JPS63281969A - Housing strip for electronic part - Google Patents

Abstract

PURPOSE:To provide a housing strip preventing the revolution and fine movement of an electronic part and made easy to receive and take out said electronic part, by providing a guide part for positioning the electronic part and a contact part brought into contact with the lead wire of the electronic part. CONSTITUTION:Recessed housing parts 12 are formed to a housing strip 11 so as to provide a predetermined pitch in the longitudinal direction thereof and, for example, a pair of lead wires 18 are protruded from the end surface of an electronic part 17. Both side parts of the main body 17a of the electronic part 17 accepted in each recessed housing part 12 so that the axial center of said part 17 is set in the longitudinal direction of said recessed part 12 are respectively brought into contact with guide parts 14 and the positioning of the electronic part 17 in the recessed part 12 is performed. The bent leading end parts 18a of the lead wires 1 are respectively brought into contact with a contact part 15 to perform the positioning of the electronic part 17 in the revolving direction thereof. The left and right surfaces opposed each other of the recessed parts 12 in the longitudinal direction thereof are formed over a definite distance at a large taper angle to form the guide parts 14. Then, by sucking air through the hollow part 31 of a sucking head 31, the electronic part 17 is held.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic component storage belt that can store electronic components having lead wires in a positioned manner.

[Prior art and problems to be solved by the invention] As is well known, when electronic components, which have been widely used in recent years, are mounted on a board etc. by an automatic machine such as a mounting device, the electronic component is For example, it is sucked and gripped by a suction head of a machine,
Generally, the device is transported and placed on a predetermined location on the board, etc., and then mechanically and electrically connected by soldering to the board, etc.

By the way, in order to suction and grip electronic components with the suction head, the electronic components need to be supplied to a predetermined location in an aligned state.

Conventionally, a so-called magazine system has been adopted as a means for this supply. That is, a sliding groove for the electronic component is formed in the longitudinal direction of the magazine having a certain length and width, and the electronic component is engaged with this sliding groove, and the feeding device connected to the magazine The electronic components in the sliding groove are supplied by the above-mentioned sliding groove.

However, with this conventional technique, it is impossible to increase the stock of parts beyond the length of the magazine, and it is necessary to frequently replace the magazine. Further, since the electronic components engaged with the sliding grooves are fed while adjacent ones are in contact with each other, there is a possibility that the electronic components are damaged during feeding.

As a technique to solve this problem, for example, the Grand Duke 1
Publication No. 11157-23920 or Special Publication No. 62-6
No. 360 discloses a storage band for electronic components.

This prior art will be explained with reference to FIGS. 16 to 20. Storage recesses 2 are formed in a flexible tape-shaped storage band 1 at predetermined intervals, and A hole 3 is formed in the edge portion of the feed sprocket, into which a pawl of a feed sprocket (not shown) is engaged. Moreover, a single electronic component is stored in each of the storage recesses 2, and by rotating the sprocket, the storage belt 1 is intermittently fed, and the electronic component stored in the storage recess 2 is When it is fed and stopped at a predetermined position, the suction head 4 is lowered to this position and the electronic component is suctioned and held.

According to this prior art, the weight of the electronic component is relatively light, and due to vibrations that may occur when the storage band 1 is fed by the sprocket, the electronic component stored in the storage recess is moved to the storage recess. However, even if this rotation occurs, the electronic components to be stored in the storage recess are not held at both ends of the cylindrical main body 5 as shown in FIG. In the case of a chip-type electronic component 7 on which an electrode 6 is formed, it can be gripped and mounted by the suction head regardless of the rotation angle, and the first
In the case of a rectangular shape as shown in FIG. 9, rotation is prevented, so there is no problem.

However, when a plurality of lead wires 8 are provided at the end of a cylindrical main body as shown in FIG. 20, and rotation occurs in a chip-type electronic component 9 in which the lead wires 8 are bent,
Accurate mounting of this electronic component 9 on the board becomes difficult.

