JP2006245480A - Method for mounting component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for mounting a component in which the productivity of a substrate mounted with the component is enhanced. <P>SOLUTION: The method for mounting a component comprises a step S108 for specifying the orientation of the radial component C supplied from a pack 311a of a Z number "Z1", a step S112 for altering the mounting angle preset for the substrate B of the component supplied from the pack 311a of Z the number "Z1" depending on the orientation of the radial component C specified at a step S108 for specifying the orientation, and a first mounting step S100 for holding the radial component C supplied from the pack 311a of the Z number "Z1" on a head 330 and mounting the radial component C on the substrate B at a mounting angle altered at the altering step S112. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for mounting a component on a substrate, and more particularly, to a method for mounting the component on a substrate using a head that holds the component.

  2. Description of the Related Art Conventionally, there has been provided a component mounter that picks up an electronic component (hereinafter simply referred to as a component) with a head and mounts it on a substrate. In general, components to be mounted are collectively set for each component type in a component mounter, and supplied to the head from the set position. For example, a plurality of parts of the same type are wound around a reel as part tapes arranged in a certain direction on the tape. However, even parts of the same type should be mounted in an appropriate orientation depending on their shape and polarity. For example, even in the case of the same type of component, it may be necessary to change the orientation by 180 ° or to change the orientation without changing the orientation. In such a case, since the head must rotate one component to 180 °, the time required for mounting the component becomes long.

  Therefore, in order to reduce the time required for component mounting, even if the components are the same type, if the mounting direction differs greatly, there is already a technology for dividing those components in advance and setting them on the component mounting machine. (For example, refer to Patent Document 1).

In the above-mentioned Patent Document 1, even if it is the same type of component, a component mounted in a 0 ° orientation is set at the first position of the component mounter, and a component mounted in a 180 ° orientation is a component mounter. Set to the second position. Here, the parts set at the first and second positions are set in advance so that their directions are opposite to each other. The component mounter supplies and mounts the component from the first position when mounting the component in the 0 ° orientation, and supplies the component from the second position when mounting the component in the 180 ° orientation. And implement. Accordingly, since the component can be mounted in an appropriate direction without largely changing the direction of the supplied component, the time required for component mounting can be shortened.
Japanese Patent No. 3476485

  However, the component mounting method disclosed in Patent Document 1 has a problem that the productivity of a substrate on which components are mounted is reduced.

  That is, in the component mounting method of Patent Document 1 described above, for example, when a component breakage occurs at the first position, the same kind of component is set at the second position, but the orientation of the component is different. If the part cannot be used, production must be stopped and the part must be set again in the first position.

  Therefore, the present invention has been made in view of such problems, and an object of the present invention is to provide a component mounting method that improves the productivity of a substrate on which components are mounted.

  In order to achieve the above object, a component mounting method according to the present invention is a component mounting method for mounting the component on a substrate using a head that holds the component, and the component is supplied from the first component supply means. An orientation specifying step for specifying the orientation of the component, and a mounting angle set in advance with respect to the substrate of the component supplied from the first component supply means, according to the orientation of the component specified in the orientation specifying step A changing step for changing, and a first mounting step for holding the component supplied from the first component supplying means on the head and mounting the component on the board at the mounting angle changed in the changing step. It is characterized by that.

  Thus, since the mounting angle is changed in accordance with the direction of the component supplied from the first component supply means (for example, the direction of the electrode), for example, the direction of the component is different from the direction assumed in advance. However, the components can be mounted on the board at an appropriate mounting angle without stopping production as in the conventional example. As a result, the productivity of the component-mounted board can be improved.

  Further, the component mounting method further compares the orientation of the component identified in the orientation identifying step with a reference orientation, and changes the preset mounting angle when the orientations differ from each other. A change determination step for determining, and in the change step, when it is determined that the change should be changed in the change determination step, the orientation of the mounted component with respect to the substrate is supplied in the reference direction and set in advance. The mounting angle may be changed so as to be equal to the direction of the component mounted at the mounting angle with respect to the substrate.

  Thus, even if the orientation of the component supplied from the first component supply means is different from the reference orientation, the orientation of the mounted component relative to the substrate is supplied in the reference orientation and set in advance. Since the orientation of the component mounted at an angle is equal to the orientation of the component relative to the substrate, the orientation of the component supplied from the first component supply means can be freely set, and the utility value of the present component mounting method can be increased. For example, the first component supply means is sold from each manufacturer, and the orientation of the components supplied from the first component supply means may be different for each manufacturer. In such a case, the component can be mounted on the board in an appropriate direction using the first component supply means of any manufacturer.

  Here, in the change determination step, the direction of the component supplied from the second component supply unit is set as a reference direction, the direction of the component specified in the direction specifying step is compared with the reference direction, When the orientation is different, it is determined that the preset mounting angle should be changed, and in the changing step, the mounting angle set in advance with respect to the substrate of the component supplied from the second component supply means Is changed as a mounting angle set in advance with respect to the substrate of the component supplied from the first component supply means according to the orientation of the component specified in the orientation specifying step, and the first mounting In the step, the component supplied from the first component supply unit may be mounted on the substrate instead of the component supplied from the second component supply unit.

  Thereby, even if the direction of the component supplied from the first component supply unit is different from the direction of the component supplied from the second component supply unit, the component is supplied and mounted from the first component supply unit. Since the orientation of the component with respect to the substrate is equal to the orientation of the component supplied and mounted from the second component supply means with respect to the substrate, the first component supply is used instead of the component supplied from the second component supply means. The components supplied from the means can be appropriately mounted.

  The component mounting method is further supplied from a second mounting step in which a component supplied from the second component supply means is held on the head while being mounted on the head, and from the second component supply means. Supplied from the first component supply means when it is determined that the predetermined number has been reached in the component outage determining step and the component outage determining step. An alternative determination step for determining whether or not the component to be replaced can be replaced with the component supplied from the second component supply means. In the first mounting step, it is determined that the replacement is possible in the replacement determination step. In this case, the component supplied from the first component supply means may be held and mounted on the head.

  For example, when the remaining number of components supplied from the second component supply means reaches 0 as a result of being supplied and mounted from the second component supply means, it is supplied from the first component supply means. Since it is determined whether or not the component to be replaced can be replaced with the component supplied from the second component supply means, the component supplied from the first component supply means cannot be replaced. Nevertheless, it is possible to prevent the mounting and to mount the alternative parts reliably.

  In the orientation specifying step, the orientation of the component supplied from the first component supply means may be specified by reading the orientation of the component recorded in an IC (Integrated Circuit) tag. .

  As a result, the orientation of the component can be read out from the IC tag in a non-contact manner simply by providing the IC tag reader, so that the orientation of the component can be easily specified.

  The present invention can be realized not only as such a component mounting method but also as a component mounter and program for mounting components by the method, and as a storage medium for storing the program.

  The component mounting method of the present invention has the effect of improving the productivity of a substrate on which components are mounted.

(Embodiment 1)
Hereinafter, a component mounter according to Embodiment 1 of the present invention will be described with reference to the drawings.

FIG. 1 is an external view showing a configuration of a component mounter according to Embodiment 1 of the present invention.
The component mounter 300 according to the first embodiment of the present invention is called a so-called radial component inserter, and the radial component is mounted on the substrate by inserting the lead of the radial component into the through hole of the substrate. .

  The component mounter 300 includes a component supply unit 310, a component transport unit 320, a head 330, a transport loader 340, an XY table 350, and two IC tag readers 111.

FIG. 2 is a conceptual diagram conceptually showing the main configuration of the component mounter 300.
The component supply unit 310 stores a plurality of radial components and delivers the radial components to the component transport unit 320, and includes a component storage unit 311, a plurality of guides 312, and a plurality of cassettes 313. ing.

  The component storage unit 311 stores a plurality of packs 311a as component supply means for packaging a group of the same type of radial components C. A group of the same type of radial parts C are held in a single tape in a line. That is, the pack 311a described above is packaged in a state in which such a tape (component tape) t that holds the radial component C is folded.

  The guide 312 guides the component tape t pulled out from the pack 311 a of the component storage unit 311 to the cassette 313.

  The cassette 313 performs a continuous feeding operation by pulling out the component tape t from the pack 311a of the component storage unit 311. Then, the cassette 313 cuts the delivered component tape t from the leading end side, and sequentially separates a plurality of radial components C held on the component tape t and supplies them to the component transport unit 320.

  The component conveying unit 320 conveys the radial component C supplied from the cassette 313 to the head 330, and rotationally drives the three pulleys 321, the conveyor belt 322, the plurality of chuck holding units 323, and the pulleys 321. Drive mechanism (not shown).

