tape 10 is a packaging material for protecting IC, electrical and electronic components from physical forces during transportation and storage, and includes an embossed portion 11 in which electronic components are stored and a pitch hole for transportation. pitch holes) 12 are arranged at predetermined intervals. In addition, the embossed part 11 of the carrier tape 10 may be manufactured by being standardized according to the size of the electronic component. The carrier tape conveying member 20 of the present invention can also be manufactured in various ways such as 8mm, 12mm, 16mm, 24mm, etc. to meet the specifications of the carrier tape 10. That is, if both ends are bent into a 'c' shape in the shape of a strip-shaped rectangular plate and coupled to the upper end of the carrier tape 10 in the longitudinal direction, it may be applicable to other various sizes.
특히, 상기 'ㄷ'자 형상으로 절곡된 캐리어테이프 이송부재(20)의 양측 단부는 도 2에 도시한 바와 같이, 각각 캐리어테이프(10)의 엠보스 부(11) 및 피치 홀(12)에 간섭을 주지 않는 소정의 길이만큼 절곡된다. 상세히 설명하면, 캐리어테이프(10)가 이송부재(20)에 결합될 때 'ㄷ'자 형상으로 절곡된 부분이 전자부품을 저장하는 엠보스 부(11)와 이송을 위해 형성된 피치 홀(12)을 덮지 않는 길이만큼 절곡되어 캐리어테이프를 가이드하는 것이다.In particular, both end portions of the carrier tape transfer member 20 bent in a 'c' shape are respectively formed in the embossed portion 11 and the pitch hole 12 of the carrier tape 10, as shown in FIG. 2. It is bent by a predetermined length without interference. In detail, when the carrier tape 10 is coupled to the conveying member 20, a portion bent in a 'c' shape has an emboss portion 11 for storing electronic components and a pitch hole 12 formed for conveying. It is bent by a length not covering the guide to guide the carrier tape.
도 3 은 본 고안에 의한 캐리어테이프 이송부재의 사용 상태도이다.3 is a state diagram used of the carrier tape transfer member according to the present invention.
도 3에 도시한 바와 같이, 캐리어테이프 이송부재(20)는 칩마운터(chip mounter)(90)의 피더(feeder)(80) 상에 구비된 걸림돌기에 피치홀이 위치하여 인쇄회로기판(PCB) 상에 자동으로 장착(Pick and Place)하는 전자부품 자동 조립기(40)가 위치하는 지점으로 전자부품이 수납된 캐리어테이프(10)를 이동시키는 이송부재로 이용된다.As shown in FIG. 3, the carrier tape conveying member 20 has a pitch hole at a catching protrusion provided on a feeder 80 of a chip mounter 90, thereby printing a printed circuit board (PCB). It is used as a transfer member for moving the carrier tape 10 in which the electronic parts are stored to the point where the automatic assembly of the electronic parts 40 to be picked and placed automatically.
상기 전자부품 자동조립기(40)는 복수의 인쇄회로기판 상에 전기,전자 부품을 동시에 조립하기 위한 장치로써, 인쇄회로기판 상에 수많은 전자부품들을 전기적으로 연결되도록 그 표면에 조립한다. 전자부품의 조립은 자동화 공정에 의해 이루어지며, 대개, 인쇄회로기판을 공급하는 공정, 공급된 인쇄회로기판을 이송하는 공정, 인쇄회로기판에 전자부품을 조립하는 공정 및 전자부품이 조립된 인쇄회로기판을 반출하는 공정 등으로 이루어진다. 이러한 공정과 장치구성은 공지된 기술과 동일함으로 본 고안에서의 상세한 설명은 생략한다.The automatic assembly of electronic components 40 is an apparatus for assembling electrical and electronic components simultaneously on a plurality of printed circuit boards, and assembles a plurality of electronic components on the surface of the printed circuit board so as to be electrically connected. The assembly of electronic components is usually done by an automated process, usually a process of supplying a printed circuit board, a process of transferring a supplied printed circuit board, a process of assembling electronic components on a printed circuit board, and a printed circuit in which electronic components are assembled. The process of carrying out a board | substrate is performed. Since the process and the device configuration are the same as the known technology, detailed description of the present invention is omitted.