Further, the width of the four storage sections 2 formed in the storage band 1 is generally slightly wider than the diameter of the electronic component 7 for convenience in storing or adsorbing the electronic component 7. The position of the electronic component 7 may be changed within the storage recess 2 due to vibrations or the like when the storage band is fed. If this positional variation occurs, it becomes difficult for the suction head 4 to grip the suction 9, and it also becomes difficult to mount the suction 9 in an accurate position when the automatic machine is used to mount it on a substrate or the like.

To deal with this, it is conceivable to form the width of the storage recess 2 to be equal to or slightly smaller than the diameter of the electronic component 9; It becomes complicated to store the electronic component 9 in the recess 2, and it becomes difficult to suction 9 and hold the electronic component 9 with the suction head 4.

[Object of the Invention] The present invention has been made in view of the above-mentioned circumstances, and even if vibrations occur in the storage band in which electronic components are stored, the electronic components will not be able to move inside the storage recess of the storage band. It is an object of the present invention to provide a storage band which is prevented from being rotated or moved slightly by the electronic component, and which allows electronic components to be easily stored in and taken out from the storage recess.

[Means and effects for solving the problem] In the electronic component storage band according to the present invention, electronic component storage recesses having lead wires are formed at predetermined intervals in the tape-shaped storage band. In the storage belt for electronic components, the storage recess includes:
A guide section for positioning the electronic component and a contact section that comes into contact with a lead wire provided on the electronic component are provided, and by bringing the electronic component into contact with the guide section, the electronic component can be moved. The rotation of the electronic component is prevented by determining the position of the electronic component and abutting the lead wire provided on the electronic component.

[Embodiments of the Invention] Hereinafter, embodiments of an electronic component storage belt according to the present invention will be described with reference to the drawings.

1 to 8 relate to the first embodiment of the present invention, in which FIG. 1 is a view taken along the line II in FIG. 2, FIG. 2 is a plan view of the electronic component storage cloth, and FIG. is a view taken along the line ■-■ in Fig. 2, Fig. 4 is a reference perspective view of the storage band for electronic components, Fig. 5 is an explanatory diagram of the operating state showing the supply status of electronic parts, and Fig. 6 is a diagram showing the state of supply of electronic components. An explanatory diagram of the operating state showing the state where the suction 9 is gripped, Fig. 7 is an explanatory diagram of the operating state showing the state where the position of the electronic component is corrected, and Fig. 8 shows the state where the electronic component is mounted on the board. It is an explanatory diagram of an operating state.

In these figures, reference numeral 11 indicates a flexible storage band for electronic components, and storage recesses 12 are formed at a predetermined pitch in the longitudinal direction of the storage band 11. This storage recess 12 is formed in the storage band 11 by means such as molding, and a portion of the back surface of the storage band 12 corresponding to this storage recess 12 is a protrusion 11a.

The storage recess 12 has a rectangular plane, and the length of this rectangle is perpendicular to the length of the storage band 11.

Further, the storage recess 12 of the storage band 11 has ribs 11b at the front and rear in the longitudinal direction, and holes 13 are formed continuously at a predetermined pitch in the longitudinal direction of the storage band 11 on one side of the rib 11b. It is perforated.

The four inner circumferences of the storage recess 12 are formed as uniformly tapered surfaces that converge toward the bottom surface 12a of the storage recess 12, and the opposing left and right surfaces of the storage recess 12 have a taper angle. A large surface is formed at a certain distance, and this surface serves as the guide portion 14.

Also, is the storage recessed above? A flat surface parallel to the bottom surface 12a is formed in a portion of the bottom surface 12a of the ll512 that escapes the guide portion 14, and this surface serves as the contact portion 15. In this embodiment, the contact portion 15 and the bottom surface 12a are on the same plane.

The storage recess 12 in the above description is for storing the electronic component 17.

This electronic component 17 has one end surface 17 of a cylindrical main body 17a.
For example, a pair of lead wires 18 protrude from b. This lead 1111B is bent at a right angle while extending away from the end surface 17b, further bent parallel to the end surface 17b, and separated from the end surface 17b again at the tip 18a. In the electronic component 17 used in this embodiment, the extension of the plane formed by the plurality of bent tips 18a coincides with the side of the main body 17a of the electronic component 17. Moreover, the distance between the tip portions 17b is formed to be larger than the diameter of the main body 17a.