  The conveyor belt 322 is formed, for example, in a synthetic resin shape in an annular shape, and is stretched in a substantially triangular shape by three pulleys 321. The conveyor belt 322 circulates by the rotational drive of the pulley 321.

  The plurality of chuck holding portions 323 are respectively attached to the conveyor belt 322 at substantially equal intervals, and are configured to hold (grip) the radial component C.

  Such a component conveyance unit 320 sequentially conveys the radial component C from the cassette 313 to the head 330 by holding the radial component C supplied from the cassette 313 by the chuck holding unit 323 of the conveyor belt 322.

  As shown in FIG. 1, the transport loader 340 carries the board B to the XY table 350 and carries the board B on which components are mounted to the outside of the component mounter 300.

The XY table 350 moves the substrate B in a two-dimensional direction along the mounting surface.
The head 330 acquires and holds the radial component C conveyed by the component conveying unit 320, and mounts the radial component C on the board B installed on the XY table 350.

  The two IC tag readers 111 are disposed in the component storage unit 311 and read out component information described later from the IC tag 311b attached to each pack 311a. Further, since the signals output from the IC tags 311b are acquired by the two IC tag readers 111 disposed at different positions, the position of each IC tag 311b is specified based on the acquired signals. . That is, since each IC tag 311b is attached to each pack 311a, the position (Z number “Z1, Z2,...”) Of each pack 311a is specified.

FIG. 3 is a diagram illustrating an example of the radial component C mounted in the present embodiment.
The radial component is generally a vertical type of electronic component that is fixed by inserting a lead into a through hole of a substrate. As shown in FIG. 3, the radial component C is, for example, a transistor or an aluminum electrolytic capacitor, and the lead L protruding from the lower surface is inserted into the through hole of the substrate B. There is a type of radial component in which the leads coming out from both sides are bent and the tip of the lead is on one side, and such a type of radial component is inserted as if it stands up from the substrate. Thus, the mounting area of a board | substrate can be decreased by mounting vertically long.

  Further, the radial component C shown in FIG. 3 has polarity, and the lead L indicated by the marking (triangle mark in FIG. 3) is a specific electrode (for example, a positive electrode or a negative electrode).

  Such a component tape t holding the radial component C is packaged in the pack 311a so that the specific pole of each radial component C faces the front end side or the rear end side of the component tape t. Here, the component storage unit 311 includes a pack 311a for packaging the radial component C with the specific pole directed toward the front end side, and a pack 311a for packaging the radial component C with the specific pole directed toward the rear end side. It has been. When the component tape t is pulled out from one pack 311a, the specific pole of the radial component C faces the tip side of the component tape t, and when the component tape t is pulled out from the other pack 311a, the specific pole of the radial component C is the component. It faces the rear end side of the tape t. In other words, the supply direction (direction) of the radial component C (component tape t) supplied from each pack 311a of the component supply unit 310 is different between forward and reverse. Further, the radial parts C housed in these packs 311a are in the same type or in a substitutable relationship with each other.

FIG. 4 is a configuration diagram showing the configuration of the head 330.
The head 330 includes an insertion claw 331 for inserting each lead L of the radial part C into the groove 332 and sandwiching the inserted lead L.

  Such a head 330 receives the radial component C from the component conveying unit 320 by sandwiching (holding) the lead L of the radial component C conveyed by the component conveying unit 320 with the insertion claws 331. Then, the head 330 rotates so that the radial component C faces in an appropriate direction according to the polarity, and further, the lead claw 331 is moved up and down to form each lead L of the radial component C on the substrate B. Inserted into the through hole. As a result, the radial component C is mounted on the substrate B.

  FIG. 5 is a diagram showing a circuit configuration of the IC tag reader 111 and a circuit configuration of the IC tag 311b.

  The IC tag reader 111 includes a modulation / demodulation unit 462 connected to an AC power source 461, a control unit 463, an interface unit 464, and an antenna 465.

  The modulation / demodulation unit 462 is a circuit that communicates with the IC tag 311b via the antenna 465. The modulation / demodulation unit 462 transmits power carrier waves to the IC tag 311b and receives component information transmitted from the IC tag 311b. That is, while the modulation / demodulation unit 462 receives the control code output from the control unit 463, the modulation / demodulation unit 462 generates a power carrier signal of a radio frequency (RF: Radio Frequency, for example, 13.56 MHz), and converts the signal into power It is converted into a carrier wave and transmitted from the antenna 465.

  The control unit 463 controls transmission of the power carrier radio wave by the modulation / demodulation unit 462 and stop of the transmission, and outputs component information received by the modulation / demodulation unit 462 to the outside via the interface unit 464.

  The IC tag 311b includes an antenna 471, a modulation / demodulation unit 472, a power generation unit 473, and a logic memory 474. The logic memory 474 stores component information.

  The power generation unit 473 receives the power carrier radio wave transmitted from the IC tag reader 111 via the antenna 471 by the electromagnetic induction method or the electromagnetic coupling method, and generates high-frequency induced power. The power generation unit 473 further rectifies the induced power, smoothes the voltage of the rectified induced power to a constant value, accumulates DC power, and the antenna 471 receives the power carrier radio wave. Meanwhile, the generated DC power is continuously supplied to the modulation / demodulation unit 472 and the logic memory 474.

  The modulation / demodulation unit 472 converts the component information stored in the logic memory 474 into a radio wave and outputs it to the outside via the antenna 471. As long as the modulation scheme matches the demodulation scheme in the modulation demodulator 462 of the IC tag reader 111, any scheme such as ASK (Amplitude Shift Keying) and FSK (Frequency-Shift Keying) can be used.

  Here, the component information output from the IC tag 311b includes the contents related to the radial component C packaged in the pack 311a to which the IC tag 311b is attached.

FIG. 6 is an explanatory diagram for explaining the contents of the component information.
The part information includes the part name of the radial part C packaged in the pack 311a, the supply direction (direction) of the radial part C, and the number of the radial part C. For example, the part information on the left side in FIG. 6 includes the part name “C1”, the supply direction “positive”, and the number “300”. The part information on the right side in FIG. 6 includes the part name “C1” and the supply. The direction “reverse” and the number “200” are included.

  By the way, even if it is the same kind of radial component C, depending on the polarity, it is necessary to mount the radial component C on the board B on the one hand while changing the orientation by 180 ° on the other side. There is. However, if the head 330 rotates the direction of the radial part C received from the chuck holding portion 323 by 180 °, it takes a long time to mount the radial part C. Therefore, in order to prevent such rotation of the radial component C by 180 °, a pack 311a in which the radial component C is supplied in a different direction is set in the component mounter 300 in advance.

  The supply direction of the component information shown on the left side in FIG. 6 is “normal” and the supply direction of the component information shown on the right side in FIG. 6 is “reverse”, but conversely, the component information shown on the left side in FIG. The supply direction may be “reverse”, and the supply direction of the component information shown on the right side in FIG. 6 may be “normal”. In other words, the content information supply direction shown in FIG. 6 may be any content as long as the content information indicates that they differ from each other by 180 °.

FIG. 7 is a block diagram showing a functional configuration of the component mounter 300 shown in FIG.
The component mounter 300 includes a mounting control unit 361, an output unit 362, an input unit 363, a database unit 364, a change unit 365, a memory unit 366, a component outage detection unit 367, a mechanism unit 368, and two IC tag readers 111. . Here, in the present embodiment, the IC tag reader 111 is configured as a direction specifying unit, and the IC tag reader 111 and the changing unit 365 are configured as a mounting angle changing device.

  The memory unit 366 includes a RAM (Random Access Memory) that provides a work area for the mounting control unit 361.

  The output unit 362 is a CRT (Cathode-Ray Tube), an LCD (Liquid Crystal Display), or the like, and the input unit 363 is a keyboard or the like. These are used for dialogue between the component mounting machine 300 and an operator under the control of the mounting control unit 361.

  The mechanism unit 368 is a set of mechanism-related components including the head 330, the XY table 350, the cassette 313, the pulley 321, and a motor and a motor driver that drive these.

  The database unit 364 is a hard disk or the like for storing the component arrangement data 364b generated by the mounting control unit 361 and the mounting point data 364a generated based on a predetermined condition.

FIG. 8 is a diagram illustrating an example of the component arrangement data 364b.
As shown in FIG. 8, the part arrangement data 364b includes each Z number, the part name of the radial part C set in the Z number, the supply direction of the radial part C, and the number of the radial parts C. Indicates.