이와 같은 캐리어 테이프의 이송부재(20)는 칩 마운터에서 유실된 자재 및 잔존칩을 회수하여 설비에 장착할 때 이용된다. 또한 회수한 자재와 잔존 자재를 캐리어 테이프에 장착하고 이송부재에 결합시킴으로써 샘플제작이나 소량생산을 위한 공정에 이용할 수 있다. 또한 커버테이프가 제거된 캐리어 테이프가 결합된 이송부재를 통해 제품 생산 공정시 커버테이프를 제거하는 별도의 공정이 불필요한 장점이 있다.The conveying member 20 of the carrier tape is used to recover the material lost from the chip mounter and the remaining chips and to mount them on the facility. In addition, the recovered material and the remaining material may be mounted on a carrier tape and combined with a transfer member to be used for a sample production or a small production process. In addition, there is no need for a separate process of removing the cover tape during the product production process through the transfer member is coupled to the carrier tape is removed cover tape.
상술한 바와 같이, 본 고안의 캐리어테이프 이송부재는 칩 마운트에서 발생한 유실된 자재를 회수하여 설비에 장착할 때 이용될 수 있고, 이렇게 회수한 자재와 잔존자재를 이용하여 제품의 샘플제작이나 소량생산에 유용하게 이용할 수 있을뿐만 아니라, 샘플제작이나 소량의 제품 생산에 있어서 소요되는 전자부품에 따라 캐리어테이프가 권취된 릴을 작업자가 매번 교체해 주어야 하는 번거로움이 없다.As described above, the carrier tape conveying member of the present invention can be used to recover the lost material generated from the chip mount and install it in the facility, and to make a sample or produce a small amount of the product using the recovered material and the remaining material. Not only can it be usefully used, but there is no need for the operator to replace the reel in which the carrier tape is wound every time according to the electronic parts required for sample production or production of a small amount of product.
또한, 적은 수량의 전자부품이 필요한 제품의 조립 및 생산의 경우에도 별도의 릴 교체 작업이 불필요하고 이로 인한 작업자의 작업공수가 감소되어 생산성이 향상될 수 있으며, 수작업에 따른 불량률을 제로화 할 수 있다.In addition, in the case of the assembly and production of products requiring a small number of electronic components, no separate reel replacement work is required, thereby reducing the labor labor of the worker, thereby improving productivity and zero defect rate according to manual labor. .
더욱이, 인쇄회로기판(PCB) 상에 전자부품을 자동으로 장착(Pick and Place)하는 자동 조립기가 위치하는 지점으로 전자부품이 수납된 캐리어테이프를 이송함에 있어서 커버테이프를 제거해야 하는 별도의 공정이 불필요하여 생산효율을 증대할 수 있는 것이다.Furthermore, there is a separate process to remove the cover tape when transferring the carrier tape containing the electronic parts to the point where the automatic assembly device for picking and placing the electronic parts on the printed circuit board (PCB) is located. It is not necessary to increase the production efficiency.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-2003-0022691U KR200328632Y1 (en) | 2003-07-14 | 2003-07-14 | Apparatus for transferring carrier tape |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-2003-0022691U KR200328632Y1 (en) | 2003-07-14 | 2003-07-14 | Apparatus for transferring carrier tape |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020030047824A Division KR20050008941A (en) | 2003-07-14 | 2003-07-14 | Apparatus for transferring carrier tape |
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| KR200328632Y1 true KR200328632Y1 (en) | 2003-09-29 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230106813A (en) | 2022-01-07 | 2023-07-14 | 이승희 | Apparatus and Method for Feeding Surface Mounted Devices, and Surface Mounted Device Strip Thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230106813A (en) | 2022-01-07 | 2023-07-14 | 이승희 | Apparatus and Method for Feeding Surface Mounted Devices, and Surface Mounted Device Strip Thereof |
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