When the electronic component 17 having such a configuration is stored in the storage recess 12, the axis of the electronic component 17 is oriented in the longitudinal direction of the storage recess 12. The electronic component 17 is positioned within the housing recess 12 by abutting both sides of the main body 17a of the electronic component 17 against the guide portion 14, respectively. In addition, the lead wire 1
The bent tip portions 18a of 8 are connected to the contact portion 15, respectively.
By coming into contact with the electronic component 17, the position of the electronic component 17 in the rotational direction is determined.

In the storage band 11, the opening surface of the storage recess 12 is covered with a tape 19 having the same width and length as the storage band 11, with the electronic components 17 as described above stored in each of the storage recesses 12. It is then set onto the loading device 20.

As shown in FIG. 5, this mounting equipment M20 has the storage belt 1
1 is provided.

This guide member 22 is provided with a groove 23 in the center, and flanges 24 are formed on both sides of this guide member 22, so that the protruding portion 11a of the storage band 11 is engaged with the groove 23. Both ribs 11b of the storage band 11 are adapted to come into sliding contact with the 1m24.

Also, a part of the guide member 22 is located below a portion where the lead wire 18 of the electronic component 17 stored in the storage recess 12 is located when the storage band 11 is engaged with the guide member 22. A magnet 26, which is an example of a means for biasing the lead wires 18, is disposed at the magnet 26, which attracts each of the plurality of lead wires 18 passing through the magnet 26 to attract the electronic component 1.
Even if 7 is rotated, this rotation can be corrected.

On the other hand, a pulley (not shown) is arranged behind the guide member 22, and the storage band 11 is wound around this pulley. Further, a roller 27 is disposed on the upper surface of the guide member 22, and a winding device 28 is disposed further above the roller 27.
The tape 19 covering the surface of the tape 19 is peeled off via a roller 27 and wound around the wrapping M28.

Further, a sprocket 29 is arranged in front of the guide member 22. A recess (not shown) is provided in the center of the sprocket 29 to allow the protrusion 11b of the storage band 11 to escape, and a hole 13 formed in the side 711b of the storage band 11 is provided in the side of the sprocket 29. An engaging pawl 29a that is engaged with the sprocket 29 is provided in a circumferential manner, and as the sprocket 29 is rotated intermittently, the storage band 11 is pulled and stored in the storage recess 12 of the storage band 11. The above-mentioned electronic component 17 is sent. Note that the rotation of this sprocket 29 is synchronized with the rotation of the winding device 28.

Further, above the guide member 22, between the roller 27 and the sprocket 29, the electronic component 27 is suctioned.
A suction head 31 is arranged to grip the sprocket 2.
The electronic component 17 is moved to a predetermined position by the intermittent rotation of the electronic component 9, and when the electronic component 17 is stopped, it is lowered to the stopped position. The tip of the suction head 31 has a roundness that is the same as the curvature of the main body 17a of the electronic component 17, and a hollow portion 31a is provided at the axis of the suction head 31. The electronic component 17 is gripped by suctioning air from the tip through the tip.

The electronic component 17 gripped by this suction head 31
is configured to be conveyed to the center of the position correction device 32 and stopped. As shown in FIG. 7, this position correction device 32 includes a plurality of pressing members 3 configured to be able to gather and separate from each other on a plane perpendicular to the axis of the suction head 31.
2a, and these pressing members 32a
is brought into contact with the four circumferences of the electronic component 17 which is gripped and stopped by the suction head 31, so that the electronic component 1
7, the positioning with respect to the suction head 31 is further complemented. The electronic component 17 whose position has been corrected by the position correction device 32 is transported to a fixed position on the substrate 33 by the suction head 32. In this case, the tips 18a of the plurality of lead wires 18 provided on the electronic component 17 are connected to the land 3 formed on the substrate 33.
3a and soldered to this land 33a.