  For example, in this part arrangement data 364b, 300 radial parts C having a part name “C1” are set in the “reverse” supply direction in the Z number “Z1”, and the above-described Z number “Z2” It shows that 200 radial parts C with the part name “C1” are set in the “positive” supply direction.

FIG. 9 is a diagram illustrating an example of the mounting point data 364a.
The mounting point data 364a indicates information regarding each mounting point on the board B (specific position on the board B). The mounting point, the coordinates of the mounting point (x coordinate and y coordinate), and the mounting The mounting angle of the radial component C to be mounted at a point and the Z number on which the radial component C is set are shown. In general, the mounting angle is determined based on the state of the head 330 at the time when the radial component C is received from the component transport unit 320 in order to mount the radial component C on the substrate B in an appropriate orientation. It means the angle that must be purely rotated. In addition, the mounting point data 364a indicates the mounting order of each component by an array of mounting points.

  For example, the mounting point data 364a indicates that the radial component C must be mounted in the order of mounting point p1, mounting point p2,... → mounting point p4. In addition, the mounting point data 364a indicates that the radial part C having the Z number “Z2” should be mounted at the mounting point p1 of the coordinates (x1, y1) without rotating the head 330 from the reference, and the coordinates (x2 , Y2), the mounting point p2 of the Z number “Z2” should be mounted by rotating the head 330 by 90 ° from the reference, and the mounting point p4 of the coordinates (x4, y4) , The head 330 is rotated by −90 ° from the reference to indicate that the radial part C having the Z number “Z2” is to be mounted. Further, the mounting point data 364a indicates that the radial part C with the Z number “Z1” should be mounted at the mounting point p3 of the coordinates (x3, y3) by rotating the head 330 by 180 ° from the reference. Yes. As will be described later, the mounting control unit 361 does not rotate the head 330 from the reference by referring to the component arrangement data 364b even when the mounting angle “180 °” is indicated in the mounting point data 364a. In some cases, radial parts C are mounted. That is, the mounting point data 364a indicates the mounting angle of each mounting point on the assumption that the supply directions of the same kind of radial parts C supplied from the packs 311a of each Z number are all the same (positive). The mounting control unit 361 determines whether or not the head 330 should be rotated at the mounting angle indicated by the mounting point data 364a by confirming the supply direction of the radial component C from the component arrangement data 364b.

  The component breakage detection unit 367 detects the component breakage of the pack 311a set for each Z number. That is, the part-out detection unit 367 subtracts the number of radial parts C supplied from the cassette 313 (pack 311a) corresponding to the Z number from the number indicated in the part arrangement data 364b for each Z number. The remaining number of radial parts C packaged in the pack 311a is specified. Then, when the remaining number of radial parts C in the pack 311a set to any Z number becomes, for example, 0, the part shortage detection unit 367 indicates the Z number of the pack 311a that has run out of parts and the pack 311a. The mounting control unit 361 is notified of the part name of the radial part C that has been packaged.

  The mounting control unit 361 generates the above-described component arrangement data 364b based on a signal output from the IC tag 311b and acquired by the IC tag reader 111, that is, component information.

  Specifically, the mounting control unit 361 determines the position of each IC tag 311b based on the signal states (for example, the intensity and direction of radio waves) output from each IC tag 311b and acquired by the two IC tag readers 111. That is, the position (Z number) of each pack 311a is specified. Then, for each Z number, the mounting control unit 361 generates and arranges the component name data 364b by acquiring the component name, the supply direction, and the number of the component information corresponding to the Z number. Store.

  Further, the mounting control unit 361 generates the component array data 364b and controls each component included in the mechanism unit 368 based on the generated component array data 364b and the mounting point data 364a.

  For example, the mounting control unit 361 refers to the mounting point data 364a and identifies the Z number “Z2” and the mounting angles “0 °, 90 °” of the radial component C to be mounted at the mounting points p1, p2. Further, the mounting control unit 361 confirms that the supply direction of the radial component C set to the Z number “Z2” is “positive” by referring to the component arrangement data 364b. As a result, the mounting control unit 361 controls the mechanism unit 368 to cause the radial component C with the component name “C1” to be conveyed from the pack 311a with the Z number “Z2”, and the head 330 receives the radial component C. Then, as indicated by the mounting point data 364a, the radial component C is mounted on the mounting point p1 (coordinates (x1, y1)) without rotating the head 330. Further, the mounting control unit 361 controls the mechanism unit 368 to again convey the radial part C with the part name “C1” from the pack 311a with the Z number “Z2”, and the head 330 receives the radial part C. Then, as indicated by the mounting point data 364a, the head 330 is rotated by 90 ° with reference to the state of the head 330 at the time of reception, and the radial component C is moved to the mounting point p2 (coordinates (x2, y2)). Let it be implemented.

  Next, the mounting control unit 361 refers to the mounting point data 364a and specifies the Z number “Z1” and the mounting angle “180 °” of the radial part C to be inserted into the mounting point p3. Further, the mounting control unit 361 confirms that the supply direction of the radial component C set to the Z number “Z1” is “reverse” by referring to the component arrangement data 364b. As a result, the mounting control unit 361 controls the mechanism unit 368 to convey the radial component C with the component name “C1” from the pack 311a with the Z number “Z1”, and the head 330 receives the radial component C. Regardless of the 180 ° indicated by the mounting point data 364a, the radial component C is mounted on the mounting point p3 (coordinates (x3, y3)) without rotating the head 330.

  Thus, when the mounting angle is “180 °”, the radial component C with the Z number “Z1” set so that the supply direction is “reverse” in advance is supplied, so the mounting control unit 361 The radial part C can be quickly mounted without bothering rotating the head 330 that has received the radial part C. For example, the time required to insert one radial component C into the substrate B (insertion tact) is 0.45 seconds when the head 330 rotates 180 °, but 0 when the head 330 is not rotated. Reduced to 29 seconds.

  Further, when the mounting control unit 361 attempts to supply the radial component C from the pack 311a with the Z number indicated in the mounting point data 364a and mount the component, the component cutting detection unit 367 detects that the component of the pack 311a is cut. Then, a radial part C that is the same type (same part name) as the radial part C of the pack 311a that has run out of parts or a replaceable radial part (hereinafter referred to as an alternative part) is searched from the part arrangement data 364b. If the substitute part is found, the mounting control unit 361 identifies the Z number of the pack 311a that wraps the substitute part from the part arrangement data 364b, and supplies the substitute part from the pack 311a at the Z number.

  Here, when the mounting control unit 361 finds an alternative part, whether or not the supply direction of the alternative part is different from the supply direction (reference direction) of the radial part C in the pack 311a where the part has run out. The change unit 365 is caused to change the mounting point data 364a according to the determination result. That is, when it is determined that the supply direction is the same, the mounting control unit 361 causes the changing unit 365 to change only the Z number of the mounting point data 364a. On the other hand, when determining that the supply directions are different, the mounting control unit 361 causes the changing unit 365 to change the Z number and mounting angle of the mounting point data 364a.

  For example, when the mounting control unit 361 refers to the component arrangement data 364b and finds an alternative part (Z number “Z1”) for the radial part C that has been set to the Z number “Z2”, the supply thereof It is determined that the directions are different from each other. As a result, the mounting control unit 361 instructs the changing unit 365 to change the Z number of the mounting point data 364a from “Z2” to “Z1” and to change the mounting angle corresponding to “Z1”. To do.

  The changing unit 365 changes the mounting point data 364a based on an instruction from the mounting control unit 361. That is, when the changing unit 365 receives an instruction to change the Z number from the mounting control unit 361, the changing unit 365 changes the Z number of the pack 311a that is out of components to the Z number of the pack 311a that wraps the substitute components. Further, when the changing unit 365 receives an instruction from the mounting control unit 361 to change the mounting angle, the changing unit 365 adds 180 ° to the mounting angle associated with the Z number of the pack 311a that wraps the substitute part, and the mounting is performed. Rewrite the angle.

FIG. 10 is a diagram showing the mounting point data 364a changed by the changing unit 365. As shown in FIG.
For example, if the pack 311a set to the Z number “Z2” is out of components immediately before the mounting point p1 is mounted, the changing unit 365 changes the Z of the mounting point data 364a according to an instruction from the mounting control unit 361. The number is changed from “Z2” to “Z1”. Furthermore, the changing unit 365 adds 180 ° to the mounting angles “0 °, 90 °, 180 °, −90 °” corresponding to the Z number “Z1”. As a result, the mounting angle of the mounting point data 364a is changed to “180 °, −90 °, 0 °, 90 °”. Since the mounting angle should be indicated between −180 ° and 0 ° to 180 °, 180 ° is changed to 0 ° (360 °) by adding 180 °, and 90 ° is 180 °. It is changed to -90 ° (270 °) by addition.

  When the mounting point data 364a is changed in this way, the mounting control unit 361 refers to the mounting point data 364a and controls the mechanism unit 368, thereby the component name “C1” from the pack 311a with the Z number “Z1”. ”Is transported. Then, when the head 330 receives the radial component C, the mounting control unit 361 rotates the head 330 by 180 ° with reference to the state of the head 330 at the time of reception, and mounts the radial component C to the mounting point p1. To implement. Further, the mounting control unit 361 refers to the mounting point data 364a to control the mechanism unit 368, thereby again transporting the radial component having the component name “C1” from the pack having the Z number “Z1”. Then, when the head 330 receives the radial component C, the mounting control unit 361 rotates the head 330 by −90 ° with reference to the state of the head 330 at the time of reception, and mounts the radial component C on the mounting point. Mount on p2.

  Further, the mounting control unit 361 controls the mechanism unit 368 with reference to the mounting point data 364a, thereby transporting the radial component C having the component name “C1” from the pack 311a having the Z number “Z1”. When the head 330 receives the radial component C, the mounting control unit 361 mounts the radial component C at the mounting point p3 without rotating the head 330.

  Further, the mounting control unit 361 controls the mechanism unit 368 with reference to the mounting point data 364a, thereby transporting the radial component C having the component name “C1” from the pack 311a having the Z number “Z1”. Then, when the head 330 receives the radial component C, the mounting control unit 361 rotates the head 330 by 90 ° with reference to the state of the head 330 at the time of reception, and mounts the radial component C on the mounting point p4. To implement.

FIG. 11 is an explanatory diagram for explaining a state when a part has run out.
As shown in FIG. 11, when the radial part C of the pack 311a set to the Z number “Z2” is out of parts, the mounting control unit 361 and the changing unit 365 perform the processing as described above, Instead of the radial part C, the same kind of radial part C in the pack 311a set in the Z number “Z1” is used. At this time, since the supply directions of the radial parts C set in advance in the Z numbers “Z1, Z2” are different from each other, the head 330 is set in advance for the radial parts C in the Z number “Z2”. It rotates to a mounting angle different from the mounting angle by 180 °, and the radial component C with the Z number “Z1” is mounted on the board B.

  In this way, even if the orientation of the radial part C supplied from the pack 311a with the Z number “Z1” is different from the orientation of the radial part C supplied from the pack 311a with the Z number “Z2”, the Z number “Z1” The orientation of the radial component C supplied from the pack 311a and mounted on the substrate B is equal to the orientation of the radial component C supplied and mounted from the pack 311a of the Z number “Z2” on the substrate B. As a result, the radial component C supplied from the pack 311a with the Z number “Z1” can be appropriately mounted instead of the radial component C supplied from the pack 311a with the Z number “Z2”.

FIG. 12 is a flowchart showing the operation of the component mounter 300 in the present embodiment.
First, the component mounter 300 mounts the radial component C on the board B (step S100). Then, the component mounter 300 refers to the mounting point data 364a to determine whether there is a mounting point to be mounted next (step S102). If it is determined that there is the next mounting point (Y in step S102), the component mounter 300 determines whether or not the pack 311a having the Z number corresponding to the mounting point is out of components (step). S104). On the other hand, if it is determined that there is no next mounting point (N in step S102), the component mounter 300 ends the component mounting operation.

  If the component mounter 300 determines that the component is out in step S104 (Y in step S104), the component mounter 300 refers to the component arrangement data 364b, and the radial component C of the packaged component 311a packaged by the component mounter 300b is referred to. It is determined whether or not a substitute part has been set (step S106). If it is determined in step S104 that the part has not run out (N in step S104), the operation from step S100 is repeated.

  Next, when the component mounting machine 300 determines that the alternative component is set in step S106 (Y in step S106), the radial direction in which the supply direction of the set alternative component is out of component is used. It is determined whether or not the direction is the same as the supply direction of C (step S108). If it is determined in step S106 that no substitute part is set (N in step S106), the component mounting operation is stopped and the component is out of service. Wait until the pack 311a for packaging the radial part C is newly set (the radial part C is replenished) (step S110). Here, when the radial component C is replenished, the component mounter 300 repeats the operation from step S100 again.

  If it is determined in step S108 that the supply direction is the same (Y in step S108), the component mounter 300 changes the supply position (Z number) of the radial component C and repeats the operation from step S100 again. If it is determined in step S108 that the supply direction is different (reverse) (N in step S108), the component mounting machine 300 changes the supply position (Z number) and the mounting angle (step S112). In other words, the component mounter 300 changes the direction of the substitute component so that the component mounter 300 is different from the predetermined mounting angle by 180 °. Then, the component mounter 300 mounts the substitute component on the board B at the changed mounting angle (step S100).

  As described above, in this embodiment, when one of the packs 311a is out of parts, another pack 311a having a replacement part for the radial part C packaged in the pack 311a is searched, and further, the replacement is performed. When the component supply direction is different from the radial component C supply direction, the mounting angle of the substitute component is changed, and the substitute component is mounted instead of the radial component C. As a result, the productivity of the board B on which the components are mounted can be improved without stopping the production as in the conventional example even if the components are cut.

(Modification 1)
Here, Modification 1 of the present embodiment will be described.

  The component mounter 300 according to the present modification actually changes the mounting point data 364a based on the mounting angle indicated by the mounting point data 364a and the supply direction indicated by the component arrangement data 364b without changing the contents of the mounting point data 364a. Specify the mounting angle.

  For example, when the mounting control unit 361 tries to mount the radial part C (part name “C1”) having the Z number “Z2” at the mounting point p1 indicated by the mounting point data 364a, the pack having the Z number “Z2” is packed. If 311a is out of parts, it is determined by referring to the part arrangement data 364b shown in FIG. 8 whether or not the alternative part of the radial part C is set to another Z number. When the mounting control unit 361 determines that the substitute part (part name “C1”) is set to the Z number “Z1”, the mounting control unit 361 further refers to the part arrangement data 364b and supplies the substitute part in the supply direction ( It is determined whether or not (inverse) is different from the supply direction (forward) of the radial part C that is out of parts. If it is determined that the supply directions are different, the mounting control unit 361 specifies the actual mounting angle 180 ° from the mounting angle “0 °” indicated by the mounting point data 364a. Then, the mounting control unit 361 supplies and conveys the substitute parts from the pack 311a set to the Z number “Z1”, holds the head 330, rotates the head 330 by 180 °, and replaces the substitute parts. The component is mounted on the board B.

  Similarly to the above, when the mounting control unit 361 intends to mount the radial part (part name “C1”) having the Z number “Z2” at the mounting point p2 indicated by the mounting point data 364a, the Z number “Z2”. If the pack 311a is out of parts, it is determined by referring to the part arrangement data 364b shown in FIG. 8 whether or not the alternative part of the radial part C is set to another Z number. When the mounting control unit 361 determines that the substitute part (part name “C1”) is set to the Z number “Z1”, the mounting control unit 361 further refers to the part arrangement data 364b and supplies the substitute part in the supply direction ( It is determined whether or not (inverse) is different from the supply direction (forward) of the radial part that is out of parts. If it is determined that the supply directions are different, the mounting control unit 361 specifies the actual mounting angle of −90 ° from the mounting angle “90 °” indicated by the mounting point data 364a. Then, the mounting control unit 361 supplies and conveys the substitute part from the pack 311a set to the Z number “Z1” and holds it on the head 330, and rotates the head 330 by −90 °, The substitute part is mounted on the board B.

  As described above, the same effects as in the present embodiment can be obtained without changing the contents of the mounting point data 364a.

(Modification 2)
In the above embodiment, “normal” or “reverse” is included in the component arrangement data 364b as the supply direction, but “0 °” or “180 °” may be included.

FIG. 13 is a diagram illustrating an example of the component arrangement data 364b in the present modification.
The component arrangement data 364b shown in FIG. 13A is similar to the component arrangement data 364b shown in FIG. 8, and each Z number, the part name of the radial part C in the pack 311a set to the Z number, The supply direction of the radial part C is shown. Here, the supply direction is indicated as “0 °” or “180 °”. The component arrangement data 364b shown in FIG. 13A does not include the number of members, but the number of members may be included, or the number of members may be included in other data.