Next, the operation of the embodiment with the above-described configuration will be explained.

The protrusion 11a of the storage band 11 in which the electronic components 17 are stored in each of the storage recesses 12 is engaged with the guide member 22 at 23, and the rib 11b of this storage band 11 is connected to the collar 24 of the guide member 22. This storage band 11 is set into the mounting device 20 by sliding contact. Further, the storage band 11 located behind the guide member 22 is wound around a boob (not shown), while the part of the storage band 11 located in front of the guide member 22 is wound around a sprocket 29. The hole 13 formed in the slot 711b of the storage band 11 is engaged with the pawl 29a of the sprocket 29.

During this time, the storage band 11 is vibrated, but the storage recess 12
Since the opening is covered with a chi 719, this vibration causes the electronic component 1 stored in the storage recess 12 to
7 will not be discharged from this storage section 17.

When the storage band 11 is set on the mounting device 20, the tape 19 covering the opening of the storage recess 12 is peeled off, and its tip is wound around the winding device 28.

When the mounting device 20 starts operating in this state, the two sprockets are rotated intermittently, and the winding device 28 is rotated in synchronization with this rotation. While the tape 19 is peeled off via the roller 27, the storage strip 11 is pulled by the sprocket 29 and is fed intermittently.

As mentioned above, a plurality of storage recesses 12 are formed in the longitudinal direction of this storage belt 11, and each of these storage recesses 12 stores an electronic component 17, so when the storage belt 11 is fed, the electronic components 17 are stored. The part 17 is fed and then stopped at a predetermined position.

When the storage band 11 is fed by the sprocket 29, it is conceivable that the storage band 11 and the electronic component 17 stored in the storage recess 12 of the storage band 11 are vibrated by the sprocket 29.

Even if the storage band 11 and electronic components 17 are vibrated, this vibration is in the forward and backward direction of feeding by the sprocket 29, so there is almost no vibration in the direction of the opening of the storage recess 12. , Also, this storage recess 1
Since the left and right side surfaces of the electronic component 17 are in contact with the guide portions 14 formed on the left and right sides in the longitudinal direction of the electronic component 17 for positioning, the relative positions of the electronic component 17 and the storage recess 12 are shifted. Never. In addition, this electronic component 17
Even if vibration occurs in the vertical direction, when the electronic component 17 falls, the four circumferences of the electronic component 17 will collide with the Taber surface and the guide portion 14.
This electronic component 17 is guided to the storage recess 1.
2 to a certain position.

Further, since the tip end portion 18a of the lead wire 18 of the electronic component 17 is in contact with the contact portion 15 of the storage recess 12,
The electronic component 17 is not rotated within the storage recess 12 due to the above-mentioned vibration.

Further, since a magnet 26, which is an example of a means for biasing the lead wire 18, is disposed at a portion of the guide member 22 through which the lead wire 18 passes, even if the electronic component 17 is not placed inside the storage recess 12, a magnet 26 is arranged. This electronic component 17
Even if at least - or more of the leading ends 18a of the plurality of lead wires 18 provided in This magnet 26 allows the plurality of tips 1
8a is urged toward the abutting portion 15, and the abutting portion 15
The rotation of the electronic component 17 is restored.

When the electronic component 17 is thus positioned with respect to the housing recess 12 and is moved to a predetermined position and stopped by the sprocket 29, the suction head 31 is lowered, and the suction force of this suction head 31 is lowered. The electronic component 17 is gripped and lifted as shown in FIG.

Then, as shown in FIG. 7, it is transported to the center of the position correction device 32 and stopped. Next, the pressing member 32a of this position correction device 32 moves toward the electronic component 17, and the main body 17
By pressing a around the four circumferences, the position of the electronic component 17 relative to the suction head 31 is further complemented.

The suction head 31 is lowered to a fixed position relative to the storage recess 12, and the electronic component 17 is
is positioned with respect to this storage recess 12, so
Although the relative positions of the suction head 31 and the electronic component 17 do not deviate, the relative positions of the electronic component 17 and the suction head 31 can be made more reliable by once passing through the position corrector M32. Become something.