  Specifically, in the component arrangement data 364b shown in FIG. 13A, a pack 311a for wrapping a radial component C having a component name “C1” is set in the Z number “Z1, Z2, Z3, Z4”. The supply direction of the radial part C in the pack 311a set to the Z number “Z1, Z2” is “0 °” and is set to the Z number “Z3, Z4”. The supply direction of the radial component C in the pack 311a is “180 °”.

  In the part arrangement data 364b shown in FIG. 13B, each Z number, the part name of the radial part C in the pack 311a set to the Z number, and an alternative part for the radial part C are set. Z number (substitution information) and the supply direction of the radial part C are indicated. Here, even if the radial parts C are of the same type, if the supply directions are different, the parts names of the radial parts C are shown to be different. The supply direction is indicated as “0 °” or “180 °” as described above. The component arrangement data 364b shown in FIG. 13B does not include the number of members, but may include the number of members, or the number of members may be included in other data.

  Specifically, the component arrangement data 364b shown in FIG. 13B includes the component name “C1” of the radial component C in the pack 311a set to the Z number “Z1” and the supply direction “0 °”. It shows. Also, the component arrangement data 364b is set by the pack 311a that wraps the replacement part of the radial part C and the part name "C1" of the radial part C in the pack 311a set to the Z number "Z2". Z number “Z1” and the supply direction “0 °” are indicated. Furthermore, this part arrangement data 364b packages the part name “C1-180 °” of the radial part C in the pack 311a set in each of the Z numbers “Z3, Z4” and the replacement part of the radial part C. The Z number “Z1” in which the pack 311a is set and the supply direction “180 °” are indicated.

  When the component arrangement data 364b is configured as described above, the mounting control unit 361 can grasp the supply direction only by referring to the component name of the component arrangement data 364b, and can also substitute the substitute component by referring to the substitute information. Can be easily searched.

(Modification 3)
In the present embodiment, the component mounter 300 is configured as a radial component inserter, but may be configured as an axial component inserter. In such a case, the component mounter 300 includes a mechanism different from that of the above embodiment, and mounts an axial component on the board B.

FIG. 14 is a diagram illustrating an example of an axial component.
The axial component is a type in which leads are provided from both sides of the component, such as a diode, and is inserted in close contact with the substrate when the component is mounted. Further, the axial component shown in FIG. 14 has polarity, and the lead indicated by the marking (a triangle mark in FIG. 14) is a specific electrode (for example, a positive electrode or a negative electrode).

  The component tape that holds such an axial component is packaged in a pack so that a specific pole of each axial component faces the right side or the left side when viewed from the front end side of the component tape. Here, the component storage unit includes a pack that wraps the axial component with the specific pole directed to the right side and a pack that wraps the axial component with the specific pole directed to the left side. Therefore, also in the case of such an axial component, as in the case of the radial component, the supply direction (direction) of the axial component (component tape) supplied from each pack of the component supply unit is different between forward and reverse. -ing This component mounting method is useful even when mounting such an axial component.

(Embodiment 2)
Hereinafter, the component mounting system according to the second embodiment will be described with reference to the drawings.

  FIG. 15 is an external view showing the overall configuration of the component mounting system 10 according to the present embodiment. The component mounting system 10 includes a plurality of component mounting machines 100 and 200 constituting a production line on which electronic components (components) are mounted while sending a circuit board (board) 20 from upstream to downstream, and a component mounting machine And a management device 900 that manages 100 and 200. Since the component mounters 100 and 200 have the same configuration, the component mounter 100 will be described in detail below.

  The component mounting machine 100 includes two sub facilities (a front sub facility 110 and a rear sub facility 120) that perform component mounting simultaneously and independently. Each sub-equipment 110 (120) is an orthogonal robot type mounting stage, and includes component supply units 115a and 115b, a multi-mounting head 112, an XY robot 113, a component recognition camera 116, and a tray supply unit 117. Each of the component supply units 115a and 115b includes an array of a maximum of 48 component cassettes 114 for storing component tapes. The multi-mounting head 112 is also referred to as a 10-nozzle head or simply as a head. Simply referred to as a “nozzle”). Hereinafter, the multi mounting head 112 is simply referred to as the head 112. The XY robot 113 moves the head 112. The component recognition camera 116 is used for two-dimensionally or three-dimensionally inspecting the suction state of the component sucked by the head 112. The tray supply unit 117 supplies tray parts. Each such sub-equipment executes component mounting on the board 20 in charge of each sub-equipment independently (in parallel) with other sub-equipment.

  The “component tape” is actually a plurality of components of the same component type arranged on a tape (carrier tape) and supplied in a state of being wound around a reel (supply reel) or the like. The It is mainly used to supply a relatively small size component called a chip component to a component mounter. Note that a component supplied by a component tape is called a taping component.

  Specifically, the component mounting machine 100 is a mounting machine having both functions of a component mounting machine called a high-speed mounting machine and a component mounting machine called a multi-function mounting machine. A high-speed mounting machine is a facility characterized by high productivity that mainly mounts electronic components of 10 mm square or less at a speed of about 0.1 seconds per point. A multi-function mounting machine is a large machine of 10 mm square or larger. It is equipment for mounting electronic parts, odd-shaped parts such as switches and connectors, and IC parts such as QFP (Quad Flat Package) and BGA (Ball Grid Array).

  That is, this component mounting machine 100 uses a plurality of types of suction nozzles (implementing nozzle replacement or the like), so that almost all types of electronic components (0.4 mm × 0.2 mm as components to be mounted). (From a chip resistor to a 200 mm connector) can be mounted, and a production line can be configured by arranging a required number of component mounting machines 100.

FIG. 16 is a plan view showing a main configuration of the component mounter 100 according to the present invention.
The shuttle conveyor 118 is a moving table (component conveying conveyor) for placing the components taken out from the tray supply unit 117 and transporting them to a predetermined position where the head 112 can adsorb them. The nozzle station 119 is a table on which replacement nozzles for accommodating various types of component types are placed. The transport unit 121 carries the substrate 20 into the component mounting machine 100 or carries it out of the component mounting machine 100.

  The two component supply units 115a and 115b constituting each sub-equipment 110 (or 120) are respectively arranged on the left and right with the component recognition camera 116 interposed therebetween. Therefore, the head 112 that has picked up the component in the component supply unit 115a or 115b moves to the mounting point of the substrate 20 after passing through the component recognition camera 116, and repeats the operation of sequentially mounting all the sucked components.

  Here, a single operation (suction / movement / mounting) in a series of operations of picking, moving, and mounting parts by the head 112, or a group of components mounted by such a single operation is “task”. Call it. For example, with a 10-nozzle head, the maximum number of parts to be mounted by one task is 10. The “suction” here includes all the suction operations from when the head 112 starts to pick up components until it moves. For example, 10 suction operations (up and down motion of the head 112) This includes not only the case of picking up parts but also the case of picking up 10 parts by a plurality of picking operations.

  Further, two IC tag readers 111 are disposed in the component supply units 115a and 115b for each of the sub-equipment 110 and 120. These IC tag readers 111 read component information from an IC tag described later. Since the IC tag reader 111 and the IC tag are configured in the same manner as the IC tag reader and the IC tag according to the first embodiment, detailed description thereof is omitted.

FIG. 17 is a schematic diagram showing the positional relationship between the head 112 and the component cassette 114.
The component cassette 114 pulls out the component tape wound around the supply reel 426 and sends out the components packed in the component tape in order from the top side to the suction position. The head 112 is a work head called a “gang pickup system”, and can attach a maximum of ten suction nozzles 112a as described above. When ten suction nozzles 112a are attached, parts can be picked up simultaneously (by one up-and-down operation) from each of the suction positions of up to ten part cassettes 114.

  Also, the set position of the component cassette 114 (or supply reel 426, component tape) in the component supply units 115a and 115b is referred to as “value on the Z axis” or “position on the Z axis (Z number)”. For the number, a serial number or the like in which the leftmost end of the component supply unit 115a is “Z1” is used. The “Z-axis” refers to a coordinate axis that specifies the set position of the component cassette 114 set for each component mounter (or a sub-equipment if a sub-equipment is provided).

The operation of the component mounting machine 100 is summarized as follows.
(1) Nozzle replacement When the nozzles required for the next mounting operation are not in the head 112, the head 112 moves to the nozzle station 119 and performs nozzle replacement. As types of nozzles, there are, for example, types S, M, and L, depending on the size of the parts that can be picked up.
(2) Component adsorption The head 112 moves to the component supply units 115a and 115b and adsorbs electronic components. When 10 parts cannot be picked up at the same time, a maximum of 10 parts can be picked up by moving the picking position up and down several times.
(3) Recognition Scan The head 112 is moved at a constant speed on the component recognition camera 116, and the component recognition camera 116 images all electronic components sucked by the head 112. As a result, the size and suction state of the component are accurately recognized.
(4) Component mounting Electronic components are sequentially mounted on the substrate 20.

  By repeating the operations (1) to (4), all electronic components are mounted on the substrate 20. The operations (2) to (4) are basic operations in mounting a component by the component mounter 100, and correspond to “tasks”. In other words, a maximum of 10 electronic components can be mounted on the substrate in one task.

FIG. 18 is a diagram illustrating an example of a component tape containing electronic components and a supply reel 426.
The electronic component D is accommodated in an accommodation recess 424a formed continuously at a predetermined interval on a carrier tape 424 shown in FIG. 18, and is covered with a cover tape 425 attached to the upper surface. The carrier tape 424 with the cover tape 425 attached in this way is supplied to the user in a taping form wound around the supply reel 426 by a predetermined quantity. However, the shape of the part in which the electronic component D is accommodated is not limited to the concave shape. Such carrier tape 424 and cover tape 425 constitute a component tape, and a supply reel 426 around which the component tape is wound constitutes a component supply means. Further, an IC tag 311b is attached to the supply reel 426, and component information described later is stored in the IC tag 311b.

FIG. 19 is a diagram illustrating an example of a chip-type electronic component D mounted in the present embodiment.
The chip-shaped electronic component (hereinafter referred to as a chip component) D includes, for example, a substantially rectangular body and three leads DL protruding from the body. Such a chip component D has polarity, and the lead DL indicated by the marking (triangular mark in FIG. 19) is a specific electrode (for example, a positive electrode or a negative electrode).

  Such a component tape (carrier tape 424) for holding the chip component D is wound around the supply reel 426 so that the specific pole of each chip component D faces the left side or the right side when viewed from the front end side. . For example, when a component tape is pulled out from a supply reel 426 sold by a certain manufacturer, the specific pole of the chip component D is directed to the left side, and the component tape is pulled out from a supply reel 426 sold by another manufacturer. The specific pole of the chip component D is directed to the right side. In other words, the supply direction (orientation) of the chip component D supplied from these supply reels 426 may be different between forward and reverse for each manufacturer.

  That is, the operator of the component mounting machine 100 purchases a supply reel 426 around which a component tape including the same type of chip component D is wound from each manufacturer and sets the supply reel 426 in the component supply units 115a and 115b of the component mounting machine 100. In this case, even for the same type of chip component D, supply reels 426 having different supply directions may be set.

FIG. 20 is an explanatory diagram for explaining the operation of the nozzle.
Each nozzle 112a attached to the head 112 sucks the chip component D in order from the chip component D on the tip side of the component tape by moving up and down. The nozzle 112a rotates so that the chip component D faces in an appropriate direction according to the polarity, and further moves up and down to mount the chip component D on the substrate 20. Thereby, the chip component D is mounted on the substrate 20.

  FIG. 21 is an explanatory diagram for explaining the contents of the component information output from the IC tag 311b.

  Similar to the component information described in the first embodiment, this component information includes the component name of the chip component D included in the component tape wound on the supply reel 426, the supply direction (direction) of the chip component D, and the like. , And the number of chip parts D. For example, the part information on the left side in FIG. 21 includes the part name “D1”, the supply direction “positive”, and the number “300”, and the part information on the right side in FIG. 21 includes the part name “D1” and the supply. The direction “reverse” and the number “200” are included.

  The component information supply direction shown on the left side in FIG. 21 is “normal” and the component information supply direction shown on the right side in FIG. 21 is “reverse”, but conversely, the component information shown on the left side in FIG. May be “reverse” and the component information supply direction shown on the right side in FIG. 21 may be “normal”. In other words, the supply direction of the component information shown in FIG. 21 may be any content as long as the content indicates that the supply directions differ from each other by 180 °.

  FIG. 22 is a block diagram showing a functional configuration of the component mounter 100 shown in FIG.

  The component mounter 100 includes a mounting control unit 151, an output unit 152, an input unit 153, a database unit 154, a change unit 157, a memory unit 159, a component outage detection unit 155, a mechanism unit 150, and four IC tag readers 111. . Here, in the present embodiment, the IC tag reader 111 is configured as a direction identifying unit, and the IC tag reader 111 and the changing unit 157 are configured as a mounting angle changing device.

  The memory unit 159 includes a RAM (Random Access Memory) that provides a work area for the mounting control unit 151.

  The output unit 152 is a CRT (Cathode-Ray Tube), an LCD (Liquid Crystal Display), or the like, and the input unit 153 is a keyboard or the like. These are used for dialogue between the component mounting machine 100 and an operator under the control of the mounting control unit 151.

  The mechanism unit 150 is a set of mechanism-related components including the head 112, the XY robot 113, the component cassette 114, the component recognition camera 116, the transport unit 121, and a motor and a motor driver that drive these.

  The database unit 154 is a hard disk or the like for storing the component arrangement data 154b generated by the mounting control unit 151 and the mounting point data 154a generated based on a predetermined condition.

FIG. 23 is a diagram illustrating an example of the component arrangement data 154b.
As shown in FIG. 23, the component arrangement data 154b includes, for each sub-equipment, each Z number, the component name of the chip component D set in the Z number, the supply direction of the chip component D, and the chip The number of parts D is shown.

  For example, in the component arrangement data 154b of the front sub-equipment 110, 300 chip components D having a component name “D1” are set to the Z number “Z1” in the “reverse” supply direction, and the Z number “Z2” is set. Indicates that 200 chip parts D with the above-mentioned part name “D1” are set in the “positive” supply direction.

FIG. 24 is a diagram illustrating an example of the mounting point data 154a.
The mounting point data 154a indicates information regarding each mounting point (specific position on the substrate 20) on the substrate 20, and includes the mounting point, the coordinates of the mounting point (x coordinate and y coordinate), and the mounting thereof. Control data related to component mounting at a point (type of suction nozzle that can be used, maximum moving speed of head 112, etc.), mounting angle of chip component D to be mounted at the mounting point, and chip component D Indicates the set Z number. In general, the mounting angle is determined based on the state of the nozzle 112a when the chip component D is sucked at the suction position of the component cassette 114 in order to mount the chip component D on the substrate 20 in an appropriate direction. It means the angle that must be purely rotated from the reference. In addition, the mounting point data 154a indicates the mounting order of each component by an array of mounting points.

  For example, the mounting point data 154a indicates that the chip component D must be mounted in the order of mounting point p1, mounting point p2,... → mounting point p4. Further, the mounting point data 154a is that the mounting point p1 of the coordinates (x1, y1) is rotated by the nozzle 112a by θ1 from the above reference under the restriction by the control data φ1, and the chip part D with the Z number “Z2” is placed. At the mounting point p2 of the coordinates (x2, y2) to be mounted, the chip part D with the Z number “Z2” is mounted by rotating the nozzle 112a by θ2 from the above reference under the restriction by the control data φ2. Indicates what should be done.

  The component breakage detection unit 155 detects the component breakage of the supply reel 426 set for each Z number. That is, for each Z number, the component breakage detection unit 155 supplies the chip by subtracting the number of chip components D supplied from the supply reel 426 corresponding to the Z number from the number indicated in the component arrangement data 154b. The remaining number of chip parts D on the reel 426 is specified. When the remaining number of chip parts D on the supply reel 426 set to any Z number becomes 0, the part shortage detection unit 155 detects the Z number of the supply reel 426 that has run out of parts, The mounting controller 151 is notified of the component name of the chip component D held on the supply reel 426.

  As in the first embodiment, the mounting control unit 151 generates the above-described component arrangement data 154b based on a signal output from the IC tag 311b and acquired by the IC tag reader 111, that is, component information.

  Specifically, the mounting control unit 151 determines, for each of the sub-equipment 110 and 120, the signal status (for example, the intensity or direction of the radio wave) output from each IC tag 311b and acquired by the two IC tag readers 111. The position of each IC tag 311b, that is, the position (Z number) of each supply reel 426 is specified. Then, for each Z number, the mounting control unit 151 obtains and summarizes the part name, the supply direction, and the number of the part information corresponding to the Z number, thereby generating the component arrangement data 154b and storing it in the database unit 154. Store.

  Further, the mounting control unit 151 generates the component arrangement data 154b and controls each component included in the mechanism unit 150 based on the generated component arrangement data 154b and the mounting point data 154a.