When the position is corrected in this way, the suction head 31
further starts to move and places the electron 17 at a predetermined position δ on the substrate 33. Then, the tip end 18a of the lead wire 18 of this electronic component 17 comes into contact with the land 33a of the board 33. Then, the tip portion 18a and this land 33
a and are soldered.

When this step is completed, the suction head 31 stops suction and is moved above the guide member 22, and the storage band 11 is moved by the pitch of forming the storage recess 12 by the action of the sprocket 29 and stopped. The same action as described above is repeated.

In this embodiment, a planar guide portion 14 is provided on the longitudinal side surface of the storage recess 12, and the tip 18a of the lead wire 18 abuts on the same plane as the bottom surface 12a of the storage recess 12. Although an example in which the contact portion 15 is formed has been described, the shapes of the guide portion 14 and the contact portion 15 are not limited to this example, and for example,
The guide portion 14 is formed as a surface having a roundness similar to the curvature of the outside of the main body 17a of the electronic component 17,
It is also possible to position the electronic component 17 within the storage recess 12, or by forming the contact portion 15 into an edge shape and bringing the top of this edge into contact with the lead wire 18. It is also possible to prevent the electronic component 17 from rotating.

Further, in this embodiment, an example has been described in which a pair of guide parts 14 are formed on the longitudinal side surfaces of the storage recess 12, but the number of guide parts 14 should not be limited to one pair, and the number of guide parts 14 should not be limited to one pair. It is not limited to this area. For example, it is possible to provide the guide portions 14 on the front and rear surfaces of the storage recess 12 in the longitudinal direction, and furthermore, all four circumferences of the four storage portions 12 are configured as guide surfaces 14, and each of these guide surfaces 14 It is also possible to configure such that the position of the electronic component 17 in the housing recess 12 is regulated by contacting the electronic component 17 .

Further, in this embodiment, since the feeding hole 13 is formed in the storage band 11, there is an effect that the feeding of the storage band 11 is reliably performed. The present invention is not limited to the sprocket 29. For example, the storage belt 11 may be gripped by a pair of friction wheels that are in sliding contact with each other, and the storage belt 11 may be sent by the rotating force of the friction wheels. It is possible, and it is also possible to send the storage band 11 by locking some kind of member to the protrusion 11a on the back surface of the storage band 11.

Further, in this embodiment, an example was described in which the tip end 18a of the lead wire 18 was expanded wider than the diameter of the main body 17 of the electronic component 17, but the storage band 11 according to the present invention is In addition to the electronic component 17 having the above-mentioned configuration,
Even if the tip portion 18a is formed to be approximately the same diameter as the main body 17a, or narrower than this diameter, it can be accommodated, and it goes without saying that the same effect can be achieved in this case as well. be. Furthermore, in this embodiment, an example has been described in which the contact portion 15 provided in the storage recess 12 is flush with the bottom surface 12a of the storage recess 12. The positional relationship between the bottom surface 1
It is also possible to provide a step between 2a and the contact portion 15, or to form the bottom surface 12 and the contact portion 15 at a predetermined angle.

Furthermore, in this embodiment, since the opening of the storage recess 12 is covered with the tape 19, there is an effect that the storage belt 11 can be easily transported.

Furthermore, in this embodiment, since the magnet 26 is disposed at the portion through which the lead wire 18 passes, rotation of the electronic component 17 within the storage recess 12 is more reliably prevented, and rotation does not occur. Even if the rotation occurs, the effect is that it is possible to correct this rotation. In this embodiment, the magnet 26 is disposed only below the portion through which the lead wire 18 passes; however, by forming the magnet 26, for example, in a box shape, it is placed on the side where the lead wire 18 passes. It is also possible to arrange the electronic member 17 so that the axial position of the electronic member 17 is determined within the storage recess 12. Furthermore, it is possible to arrange an electromagnetic coil in place of the magnet 26, and also to arrange a suppressing member above the guide member 22, and press the plurality of lead wires 18 with this pressing member to suppress the electronic It is also possible to configure the rotation of the component 17 to be corrected.