  For example, the mounting control unit 151 refers to the mounting point data 154a and specifies the Z number “Z2”, the mounting angle “θ1”, and the control data φ1 of the chip component D to be mounted at the mounting point p1. Then, the mounting control unit 151 controls the mechanism unit 150 under the restriction of the control data φ 1, so that the chip component D with the component name “D 1” on the supply reel 426 with the Z number “Z 2” is transferred to the head 112. The nozzle 112a is sucked, and the nozzle 112a is rotated by θ1 on the basis of the state of the nozzle 112a at the time of sucking, and the chip component D is mounted on the mounting point p1.

  Further, the mounting control unit 151 supplies the chip component D from the supply reel 426 having the Z number indicated by the mounting point data 154a and tries to mount the chip component D by the component outage detection unit 155. When out-of-stock is detected, the part arrangement data 154b is searched for the same type (same part name) as the chip part D of the supply reel 426 that has run out of parts or a substitutable part (hereinafter referred to as a substitute part). If the substitute part is found, the mounting control unit 151 specifies the Z number of the supply reel 426 having the substitute part from the part arrangement data 154b, and the substitute part of the supply reel 426 at the Z number is identified by the head. Adsorbed to 112.

  Here, when finding a substitute part, the mounting control unit 151 further determines whether or not the supply direction of the substitute part is different from the supply direction of the chip part D of the supply reel 426 that is out of parts. Depending on the determination result, the changing unit 157 changes the mounting point data 154a. That is, when the mounting control unit 151 determines that the supply direction is the same, the mounting control unit 151 causes the changing unit 157 to change only the Z number of the mounting point data 154a. On the other hand, when determining that the supply directions are different, the mounting control unit 151 causes the changing unit 157 to change the Z number and the mounting angle of the mounting point data 154a.

  For example, when the mounting control unit 151 refers to the component arrangement data 154b and finds a substitute component (Z number “Z1”) for the chip component D of the supply reel 426 that is out of components set to the Z number “Z2”. It is determined that their supply directions are different from each other. As a result, the mounting control unit 151 instructs the changing unit 157 to change the Z number of the mounting point data 154a from “Z2” to “Z1” and to change the mounting angle corresponding to “Z1”. To do.

  The changing unit 157 changes the mounting point data 154a based on an instruction from the mounting control unit 151. That is, when the changing unit 157 receives an instruction from the mounting control unit 151 to change the Z number, the changing unit 157 changes the Z number of the supply reel 426 that is out of components to the Z number of the supply reel 426 that has a substitute part. . Further, when the changing unit 157 receives an instruction to change the mounting angle from the mounting control unit 151, the changing unit 157 adds 180 ° to the mounting angle associated with the Z number of the supply reel 426 having the substitute part, and Rewrite the mounting angle.

FIG. 25 is a diagram illustrating the mounting point data 154 a changed by the changing unit 157.
For example, after the mounting points p1 and p2 are mounted, the supply reel 426 set to the Z number “Z2” runs out of parts. In such a case, in the contents after the mounting point p3 of the mounting point data 154a, the changing unit 157 changes the Z number “Z2” of the mounting point data 154a to “Z1” in response to an instruction from the mounting control unit 151. Then, 180 ° is added to the mounting angles “θ3, θ4” corresponding to the Z number “Z1”. As a result, the mounting angles “θ3, θ4” of the mounting point data 154a are changed to “θ3 + 180 °, θ4 + 180 °”. Since the mounting angle should be indicated between −180 ° to 0 ° to 180 °, when θ3 is 180 °, θ3 is changed to 0 ° (360 °) by adding 180 °. , Θ4 is 90 °, θ4 is changed to −90 ° (270 °) by adding 180 °.

  When the mounting point data 154a is changed in this way, the mounting control unit 151 controls the mechanism unit 150 with reference to the mounting point data 154a, thereby the component name “Z1” on the component tape “Z1”. The chip component D of “D1” is attracted to the nozzle 112a of the head 112, and the nozzle 112a is rotated by θ3 + 180 ° with reference to the state of the nozzle 112a at the time of the adsorption, and the chip component D is mounted on the mounting point p1. .

FIG. 26 is an explanatory diagram for explaining a state when parts are out of stock.
As shown in FIG. 26, when the chip component D of the supply reel 426 set to the Z number “Z2” is out of components, the mounting control unit 151 and the changing unit 157 perform the processing as described above. Instead of the chip part D, the same kind of chip part D of the supply reel 426 set in the Z number “Z1” is used. At this time, since the supply directions of the chip components D set in advance in the Z numbers “Z1, Z2” are different from each other, the nozzle 112a is set in advance for the chip components D in the Z number “Z2”. It rotates to a mounting angle different from the mounting angle by 180 °, and the chip part D with the Z number “Z1” is mounted on the substrate 20.

  In such a component mounting machine 100, when a plurality of supply reels 426 having the same kind of chip components D but having different supply directions are set, that is, a plurality of supply reels 426 supplied from each manufacturer are provided. When set, the same operation as that shown in FIG. 12 of the first embodiment is performed. Even when only the supply reel 426 supplied from one manufacturer is set, the component mounter 100 confirms the supply direction of the chip component D of the supply reel 426. That is, when the component mounting machine 100 takes out the chip component D from the supply reel 426 set at the Z number indicated by the mounting point data 154a, the component mounting machine 100 determines whether the supply direction is normal or reverse. The mounting angle set in advance with the supply direction being positive is changed. Then, the component mounter 100 mounts the chip component D on the board 20 at the changed mounting angle.

  As described above, in this embodiment, when any one of the supply reels 426 is out of parts, another supply reel 426 having a substitute part for the chip part D in the supply reel 426 is searched, Furthermore, when the supply direction of the substitute component is different from the supply direction of the chip component D, the mounting angle of the substitute component is changed, and the substitute component is mounted instead of the chip component D. As a result, even if a plurality of supply reels 426 are purchased from each manufacturer (multi-company purchase), the plurality of supply reels 426 are set in the component mounting machine 100 regardless of the supply direction of each supply reel 426. In this case, the productivity of the board 20 on which the components are mounted can be improved without stopping the production as in the conventional example even if the components are cut.

  In this embodiment, even if the orientation of the chip component D supplied from any of the supply reels 426 is different from the reference orientation, the orientation of the mounted chip component D with respect to the substrate 20 is The mounting angle is changed so as to be equal to the direction of the chip component D to be mounted at a predetermined mounting angle with respect to the board 20. As a result, the orientation of the chip component D supplied from the supply reel 426 can be freely set, and the utility value of this component mounting method can be increased. For example, even if a supply reel 426 having a different supply direction is purchased for each manufacturer and set on the component mounter 100, the chip component D can be mounted on the substrate 20 in an appropriate direction.

  Also in the present embodiment, as in the first modification of the first embodiment, the mounting angle may be changed without rewriting the contents of the mounting point data 154a, and the first embodiment is used instead of the component arrangement data 154b. The component arrangement data 364b of the second modification may be used.

  As mentioned above, although the component mounting method concerning this invention was demonstrated using Embodiment 1, its modification, and Embodiment 2, this invention is not limited to these.

  For example, in the first embodiment and the modification thereof, the pack 311a has been described as the component supply unit, but the pack 311a, the guide 312 and the cassette 313 may be used as the component supply unit, and any one of them may be supplied as the component supply unit. It may be a means. In the second embodiment, the supply reel 426 is described as the component supply unit. However, the supply reel 426, the component tape, and the component cassette 114 may be used as the component supply unit, and any one of them may be a component supply unit. It may be a supply means.

  In the second embodiment, the change unit 157 is provided in the component mounter 100, but may be provided in the management apparatus 900. In this case, the management device 900 and the IC tag reader 111 are configured as a mounting angle changing device.

  Further, in the first embodiment and the modified example and the second embodiment, the replacement part is searched when the part runs out. However, before the part runs out, for example, the part is replaced when the remaining part becomes small. You may search for parts.

  In the first embodiment and the modified example and the second embodiment, the supply direction is specified using the IC tag 311b and the IC tag reader 111. However, the supply direction may be specified using a barcode and a barcode reader. Good. For example, a barcode indicating the above-described component information is attached to the pack 311a and the supply reel 426, and the barcode reader reads the component information to specify the supply direction. Similarly, the number of parts may be specified using a barcode and a barcode reader.

  Further, in the first embodiment and the modified example and the second embodiment, when a part is cut out, a part having the same part name as that of the part that has been cut out is searched for as a substitute part. If so, the parts may be searched as alternative parts even if they are not the same part name.