9 and 10 relate to the second embodiment of the present invention, and FIG.
The figure is a plan view of the storage recess, and FIG. 10 is a cross-sectional side view of the storage recess. Note that the same members used in the first embodiment described above and members having similar functions are designated by the same reference numerals, and their explanations will be omitted.

In this embodiment, when the electronic component 17 is stored in the storage recess 12, the storage recess 12 is placed approximately at the center of the side wall of the storage recess 12, which faces the end surface 17b from which the lead 1a18 of the electronic component 17 is projected. A protrusion 34 that protrudes toward the center is formed, and when the electronic component 17 is stored in the storage recess 12, the tip 34a of the protrusion 34 is attached to a plurality of electronic components 17. Located in the middle of the protruding lead wire 18, this tip 34
is located very close to the end surface 17b of the electronic member 17.

With this configuration, even if the storage band 11 is vibrated, the tip of the protrusion 34 will come into contact with the end surface 17b of the electronic component 17, and the tip 34a will protrude to the end surface 17b. By coming into contact with the inside of the lead wire 18, the effect of more reliably preventing vibration of the electronic component 17 within the storage recess 12 is exhibited.

In addition, in this embodiment, an example in which the end face of the tip portion 34a is formed vertically, for example, has been described, but this end face is an inclined face that gradually projects toward the bottom face 12a of the storage recess 12, and this clear face is formed. The end face 17b of the electronic component 17
It is also possible to configure it so that the two come into contact with each other.

FIG. 11 is a perspective view of a storage recess according to a third embodiment of the present invention.

In this embodiment, a step is provided between the bottom surface 12a of the storage recess 12 and the contact portion 15 against which, for example, the tip end 18a of the lead wire 18 comes into contact, and the bent portion of the lead wire 18 The length of the electronic component 17 is shorter than that of the two embodiments described above, and the plane formed by the tips 18a of the plurality of lead wires 18 and one side surface of the main body 17a of the electronic component 17 do not form the same plane. It should be stored. With this configuration, the same effects as those of the first embodiment described above are exhibited.

FIG. 12 is a perspective view of a storage recess according to a fourth embodiment of the present invention.

In this embodiment, a single lead wire 18 is provided to the electronic component 17 to be stored in the storage recess 12, and this lead wire 1
The tip end 18a of the electronic component 17 is bent in a direction away from the end surface 17b of the electronic component 17.

Further, in the three embodiments described above, the abutment part 15 against which the tip end 18a abuts and the bottom surface 12a of the storage recess 12 are formed in parallel or on the same plane, but in this embodiment, this reference part A contact portion 15 is provided facing the lead wire 18 so as to contact it from the side, and the surface forming the contact portion 15 is formed in a tapered shape that widens as it is spaced apart from the bottom surface.

With this configuration, the lead wire 18 and the lead wire 1
A contact portion 15 is brought into contact with the side of the tip portion 18a of the electronic component 17 to prevent the electronic component 17 from rotating.

Further, in this embodiment, the contact portions 15 formed opposite to each other are formed to expand as they are separated from the bottom surface 12a of the storage recess 12, so that the electronic component 17 is stored in the storage recess 12. When the electronic component 17 is removed from the storage recess 12, friction between the lead wire 18 and the contact portion 15 is prevented as much as possible.
It has the effect of being easy to store and take out.

FIG. 13 is a perspective view of a storage recess according to a fifth embodiment of the present invention.

In this embodiment, the lead wire 18 of the electronic component 17 to be stored in the storage recess 12 is connected to both end surfaces 17b and 1 of the main body 17a.
7c, each of which has a bent end portion 18a, and the abutment portion 15 formed in the storage recess 12 has two sides so as to abut each of the plurality of leads 5i118 from the side. vs. provided. This configuration prevents the electronic component 17 from rotating.

FIG. 14 is a perspective view of a storage projection according to a sixth embodiment of the present invention.