  The component mounting method of the present invention has the effect of improving the productivity of a component-mounted board. For example, from a component mounter that mounts an electronic component on a printed wiring board, or a plurality of component mounters thereof It can be applied to production lines that are configured.

It is an external view which shows the structure of the component mounting machine in Embodiment 1 of this invention. It is a conceptual diagram which shows notionally the main structures of a component mounting machine same as the above. It is a figure which shows an example of a radial component same as the above. It is a block diagram which shows the structure of a head same as the above. It is a figure which shows the circuit structure of an IC tag reader same as the above, and the circuit structure of an IC tag. It is explanatory drawing for demonstrating the content of the component information same as the above. It is a block diagram which shows the functional structure of a component mounting machine same as the above. It is a figure which shows an example of component arrangement data same as the above. It is a figure which shows an example of mounting point data same as the above. It is a figure which shows the mounting point data changed by the change part same as the above. It is explanatory drawing for demonstrating a mode when it becomes out of components same as the above. It is a flowchart which shows operation | movement of a component mounting machine same as the above. It is a figure which shows the example of the components arrangement | sequence data in the modification 2 same as the above. It is a figure which shows an example of the axial component in the modification 3 same as the above. It is an external view which shows the structure of the whole component mounting system in Embodiment 2 of this invention. It is a top view which shows the main structures of a component mounting machine same as the above. It is a schematic diagram which shows the positional relationship of a head same as the above and a component cassette. It is a figure which shows the example of the component tape which accommodated the electronic component same as the above, and the reel for supply. It is a figure which shows an example of the chip-shaped electronic component D same as the above. It is explanatory drawing for demonstrating operation | movement of a nozzle same as the above. It is explanatory drawing for demonstrating the content of the component information output from an IC tag same as the above. It is a block diagram which shows the functional structure of a component mounting machine same as the above. It is a figure which shows an example of component arrangement data same as the above. It is a figure which shows an example of mounting point data same as the above. It is a figure which shows the mounting point data changed by the change part same as the above. It is explanatory drawing for demonstrating a mode when it becomes out of components same as the above.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Component mounting system 20, B board | substrate 100,200,300 Component mounting machine 110 Front sub-equipment 112,330 Head 112a Nozzle 115a, 115b Component supply part 120 Rear sub-equipment 150,368 Mechanism part 151,361 Mounting control part 152,362 Output unit 153, 363 Input unit 154, 364 Database unit 154a, 364a Mounting point data 154b, 364b Component arrangement data 157, 365 Change unit 159, 366 Memory unit 311a Pack 426 Supply reel 900 Management device C Radial component D Axial component L DL read

Claims (17)

A component mounting method for mounting the component on a substrate using a head for holding the component,
A direction identifying step for identifying a direction of a component supplied from the first component supply means;
A change step of changing a mounting angle set in advance with respect to the substrate of the component supplied from the first component supply means according to the orientation of the component specified in the orientation specifying step;
And a first mounting step of holding the component supplied from the first component supply means on the head and mounting the component on the board at the mounting angle changed in the changing step. Implementation method. The component mounting method further includes:
A change determination step of comparing the orientation of the component specified in the orientation specification step with a reference orientation, and determining that the preset mounting angle should be changed when the orientations differ from each other;
In the changing step,
When it is determined that the change should be made in the change determination step, the orientation of the mounted component relative to the substrate is supplied in the reference orientation, and the orientation of the component mounted at the preset mounting angle relative to the substrate The component mounting method according to claim 1, wherein the mounting angle is changed to be equal to: In the change determination step,
The direction of the component supplied from the second component supply means is used as a reference direction, the direction of the component specified in the direction specifying step is compared with the reference direction, and the preset direction is set when the directions are different from each other. It is determined that the mounted mounting angle should be changed,
In the changing step,
The mounting angle preset for the substrate of the component supplied from the second component supply means is set to the mounting angle preset for the board of the component supplied from the first component supply means. And changing according to the orientation of the component identified in the orientation identification step,
In the first mounting step,
The component mounting method according to claim 2, wherein a component supplied from the first component supply unit is mounted on a substrate instead of the component supplied from the second component supply unit. The component mounting method further includes:
A second mounting step of mounting the component supplied from the second component supply means on the substrate while holding the component on the head;
A component runout determining step for determining whether or not the remaining number of components supplied from the second component supply means has reached a predetermined number;
Whether it is possible to replace the component supplied from the first component supply unit with the component supplied from the second component supply unit when it is determined that the predetermined number has been reached in the component outage determination step And an alternative determination step for determining
In the first mounting step,
The component mounting method according to claim 3, wherein when it is determined in the replacement determining step that replacement is possible, the component supplied from the first component supply unit is mounted on the head. In the changing step,
Rewriting the mounting angle of the mounting point data indicating the mounting angle of the component determined on the condition that the direction of the component supplied from the first component supply unit is set to the reference direction;
In the first mounting step,
The component mounting method according to claim 4, wherein the component is mounted on the board at a mounting angle of the mounting point data rewritten in the changing step. The changing step includes
An angle that identifies the mounting angle from mounting point data indicating the mounting angle of the component determined on the condition that the direction of the component supplied from the first component supply unit is set to the reference direction. Specific steps,
A difference identifying step for identifying a difference between the orientation of the component identified in the orientation identifying step and a reference orientation;
The component mounting method according to claim 4, wherein the mounting angle specified in the angle specifying step is changed based on the difference specified in the difference specifying step. In the orientation specifying step,
The component mounting method according to claim 1, wherein the orientation of the component supplied from the first component supply means is specified by reading the orientation of the component recorded in an IC (Integrated Circuit) tag. The part cut-off determination step includes:
A read step for reading the number of parts recorded in an IC (Integrated Circuit) tag;
A counting step for counting the number of parts supplied from the second part supply means;
A subtraction step of subtracting the number of parts counted in the counting step from the number of parts read out in the reading step,
The component mounting method according to claim 4, wherein it is determined whether or not a subtraction result obtained by the subtraction step has reached the predetermined number. In the changing step, when the orientation of the component supplied from the first component supply means is opposite to the reference orientation, the preset mounting angle is changed by 180 °. 2. The component mounting method according to 2. In the first mounting step,
The component mounting method according to claim 1, wherein the component is mounted on the substrate at a mounting angle changed in the changing step by rotating a nozzle that holds the component of the head. In the orientation specifying step,
The component mounting method according to claim 1, wherein a direction of polarity of a component supplied from the first component supply unit is specified. A component mounting method for mounting the component on a substrate using a head for holding the component,
A first mounting step in which the component supplied from the first component supply means is held on the head and mounted on the substrate;
A component runout determining step of determining whether or not the remaining number of components supplied from the first component supply means has reached a predetermined number;
When it is determined that the predetermined number has been reached in the component cutting determination step, the direction of the component supplied from the first component supply unit and the component supplied from the second component supply unit can be substituted. A difference identifying step for identifying a difference from the orientation of the alternative part,
A change step of changing a mounting angle set in advance for the substrate of the component supplied from the first component supply means according to the difference specified in the difference specifying step;
A second mounting step of holding the substitute component supplied from the second component supply means on the head, and mounting the substitute component on the board at the mounting angle changed in the changing step. Component mounting method. In order to mount the component on a substrate using a head that holds the component, a method of changing a mounting angle of the component with respect to the substrate,
A direction identifying step for identifying a direction of a component supplied from the first component supply means;
A changing step of changing a mounting angle set in advance with respect to the substrate of the component supplied from the first component supplying means according to the orientation of the component specified in the orientation specifying step. How to change the mounting angle. A component mounter that mounts the component on a board using a head that holds the component,
Parts supply means for supplying parts;
Orientation specifying means for specifying the orientation of a component supplied from the component supply means;
A changing unit that changes a mounting angle set in advance with respect to the substrate of the component supplied from the component supplying unit according to the orientation of the component specified by the orientation specifying unit;
A mounting control unit that holds the component supplied from the first component supplying unit on the head and mounts the component on the board at the mounting angle changed by the changing unit. . A mounting angle changing device that changes a mounting angle of a component supplied from a component supply unit with respect to the substrate in order to mount the component on the substrate using a head that holds the component,
Orientation specifying means for specifying the orientation of the parts supplied from the parts supply means;
A mounting unit comprising: a changing unit configured to change a preset mounting angle of the component supplied from the component supplying unit with respect to the substrate in accordance with a direction of the component specified by the direction specifying unit. Angle changing device.   The program which makes a computer perform the step contained in the component mounting method of any one of Claims 1-12.   The program which makes a computer perform the step contained in the mounting angle change method of Claim 13.

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