In this embodiment, the lead wire 18 of the electronic component 17 to be stored in the storage recess 12 is connected to both end surfaces 17b and 1 of the main body 18a.
The leading ends 18a of the lead wires 18 each protrude from the housing recess 12 are bent.
A pair of storage recesses 12 are formed at the front and back in the longitudinal direction of the storage recess 12, parallel to the bottom surface 12a of the storage recess 12 and having a step.

With this configuration, the tip portion 18a of the bent lead wire 18 is made parallel to the longitudinal direction of the storage band 11, and the contact portion 1
By placing the electronic component 17 on the electronic component 5, rotation of the electronic component 17 is prevented.

FIG. 15 is a cross-sectional side view of a storage band 11 according to a seventh embodiment of the present invention.

In this embodiment, the guide portions 14 provided in the storage recess 12 are formed to face each other in parallel, and the guide portions 14 have tapered portions 14a spaced apart from each other near the frontage of the storage recess 12. It is formed by

With this configuration, the electronic component 17 is positioned within the storage recess 12 by the guide portion 14 formed in parallel. Further, since the guide portion 14 is formed with the tapered portion 14a, it is easy to store the electronic component 17 in the storage recess 12 and to take out the electronic component 17 from the storage recess.

[Effects of the Invention] As explained above, according to the electronic component storage band of the present invention, the electronic component is positioned relative to the storage recess and is prevented from rotating within the storage recess. This has the effect of making it possible to position the electronic component extremely easily when mounting the electronic component.

Further, it has the effect that it is easy to store electronic components in the storage recess and to take out the electronic components from the storage recess.

[Brief explanation of the drawing]

1 to 8 relate to a first embodiment of the present invention, in which FIG. 1 is a view taken along the line I-I in FIG. 2, FIG. 2 is a plan view of a storage band for electronic components, and FIG. is a view taken along the line ■-■ in Fig. 2, Fig. 4 is a reference perspective view of the storage band for electronic components, Fig. 5 is an explanatory diagram of the operating state showing the supply status of electronic parts, and Fig. 6 is a diagram showing the state of supply of electronic components. An explanatory diagram of the operating state showing the state where the suction 9 is gripped, Fig. 7 is an explanatory diagram of the operating state showing the state where the position of the electronic component is corrected, and Fig. 8 shows the state where the electronic component is mounted on the board. - Figures 9 and 10 relate to the second embodiment of the present invention; Figure 9 is a plan view of the storage recess, Figure 10 is a cross-sectional side view of the storage recess, and Figure 11 is a view of the book. FIG. 12 is a perspective view of the storage recess according to the fourth embodiment of the invention; FIG. 13 is a perspective view of the storage recess according to the fifth embodiment of the invention. 14 is a perspective view of a storage recess according to a sixth embodiment of the present invention, FIG. 15 is a cross-sectional side view of a storage band for electronic components according to a seventh embodiment of the present invention, and FIGS. The figures relate to conventional technology; FIG. 16 is a perspective view of a storage band for storing cylindrical chip-type electronic components; FIG. 17 is a perspective view of a storage band for storing square-shaped chip-type electronic components;
Figure 18 is a perspective view of a cylindrical chip-type electronic component;
The figure is a perspective view of a square chip-type electronic component, and FIG. 20 is a perspective view of a cylindrical chip-type electronic component having lead wires. 11... Storage band 12... Storage recess 14... Guide part 15... Contact part 17... Electronic component 18... ... Lead wire Figure 1 Figure 2 Figure 3 Figure 5 Figure 6 Figure 8 Figure 7: 5 and d Figure 12 1t56 Figure 13 Figure 14 Figure 15

Claims (2)

[Claims] (1) In a tape-shaped storage band, in which storage recesses for electronic components having lead wires are formed at predetermined intervals, a guide for positioning electronic components in the storage recesses. What is claimed is: 1. A storage belt for electronic components, characterized in that a storage band for electronic components is provided, and a contact portion that contacts a lead wire provided on the electronic component. (2) The storage band for electronic components according to claim 1, wherein a protrusion for positioning the electronic component in the axial direction is formed in the storage recess.